KR102114513B1 - 전도성 접착제의 개선 - Google Patents

전도성 접착제의 개선 Download PDF

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Publication number
KR102114513B1
KR102114513B1 KR1020157003573A KR20157003573A KR102114513B1 KR 102114513 B1 KR102114513 B1 KR 102114513B1 KR 1020157003573 A KR1020157003573 A KR 1020157003573A KR 20157003573 A KR20157003573 A KR 20157003573A KR 102114513 B1 KR102114513 B1 KR 102114513B1
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KR
South Korea
Prior art keywords
particles
signal
conductive
conductive adhesive
height
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Expired - Fee Related
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KR1020157003573A
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English (en)
Korean (ko)
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KR20150036524A (ko
Inventor
케이스 레드포드
헬제 크리스티안센
Original Assignee
콘파트 에이에스
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Publication of KR20150036524A publication Critical patent/KR20150036524A/ko
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
KR1020157003573A 2012-07-13 2013-07-12 전도성 접착제의 개선 Expired - Fee Related KR102114513B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1212489.7 2012-07-13
GBGB1212489.7A GB201212489D0 (en) 2012-07-13 2012-07-13 Improvements in conductive adhesives
PCT/EP2013/064838 WO2014009552A2 (en) 2012-07-13 2013-07-12 Improvements in conductive adhesives

Publications (2)

Publication Number Publication Date
KR20150036524A KR20150036524A (ko) 2015-04-07
KR102114513B1 true KR102114513B1 (ko) 2020-05-25

Family

ID=46799574

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157003573A Expired - Fee Related KR102114513B1 (ko) 2012-07-13 2013-07-12 전도성 접착제의 개선

Country Status (8)

Country Link
US (1) US10344189B2 (https=)
EP (1) EP2872580B1 (https=)
KR (1) KR102114513B1 (https=)
CN (1) CN104619801B (https=)
GB (1) GB201212489D0 (https=)
IN (1) IN2015MN00084A (https=)
TW (1) TWI630256B (https=)
WO (1) WO2014009552A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6457255B2 (ja) * 2014-12-10 2019-01-23 デクセリアルズ株式会社 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
CN104559827B (zh) * 2014-12-29 2017-11-21 3M创新有限公司 可压缩的微米级聚合物颗粒及其用途、可固化组合物及其制备方法、压敏粘合剂、胶带
KR20170125814A (ko) * 2015-03-04 2017-11-15 세키스이가가쿠 고교가부시키가이샤 도통 페이스트, 전기 모듈 및 전기 모듈의 제조 방법
CN106297959A (zh) * 2016-11-01 2017-01-04 京东方科技集团股份有限公司 导电粒子、各向异性导电膜层及其制备方法和显示装置
KR20200015445A (ko) * 2017-06-01 2020-02-12 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
CN112740483B (zh) * 2018-10-03 2023-07-14 迪睿合株式会社 各向异性导电薄膜、连接结构体、连接结构体的制备方法
CN110970153B (zh) * 2019-11-29 2021-06-04 维沃移动通信有限公司 导电膜及电子设备
CN118642289B (zh) * 2024-08-16 2025-02-28 Tcl华星光电技术有限公司 显示面板和显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003317826A (ja) * 2002-04-26 2003-11-07 Shin Etsu Polymer Co Ltd 異方導電性接着剤
KR100650284B1 (ko) * 2005-02-22 2006-11-27 제일모직주식회사 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU530410B2 (en) 1978-02-21 1983-07-14 Sintef Preparing aqueous emulsions
US4338173A (en) 1980-06-23 1982-07-06 Allied Corporation Catalytic isomerization process using photo-induced deligandation
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH0410304A (ja) 1990-04-25 1992-01-14 Nec Corp 異方性導電材料及び半導体集積回路素子の接続方法
GB9115372D0 (en) 1991-07-16 1991-08-28 Sinvent As Polymerisation process
US5674468A (en) 1992-03-06 1997-10-07 Nycomed Imaging As Contrast agents comprising gas-containing or gas-generating polymer microparticles or microballoons
AU1354497A (en) 1995-12-21 1997-07-14 Drexel University Hollow polymer microcapsules and method of producing
KR100539060B1 (ko) 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 이방도전성접착제및접착용막
GB9822822D0 (en) 1998-10-19 1998-12-16 Dyno Particles As Particles
CN1311005C (zh) 1999-04-09 2007-04-18 迪纳尔生物技术公司 用于制备单分散聚合物颗粒的方法
US7045050B2 (en) 2001-07-31 2006-05-16 Sekisui Chemical Co., Ltd. Method for producing electroconductive particles
JP2003249287A (ja) 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
US6942824B1 (en) 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
JP2004095269A (ja) 2002-08-30 2004-03-25 Idemitsu Kosan Co Ltd 異方導電粒子及び異方導電性接着剤
JP2004331910A (ja) 2003-05-12 2004-11-25 Seiko Epson Corp 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器
JP5010990B2 (ja) 2007-06-06 2012-08-29 ソニーケミカル&インフォメーションデバイス株式会社 接続方法
KR20090073558A (ko) * 2007-12-31 2009-07-03 주식회사 효성 감압마이크로캡슐이 분산된 이방성 도전 필름
KR20100007035A (ko) * 2008-07-11 2010-01-22 주식회사 효성 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름
US7972905B2 (en) * 2009-04-16 2011-07-05 Texas Instruments Incorporated Packaged electronic device having metal comprising self-healing die attach material
KR101184910B1 (ko) * 2009-11-02 2012-09-20 회명산업 주식회사 저온 단시간 접착이 가능하고 리페어성이 우수한 이방 도전성 접착제
CN104428723A (zh) 2012-07-13 2015-03-18 锡克拜控股有限公司 鉴定计时器的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003317826A (ja) * 2002-04-26 2003-11-07 Shin Etsu Polymer Co Ltd 異方導電性接着剤
KR100650284B1 (ko) * 2005-02-22 2006-11-27 제일모직주식회사 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료

Also Published As

Publication number Publication date
KR20150036524A (ko) 2015-04-07
US10344189B2 (en) 2019-07-09
IN2015MN00084A (https=) 2015-09-11
EP2872580B1 (en) 2019-12-04
TWI630256B (zh) 2018-07-21
CN104619801A (zh) 2015-05-13
EP2872580A2 (en) 2015-05-20
WO2014009552A3 (en) 2014-06-26
CN104619801B (zh) 2018-12-21
TW201404859A (zh) 2014-02-01
GB201212489D0 (en) 2012-08-29
US20150175851A1 (en) 2015-06-25
WO2014009552A2 (en) 2014-01-16

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