KR102167554B1 - 개선된 에지 링 립 - Google Patents

개선된 에지 링 립 Download PDF

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Publication number
KR102167554B1
KR102167554B1 KR1020157011173A KR20157011173A KR102167554B1 KR 102167554 B1 KR102167554 B1 KR 102167554B1 KR 1020157011173 A KR1020157011173 A KR 1020157011173A KR 20157011173 A KR20157011173 A KR 20157011173A KR 102167554 B1 KR102167554 B1 KR 102167554B1
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KR
South Korea
Prior art keywords
substrate
edge lip
edge
ring
support ring
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KR1020157011173A
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English (en)
Korean (ko)
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KR20150058520A (ko
Inventor
조셉 엠. 라니쉬
볼프강 알. 아더홀드
블레이크 코엘멜
일야 라비트스키
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20150058520A publication Critical patent/KR20150058520A/ko
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    • H01L21/68735—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/2636—
    • H01L21/324—
    • H01L21/68714—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020157011173A 2012-09-28 2013-08-15 개선된 에지 링 립 Active KR102167554B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/630,291 2012-09-28
US13/630,291 US8865602B2 (en) 2012-09-28 2012-09-28 Edge ring lip
PCT/US2013/055167 WO2014051874A1 (en) 2012-09-28 2013-08-15 Improved edge ring lip

Publications (2)

Publication Number Publication Date
KR20150058520A KR20150058520A (ko) 2015-05-28
KR102167554B1 true KR102167554B1 (ko) 2020-10-19

Family

ID=50385609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157011173A Active KR102167554B1 (ko) 2012-09-28 2013-08-15 개선된 에지 링 립

Country Status (6)

Country Link
US (1) US8865602B2 (https=)
JP (1) JP6258334B2 (https=)
KR (1) KR102167554B1 (https=)
CN (1) CN104641463B (https=)
TW (1) TWI512884B (https=)
WO (1) WO2014051874A1 (https=)

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US9768052B2 (en) * 2013-03-14 2017-09-19 Applied Materials, Inc. Minimal contact edge ring for rapid thermal processing
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
TWM573071U (zh) * 2017-03-06 2019-01-11 美商應用材料股份有限公司 用於熱處理腔室的旋轉器蓋與用於處理基板的設備
KR102538177B1 (ko) 2017-11-16 2023-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
KR102404061B1 (ko) 2017-11-16 2022-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
CN118380372A (zh) 2017-11-21 2024-07-23 朗姆研究公司 底部边缘环和中部边缘环
CN111819679A (zh) * 2018-03-13 2020-10-23 应用材料公司 具有等离子体喷涂涂层的支撑环
CN119008508A (zh) * 2018-03-20 2024-11-22 玛特森技术公司 热处理系统中用于局部加热的支撑板
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
KR102295249B1 (ko) * 2019-10-08 2021-08-30 (주)에스티아이 기판처리장치
US11764101B2 (en) * 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
JP7760511B2 (ja) 2020-02-11 2025-10-27 ラム リサーチ コーポレーション ウエハベベル／エッジ上の堆積を制御するためのキャリアリング設計
US12588426B2 (en) * 2020-02-20 2026-03-24 Metox International, Inc. Susceptor for a chemical vapor deposition reactor
KR102905595B1 (ko) 2020-03-23 2025-12-29 램 리써치 코포레이션 기판 프로세싱 시스템들에서의 중간-링 부식 보상
JP7461214B2 (ja) * 2020-05-19 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
WO2021262583A1 (en) * 2020-06-25 2021-12-30 Lam Research Corporation Carrier rings with radially-varied plasma impedance
WO2022076227A1 (en) 2020-10-05 2022-04-14 Lam Research Corporation Moveable edge rings for plasma processing systems
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
US20240128077A1 (en) * 2022-10-14 2024-04-18 Nanya Technology Corporation Semiconductor device and a method for film deposition
US20250142678A1 (en) * 2023-08-01 2025-05-01 Animal Lamps, LLC Heat lamp
CN117604478A (zh) * 2023-11-13 2024-02-27 中国科学院上海光学精密机械研究所 一种大口径光学薄膜元件镀膜夹具
CN121700368A (zh) * 2024-05-31 2026-03-20 北京北方华创微电子装备有限公司 一种基片台系统及mpcvd设备

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US5474612A (en) 1990-03-19 1995-12-12 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
JP2003059852A (ja) * 2001-08-10 2003-02-28 Dainippon Screen Mfg Co Ltd 基板の熱処理装置

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US5474612A (en) 1990-03-19 1995-12-12 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
JP2003059852A (ja) * 2001-08-10 2003-02-28 Dainippon Screen Mfg Co Ltd 基板の熱処理装置

Also Published As

Publication number Publication date
US20140094039A1 (en) 2014-04-03
JP6258334B2 (ja) 2018-01-10
TW201413866A (zh) 2014-04-01
CN104641463A (zh) 2015-05-20
US8865602B2 (en) 2014-10-21
WO2014051874A1 (en) 2014-04-03
TWI512884B (zh) 2015-12-11
JP2015536048A (ja) 2015-12-17
CN104641463B (zh) 2018-05-08
KR20150058520A (ko) 2015-05-28

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