KR102128393B1 - 화학적 기계적 평탄화 전 버핑 모듈을 위한 방법 및 장치 - Google Patents

화학적 기계적 평탄화 전 버핑 모듈을 위한 방법 및 장치 Download PDF

Info

Publication number
KR102128393B1
KR102128393B1 KR1020147033449A KR20147033449A KR102128393B1 KR 102128393 B1 KR102128393 B1 KR 102128393B1 KR 1020147033449 A KR1020147033449 A KR 1020147033449A KR 20147033449 A KR20147033449 A KR 20147033449A KR 102128393 B1 KR102128393 B1 KR 102128393B1
Authority
KR
South Korea
Prior art keywords
substrate
polishing pad
pad assembly
rotating
buffing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020147033449A
Other languages
English (en)
Korean (ko)
Other versions
KR20150005680A (ko
Inventor
후이 첸
훙 첸
짐 케이. 앳킨슨
앨런 엘. 디'암브라
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20150005680A publication Critical patent/KR20150005680A/ko
Application granted granted Critical
Publication of KR102128393B1 publication Critical patent/KR102128393B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020147033449A 2012-04-28 2013-04-16 화학적 기계적 평탄화 전 버핑 모듈을 위한 방법 및 장치 Active KR102128393B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/459,177 2012-04-28
US13/459,177 US8968055B2 (en) 2012-04-28 2012-04-28 Methods and apparatus for pre-chemical mechanical planarization buffing module
PCT/US2013/036764 WO2013162950A1 (en) 2012-04-28 2013-04-16 Methods and apparatus for pre-chemical mechanical planarization of buffing module

Publications (2)

Publication Number Publication Date
KR20150005680A KR20150005680A (ko) 2015-01-14
KR102128393B1 true KR102128393B1 (ko) 2020-06-30

Family

ID=49477715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147033449A Active KR102128393B1 (ko) 2012-04-28 2013-04-16 화학적 기계적 평탄화 전 버핑 모듈을 위한 방법 및 장치

Country Status (6)

Country Link
US (1) US8968055B2 (https=)
JP (1) JP2015517923A (https=)
KR (1) KR102128393B1 (https=)
CN (1) CN104303272B (https=)
TW (1) TWI573660B (https=)
WO (1) WO2013162950A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMO20130231A1 (it) * 2013-08-06 2015-02-07 Cms Spa Attrezzatura per tenere un pezzo
JP6721967B2 (ja) * 2015-11-17 2020-07-15 株式会社荏原製作所 バフ処理装置および基板処理装置
WO2017165046A1 (en) * 2016-03-25 2017-09-28 Applied Materials, Inc. Polishing system with local area rate control and oscillation mode
KR102666494B1 (ko) * 2016-03-25 2024-05-17 어플라이드 머티어리얼스, 인코포레이티드 국부 영역 연마 시스템 및 연마 시스템용 연마 패드 조립체들
CN107520717A (zh) * 2017-08-11 2017-12-29 王臻 一种风能发电叶片用打磨装置
CN109702625A (zh) * 2018-12-28 2019-05-03 天津洙诺科技有限公司 一种硅片单面抛光装置及其方法
CN110977680B (zh) * 2019-12-24 2021-04-16 丹阳广丰光学器材有限公司 一种光学镜片加工用抛光装置
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004507097A (ja) * 2000-08-22 2004-03-04 ラム　リサーチ　コーポレーション ウエハと逆方向に回転する振動研磨パッドを備えたｃｍｐ装置
JP2004148479A (ja) * 2002-11-01 2004-05-27 Fuji Seiki Seisakusho:Kk 研磨装置
WO2005016595A1 (ja) * 2003-08-19 2005-02-24 Nikon Corporation 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JPH09168968A (ja) * 1995-10-27 1997-06-30 Applied Materials Inc ケミカルメカニカルポリシング装置のキャリアヘッドのデザイン
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
JPH10329011A (ja) * 1997-03-21 1998-12-15 Canon Inc 精密研磨装置及び方法
JPH11291166A (ja) * 1998-04-07 1999-10-26 Nikon Corp 研磨装置及び研磨方法
US6095905A (en) * 1998-07-01 2000-08-01 Molecular Optoelectronics Corporation Polishing fixture and method
US6296557B1 (en) 1999-04-02 2001-10-02 Micron Technology, Inc. Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2001044157A (ja) 1999-07-16 2001-02-16 Promos Technol Inc 化学機械研磨終点を検出する方法と装置
US6435941B1 (en) 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US6913528B2 (en) * 2001-03-19 2005-07-05 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method
KR100568258B1 (ko) 2004-07-01 2006-04-07 삼성전자주식회사 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004507097A (ja) * 2000-08-22 2004-03-04 ラム　リサーチ　コーポレーション ウエハと逆方向に回転する振動研磨パッドを備えたｃｍｐ装置
JP2004148479A (ja) * 2002-11-01 2004-05-27 Fuji Seiki Seisakusho:Kk 研磨装置
WO2005016595A1 (ja) * 2003-08-19 2005-02-24 Nikon Corporation 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Also Published As

Publication number Publication date
US8968055B2 (en) 2015-03-03
JP2015517923A (ja) 2015-06-25
TW201402273A (zh) 2014-01-16
TWI573660B (zh) 2017-03-11
WO2013162950A1 (en) 2013-10-31
US20130288578A1 (en) 2013-10-31
KR20150005680A (ko) 2015-01-14
CN104303272A (zh) 2015-01-21
CN104303272B (zh) 2017-06-16

Similar Documents

Publication Publication Date Title
KR102128393B1 (ko) 화학적 기계적 평탄화 전 버핑 모듈을 위한 방법 및 장치
US10256120B2 (en) Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
CN101164141A (zh) 清洁基材边缘的方法及设备
CN211681559U (zh) 晶圆的研磨装置
CN108115553B (zh) 化学机械抛光设备和化学机械抛光方法
JP2016043471A (ja) 基板処理装置
KR102396676B1 (ko) 화학 기계적 평탄화 후의 기판 세정을 위한 시스템, 방법 및 장치
CN105364699B (zh) 一种化学机械研磨方法和化学机械研磨设备
JP2008277518A (ja) 基板洗浄装置および基板洗浄方法
WO2022149346A1 (ja) 基板処理装置および基板処理方法
JP5433968B2 (ja) 保持装置、研磨装置および保持方法
JP2018192412A (ja) 加工装置
JP6061708B2 (ja) レンズ加工方法及びレンズ加工装置
JP4885548B2 (ja) ウェーハの研磨方法
CN208275820U (zh) 清洗装置
JP2005040916A (ja) ポリッシング方法
JP2016043472A (ja) 基板処理装置
JP2005238404A (ja) 両面研磨装置及び両面研磨方法
JP2006062023A (ja) 研磨方法および研磨装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

X091 Application refused [patent]
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000