KR102167941B1 - 취성 기판의 분단 방법 - Google Patents

취성 기판의 분단 방법 Download PDF

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Publication number
KR102167941B1
KR102167941B1 KR1020187033990A KR20187033990A KR102167941B1 KR 102167941 B1 KR102167941 B1 KR 102167941B1 KR 1020187033990 A KR1020187033990 A KR 1020187033990A KR 20187033990 A KR20187033990 A KR 20187033990A KR 102167941 B1 KR102167941 B1 KR 102167941B1
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KR
South Korea
Prior art keywords
tip
line
blade tip
brittle substrate
blade
Prior art date
Application number
KR1020187033990A
Other languages
English (en)
Korean (ko)
Other versions
KR20180136528A (ko
Inventor
히로시 소야마
아츠시 이무라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20180136528A publication Critical patent/KR20180136528A/ko
Application granted granted Critical
Publication of KR102167941B1 publication Critical patent/KR102167941B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020187033990A 2016-05-25 2017-05-17 취성 기판의 분단 방법 KR102167941B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-103952 2016-05-25
JP2016103952 2016-05-25
PCT/JP2017/018536 WO2017204055A1 (ja) 2016-05-25 2017-05-17 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
KR20180136528A KR20180136528A (ko) 2018-12-24
KR102167941B1 true KR102167941B1 (ko) 2020-10-20

Family

ID=60412293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187033990A KR102167941B1 (ko) 2016-05-25 2017-05-17 취성 기판의 분단 방법

Country Status (5)

Country Link
JP (1) JP6645577B2 (zh)
KR (1) KR102167941B1 (zh)
CN (1) CN109219505B (zh)
TW (1) TWI740945B (zh)
WO (1) WO2017204055A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840267B2 (en) 2018-05-14 2020-11-17 Yungu (Gu'an) Technology Co., Ltd. Array substrates and manufacturing methods thereof, and display panels
CN108428728B (zh) * 2018-05-14 2019-07-02 云谷（固安）科技有限公司 阵列基板及制作方法、显示面板及制作方法、显示装置
JP7255890B2 (ja) * 2020-12-24 2023-04-11 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP2014088295A (ja) * 2012-10-31 2014-05-15 Amagasaki Kosakusho:Kk 硬質脆性板の割断装置
WO2016047317A1 (ja) 2014-09-25 2016-03-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
EP1579970A4 (en) * 2002-11-06 2006-09-20 Mitsuboshi Diamond Ind Co Ltd DEVICE FOR PREPARING A CROP LINE AND METHOD FOR PRODUCING A CROP LINE
JP5060880B2 (ja) * 2007-09-11 2012-10-31 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置および分断方法
JP5597327B2 (ja) * 2010-06-29 2014-10-01 学校法人東京理科大学 ダイヤモンド被覆工具およびその製造方法
JP2015191999A (ja) * 2014-03-28 2015-11-02 三星ダイヤモンド工業株式会社 シリコン基板の分断方法
WO2015151755A1 (ja) 2014-03-31 2015-10-08 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP2014088295A (ja) * 2012-10-31 2014-05-15 Amagasaki Kosakusho:Kk 硬質脆性板の割断装置
WO2016047317A1 (ja) 2014-09-25 2016-03-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP2016069195A (ja) * 2014-09-26 2016-05-09 三星ダイヤモンド工業株式会社 基板分断方法

Also Published As

Publication number Publication date
CN109219505B (zh) 2021-05-07
JP6645577B2 (ja) 2020-02-14
CN109219505A (zh) 2019-01-15
TWI740945B (zh) 2021-10-01
JPWO2017204055A1 (ja) 2019-01-17
KR20180136528A (ko) 2018-12-24
TW201808840A (zh) 2018-03-16
WO2017204055A1 (ja) 2017-11-30

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