JP6645577B2 - 脆性基板の分断方法 - Google Patents

脆性基板の分断方法 Download PDF

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Publication number
JP6645577B2
JP6645577B2 JP2018519215A JP2018519215A JP6645577B2 JP 6645577 B2 JP6645577 B2 JP 6645577B2 JP 2018519215 A JP2018519215 A JP 2018519215A JP 2018519215 A JP2018519215 A JP 2018519215A JP 6645577 B2 JP6645577 B2 JP 6645577B2
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JP
Japan
Prior art keywords
cutting edge
line
tip
brittle substrate
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2018519215A
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English (en)
Japanese (ja)
Other versions
JPWO2017204055A1 (ja
Inventor
曽山　浩
浩 曽山
淳史 井村
淳史 井村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of JPWO2017204055A1 publication Critical patent/JPWO2017204055A1/ja
Application granted granted Critical
Publication of JP6645577B2 publication Critical patent/JP6645577B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2018519215A 2016-05-25 2017-05-17 脆性基板の分断方法 Expired - Fee Related JP6645577B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016103952 2016-05-25
JP2016103952 2016-05-25
PCT/JP2017/018536 WO2017204055A1 (ja) 2016-05-25 2017-05-17 脆性基板の分断方法

Publications (2)

Publication Number Publication Date
JPWO2017204055A1 JPWO2017204055A1 (ja) 2019-01-17
JP6645577B2 true JP6645577B2 (ja) 2020-02-14

Family

ID=60412293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018519215A Expired - Fee Related JP6645577B2 (ja) 2016-05-25 2017-05-17 脆性基板の分断方法

Country Status (5)

Country Link
JP (1) JP6645577B2 (zh)
KR (1) KR102167941B1 (zh)
CN (1) CN109219505B (zh)
TW (1) TWI740945B (zh)
WO (1) WO2017204055A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10840267B2 (en) 2018-05-14 2020-11-17 Yungu (Gu'an) Technology Co., Ltd. Array substrates and manufacturing methods thereof, and display panels
CN108428728B (zh) * 2018-05-14 2019-07-02 云谷（固安）科技有限公司 阵列基板及制作方法、显示面板及制作方法、显示装置
JP7255890B2 (ja) * 2020-12-24 2023-04-11 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法及び分断方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (ja) 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 ガラスカッターホイール
WO2004041493A1 (ja) * 2002-11-06 2004-05-21 Mitsuboshi Diamond Industrial Co.,Ltd. スクライブライン形成装置及びスクライブライン形成方法
JP2006007677A (ja) * 2004-06-29 2006-01-12 National Institute For Materials Science ダイヤモンド多結晶体スクライバー
JP5060880B2 (ja) * 2007-09-11 2012-10-31 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置および分断方法
JP5597327B2 (ja) * 2010-06-29 2014-10-01 学校法人東京理科大学 ダイヤモンド被覆工具およびその製造方法
JP2014031292A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 強化ガラス基板のスクライブ方法
JP5996376B2 (ja) * 2012-10-31 2016-09-21 株式会社尼崎工作所 硬質脆性板の割断装置
JP2015191999A (ja) * 2014-03-28 2015-11-02 三星ダイヤモンド工業株式会社 シリコン基板の分断方法
CN109455919B (zh) 2014-03-31 2022-03-08 三星钻石工业股份有限公司 脆性材料基板的分断方法
EP3199499A4 (en) * 2014-09-25 2018-06-06 Mitsuboshi Diamond Industrial Co., Ltd. Method for cutting brittle substrate
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法

Also Published As

Publication number Publication date
CN109219505A (zh) 2019-01-15
TW201808840A (zh) 2018-03-16
JPWO2017204055A1 (ja) 2019-01-17
KR102167941B1 (ko) 2020-10-20
WO2017204055A1 (ja) 2017-11-30
KR20180136528A (ko) 2018-12-24
TWI740945B (zh) 2021-10-01
CN109219505B (zh) 2021-05-07

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