KR102068933B1 - 탄화규소 잉곳 성장용 분말 및 이를 이용한 탄화규소 잉곳의 제조방법 - Google Patents
탄화규소 잉곳 성장용 분말 및 이를 이용한 탄화규소 잉곳의 제조방법 Download PDFInfo
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Abstract
Description
도2는 본 명세서에 개시된 실험실시예에서 실시예 및 비교예의 흐름지수를 보여주는 그래프이다.
| Consolidation Strength (CS, kPa) | Unconfined Failure Strength (UFS, kPa) | ||||||
| 실시예1 | 실시예2 | 실시예3 | 실시예4 | 실시예5 | 실시예6 | 비교예1 | |
| 0.5 | 0.05 | 0.02 | 0.06 | 0.02 | 0.02 | 0.05 | 0.02 |
| 1 | 0.11 | 0.08 | 0.12 | 0.12 | 0.05 | 0.15 | 0.06 |
| 2 | 0.2 | 0.13 | 0.26 | 0.15 | 0.09 | 0.29 | 0.08 |
| 4 | 0.38 | 0.22 | 0.49 | 0.27 | 0.18 | 0.69 | 0.15 |
| 9 | 0.8 | 0.33 | 1.17 | 0.5 | 0.31 | 1.43 | 0.26 |
| 추세선 기울기 | 0.087 | 0.035 | 0.129 | 0.053 | 0.034 | 0.163 | 0.026 |
| FF | 11.5 | 28.9 | 7.8 | 18.9 | 29.5 | 6.1 | 37.9 |
| 구분 | D50 (㎛) | Flow Factor (FF) | 압축전 내부마찰각(°) | 8 kPa 압축 후 내부마찰각(°) | 내부마찰각 변화량 (%) | 표면 핏 (k/cm2) |
다형혼입 |
| 실시예 1 | 130 | 11.5 | 38.1 | 33.5 | 12.1 | 8.5 | Pass |
| 실시예 2 | 450 | 28.9 | 36.0 | 31.9 | 11.4 | 8.9 | Pass |
| 실시예 3 | 80 | 7.8 | 39.2 | 32.5 | 17.1 | 9.4 | Pass |
| 실시예 4 | 280 | 18.9 | 37.6 | 34.7 | 7.6 | 8.7 | Pass |
| 실시예 5 | 380 | 29.5 | 35.9 | 34.7 | 3.3 | 9.9 | Pass |
| 실시예 6 | 130 | 6.1 | 38.5 | 30.9 | 19.7 | 9.8 | Fail |
| 비교예 1 | 300 | 37.9 | 37.3 | 33.1 | 11.3 | 10.9 | Fail |
| 구분 | 오프각 (Wafer Off angle) | XRD [11-20] | |
| 피크각도 (angle at Max intensity) |
로킹각도 (Rocking angle) |
||
| 실시예 1 | 0° | 17.811° | ±0.15° |
| 실시예 2 | 4° | 13.811° | ±0.07° |
| 실시예 3 | 4° | 13.811° | ±0.60° |
| 실시예 4 | 8° | 9.811° | ±0.12° |
| 실시예 5 | 0° | 17.811° | ± 1.2° |
| 실시예 6 | 4° | 13.811° | ± 1.7° |
| 비교예 1 | 4° | 13.811° | ± 1.8° |
110: 종자정 홀더 120: 거치대
200: 원료물질, 분말 300: 도가니, 반응용기
310: 도가니 본체 320: 도가니 뚜껑
400: 단열재 410: 석영관
500: 가열수단
Claims (11)
- 탄화규소 입자를 포함하는 분말을 반응 용기에 장입하고, 상기 반응 용기 일면에 종자정을 배치하는 준비단계; 및
상기 분말을 승화시켜, 상기 종자정으로부터 탄화규소 잉곳을 성장시키는 성장단계;를 포함하고,
상기 분말은 흐름지수가 5 내지 35 이고,
상기 분말에 8 kPa의 압력을 가하여 압축했을 때, 압축 전의 내부 마찰각에 대한 압축 후의 내부 마찰각의 변화량이 5% 내지 18%이고,
상기 탄화규소 잉곳은 표면 핏(pit)이 10K/cm2 이하인, 탄화규소 잉곳의 제조방법. - 제1항에 있어서,
상기 분말의 D50이 10 ㎛ 내지 800 ㎛ 인, 탄화규소 잉곳의 제조방법. - 삭제
- 삭제
- 제1항에 있어서,
상기 탄화규소 잉곳이 4인치 이상의 구경을 갖는, 탄화규소 잉곳의 제조방법. - 제1항에 있어서,
상기 탄화규소 잉곳이 6인치 이상의 구경을 갖는, 탄화규소 잉곳의 제조방법. - 제1항에 있어서,
상기 탄화규소 잉곳은 4H SiC 단결정을 포함하는 잉곳인, 탄화규소 잉곳의 제조방법. - 제1항에 있어서,
상기 탄화규소 잉곳은 그 표면이 볼록한 형태 또는 평평한 형태의 것인, 탄화규소 잉곳의 제조방법. - 삭제
- 표면 핏(pit)이 10K/cm2 이하인 탄화규소 잉곳의 제조에 적용되는 분말로,
상기 분말은 일정한 압력을 가했을 때 흐름이 발생하고,
탄화규소 입자를 포함하며,
흐름지수가 5 내지 35 이고,
상기 분말에 8 kPa의 압력을 가하여 압축했을 때, 압축 전의 내부 마찰각에 대한 압축 후의 내부 마찰각의 변화량이 5% 내지 18%인, 분말.
- 삭제
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020190083910A KR102068933B1 (ko) | 2019-07-11 | 2019-07-11 | 탄화규소 잉곳 성장용 분말 및 이를 이용한 탄화규소 잉곳의 제조방법 |
| JP2020066603A JP6758527B1 (ja) | 2019-07-11 | 2020-04-02 | 炭化珪素インゴット成長用粉末及びそれを用いた炭化珪素インゴットの製造方法 |
| TW109112360A TWI725816B (zh) | 2019-07-11 | 2020-04-13 | 用於碳化矽錠之粉末以及使用其製備碳化矽錠之方法 |
| US16/887,263 US10822720B1 (en) | 2019-07-11 | 2020-05-29 | Composition for preparing silicon carbide ingot and method for preparing silicon carbide ingot using the same |
| EP20179127.4A EP3763852A1 (en) | 2019-07-11 | 2020-06-10 | A composition for preparing a silicon carbide ingot and a method for preparing a silicon carbide ingot using the same |
| CN202010531612.9A CN112210824A (zh) | 2019-07-11 | 2020-06-11 | 用于生长碳化硅晶锭的粉末以及碳化硅晶锭的制备方法 |
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| US (1) | US10822720B1 (ko) |
| EP (1) | EP3763852A1 (ko) |
| JP (1) | JP6758527B1 (ko) |
| KR (1) | KR102068933B1 (ko) |
| CN (1) | CN112210824A (ko) |
| TW (1) | TWI725816B (ko) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102192518B1 (ko) * | 2020-07-14 | 2020-12-17 | 에스케이씨 주식회사 | 웨이퍼 및 웨이퍼의 제조방법 |
| KR102235858B1 (ko) * | 2020-04-09 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법 및 탄화규소 잉곳 제조용 시스템 |
| KR102236395B1 (ko) * | 2020-09-22 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳 제조방법, 탄화규소 웨이퍼 및 탄화규소 웨이퍼 제조방법 |
| JP2021195298A (ja) * | 2020-06-16 | 2021-12-27 | エスケイシー・カンパニー・リミテッドSkc Co., Ltd. | 炭化珪素インゴット、ウエハ及びその製造方法 |
| KR102442732B1 (ko) * | 2021-11-05 | 2022-09-13 | 주식회사 쎄닉 | 탄화규소 웨이퍼 및 이의 제조방법 |
| KR102442731B1 (ko) * | 2021-12-23 | 2022-09-13 | 주식회사 쎄닉 | 탄화규소 분말 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
| KR102567936B1 (ko) * | 2022-08-22 | 2023-08-17 | 주식회사 쎄닉 | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
| KR102581526B1 (ko) * | 2022-08-22 | 2023-09-20 | 주식회사 쎄닉 | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
| US11795572B2 (en) | 2020-05-29 | 2023-10-24 | Senic Inc. | Method of manufacturing a silicon carbide ingot comprising moving a heater surrounding a reactor to induce silicon carbide raw materials to sublimate and growing the silicon carbide ingot on a seed crystal |
| KR20240029434A (ko) * | 2022-08-26 | 2024-03-05 | 주식회사 쎄닉 | 탄화규소 분말 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 |
| US12320033B2 (en) | 2020-09-22 | 2025-06-03 | Senic Inc. | Silicon carbide wafer and method of preparing the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102340110B1 (ko) * | 2019-10-29 | 2021-12-17 | 주식회사 쎄닉 | 탄화규소 잉곳, 웨이퍼 및 이의 제조방법 |
| WO2021215120A1 (ja) * | 2020-04-22 | 2021-10-28 | 住友電気工業株式会社 | 炭化珪素単結晶および炭化珪素単結晶の製造方法 |
| CN117328138A (zh) * | 2023-10-10 | 2024-01-02 | 江苏超芯星半导体有限公司 | 一种碳化硅晶锭生长质量一致性的控制方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013067523A (ja) * | 2011-09-21 | 2013-04-18 | Sumitomo Electric Ind Ltd | 炭化珪素基板およびその製造方法 |
| WO2015181971A1 (ja) * | 2014-05-30 | 2015-12-03 | 新日鉄住金マテリアルズ株式会社 | バルク状炭化珪素単結晶の評価方法、及びその方法に用いられる参照用炭化珪素単結晶 |
| KR20160036527A (ko) * | 2013-07-31 | 2016-04-04 | 다이헤이요 세멘토 가부시키가이샤 | 탄화규소 분말 및 탄화규소 단결정의 제조 방법 |
| KR101809642B1 (ko) | 2016-12-20 | 2017-12-15 | 에스케이씨 주식회사 | 대구경 탄화규소 단결정 잉곳의 성장방법 |
| KR101854731B1 (ko) | 2011-07-28 | 2018-05-04 | 엘지이노텍 주식회사 | 잉곳 제조 방법 |
| JP2019052085A (ja) * | 2018-11-22 | 2019-04-04 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699202A (en) * | 1986-10-02 | 1987-10-13 | Bethlehem Steel Corporation | System and method for controlling secondary spray cooling in continuous casting |
| JP4061700B2 (ja) * | 1998-03-19 | 2008-03-19 | 株式会社デンソー | 単結晶の製造方法 |
| DE602004001802T3 (de) * | 2003-04-24 | 2012-01-26 | Norstel Ab | Vorrichtung und Verfahren zur Herstellung von Einkristallen durch Dampfphasenabscheidung |
| JP2011233638A (ja) * | 2010-04-26 | 2011-11-17 | Sumitomo Electric Ind Ltd | 炭化珪素基板およびその製造方法 |
| JP5706671B2 (ja) * | 2010-11-15 | 2015-04-22 | 独立行政法人産業技術総合研究所 | 昇華再結晶法による炭化ケイ素単結晶製造用炭化ケイ素粉体及びその製造方法 |
| DE202015009519U1 (de) * | 2014-07-07 | 2018-02-08 | Sumitomo Electric Industries, Ltd. | Siliziumkarbid-Substrat |
| KR102160863B1 (ko) * | 2014-09-30 | 2020-09-28 | 쇼와 덴코 가부시키가이샤 | 탄화규소 단결정 웨이퍼 |
| CN106715767A (zh) * | 2014-10-01 | 2017-05-24 | 住友电气工业株式会社 | 碳化硅外延基板 |
| JP6443103B2 (ja) * | 2015-02-13 | 2018-12-26 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
| GB2537648B (en) * | 2015-04-22 | 2020-01-08 | Cosmetic Warriors Ltd | Composition |
| JP6640680B2 (ja) * | 2016-08-25 | 2020-02-05 | 太平洋セメント株式会社 | 炭化珪素単結晶の製造方法 |
| JP6493690B2 (ja) * | 2016-08-31 | 2019-04-03 | 昭和電工株式会社 | SiCエピタキシャルウェハ及びその製造方法、並びに、ラージピット欠陥検出方法、欠陥識別方法 |
-
2019
- 2019-07-11 KR KR1020190083910A patent/KR102068933B1/ko active Active
-
2020
- 2020-04-02 JP JP2020066603A patent/JP6758527B1/ja active Active
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- 2020-06-10 EP EP20179127.4A patent/EP3763852A1/en not_active Ceased
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101854731B1 (ko) | 2011-07-28 | 2018-05-04 | 엘지이노텍 주식회사 | 잉곳 제조 방법 |
| JP2013067523A (ja) * | 2011-09-21 | 2013-04-18 | Sumitomo Electric Ind Ltd | 炭化珪素基板およびその製造方法 |
| KR20160036527A (ko) * | 2013-07-31 | 2016-04-04 | 다이헤이요 세멘토 가부시키가이샤 | 탄화규소 분말 및 탄화규소 단결정의 제조 방법 |
| WO2015181971A1 (ja) * | 2014-05-30 | 2015-12-03 | 新日鉄住金マテリアルズ株式会社 | バルク状炭化珪素単結晶の評価方法、及びその方法に用いられる参照用炭化珪素単結晶 |
| KR101809642B1 (ko) | 2016-12-20 | 2017-12-15 | 에스케이씨 주식회사 | 대구경 탄화규소 단결정 잉곳의 성장방법 |
| JP2019052085A (ja) * | 2018-11-22 | 2019-04-04 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
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| US11591711B2 (en) | 2020-04-09 | 2023-02-28 | Senic Inc. | Method and system for producing silicon carbide ingot |
| KR102235858B1 (ko) * | 2020-04-09 | 2021-04-02 | 에스케이씨 주식회사 | 탄화규소 잉곳의 제조방법 및 탄화규소 잉곳 제조용 시스템 |
| US11795572B2 (en) | 2020-05-29 | 2023-10-24 | Senic Inc. | Method of manufacturing a silicon carbide ingot comprising moving a heater surrounding a reactor to induce silicon carbide raw materials to sublimate and growing the silicon carbide ingot on a seed crystal |
| US11566344B2 (en) | 2020-06-16 | 2023-01-31 | Senic Inc. | Silicon carbide ingot, wafer, method for producing a silicon carbide ingot, and method for manufacturing a wafer |
| JP7161784B2 (ja) | 2020-06-16 | 2022-10-27 | セニック・インコーポレイテッド | 炭化珪素インゴット、ウエハ及びその製造方法 |
| JP2021195298A (ja) * | 2020-06-16 | 2021-12-27 | エスケイシー・カンパニー・リミテッドSkc Co., Ltd. | 炭化珪素インゴット、ウエハ及びその製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202102730A (zh) | 2021-01-16 |
| JP2021014395A (ja) | 2021-02-12 |
| CN112210824A (zh) | 2021-01-12 |
| EP3763852A1 (en) | 2021-01-13 |
| TWI725816B (zh) | 2021-04-21 |
| JP6758527B1 (ja) | 2020-09-23 |
| US10822720B1 (en) | 2020-11-03 |
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