GB201212489D0 - Improvements in conductive adhesives - Google Patents

Improvements in conductive adhesives

Info

Publication number
GB201212489D0
GB201212489D0 GBGB1212489.7A GB201212489A GB201212489D0 GB 201212489 D0 GB201212489 D0 GB 201212489D0 GB 201212489 A GB201212489 A GB 201212489A GB 201212489 D0 GB201212489 D0 GB 201212489D0
Authority
GB
United Kingdom
Prior art keywords
conductive adhesives
adhesives
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1212489.7A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conpart AS
Original Assignee
Conpart AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conpart AS filed Critical Conpart AS
Priority to GBGB1212489.7A priority Critical patent/GB201212489D0/en
Publication of GB201212489D0 publication Critical patent/GB201212489D0/en
Priority to KR1020157003573A priority patent/KR102114513B1/ko
Priority to EP13735344.7A priority patent/EP2872580B1/en
Priority to CN201380047530.5A priority patent/CN104619801B/zh
Priority to PCT/EP2013/064838 priority patent/WO2014009552A2/en
Priority to IN84MUN2015 priority patent/IN2015MN00084A/en
Priority to US14/414,145 priority patent/US10344189B2/en
Priority to TW102125284A priority patent/TWI630256B/zh
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
GBGB1212489.7A 2012-07-13 2012-07-13 Improvements in conductive adhesives Ceased GB201212489D0 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GBGB1212489.7A GB201212489D0 (en) 2012-07-13 2012-07-13 Improvements in conductive adhesives
KR1020157003573A KR102114513B1 (ko) 2012-07-13 2013-07-12 전도성 접착제의 개선
EP13735344.7A EP2872580B1 (en) 2012-07-13 2013-07-12 Improvements in conductive adhesives
CN201380047530.5A CN104619801B (zh) 2012-07-13 2013-07-12 导电粘接剂的改进
PCT/EP2013/064838 WO2014009552A2 (en) 2012-07-13 2013-07-12 Improvements in conductive adhesives
IN84MUN2015 IN2015MN00084A (https=) 2012-07-13 2013-07-12
US14/414,145 US10344189B2 (en) 2012-07-13 2013-07-12 Conductive adhesives
TW102125284A TWI630256B (zh) 2012-07-13 2013-07-15 經改良之導電黏著劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1212489.7A GB201212489D0 (en) 2012-07-13 2012-07-13 Improvements in conductive adhesives

Publications (1)

Publication Number Publication Date
GB201212489D0 true GB201212489D0 (en) 2012-08-29

Family

ID=46799574

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1212489.7A Ceased GB201212489D0 (en) 2012-07-13 2012-07-13 Improvements in conductive adhesives

Country Status (8)

Country Link
US (1) US10344189B2 (https=)
EP (1) EP2872580B1 (https=)
KR (1) KR102114513B1 (https=)
CN (1) CN104619801B (https=)
GB (1) GB201212489D0 (https=)
IN (1) IN2015MN00084A (https=)
TW (1) TWI630256B (https=)
WO (1) WO2014009552A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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JP6457255B2 (ja) * 2014-12-10 2019-01-23 デクセリアルズ株式会社 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
CN104559827B (zh) * 2014-12-29 2017-11-21 3M创新有限公司 可压缩的微米级聚合物颗粒及其用途、可固化组合物及其制备方法、压敏粘合剂、胶带
KR20170125814A (ko) * 2015-03-04 2017-11-15 세키스이가가쿠 고교가부시키가이샤 도통 페이스트, 전기 모듈 및 전기 모듈의 제조 방법
CN106297959A (zh) * 2016-11-01 2017-01-04 京东方科技集团股份有限公司 导电粒子、各向异性导电膜层及其制备方法和显示装置
KR20200015445A (ko) * 2017-06-01 2020-02-12 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
CN112740483B (zh) * 2018-10-03 2023-07-14 迪睿合株式会社 各向异性导电薄膜、连接结构体、连接结构体的制备方法
CN110970153B (zh) * 2019-11-29 2021-06-04 维沃移动通信有限公司 导电膜及电子设备
CN118642289B (zh) * 2024-08-16 2025-02-28 Tcl华星光电技术有限公司 显示面板和显示装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU530410B2 (en) 1978-02-21 1983-07-14 Sintef Preparing aqueous emulsions
US4338173A (en) 1980-06-23 1982-07-06 Allied Corporation Catalytic isomerization process using photo-induced deligandation
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH0410304A (ja) 1990-04-25 1992-01-14 Nec Corp 異方性導電材料及び半導体集積回路素子の接続方法
GB9115372D0 (en) 1991-07-16 1991-08-28 Sinvent As Polymerisation process
US5674468A (en) 1992-03-06 1997-10-07 Nycomed Imaging As Contrast agents comprising gas-containing or gas-generating polymer microparticles or microballoons
AU1354497A (en) 1995-12-21 1997-07-14 Drexel University Hollow polymer microcapsules and method of producing
KR100539060B1 (ko) 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 이방도전성접착제및접착용막
GB9822822D0 (en) 1998-10-19 1998-12-16 Dyno Particles As Particles
CN1311005C (zh) 1999-04-09 2007-04-18 迪纳尔生物技术公司 用于制备单分散聚合物颗粒的方法
US7045050B2 (en) 2001-07-31 2006-05-16 Sekisui Chemical Co., Ltd. Method for producing electroconductive particles
JP2003249287A (ja) 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
JP2003317826A (ja) * 2002-04-26 2003-11-07 Shin Etsu Polymer Co Ltd 異方導電性接着剤
US6942824B1 (en) 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
JP2004095269A (ja) 2002-08-30 2004-03-25 Idemitsu Kosan Co Ltd 異方導電粒子及び異方導電性接着剤
JP2004331910A (ja) 2003-05-12 2004-11-25 Seiko Epson Corp 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器
KR100650284B1 (ko) * 2005-02-22 2006-11-27 제일모직주식회사 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료
JP5010990B2 (ja) 2007-06-06 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 接続方法
KR20090073558A (ko) * 2007-12-31 2009-07-03 주식회사 효성 감압마이크로캡슐이 분산된 이방성 도전 필름
KR20100007035A (ko) * 2008-07-11 2010-01-22 주식회사 효성 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름
US7972905B2 (en) * 2009-04-16 2011-07-05 Texas Instruments Incorporated Packaged electronic device having metal comprising self-healing die attach material
KR101184910B1 (ko) * 2009-11-02 2012-09-20 회명산업 주식회사 저온 단시간 접착이 가능하고 리페어성이 우수한 이방 도전성 접착제
CN104428723A (zh) 2012-07-13 2015-03-18 锡克拜控股有限公司 鉴定计时器的方法

Also Published As

Publication number Publication date
KR20150036524A (ko) 2015-04-07
US10344189B2 (en) 2019-07-09
IN2015MN00084A (https=) 2015-09-11
EP2872580B1 (en) 2019-12-04
KR102114513B1 (ko) 2020-05-25
TWI630256B (zh) 2018-07-21
CN104619801A (zh) 2015-05-13
EP2872580A2 (en) 2015-05-20
WO2014009552A3 (en) 2014-06-26
CN104619801B (zh) 2018-12-21
TW201404859A (zh) 2014-02-01
US20150175851A1 (en) 2015-06-25
WO2014009552A2 (en) 2014-01-16

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)