CN104619801B - 导电粘接剂的改进 - Google Patents

导电粘接剂的改进 Download PDF

Info

Publication number
CN104619801B
CN104619801B CN201380047530.5A CN201380047530A CN104619801B CN 104619801 B CN104619801 B CN 104619801B CN 201380047530 A CN201380047530 A CN 201380047530A CN 104619801 B CN104619801 B CN 104619801B
Authority
CN
China
Prior art keywords
particle
signal
electrically conducting
conducting adhesive
instruction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380047530.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN104619801A (zh
Inventor
基思·雷德福德
赫尔吉·克里斯蒂安森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compass Academy Of Sciences
Original Assignee
Compass Academy Of Sciences
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compass Academy Of Sciences filed Critical Compass Academy Of Sciences
Publication of CN104619801A publication Critical patent/CN104619801A/zh
Application granted granted Critical
Publication of CN104619801B publication Critical patent/CN104619801B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
CN201380047530.5A 2012-07-13 2013-07-12 导电粘接剂的改进 Expired - Fee Related CN104619801B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1212489.7 2012-07-13
GBGB1212489.7A GB201212489D0 (en) 2012-07-13 2012-07-13 Improvements in conductive adhesives
PCT/EP2013/064838 WO2014009552A2 (en) 2012-07-13 2013-07-12 Improvements in conductive adhesives

Publications (2)

Publication Number Publication Date
CN104619801A CN104619801A (zh) 2015-05-13
CN104619801B true CN104619801B (zh) 2018-12-21

Family

ID=46799574

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380047530.5A Expired - Fee Related CN104619801B (zh) 2012-07-13 2013-07-12 导电粘接剂的改进

Country Status (8)

Country Link
US (1) US10344189B2 (https=)
EP (1) EP2872580B1 (https=)
KR (1) KR102114513B1 (https=)
CN (1) CN104619801B (https=)
GB (1) GB201212489D0 (https=)
IN (1) IN2015MN00084A (https=)
TW (1) TWI630256B (https=)
WO (1) WO2014009552A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6457255B2 (ja) * 2014-12-10 2019-01-23 デクセリアルズ株式会社 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
CN104559827B (zh) * 2014-12-29 2017-11-21 3M创新有限公司 可压缩的微米级聚合物颗粒及其用途、可固化组合物及其制备方法、压敏粘合剂、胶带
CN107210082A (zh) * 2015-03-04 2017-09-26 积水化学工业株式会社 导电膏、电气模块及电气模块的制造方法
CN106297959A (zh) 2016-11-01 2017-01-04 京东方科技集团股份有限公司 导电粒子、各向异性导电膜层及其制备方法和显示装置
CN110622258A (zh) * 2017-06-01 2019-12-27 积水化学工业株式会社 导电材料以及连接结构体
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
KR20210033513A (ko) * 2018-10-03 2021-03-26 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
CN110970153B (zh) * 2019-11-29 2021-06-04 维沃移动通信有限公司 导电膜及电子设备
CN118642289B (zh) * 2024-08-16 2025-02-28 Tcl华星光电技术有限公司 显示面板和显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249287A (ja) * 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
KR20090073558A (ko) * 2007-12-31 2009-07-03 주식회사 효성 감압마이크로캡슐이 분산된 이방성 도전 필름

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU530410B2 (en) 1978-02-21 1983-07-14 Sintef Preparing aqueous emulsions
US4338173A (en) 1980-06-23 1982-07-06 Allied Corporation Catalytic isomerization process using photo-induced deligandation
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH0410304A (ja) 1990-04-25 1992-01-14 Nec Corp 異方性導電材料及び半導体集積回路素子の接続方法
GB9115372D0 (en) 1991-07-16 1991-08-28 Sinvent As Polymerisation process
US5674468A (en) 1992-03-06 1997-10-07 Nycomed Imaging As Contrast agents comprising gas-containing or gas-generating polymer microparticles or microballoons
WO1997022409A1 (en) 1995-12-21 1997-06-26 Drexel University Hollow polymer microcapsules and method of producing
US5965064A (en) 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
GB9822822D0 (en) 1998-10-19 1998-12-16 Dyno Particles As Particles
US7217762B1 (en) 1999-04-09 2007-05-15 Invitrogen Corporation Process for the preparation of monodisperse polymer particles
US7045050B2 (en) 2001-07-31 2006-05-16 Sekisui Chemical Co., Ltd. Method for producing electroconductive particles
JP2003317826A (ja) * 2002-04-26 2003-11-07 Shin Etsu Polymer Co Ltd 異方導電性接着剤
US6942824B1 (en) 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
JP2004095269A (ja) 2002-08-30 2004-03-25 Idemitsu Kosan Co Ltd 異方導電粒子及び異方導電性接着剤
JP2004331910A (ja) 2003-05-12 2004-11-25 Seiko Epson Corp 異方導電性接着剤、実装方法、電気光学装置モジュールおよび電子機器
KR100650284B1 (ko) * 2005-02-22 2006-11-27 제일모직주식회사 도전성능이 우수한 고분자 수지 미립자, 전도성 미립자 및이를 포함한 이방 전도성 접속재료
JP5010990B2 (ja) * 2007-06-06 2012-08-29 ソニーケミカル&インフォメーションデバイス株式会社 接続方法
KR20100007035A (ko) * 2008-07-11 2010-01-22 주식회사 효성 이방성 도전 필름의 제조방법 및 이에 의해 제조된 이방성도전 필름
US7972905B2 (en) * 2009-04-16 2011-07-05 Texas Instruments Incorporated Packaged electronic device having metal comprising self-healing die attach material
KR101184910B1 (ko) * 2009-11-02 2012-09-20 회명산업 주식회사 저온 단시간 접착이 가능하고 리페어성이 우수한 이방 도전성 접착제
WO2014009562A1 (en) 2012-07-13 2014-01-16 Sicpa Holding Sa Method and system for authenticating a timepiece

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249287A (ja) * 2002-02-25 2003-09-05 Shin Etsu Polymer Co Ltd 異方導電性接着剤、ヒートシールコネクター及び接続構造
KR20090073558A (ko) * 2007-12-31 2009-07-03 주식회사 효성 감압마이크로캡슐이 분산된 이방성 도전 필름

Also Published As

Publication number Publication date
US10344189B2 (en) 2019-07-09
IN2015MN00084A (https=) 2015-09-11
KR102114513B1 (ko) 2020-05-25
KR20150036524A (ko) 2015-04-07
TWI630256B (zh) 2018-07-21
WO2014009552A3 (en) 2014-06-26
EP2872580A2 (en) 2015-05-20
CN104619801A (zh) 2015-05-13
TW201404859A (zh) 2014-02-01
US20150175851A1 (en) 2015-06-25
WO2014009552A2 (en) 2014-01-16
EP2872580B1 (en) 2019-12-04
GB201212489D0 (en) 2012-08-29

Similar Documents

Publication Publication Date Title
CN104619801B (zh) 导电粘接剂的改进
KR950000710B1 (ko) 이방도전성 접착제 조성물
CN103178033B (zh) 由包括导电微球的各向异性导电膜连接的半导体装置
TWI647886B (zh) Anisotropic conductive film, connection structure, connection structure manufacturing method and connection method
KR101410185B1 (ko) 이방성 도전 접착 필름, 접속 구조체 및 그 제조 방법
KR20120124470A (ko) 이방성 도전 필름, 접합체 및 접속 방법
KR101151133B1 (ko) 접착 필름, 및 접착 필름의 제조 방법
CN101689409A (zh) 各向异性导电材料、连接结构体及其制造方法
CN108475558A (zh) 各向异性导电膜、其制造方法和连接结构体
CN109983629B (zh) 各向异性导电膜
CN109074894A (zh) 各向异性导电膜
CN109417233A (zh) 各向异性导电膜
TWI468486B (zh) 連接膠膜、接合體以及其製造方法
TW202419582A (zh) 樹脂粒子、導電性粒子、導電材料及連接構造體
TWI852907B (zh) 導電粒子的選別方法、電路連接材料、連接結構體及其製造方法
JPH07268303A (ja) 異方導電性接着剤組成物
KR102743445B1 (ko) 도전입자, 도전재료 및 접속 구조체
TWI888361B (zh) 異向性導電膜、連接結構體、連接結構體之製造方法
JP2018104653A (ja) 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
KR100509109B1 (ko) 이방성 도전 필름용 조성물
JP4538266B2 (ja) 接着フィルム、接着剤付き基板の製造方法、及び接着フィルムの製造方法
KR102422589B1 (ko) 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
KR20080061492A (ko) 색상변화 기능을 갖는 이방성 도전 필름
KR102545861B1 (ko) 도전 재료
KR20050106255A (ko) 적층구조를 갖는 이등방 전도성 접착제 이를 이용한 필름

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20181221

Termination date: 20210712

CF01 Termination of patent right due to non-payment of annual fee