KR102114513B1 - 전도성 접착제의 개선 - Google Patents
전도성 접착제의 개선 Download PDFInfo
- Publication number
- KR102114513B1 KR102114513B1 KR1020157003573A KR20157003573A KR102114513B1 KR 102114513 B1 KR102114513 B1 KR 102114513B1 KR 1020157003573 A KR1020157003573 A KR 1020157003573A KR 20157003573 A KR20157003573 A KR 20157003573A KR 102114513 B1 KR102114513 B1 KR 102114513B1
- Authority
- KR
- South Korea
- Prior art keywords
- particles
- signal
- conductive
- conductive adhesive
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1212489.7 | 2012-07-13 | ||
| GBGB1212489.7A GB201212489D0 (en) | 2012-07-13 | 2012-07-13 | Improvements in conductive adhesives |
| PCT/EP2013/064838 WO2014009552A2 (en) | 2012-07-13 | 2013-07-12 | Improvements in conductive adhesives |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150036524A KR20150036524A (ko) | 2015-04-07 |
| KR102114513B1 true KR102114513B1 (ko) | 2020-05-25 |
Family
ID=46799574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157003573A Expired - Fee Related KR102114513B1 (ko) | 2012-07-13 | 2013-07-12 | 전도성 접착제의 개선 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10344189B2 (https=) |
| EP (1) | EP2872580B1 (https=) |
| KR (1) | KR102114513B1 (https=) |
| CN (1) | CN104619801B (https=) |
| GB (1) | GB201212489D0 (https=) |
| IN (1) | IN2015MN00084A (https=) |
| TW (1) | TWI630256B (https=) |
| WO (1) | WO2014009552A2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6457255B2 (ja) * | 2014-12-10 | 2019-01-23 | デクセリアルズ株式会社 | 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 |
| CN104559827B (zh) * | 2014-12-29 | 2017-11-21 | 3M创新有限公司 | 可压缩的微米级聚合物颗粒及其用途、可固化组合物及其制备方法、压敏粘合剂、胶带 |
| KR20170125814A (ko) * | 2015-03-04 | 2017-11-15 | 세키스이가가쿠 고교가부시키가이샤 | 도통 페이스트, 전기 모듈 및 전기 모듈의 제조 방법 |
| CN106297959A (zh) * | 2016-11-01 | 2017-01-04 | 京东方科技集团股份有限公司 | 导电粒子、各向异性导电膜层及其制备方法和显示装置 |
| KR20200015445A (ko) * | 2017-06-01 | 2020-02-12 | 세키스이가가쿠 고교가부시키가이샤 | 도전 재료 및 접속 구조체 |
| KR20190015652A (ko) * | 2017-08-03 | 2019-02-14 | (주)트러스 | 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법 |
| CN112740483B (zh) * | 2018-10-03 | 2023-07-14 | 迪睿合株式会社 | 各向异性导电薄膜、连接结构体、连接结构体的制备方法 |
| CN110970153B (zh) * | 2019-11-29 | 2021-06-04 | 维沃移动通信有限公司 | 导电膜及电子设备 |
| CN118642289B (zh) * | 2024-08-16 | 2025-02-28 | Tcl华星光电技术有限公司 | 显示面板和显示装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003317826A (ja) * | 2002-04-26 | 2003-11-07 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤 |
| KR100650284B1 (ko) * | 2005-02-22 | 2006-11-27 | 제일모직주식회사 | 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU530410B2 (en) | 1978-02-21 | 1983-07-14 | Sintef | Preparing aqueous emulsions |
| US4338173A (en) | 1980-06-23 | 1982-07-06 | Allied Corporation | Catalytic isomerization process using photo-induced deligandation |
| US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
| JPH0410304A (ja) | 1990-04-25 | 1992-01-14 | Nec Corp | 異方性導電材料及び半導体集積回路素子の接続方法 |
| GB9115372D0 (en) | 1991-07-16 | 1991-08-28 | Sinvent As | Polymerisation process |
| US5674468A (en) | 1992-03-06 | 1997-10-07 | Nycomed Imaging As | Contrast agents comprising gas-containing or gas-generating polymer microparticles or microballoons |
| AU1354497A (en) | 1995-12-21 | 1997-07-14 | Drexel University | Hollow polymer microcapsules and method of producing |
| KR100539060B1 (ko) | 1997-10-28 | 2007-04-25 | 소니 케미카루 가부시키가이샤 | 이방도전성접착제및접착용막 |
| GB9822822D0 (en) | 1998-10-19 | 1998-12-16 | Dyno Particles As | Particles |
| CN1311005C (zh) | 1999-04-09 | 2007-04-18 | 迪纳尔生物技术公司 | 用于制备单分散聚合物颗粒的方法 |
| US7045050B2 (en) | 2001-07-31 | 2006-05-16 | Sekisui Chemical Co., Ltd. | Method for producing electroconductive particles |
| JP2003249287A (ja) | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
| US6942824B1 (en) | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| JP2004095269A (ja) | 2002-08-30 | 2004-03-25 | Idemitsu Kosan Co Ltd | 異方導電粒子及び異方導電性接着剤 |
| JP2004331910A (ja) | 2003-05-12 | 2004-11-25 | Seiko Epson Corp | 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器 |
| JP5010990B2 (ja) | 2007-06-06 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続方法 |
| KR20090073558A (ko) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | 감압마이크로캡슐이 분산된 이방성 도전 필름 |
| KR20100007035A (ko) * | 2008-07-11 | 2010-01-22 | 주식회사 효성 | 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름 |
| US7972905B2 (en) * | 2009-04-16 | 2011-07-05 | Texas Instruments Incorporated | Packaged electronic device having metal comprising self-healing die attach material |
| KR101184910B1 (ko) * | 2009-11-02 | 2012-09-20 | 회명산업 주식회사 | 저온 단시간 접착이 가능하고 리페어성이 우수한 이방 도전성 접착제 |
| CN104428723A (zh) | 2012-07-13 | 2015-03-18 | 锡克拜控股有限公司 | 鉴定计时器的方法 |
-
2012
- 2012-07-13 GB GBGB1212489.7A patent/GB201212489D0/en not_active Ceased
-
2013
- 2013-07-12 EP EP13735344.7A patent/EP2872580B1/en active Active
- 2013-07-12 KR KR1020157003573A patent/KR102114513B1/ko not_active Expired - Fee Related
- 2013-07-12 US US14/414,145 patent/US10344189B2/en not_active Expired - Fee Related
- 2013-07-12 IN IN84MUN2015 patent/IN2015MN00084A/en unknown
- 2013-07-12 CN CN201380047530.5A patent/CN104619801B/zh not_active Expired - Fee Related
- 2013-07-12 WO PCT/EP2013/064838 patent/WO2014009552A2/en not_active Ceased
- 2013-07-15 TW TW102125284A patent/TWI630256B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003317826A (ja) * | 2002-04-26 | 2003-11-07 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤 |
| KR100650284B1 (ko) * | 2005-02-22 | 2006-11-27 | 제일모직주식회사 | 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150036524A (ko) | 2015-04-07 |
| US10344189B2 (en) | 2019-07-09 |
| IN2015MN00084A (https=) | 2015-09-11 |
| EP2872580B1 (en) | 2019-12-04 |
| TWI630256B (zh) | 2018-07-21 |
| CN104619801A (zh) | 2015-05-13 |
| EP2872580A2 (en) | 2015-05-20 |
| WO2014009552A3 (en) | 2014-06-26 |
| CN104619801B (zh) | 2018-12-21 |
| TW201404859A (zh) | 2014-02-01 |
| GB201212489D0 (en) | 2012-08-29 |
| US20150175851A1 (en) | 2015-06-25 |
| WO2014009552A2 (en) | 2014-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
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| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
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| PR0701 | Registration of establishment |
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