KR102130124B1 - 실장 장치 - Google Patents

실장 장치 Download PDF

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Publication number
KR102130124B1
KR102130124B1 KR1020187021580A KR20187021580A KR102130124B1 KR 102130124 B1 KR102130124 B1 KR 102130124B1 KR 1020187021580 A KR1020187021580 A KR 1020187021580A KR 20187021580 A KR20187021580 A KR 20187021580A KR 102130124 B1 KR102130124 B1 KR 102130124B1
Authority
KR
South Korea
Prior art keywords
plunger
pin
mounting
head
sheet
Prior art date
Application number
KR1020187021580A
Other languages
English (en)
Korean (ko)
Other versions
KR20190020641A (ko
Inventor
츠요시 타츠이와
Original Assignee
가부시키가이샤 스즈키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스즈키 filed Critical 가부시키가이샤 스즈키
Publication of KR20190020641A publication Critical patent/KR20190020641A/ko
Application granted granted Critical
Publication of KR102130124B1 publication Critical patent/KR102130124B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020187021580A 2016-06-22 2016-06-22 실장 장치 KR102130124B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/068526 WO2017221350A1 (ja) 2016-06-22 2016-06-22 実装方法、実装用ヘッドおよび実装装置

Publications (2)

Publication Number Publication Date
KR20190020641A KR20190020641A (ko) 2019-03-04
KR102130124B1 true KR102130124B1 (ko) 2020-07-03

Family

ID=60783307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187021580A KR102130124B1 (ko) 2016-06-22 2016-06-22 실장 장치

Country Status (6)

Country Link
JP (1) JP6603412B2 (zh)
KR (1) KR102130124B1 (zh)
CN (1) CN108605427B (zh)
SG (1) SG11201806151UA (zh)
TW (1) TWI706480B (zh)
WO (1) WO2017221350A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100512488B1 (ko) * 2002-06-26 2005-09-05 주식회사 삼우테크놀로지 자기테이프에서 자성도료와 베이스필름의 분리 추출방법
WO2023027387A1 (ko) 2021-08-25 2023-03-02 레이저쎌 주식회사 전사 방식을 이용한 초소형 led 칩 리웍장치 및 리웍방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210429751U (zh) 2018-09-11 2020-04-28 Pyxis Cf私人有限公司 半导体器件贴片装置及用于对准多个半导体器件的机构
JP7205896B2 (ja) * 2019-05-22 2023-01-17 株式会社 ベアック 貼り付け装置および貼り付け方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225588A (ja) 1999-02-08 2000-08-15 Juki Corp 切替え式吸着パッド装置
JP2007317748A (ja) 2006-05-23 2007-12-06 Renesas Technology Corp 半導体装置の製造方法
JP2010040657A (ja) 2008-08-01 2010-02-18 Canon Machinery Inc チップ剥離装置およびチップ剥離方法
JP2013507010A (ja) 2009-10-06 2013-02-28 アエロラス ゲーエムベーハー 電気または電子部品を取り扱うための挿入ヘッド

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS557775B2 (zh) 1974-06-20 1980-02-28
JPS6063940A (ja) * 1984-07-26 1985-04-12 Sanken Electric Co Ltd 半導体ペレツトのダイボンデイング方法
JPS6430235A (en) * 1987-07-27 1989-02-01 Matsushita Electronics Corp Die bonding device
JP2540075B2 (ja) * 1989-06-15 1996-10-02 ティーディーケイ株式会社 部品装着装置
JPH07105633B2 (ja) * 1990-01-08 1995-11-13 松下電器産業株式会社 部品装着機
JPH06188595A (ja) * 1993-08-01 1994-07-08 Matsushita Electric Ind Co Ltd 電子部品の装着装置
JP3145899B2 (ja) * 1995-07-11 2001-03-12 有限会社ソルテック 電磁ソレノイド駆動装置及びこれを用いたパチンコ機の入賞装置
JP5964005B2 (ja) * 2005-04-08 2016-08-03 パック テック−パッケージング テクノロジーズ ゲーエムベーハー チップを接触基板に移送する方法及び装置
US9258936B2 (en) * 2011-12-27 2016-02-09 Hanwha Techwin Co., Ltd. Adsorption head for surface mounting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225588A (ja) 1999-02-08 2000-08-15 Juki Corp 切替え式吸着パッド装置
JP2007317748A (ja) 2006-05-23 2007-12-06 Renesas Technology Corp 半導体装置の製造方法
JP2010040657A (ja) 2008-08-01 2010-02-18 Canon Machinery Inc チップ剥離装置およびチップ剥離方法
JP2013507010A (ja) 2009-10-06 2013-02-28 アエロラス ゲーエムベーハー 電気または電子部品を取り扱うための挿入ヘッド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100512488B1 (ko) * 2002-06-26 2005-09-05 주식회사 삼우테크놀로지 자기테이프에서 자성도료와 베이스필름의 분리 추출방법
WO2023027387A1 (ko) 2021-08-25 2023-03-02 레이저쎌 주식회사 전사 방식을 이용한 초소형 led 칩 리웍장치 및 리웍방법
KR20230030385A (ko) 2021-08-25 2023-03-06 레이저쎌 주식회사 전사 방식을 이용한 초소형 led 칩 리웍장치 및 리웍방법

Also Published As

Publication number Publication date
CN108605427B (zh) 2020-10-30
KR20190020641A (ko) 2019-03-04
TWI706480B (zh) 2020-10-01
SG11201806151UA (en) 2019-01-30
JPWO2017221350A1 (ja) 2019-04-11
WO2017221350A1 (ja) 2017-12-28
TW201801208A (zh) 2018-01-01
CN108605427A (zh) 2018-09-28
JP6603412B2 (ja) 2019-11-06

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