KR102105874B1 - Socket module for testing semiconductor package and semiconductor package docking plate having the same - Google Patents

Abstract

The present invention provides a socket module for testing a semiconductor package and a semiconductor docking plate providing the same. The socket module for testing a semiconductor package comprises: a base having a body forming a mounting hole and a support projection formed on an inner circumferential surface defining the mounting hole of the body and the mounting hole of the body; a pocket having the body forming an accommodating hole accommodating the semiconductor package, a target protrusion unit to be a target protrusion on the support projection while the body is inserted into the mounting hole, and a protrusion groove formed concave on an outer surface of the body; and a socket having a holder coupled to the body, a protruding arm extending from the holder in a protruding direction with respect to a plane formed by the holder, and a contact pad positioned on the bottom surface side of the pocket while being engaged with the holder and mediating the electrical connection between the semiconductor package and an inspection circuit board.

Description

Socket module for semiconductor package test and semiconductor package docking plate equipped with the same.SOCKET MODULE FOR TESTING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE DOCKING PLATE HAVING THE SAME}

The present invention relates to a socket module for testing a semiconductor package and a docking plate for a semiconductor package having the same.

In general, a semiconductor package completed by a semiconductor manufacturing process is shipped when it is classified as a good product after being checked for proper electrical operation characteristics through a test (inspection) process.

In this inspection process, the semiconductor package is electrically connected to the inspection circuit board while being inserted into the socket module. Specifically, the ball of the semiconductor package is electrically connected to the electrode of the circuit board via the socket of the socket module. Under this connection, when power is applied to the semiconductor package from the circuit board, the normal operation of the semiconductor package is determined based on whether the power is abnormal due to the semiconductor package.

During repeated inspections above, the socket is deformed by a ball in the semiconductor package. Thereby, the above socket must be replaced at regular intervals while using the socket module. Accordingly, a method for economically performing the process for replacing the socket may be considered.

An object of the present invention is to provide a socket module for semiconductor package testing and a socket module for semiconductor package testing in a state in which a socket module for semiconductor package testing is installed on a semiconductor package docking plate to replace a modified socket in a simple manner. To provide a semiconductor package docking plate.

A socket module for testing a semiconductor package according to an aspect of the present invention for realizing the above object includes a base having a body having a mounting hole and a support jaw formed on an inner circumferential surface defining the mounting hole among the bodies; A main body having an accommodation hole for receiving a semiconductor package and a protruding protrusion formed on an outer surface of the main body, a target protrusion that is a target of the support jaw while the main body is inserted into the mounting hole and a concave groove formed on the outer surface of the main body A pocket having a groove; And a holder arm coupled to the main body and extending from the holder in a protruding direction with respect to a plane formed by the holder, and positioned on a bottom surface side of the pocket while being engaged with the holder and the holder arm caught in the locking groove to support the semiconductor package. And it may include a socket having a contact pad for mediating the electrical connection between the semiconductor package and the inspection circuit board.

Here, the locking arm is defined by a pair of adjacent cutting lines formed in the holder, and may be bent with respect to the rest of the holder to direct the protruding direction.

Here, the locking arm includes a connecting portion connected to the holder, a locking portion bent at the connecting portion and arranged along the protruding direction, and the locking portion includes an enlarged area that increases in width as it moves away from the connecting portion can do.

Here, the locking groove may include an entry area that enters while the locking arm is bent, and a locking area that has a width smaller than that of the entering area and is bent when the locking arm is bent.

Here, an elastic coupling unit may be further provided to extend in the form of a cantilever from the main body and adhere to an inner circumferential surface defining the mounting hole in the body, so that the pocket is elastically coupled to the base.

Here, the elastic coupling unit may be formed to correspond to a pair of adjacent corners of the body at the corners of the body.

Here, the resilient coupling unit may include a protruding region protruding from an edge of the main body at an outer portion thereof and contacting the body.

A socket module for testing a semiconductor package according to another aspect of the present invention includes a base having a body having a mounting hole and a support jaw formed on an inner circumferential surface defining the mounting hole among the bodies; A pocket having a main body having an accommodation hole for receiving a semiconductor package and a target protrusion formed protrudingly on an outer surface of the main body to be caught by the support jaw while the main body is inserted into the mounting hole; And a one-touch coupling to the lower side of the main body, the holder having a rectangular ring shape, and being coupled to the holder, located on the bottom side of the pocket to close the lower portion of the receiving hole and supporting the semiconductor package to support the semiconductor package and inspection circuit. And a socket having a contact pad that mediates electrical connection between the substrates.

Here, an elastic coupling unit may be further provided to extend in the form of a cantilever from the main body and adhere to an inner circumferential surface defining the mounting hole in the body, so that the pocket is elastically coupled to the base.

Here, the resilient coupling unit, protruding from the edge of the main body has a protruding area in contact with the body, and may be formed in an arc shape corresponding to a pair of adjacent corners of the body at the corner of the body.

Here, the pocket further includes a locking groove concavely formed on the outer surface of the main body, the locking groove includes an entry area and an engagement area having a smaller width than the entrance area, and the socket includes the holder It is defined by a pair of cutting lines formed in the bent in the protruding direction with respect to the plane formed by the holder, it may further include a hook arm that is finally bent after entering the entry area and is caught in the engagement area.

A semiconductor package docking plate according to another aspect of the present invention, a frame having a plurality of socket module holes arranged in a grid; Inserted into the socket module hole, a base having a mounting hole, a pocket inserted into the mounting hole and receiving a semiconductor package, one-touch coupled to a lower side of the pocket and supporting the semiconductor package to inspect the semiconductor package A socket module for testing a semiconductor package having a socket for mediating electrical connection between circuit boards; And it is mounted on the frame to correspond to the socket module hole, and may include an installation table to which the socket module for testing the semiconductor package is connected.

According to the socket package for semiconductor package test and the semiconductor package docking plate having the same according to the present invention configured as described above, even when the socket module is installed in the frame, it is in close contact or supported by an elastic coupling unit against the base path of the socket module. The pocket supported by the chin is separated, and the socket having the locking arm that is one-touch coupled to the locking groove of the pocket can be separated.

Thereby, the cumbersome process of removing the mounting table from the frame of the docking plate, removing the socket module from the mounting table again, and separating the socket from the socket module can be simplified in two stages of operation: separation of the pocket and the socket.

1 is a partial perspective view of a semiconductor package docking plate 100 according to an embodiment of the present invention.
FIG. 2 is an assembled perspective view of the socket module 200 for testing the semiconductor package of FIG. 1.
3 is an exploded perspective view of the socket module 200 for testing the semiconductor package of FIG. 2.
4 is a partial plan view of the elastic coupling unit 250 in FIG. 2.
5 is an exploded perspective view of the pocket 230 and the socket 270 of FIG. 3.
6 is a partially enlarged perspective view of the locking groove 235 of the pocket 230 of FIG. 5.

Hereinafter, a socket module for testing a semiconductor package according to a preferred embodiment of the present invention and a semiconductor package docking plate having the same will be described in detail with reference to the accompanying drawings. In this specification, the same or similar reference numerals are assigned to the same or similar configurations in different embodiments, and the description is replaced with the first description.

1 is a partial perspective view of a semiconductor package docking plate 100 according to an embodiment of the present invention.

Referring to this drawing, the semiconductor package docking plate 100 is mounted on the inspection circuit board, and is a component involved in connecting the semiconductor package to the electrodes of the circuit board. The semiconductor package docking plate 100 may specifically have a frame 110, a socket module 130, and an installation table 150.

The frame 110 is a generally rectangular plate material, and may be installed on the inspection circuit board. The frame 110 has a plurality of socket module holes 115. The plurality of socket module holes 115 may be arranged in a grid shape.

The socket module 130 is disposed to be inserted into the socket module hole 115, and is configured to accommodate a semiconductor package (not shown). Since a single socket module 130 is inserted into each of the plurality of socket module holes 115, a plurality of socket modules 130 may also be provided. The socket module 130 may simply have a base 131, a pocket 133, and a socket 135. Here, the base 131 is screwed to the mounting base 150 so as to be located in the socket module hole 115, while the pocket 133 can be coupled / released to the base 131 with one touch. The socket 135 can also be coupled / disengaged with one touch to the pocket 133. The specific configuration of the socket module 130 will be described later with reference to FIG. 2 and the like.

The mounting table 150 is a medium for coupling the socket module 130 to the frame 110. Specifically, the mounting table 150 is mounted on the frame 110 to correspond to the socket module hole 115. In addition, the mounting module 150 is connected to the socket module 130, specifically the base 131. At this time, the base 131 is disposed on the lower side of the mounting table 150, the pocket 133 may be located accessible from the outside through the opening 155 of the mounting table 150.

According to this configuration, when the socket 135 installed in the pocket 133 is to be replaced, the replacement process can be simplified.

Specifically, the pocket 133 on which the socket 135 is mounted may be separated directly from the base 131. At this time, the separation of the pocket 133 from the base 131 is made in one touch.

The separated pocket 133 may be taken out through the opening 155 of the mounting table 150. Accordingly, in order to separate the pocket 133 or the socket module 130, it is not necessary to remove the mounting table 150 from the frame 110 as a premise. In other words, it is possible to simplify the cumbersome process of separating the mounting table 150 from the frame 110, removing the socket module 130 from the mounting table 150, and removing the socket 135 from the socket module 130. It will be. Further, in the separated pocket 133, the socket 135 can also be separated by one touch.

In the above description of the configuration of the socket module 130, for convenience, the reference numerals of the socket module will be described by changing from 130 to 200.

First, FIG. 2 is an assembled perspective view of the socket module 200 for testing the semiconductor package of FIG. 1.

Referring to this drawing, the socket module 200 for semiconductor package testing may have a base 210, a pocket 230, an elastic coupling unit 250, and a socket 270.

The base 210 is a configuration in which the pocket 230 is mounted and the elastic coupling unit 250 is coupled. The base 210 is a mounting hole 213 (see FIG. 3) opened in the center, and may have a generally rectangular ring shape.

The pocket 230 is inserted into the mounting hole 213 of the base 210 and coupled to the base 210. The pocket 230 is a trough shape with an open top. A receiving hole 232 (see FIG. 3) for receiving the semiconductor package is formed through the center of the pocket 230.

The elastic coupling unit 250 is configured to be coupled to the base 210 while the pocket 230 is mounted on the base 210. The resilient coupling unit 250 is formed in a cantilever shape in the pocket 230 and can be in close contact with the base 210.

The socket 270 is coupled to the lower side of the main body 231 (see FIG. 3) to close the lower end of the receiving hole 232 of the pocket 230. The socket 270 is a component that mediates the electrical connection between the electrode of the semiconductor package (not shown) accommodated in the receiving hole 232 and the electrode of the test circuit board (not shown).

Next, FIG. 3 is an exploded perspective view of the socket module 200 for testing the semiconductor package of FIG. 2.

Referring to this drawing, the base 210 may further include a body 211, a seating portion 215, and a support jaw 217 in addition to the above-described mounting hole 213.

The body 211 is formed with a mounting hole 213 and constitutes a skeleton of the base 210. In this embodiment, the body 211 has a generally rectangular ring shape.

The seating portion 215 is a portion corresponding to the upper portion of the inner circumferential surface defining the mounting hole 213 of the body 211. The elastic coupling unit 250 may be in close contact with the seating portion 215.

The support jaw 217 is configured to protrude into the mounting hole 213. The support jaw 217 is disposed at a position capable of supporting the body 231 of the pocket 230. The support jaw 217 is exemplified as continuously protruding along the inner circumferential surface of the body 211 defining the mounting hole 213, but may be formed of one or more protrusions spaced apart from each other.

The pocket 230 may further have a target protrusion 234 and a locking groove 235 in addition to the main body 231.

The main body 231 may further have a tool groove 233 in addition to the accommodation hole 232. The tool groove 233 is configured to insert a tool for separating the body 231 from the body 211. To this end, the tool grooves 233 may be formed on two of the four inner circumferential surfaces of the main body 231 facing each other.

The target protrusion 234 is configured to be a target supported by the support jaw 217 while the main body 231 is inserted into the mounting hole 213. The target protrusion 234 may be formed on an upper surface of the outer surface of the main body 231. Further, the target protrusion 234 is illustrated in a form extending continuously along the outer circumferential direction of the main body 231, but may be formed of one or more protrusions.

The locking groove 235 is concavely formed on the outer surface of the main body 231. The locking groove 235 is illustrated as being located on the lower side of the main body 231, but may be formed at another position.

The elastic coupling unit 250 is formed on the main body 231, and is configured to stably maintain the state in which the main body 231 is mounted on the body 211. The elastic coupling unit 250 may be located at a corner of the main body 231. In this embodiment, corresponding to the four corners of the main body 231, the elastic coupling unit 250 is illustrated for each corner. Furthermore, the elastic coupling unit 250 may be formed by processing a portion of the target protrusions 234.

The socket 270 is coupled to the main body 231 to close the open bottom of the receiving hole 232. Thereby, the socket 270 supports the semiconductor package accommodated in the receiving hole 232, and serves to mediate electrical connection between the semiconductor package and the inspection circuit board.

Now, with reference to Figure 4, the configuration of the elastic coupling unit 250 will be described in detail.

4 is a partial plan view of the elastic coupling unit 250 in FIG. 2.

Referring to this drawing, the resilient coupling unit 250 has a cantilever 251 formed in a corner portion of the main body 231. The cantilever 251 may be formed by forming a machining groove 252 in a corner portion of the main body 231. The machining groove 252 may have a shape in which a bit for drilling is vertically lowered and then injected into the main body 231 and then exited in a horizontal direction.

The cantilever 251 may be in close contact with the seating portion 215 of the body 211. For effective contact with the seating portion 215, first and second protruding regions 253 and 255 may be formed outside the cantilever beam 251. The first and second protruding regions 253 and 255 protrude in the direction toward the seating portion 215 than the extension lines of the first and second corners 231a and 231b of the main body 231, respectively. Thereby, the first and second protruding regions 253 and 255 may be in close contact with a pair of seating portions 215 adjacent to each other, respectively. To this end, the cantilever 251 may be formed in a circular arc shape to correspond to an adjacent pair of edges of the body 211. Furthermore, the first and second edges 231a and 231b of the body 231 may be placed in a relationship of being spaced apart or lightly contacted with respect to the body 211.

Next, the coupling relationship between the socket 270 and the pocket 230 will be described with reference to FIGS. 5 and 6.

First, FIG. 5 is an exploded perspective view of the pocket 230 and the socket 270 of FIG. 3.

Referring to this drawing, a locking groove 235 is formed in the main body 231 of the pocket 230. Furthermore, a coupling protrusion 236 may be formed on the bottom surface of the main body 231.

The socket 270 that is one-touch coupled to the pocket 230 may have a holder 271, a contact pad 273, and a locking arm 275.

The holder 271 may have a substantially rectangular ring shape. This is a shape corresponding to the bottom surface of the main body 231. Furthermore, the holder 271 may be formed of a metal material. The holder 271 may be formed with a coupling hole 272 accommodating the coupling protrusion 236.

The contact pad 273 is coupled to the holder 271 and closes the bottom of the receiving hole 232 of the pocket 230. The contact pad 273 may have a conductive pillar formed in the non-conductive substrate. The conductive pillars form an electrical connection between the electrodes of the semiconductor package and the electrodes of the inspection circuit board.

The locking arm 275 is configured to extend in a protruding direction with respect to a plane formed by the holder 271. The locking arm 275 may be formed integrally with the holder 271. In this case, the locking arm 275 may be defined as a cantilever shape by a pair of adjacent cutting lines 276 formed on the holder 271. The locking arm 275 may be bent with respect to the rest of the holder 271 to direct the protruding direction. Specifically, the locking arm 275 may be composed of a connecting portion 275a connected to the holder 271 and a locking portion 275b bent at the connecting portion 275a and arranged along the protruding direction. The engaging portion 275b has an enlarged region 275b 'whose width increases as it moves away from the connecting portion 275a.

The engaging arm 275 is one-touch coupled to the engaging groove 235 while the engaging portion 275b is bent with respect to the connecting portion 275a. The detailed configuration of the locking groove 235 for this will be described with reference to FIG. 6.

6 is a partially enlarged perspective view of the locking groove 235 of the pocket 230 of FIG. 5.

Referring to this drawing, the locking groove 235 may be a groove formed concave in the inner direction from the side surface of the main body 231. Furthermore, the locking region 235b may be formed to be concave even with respect to the bottom surface of the main body 231.

The engaging groove 235 may include an entry area 235a and an engaging area 235b. The entry area 235a is located inside compared to the engagement area 235b, and its width is narrower. Thus, a stepped stepped structure is formed between the entry area 235a and the engagement area 235b.

In the process of the one-touch engagement of the locking arm 275 (see FIG. 5) with respect to the locking groove 235, the locking arm 275 is first bent into the entry area 235a while bending with respect to the holder 271. Thereafter, the locking arm 275 may be seated in the locking region 235b by further bending. In this final engagement state, the enlarged region 275b 'of the engaging arm 275 (see FIG. 5) is caught in a narrow portion of the lower portion of the engaging region 235b. As a result, the locking arm 275 is finally caught in the locking region 235b, so that the socket 270 is one-touch coupled to the pocket 230.

When the socket 270 is to be separated from the pocket 230, the hook arm 275 may be bent in the opposite direction as before. Then, the engaging arm 275 is released from the engaging groove 235, so the coupling between the socket 270 and the pocket 230 is released.

The socket package for testing a semiconductor package as described above and the semiconductor package docking plate having the same are not limited to the configuration and operation method of the above-described embodiments. The above embodiments may be configured such that all or part of each embodiment is selectively combined to make various modifications.

100: semiconductor package docking plate 110: frame
115: socket module hole 150: mounting table
130,200: Socket module for semiconductor package test 131,210: Base
213: mounting hole 215: seating portion
133,230: Pocket 231: main body
235: engaging groove 250: elastic coupling unit
251: cantilever 270: socket
271: holder 273: contact pad
275: Hanging arm

Claims (12)

A base having a mounting hole formed thereon and a support jaw formed on an inner circumferential surface defining the mounting hole among the bodies;
A main body having an accommodation hole for receiving a semiconductor package and a protruding protrusion formed on an outer surface of the main body, a target protrusion that is a target of the support jaw while the main body is inserted into the mounting hole and a concave groove formed on the outer surface of the main body A pocket having a groove; And
The holder is coupled to the main body and extends from the holder in a protruding direction with respect to the plane formed by the holder, and is coupled to the locking arm and the holder, and is located on the bottom side of the pocket while supporting the semiconductor package. And a socket having a contact pad that mediates electrical connection between the semiconductor package and an inspection circuit board.
According to claim 1,
The hook arm,
A socket module for testing a semiconductor package, defined by a pair of adjacent cutting lines formed in the holder and bent with respect to the rest of the holder to direct the projecting direction.
According to claim 2,
The hook arm,
It includes a connecting portion connected to the holder, and a hook portion bent at the connecting portion and arranged along the protruding direction,
The engaging portion,
A socket module for testing a semiconductor package including an enlarged area that increases in width as it moves away from the connection part.
According to claim 1,
The locking groove,
A socket module for testing a semiconductor package, comprising an entry area that enters while the hooking arm is bent, and a hooking area having a width smaller than that of the entering area and being hooked when the hooking arm is bent.
According to claim 1,
A socket module for semiconductor package testing, further comprising an elastic coupling unit that extends from the body in a cantilever shape and is in close contact with an inner circumferential surface defining the mounting hole in the body, so that the pocket is elastically coupled to the base.
The method of claim 5,
The elastic coupling unit,
A socket module for semiconductor package testing, which is formed to correspond to a pair of adjacent corners of the body at a corner of the body.
The method of claim 5,
The elastic coupling unit,
A socket module for testing a semiconductor package, including a protruding area protruding from an edge of the main body at an outer portion thereof and contacting the body.
A base having a mounting hole formed thereon and a support jaw formed on an inner circumferential surface defining the mounting hole among the bodies;
A pocket having a main body having an accommodation hole for receiving a semiconductor package and a target protrusion formed protrudingly on an outer surface of the main body to be caught by the support jaw while the main body is inserted into the mounting hole; And
One-touch coupled to the lower side of the main body and positioned on the bottom side of the pocket while coupled to the holder having a rectangular ring shape and the holder, closing the lower portion of the receiving hole and supporting the semiconductor package to support the semiconductor package and the inspection circuit board A socket module for testing a semiconductor package, comprising a socket having a contact pad that mediates electrical connection therebetween.
The method of claim 8,
A socket module for semiconductor package testing, further comprising an elastic coupling unit that extends from the body in a cantilever shape and is in close contact with an inner circumferential surface defining the mounting hole in the body, so that the pocket is elastically coupled to the base.
The method of claim 9,
The elastic coupling unit,
A socket module for testing a semiconductor package, having a protruding area protruding from an edge of the body and contacting the body, and formed in an arc shape corresponding to a pair of adjacent edges of the body at a corner of the body.
The method of claim 8,
The pocket,
Further provided with a locking groove that is concave formed on the outer surface of the body,
The locking groove,
And an engaging region having a width smaller than that of the entering region,
The socket,
A semiconductor defined by a pair of cutting lines formed in the holder and bent in a protruding direction with respect to a plane formed by the holder, and further comprising a locking arm that is finally bent after entering the entry area and is caught in the engagement area. Socket module for package testing.
A frame having a plurality of socket module holes arranged in a grid;
Inserted into the socket module hole, a base having a mounting hole, a pocket inserted into the mounting hole and receiving a semiconductor package, one-touch coupled to a lower side of the pocket and supporting the semiconductor package to inspect the semiconductor package A socket module for testing a semiconductor package having a socket for mediating electrical connection between circuit boards; And
A semiconductor package docking plate mounted on the frame to correspond to the socket module hole, and including an installation table to which the socket module for testing the semiconductor package is connected.

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