JP6258334B2 - 改善されたエッジリングリップ - Google Patents

改善されたエッジリングリップ Download PDF

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Publication number
JP6258334B2
JP6258334B2 JP2015534491A JP2015534491A JP6258334B2 JP 6258334 B2 JP6258334 B2 JP 6258334B2 JP 2015534491 A JP2015534491 A JP 2015534491A JP 2015534491 A JP2015534491 A JP 2015534491A JP 6258334 B2 JP6258334 B2 JP 6258334B2
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Japan
Prior art keywords
substrate
edge lip
edge
ring
support
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Active
Application number
JP2015534491A
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English (en)
Japanese (ja)
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JP2015536048A5 (https=
JP2015536048A (ja
Inventor
ジョゼフ エム． ラニッシュ，
ジョゼフ エム． ラニッシュ，
ウルフギャング アール． アダーホールド，
ウルフギャング アール． アダーホールド，
ブレイク ケルメル，
ブレイク ケルメル，
イリヤ ラビッツキー，
イリヤ ラビッツキー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2015536048A publication Critical patent/JP2015536048A/ja
Publication of JP2015536048A5 publication Critical patent/JP2015536048A5/ja
Application granted granted Critical
Publication of JP6258334B2 publication Critical patent/JP6258334B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
JP2015534491A 2012-09-28 2013-08-15 改善されたエッジリングリップ Active JP6258334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/630,291 2012-09-28
US13/630,291 US8865602B2 (en) 2012-09-28 2012-09-28 Edge ring lip
PCT/US2013/055167 WO2014051874A1 (en) 2012-09-28 2013-08-15 Improved edge ring lip

Publications (3)

Publication Number Publication Date
JP2015536048A JP2015536048A (ja) 2015-12-17
JP2015536048A5 JP2015536048A5 (https=) 2016-09-29
JP6258334B2 true JP6258334B2 (ja) 2018-01-10

Family

ID=50385609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015534491A Active JP6258334B2 (ja) 2012-09-28 2013-08-15 改善されたエッジリングリップ

Country Status (6)

Country Link
US (1) US8865602B2 (https=)
JP (1) JP6258334B2 (https=)
KR (1) KR102167554B1 (https=)
CN (1) CN104641463B (https=)
TW (1) TWI512884B (https=)
WO (1) WO2014051874A1 (https=)

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US9768052B2 (en) * 2013-03-14 2017-09-19 Applied Materials, Inc. Minimal contact edge ring for rapid thermal processing
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
TWM573071U (zh) * 2017-03-06 2019-01-11 美商應用材料股份有限公司 用於熱處理腔室的旋轉器蓋與用於處理基板的設備
KR102538177B1 (ko) 2017-11-16 2023-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
KR102404061B1 (ko) 2017-11-16 2022-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
CN118380372A (zh) 2017-11-21 2024-07-23 朗姆研究公司 底部边缘环和中部边缘环
CN111819679A (zh) * 2018-03-13 2020-10-23 应用材料公司 具有等离子体喷涂涂层的支撑环
CN119008508A (zh) * 2018-03-20 2024-11-22 玛特森技术公司 热处理系统中用于局部加热的支撑板
SG11202010375QA (en) 2018-04-20 2020-11-27 Lam Res Corp Edge exclusion control
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
KR102295249B1 (ko) * 2019-10-08 2021-08-30 (주)에스티아이 기판처리장치
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US12588426B2 (en) * 2020-02-20 2026-03-24 Metox International, Inc. Susceptor for a chemical vapor deposition reactor
KR102905595B1 (ko) 2020-03-23 2025-12-29 램 리써치 코포레이션 기판 프로세싱 시스템들에서의 중간-링 부식 보상
JP7461214B2 (ja) * 2020-05-19 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
WO2021262583A1 (en) * 2020-06-25 2021-12-30 Lam Research Corporation Carrier rings with radially-varied plasma impedance
WO2022076227A1 (en) 2020-10-05 2022-04-14 Lam Research Corporation Moveable edge rings for plasma processing systems
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
US20240128077A1 (en) * 2022-10-14 2024-04-18 Nanya Technology Corporation Semiconductor device and a method for film deposition
US20250142678A1 (en) * 2023-08-01 2025-05-01 Animal Lamps, LLC Heat lamp
CN117604478A (zh) * 2023-11-13 2024-02-27 中国科学院上海光学精密机械研究所 一种大口径光学薄膜元件镀膜夹具
CN121700368A (zh) * 2024-05-31 2026-03-20 北京北方华创微电子装备有限公司 一种基片台系统及mpcvd设备

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Also Published As

Publication number Publication date
US20140094039A1 (en) 2014-04-03
TW201413866A (zh) 2014-04-01
CN104641463A (zh) 2015-05-20
US8865602B2 (en) 2014-10-21
KR102167554B1 (ko) 2020-10-19
WO2014051874A1 (en) 2014-04-03
TWI512884B (zh) 2015-12-11
JP2015536048A (ja) 2015-12-17
CN104641463B (zh) 2018-05-08
KR20150058520A (ko) 2015-05-28

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