KR102106923B1 - 반도체 가공시트 및 반도체 장치의 제조방법 - Google Patents

반도체 가공시트 및 반도체 장치의 제조방법 Download PDF

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Publication number
KR102106923B1
KR102106923B1 KR1020130104715A KR20130104715A KR102106923B1 KR 102106923 B1 KR102106923 B1 KR 102106923B1 KR 1020130104715 A KR1020130104715 A KR 1020130104715A KR 20130104715 A KR20130104715 A KR 20130104715A KR 102106923 B1 KR102106923 B1 KR 102106923B1
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KR
South Korea
Prior art keywords
resin
resin layer
adhesive layer
layer
olefin
Prior art date
Application number
KR1020130104715A
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English (en)
Korean (ko)
Other versions
KR20140031134A (ko
Inventor
나오키 타야
마사시 우에다
마사하루 이토
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20140031134A publication Critical patent/KR20140031134A/ko
Application granted granted Critical
Publication of KR102106923B1 publication Critical patent/KR102106923B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020130104715A 2012-09-04 2013-09-02 반도체 가공시트 및 반도체 장치의 제조방법 KR102106923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-193952 2012-09-04
JP2012193952A JP6001964B2 (ja) 2012-09-04 2012-09-04 半導体加工シート及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20140031134A KR20140031134A (ko) 2014-03-12
KR102106923B1 true KR102106923B1 (ko) 2020-05-06

Family

ID=50609055

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130104715A KR102106923B1 (ko) 2012-09-04 2013-09-02 반도체 가공시트 및 반도체 장치의 제조방법

Country Status (3)

Country Link
JP (1) JP6001964B2 (ja)
KR (1) KR102106923B1 (ja)
TW (1) TWI616509B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6703485B2 (ja) * 2014-09-29 2020-06-03 リンテック株式会社 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法
JP6242351B2 (ja) * 2015-01-05 2017-12-06 グンゼ株式会社 ダイシング用基体フイルム、ダイシングフイルム、及びダイシング用基体フイルムの製造方法
DE112016006018T5 (de) * 2015-12-24 2018-09-20 Toyota Jidosha Kabushiki Kaisha Solarbatteriemodul
JP7025138B2 (ja) * 2017-06-15 2022-02-24 三井化学東セロ株式会社 粘着性積層フィルムおよび電子装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ
JP2008153586A (ja) 2006-12-20 2008-07-03 Gunze Ltd ダイシング用基体フイルム
WO2011122428A1 (ja) 2010-03-31 2011-10-06 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715087B2 (ja) 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
DE19536043A1 (de) * 1995-09-28 1997-04-10 Hoechst Ag Polyolefinfolie mit Cycloolefinpolymer, Verfahren zu ihrer Herstellung und ihre Verwendung
US20050031822A1 (en) * 2003-08-07 2005-02-10 Mitsui Chemicals, Inc. Adhesive sheet
JP2006156754A (ja) 2004-11-30 2006-06-15 Furukawa Electric Co Ltd:The ダイシングダイボンドテープ
TW201043658A (en) * 2009-06-15 2010-12-16 Sumitomo Bakelite Co Temporarily fixing agent for semiconductor wafer and method for producing semiconductor device using the same
JP5406615B2 (ja) * 2009-07-15 2014-02-05 日東電工株式会社 透明フィルムおよび該フィルムを用いた表面保護フィルム
JP2011199307A (ja) * 2011-06-06 2011-10-06 Hitachi Chem Co Ltd 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012670A (ja) 2005-06-28 2007-01-18 Furukawa Electric Co Ltd:The 粘接着テープ
JP2008153586A (ja) 2006-12-20 2008-07-03 Gunze Ltd ダイシング用基体フイルム
WO2011122428A1 (ja) 2010-03-31 2011-10-06 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート

Also Published As

Publication number Publication date
TW201420713A (zh) 2014-06-01
TWI616509B (zh) 2018-03-01
JP6001964B2 (ja) 2016-10-05
KR20140031134A (ko) 2014-03-12
JP2014049719A (ja) 2014-03-17

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