KR102106923B1 - 반도체 가공시트 및 반도체 장치의 제조방법 - Google Patents
반도체 가공시트 및 반도체 장치의 제조방법 Download PDFInfo
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- KR102106923B1 KR102106923B1 KR1020130104715A KR20130104715A KR102106923B1 KR 102106923 B1 KR102106923 B1 KR 102106923B1 KR 1020130104715 A KR1020130104715 A KR 1020130104715A KR 20130104715 A KR20130104715 A KR 20130104715A KR 102106923 B1 KR102106923 B1 KR 102106923B1
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- resin
- resin layer
- adhesive layer
- layer
- olefin
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- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012193952A JP6001964B2 (ja) | 2012-09-04 | 2012-09-04 | 半導体加工シート及び半導体装置の製造方法 |
JPJP-P-2012-193952 | 2012-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140031134A KR20140031134A (ko) | 2014-03-12 |
KR102106923B1 true KR102106923B1 (ko) | 2020-05-06 |
Family
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Family Applications (1)
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KR1020130104715A KR102106923B1 (ko) | 2012-09-04 | 2013-09-02 | 반도체 가공시트 및 반도체 장치의 제조방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6001964B2 (ja) |
KR (1) | KR102106923B1 (ja) |
TW (1) | TWI616509B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2016052444A1 (ja) * | 2014-09-29 | 2016-04-07 | リンテック株式会社 | 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法 |
JP6242351B2 (ja) * | 2015-01-05 | 2017-12-06 | グンゼ株式会社 | ダイシング用基体フイルム、ダイシングフイルム、及びダイシング用基体フイルムの製造方法 |
DE112016006018T5 (de) * | 2015-12-24 | 2018-09-20 | Toyota Jidosha Kabushiki Kaisha | Solarbatteriemodul |
JP7025138B2 (ja) * | 2017-06-15 | 2022-02-24 | 三井化学東セロ株式会社 | 粘着性積層フィルムおよび電子装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007012670A (ja) | 2005-06-28 | 2007-01-18 | Furukawa Electric Co Ltd:The | 粘接着テープ |
JP2008153586A (ja) | 2006-12-20 | 2008-07-03 | Gunze Ltd | ダイシング用基体フイルム |
WO2011122428A1 (ja) | 2010-03-31 | 2011-10-06 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715087B2 (ja) | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
DE19536043A1 (de) * | 1995-09-28 | 1997-04-10 | Hoechst Ag | Polyolefinfolie mit Cycloolefinpolymer, Verfahren zu ihrer Herstellung und ihre Verwendung |
US20050031822A1 (en) * | 2003-08-07 | 2005-02-10 | Mitsui Chemicals, Inc. | Adhesive sheet |
JP2006156754A (ja) | 2004-11-30 | 2006-06-15 | Furukawa Electric Co Ltd:The | ダイシングダイボンドテープ |
TW201043658A (en) * | 2009-06-15 | 2010-12-16 | Sumitomo Bakelite Co | Temporarily fixing agent for semiconductor wafer and method for producing semiconductor device using the same |
JP5406615B2 (ja) * | 2009-07-15 | 2014-02-05 | 日東電工株式会社 | 透明フィルムおよび該フィルムを用いた表面保護フィルム |
JP2011199307A (ja) * | 2011-06-06 | 2011-10-06 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
-
2012
- 2012-09-04 JP JP2012193952A patent/JP6001964B2/ja active Active
-
2013
- 2013-08-09 TW TW102128586A patent/TWI616509B/zh active
- 2013-09-02 KR KR1020130104715A patent/KR102106923B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007012670A (ja) | 2005-06-28 | 2007-01-18 | Furukawa Electric Co Ltd:The | 粘接着テープ |
JP2008153586A (ja) | 2006-12-20 | 2008-07-03 | Gunze Ltd | ダイシング用基体フイルム |
WO2011122428A1 (ja) | 2010-03-31 | 2011-10-06 | リンテック株式会社 | ダイシングシート用基材フィルムおよびダイシングシート |
Also Published As
Publication number | Publication date |
---|---|
TWI616509B (zh) | 2018-03-01 |
KR20140031134A (ko) | 2014-03-12 |
JP6001964B2 (ja) | 2016-10-05 |
JP2014049719A (ja) | 2014-03-17 |
TW201420713A (zh) | 2014-06-01 |
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