KR102121137B1 - 용량성 미세 기계화된 초음파 트랜스듀서들(cmut들)의 바이어싱 및 관련 장치 및 방법들 - Google Patents

용량성 미세 기계화된 초음파 트랜스듀서들(cmut들)의 바이어싱 및 관련 장치 및 방법들 Download PDF

Info

Publication number
KR102121137B1
KR102121137B1 KR1020187018266A KR20187018266A KR102121137B1 KR 102121137 B1 KR102121137 B1 KR 102121137B1 KR 1020187018266 A KR1020187018266 A KR 1020187018266A KR 20187018266 A KR20187018266 A KR 20187018266A KR 102121137 B1 KR102121137 B1 KR 102121137B1
Authority
KR
South Korea
Prior art keywords
bias
ultrasonic transducers
group
electrode
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020187018266A
Other languages
English (en)
Korean (ko)
Other versions
KR20180088696A (ko
Inventor
수잔 에이. 에일리
제이미 스콧 자호리안
카이리앙 첸
Original Assignee
버터플라이 네트워크, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 버터플라이 네트워크, 인크. filed Critical 버터플라이 네트워크, 인크.
Publication of KR20180088696A publication Critical patent/KR20180088696A/ko
Application granted granted Critical
Publication of KR102121137B1 publication Critical patent/KR102121137B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • B06B1/0614—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile for generating several frequencies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Micromachines (AREA)
KR1020187018266A 2015-12-02 2016-12-01 용량성 미세 기계화된 초음파 트랜스듀서들(cmut들)의 바이어싱 및 관련 장치 및 방법들 Expired - Fee Related KR102121137B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/957,098 2015-12-02
US14/957,098 US9987661B2 (en) 2015-12-02 2015-12-02 Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
PCT/US2016/064325 WO2017095988A1 (en) 2015-12-02 2016-12-01 Biasing of capacitive micromachined ultrasonic transducers (cmuts) and related apparatus and methods

Publications (2)

Publication Number Publication Date
KR20180088696A KR20180088696A (ko) 2018-08-06
KR102121137B1 true KR102121137B1 (ko) 2020-06-09

Family

ID=58797703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187018266A Expired - Fee Related KR102121137B1 (ko) 2015-12-02 2016-12-01 용량성 미세 기계화된 초음파 트랜스듀서들(cmut들)의 바이어싱 및 관련 장치 및 방법들

Country Status (10)

Country Link
US (2) US9987661B2 (enExample)
EP (1) EP3383277B1 (enExample)
JP (1) JP2019504534A (enExample)
KR (1) KR102121137B1 (enExample)
CN (1) CN108366774A (enExample)
AU (1) AU2016365309B2 (enExample)
CA (1) CA3006505A1 (enExample)
ES (1) ES2909488T3 (enExample)
TW (1) TWI705858B (enExample)
WO (1) WO2017095988A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US20180180724A1 (en) * 2016-12-26 2018-06-28 Nxp Usa, Inc. Ultrasonic transducer integrated with supporting electronics
EP3801705A1 (en) 2018-05-31 2021-04-14 Matt McGrath Design & Co, LLC Biocompatible material with pain management capability and method of use thereof
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
CN115917485B (zh) 2019-05-21 2024-09-06 京东方科技集团股份有限公司 用于产生和检测超声波感测信号的传感器电路、超声波感测显示设备
WO2020251915A1 (en) 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
US11558062B2 (en) 2019-07-25 2023-01-17 Bfly Operations, Inc. Methods and apparatuses for turning on and off an ADC driver in an ultrasound device
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11921240B2 (en) 2019-09-19 2024-03-05 Bfly Operations, Inc. Symmetric receiver switch for ultrasound devices
EP3815795A1 (en) * 2019-10-30 2021-05-05 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Membrane transducer with improved bandwidth
WO2021211822A1 (en) * 2020-04-16 2021-10-21 Bfly Operations, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
US12156762B2 (en) 2021-04-01 2024-12-03 Bfly Operations, Inc. Apparatuses and methods for configuring ultrasound devices
CN113477495A (zh) * 2021-06-26 2021-10-08 西北工业大学 一种基于堆栈排列的双频长焦深超声换能器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030048698A1 (en) 2001-09-07 2003-03-13 Siemens Medical Systems, Inc. Bias control of electrostatic transducers
US20100063397A1 (en) 2008-09-09 2010-03-11 Paul Wagner Multi-dimensional transducer array and beamforming for ultrasound imaging
US20100225200A1 (en) 2009-03-05 2010-09-09 Mario Kupnik Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
WO2010146838A2 (en) 2009-06-19 2010-12-23 Canon Kabushiki Kaisha Capacitive electromechanical transducer

Family Cites Families (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5286671A (en) 1993-05-07 1994-02-15 Kulite Semiconductor Products, Inc. Fusion bonding technique for use in fabricating semiconductor devices
US6645145B1 (en) 1998-11-19 2003-11-11 Siemens Medical Solutions Usa, Inc. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
US6381197B1 (en) * 1999-05-11 2002-04-30 Bernard J Savord Aperture control and apodization in a micro-machined ultrasonic transducer
US6430109B1 (en) 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6443901B1 (en) 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6779387B2 (en) 2001-08-21 2004-08-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6694817B2 (en) 2001-08-21 2004-02-24 Georgia Tech Research Corporation Method and apparatus for the ultrasonic actuation of the cantilever of a probe-based instrument
US6659954B2 (en) 2001-12-19 2003-12-09 Koninklijke Philips Electronics Nv Micromachined ultrasound transducer and method for fabricating same
US7429495B2 (en) 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US7312440B2 (en) 2003-01-14 2007-12-25 Georgia Tech Research Corporation Integrated micro fuel processor and flow delivery infrastructure
US7208727B2 (en) 2003-01-14 2007-04-24 Georgia Tech Research Corporation Electrospray systems and methods
US7087023B2 (en) 2003-02-14 2006-08-08 Sensant Corporation Microfabricated ultrasonic transducers with bias polarity beam profile control and method of operating the same
US7257051B2 (en) 2003-03-06 2007-08-14 General Electric Company Integrated interface electronics for reconfigurable sensor array
US6865140B2 (en) 2003-03-06 2005-03-08 General Electric Company Mosaic arrays using micromachined ultrasound transducers
US7313053B2 (en) 2003-03-06 2007-12-25 General Electric Company Method and apparatus for controlling scanning of mosaic sensor array
US7247246B2 (en) 2003-10-20 2007-07-24 Atmel Corporation Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
WO2005046443A2 (en) 2003-11-07 2005-05-26 Georgia Tech Research Corporation Combination catheter devices, methods, and systems
US7030536B2 (en) 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7125383B2 (en) 2003-12-30 2006-10-24 General Electric Company Method and apparatus for ultrasonic continuous, non-invasive blood pressure monitoring
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
US7104129B2 (en) 2004-02-02 2006-09-12 Invensense Inc. Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
WO2005077012A2 (en) 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
US8008835B2 (en) 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7612483B2 (en) 2004-02-27 2009-11-03 Georgia Tech Research Corporation Harmonic cMUT devices and fabrication methods
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US8658453B2 (en) 2004-09-15 2014-02-25 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
US7518251B2 (en) 2004-12-03 2009-04-14 General Electric Company Stacked electronics for sensors
US7375420B2 (en) 2004-12-03 2008-05-20 General Electric Company Large area transducer array
US7037746B1 (en) 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7250353B2 (en) 2005-03-29 2007-07-31 Invensense, Inc. Method and system of releasing a MEMS structure
US7704743B2 (en) 2005-03-30 2010-04-27 Georgia Tech Research Corporation Electrosonic cell manipulation device and method of use thereof
EP1883956A4 (en) 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
CA2607918A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
CN101558552B (zh) 2005-06-17 2017-05-31 科隆科技公司 具有绝缘延伸部的微机电换能器
US7637149B2 (en) 2005-06-17 2009-12-29 Georgia Tech Research Corporation Integrated displacement sensors for probe microscopy and force spectroscopy
JP4523879B2 (ja) * 2005-06-20 2010-08-11 株式会社日立製作所 電気・音響変換素子、アレイ型超音波トランスデューサおよび超音波診断装置
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7612635B2 (en) 2005-08-03 2009-11-03 Kolo Technologies, Inc. MEMS acoustic filter and fabrication of the same
US7878977B2 (en) 2005-09-30 2011-02-01 Siemens Medical Solutions Usa, Inc. Flexible ultrasound transducer array
US7441447B2 (en) 2005-10-07 2008-10-28 Georgia Tech Research Corporation Methods of imaging in probe microscopy
US7599254B2 (en) * 2005-12-20 2009-10-06 Siemens Medical Solutions Usa, Inc. Transducer static discharge methods and apparatus
US7622848B2 (en) 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
US20070180916A1 (en) 2006-02-09 2007-08-09 General Electric Company Capacitive micromachined ultrasound transducer and methods of making the same
US7615834B2 (en) 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
WO2007115283A2 (en) 2006-04-04 2007-10-11 Kolo Technologies, Inc. Modulation in micromachined ultrasonic transducers
US7451651B2 (en) 2006-12-11 2008-11-18 General Electric Company Modular sensor assembly and methods of fabricating the same
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080296708A1 (en) 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
US8203912B2 (en) 2007-07-31 2012-06-19 Koninklijke Philips Electronics N.V. CMUTs with a high-k dielectric
US8277380B2 (en) 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
WO2009037655A2 (en) 2007-09-17 2009-03-26 Koninklijke Philips Electronics, N.V. Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof
US7843022B2 (en) 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7745248B2 (en) 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7786584B2 (en) 2007-11-26 2010-08-31 Infineon Technologies Ag Through substrate via semiconductor components
CN101868982B (zh) 2007-12-03 2013-10-16 科隆科技公司 带有电压反馈的电容式微机械超声换能器
CN101874287B (zh) 2007-12-03 2012-08-29 科隆科技公司 静电换能器及阵列中的贯穿晶片互连
JP5337813B2 (ja) 2007-12-03 2013-11-06 コロ テクノロジーズ インコーポレイテッド デュアルモード動作マイクロマシン超音波トランスデューサ
EP2215854A1 (en) 2007-12-03 2010-08-11 Kolo Technologies, Inc. Stacked transducing devices
US8483014B2 (en) 2007-12-03 2013-07-09 Kolo Technologies, Inc. Micromachined ultrasonic transducers
EP2227835A1 (en) 2007-12-03 2010-09-15 Kolo Technologies, Inc. Variable operating voltage in micromachined ultrasonic transducer
US7781238B2 (en) 2007-12-06 2010-08-24 Robert Gideon Wodnicki Methods of making and using integrated and testable sensor array
US8614151B2 (en) 2008-01-04 2013-12-24 Micron Technology, Inc. Method of etching a high aspect ratio contact
KR100878454B1 (ko) 2008-02-28 2009-01-13 (주)실리콘화일 신호처리블록을 구비하는 적층형 마이크로폰과 그 제조방법
AU2009243918A1 (en) 2008-05-07 2009-11-12 Signostics Limited Docking system for medical diagnostic scanning using a handheld device
EP2230497A1 (de) 2008-06-09 2010-09-22 Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V. Diodenbolometer und ein Verfahren zur Herstellung eines Diodenbolometers
JP2009291514A (ja) 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
US7812418B2 (en) 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
TWI401975B (zh) * 2008-12-09 2013-07-11 Univ Nat Kaohsiung Applied Sci 具高分子基震盪薄膜之電容式超音波換能器的製作方法
WO2010082519A1 (ja) 2009-01-16 2010-07-22 株式会社日立メディコ 超音波探触子の製造方法および超音波探触子
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
US8315125B2 (en) 2009-03-18 2012-11-20 Sonetics Ultrasound, Inc. System and method for biasing CMUT elements
WO2010109205A2 (en) 2009-03-26 2010-09-30 Ntnu Technology Transfer As Cmut array
US8451693B2 (en) 2009-08-25 2013-05-28 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducer having compliant post structure
US8345508B2 (en) 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
US8222065B1 (en) 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
US8563345B2 (en) 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
US8476145B2 (en) 2010-10-13 2013-07-02 Monolithic 3D Inc. Method of fabricating a semiconductor device and structure
US8241931B1 (en) 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate
JP5404335B2 (ja) 2009-11-17 2014-01-29 キヤノン株式会社 電気機械変換装置及びその作製方法
US8647279B2 (en) 2010-06-10 2014-02-11 Siemens Medical Solutions Usa, Inc. Volume mechanical transducer for medical diagnostic ultrasound
US8957564B1 (en) 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5702966B2 (ja) 2010-08-02 2015-04-15 キヤノン株式会社 電気機械変換装置及びその作製方法
US8273610B2 (en) 2010-11-18 2012-09-25 Monolithic 3D Inc. Method of constructing a semiconductor device and structure
JP5734620B2 (ja) * 2010-10-27 2015-06-17 オリンパス株式会社 超音波プローブ装置及びその制御方法
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US8852103B2 (en) 2011-10-17 2014-10-07 Butterfly Network, Inc. Transmissive imaging and related apparatus and methods
US20130096433A1 (en) 2011-10-18 2013-04-18 The Regents Of The University Of Michigan System and Method for Unattended Monitoring of Blood Flow
US20130161702A1 (en) 2011-12-25 2013-06-27 Kun-Lung Chen Integrated mems device
KR101894393B1 (ko) 2011-12-28 2018-09-04 삼성전자주식회사 초음파 변환기 구조물, 초음파 변환기 및 초음파 변환기의 제조 방법
JP6329491B2 (ja) * 2012-03-13 2018-05-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 荷電電圧源を有する容量性マイクロマシン加工超音波トランスデューサ装置
KR101388141B1 (ko) 2012-05-31 2014-04-23 전자부품연구원 Ｃｍｏｓ 회로가 집적된 마이크로폰 및 그 제조방법
JP6071285B2 (ja) * 2012-07-06 2017-02-01 キヤノン株式会社 静電容量型トランスデューサ
US8735199B2 (en) 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
CA2795441A1 (en) 2012-10-19 2014-04-19 The Governors Of The University Of Alberta Top-orthogonal-to-bottom electrode (tobe) 2d cmut arrays for low-channel-count 3d imaging
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
US9470710B2 (en) * 2013-02-27 2016-10-18 Texas Instruments Incorporated Capacitive MEMS sensor devices
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體（ｃｍｏｓ）超音波換能器以及用於形成其之方法
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
JP6271887B2 (ja) * 2013-07-10 2018-01-31 キヤノン株式会社 静電容量型トランスデューサ、プローブ、及び被検体情報取得装置
JP5855050B2 (ja) * 2013-07-10 2016-02-09 キヤノン株式会社 トランスデューサ、被検体情報取得装置
US10806431B2 (en) * 2013-09-25 2020-10-20 Massachusetts Institute Of Technology Application specific integrated circuit with column-row-parallel architecture for ultrasonic imaging
CN105722609B (zh) * 2013-11-18 2018-03-06 皇家飞利浦有限公司 超声换能器组件
JP6482558B2 (ja) * 2013-12-12 2019-03-13 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． モノリシックに集積された三電極ｃｍｕｔ装置
US10330781B2 (en) * 2013-12-19 2019-06-25 B-K Medical Aps Ultrasound imaging transducer array with integrated apodization
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030048698A1 (en) 2001-09-07 2003-03-13 Siemens Medical Systems, Inc. Bias control of electrostatic transducers
US20100063397A1 (en) 2008-09-09 2010-03-11 Paul Wagner Multi-dimensional transducer array and beamforming for ultrasound imaging
US20100225200A1 (en) 2009-03-05 2010-09-09 Mario Kupnik Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
WO2010146838A2 (en) 2009-06-19 2010-12-23 Canon Kabushiki Kaisha Capacitive electromechanical transducer
JP2011004280A (ja) * 2009-06-19 2011-01-06 Canon Inc 静電容量型の電気機械変換装置

Also Published As

Publication number Publication date
TWI705858B (zh) 2020-10-01
EP3383277A1 (en) 2018-10-10
US20170157646A1 (en) 2017-06-08
KR20180088696A (ko) 2018-08-06
CA3006505A1 (en) 2017-06-08
ES2909488T3 (es) 2022-05-06
WO2017095988A1 (en) 2017-06-08
JP2019504534A (ja) 2019-02-14
EP3383277A4 (en) 2019-07-24
US9987661B2 (en) 2018-06-05
US10272471B2 (en) 2019-04-30
AU2016365309A1 (en) 2018-06-14
CN108366774A (zh) 2018-08-03
US20180353995A1 (en) 2018-12-13
AU2016365309B2 (en) 2021-08-19
EP3383277B1 (en) 2022-02-02
TW201739521A (zh) 2017-11-16

Similar Documents

Publication Publication Date Title
KR102121137B1 (ko) 용량성 미세 기계화된 초음파 트랜스듀서들(cmut들)의 바이어싱 및 관련 장치 및 방법들
US8787117B2 (en) Electromechanical transducer
US11813639B2 (en) Electrode arrangement for a pMUT and pMUT transducer array
US10084394B2 (en) Control apparatus for capacitive electromechanical transducer, and method of controlling the capacitive electromechanical transducer
US8869622B2 (en) Capacitive electromechanical transducer apparatus and method for adjusting its sensitivity
US10101303B2 (en) Capacitive micromachined ultrasonic transducer and test object information acquiring apparatus including capacitive micromachined ultrasonic transducer
JPWO2013125626A1 (ja) 超音波診断装置及び超音波探触子
US9986342B2 (en) Transducer, method for manufacturing transducer, and object information acquiring apparatus
JP2019504534A5 (enExample)
US11235352B2 (en) Capacitive micromachined ultrasonic transducer and manufacturing method thereof
US20220146338A1 (en) Vibration sensor and sensor module
US20150268566A1 (en) Vibration reduction apparatus, lithography apparatus, and method of manufacturing article
US20220236120A1 (en) Tactile Sensor and Method for Operating a Tactile Sensor
EP4149691A1 (en) An ultrasound transducer and a tiled array of ultrasound transducers
US20230051555A1 (en) Transducer and driving method thereof, and system
EP4287652A1 (en) Mems device and method for operating a mems device
KR20220148161A (ko) 정전 척 장치용 전원, 정전 척 장치, 및 디척 제어 방법
JP5855142B2 (ja) 静電容量型トランスデューサの制御装置、及び静電容量型トランスデューサの制御方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20230604

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20230604