KR102067384B1 - 고체 조명 장치 및 형성 방법 - Google Patents

고체 조명 장치 및 형성 방법 Download PDF

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KR102067384B1
KR102067384B1 KR1020147021246A KR20147021246A KR102067384B1 KR 102067384 B1 KR102067384 B1 KR 102067384B1 KR 1020147021246 A KR1020147021246 A KR 1020147021246A KR 20147021246 A KR20147021246 A KR 20147021246A KR 102067384 B1 KR102067384 B1 KR 102067384B1
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composition
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optical assembly
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units
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KR20140109462A (ko
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마사아키 아마코
슈테벤 스비어
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다우 실리콘즈 코포레이션
다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
KR1020147021246A 2011-12-30 2012-12-20 고체 조명 장치 및 형성 방법 Active KR102067384B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161581852P 2011-12-30 2011-12-30
US61/581,852 2011-12-30
PCT/US2012/071011 WO2013101674A1 (en) 2011-12-30 2012-12-20 Solid state light and method of forming

Publications (2)

Publication Number Publication Date
KR20140109462A KR20140109462A (ko) 2014-09-15
KR102067384B1 true KR102067384B1 (ko) 2020-01-17

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US (1) US9000472B2 (enExample)
EP (1) EP2798024B1 (enExample)
JP (1) JP6001676B2 (enExample)
KR (1) KR102067384B1 (enExample)
CN (1) CN104204119B (enExample)
WO (1) WO2013101674A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9000472B2 (en) 2011-12-30 2015-04-07 Dow Corning Corporation Optical assembly and method of forming an optical assembly
JP6309898B2 (ja) * 2012-01-16 2018-04-11 ダウ シリコーンズ コーポレーション 光学物品及び形成方法
JP6358960B2 (ja) 2012-02-09 2018-07-18 ダウ シリコーンズ コーポレーション 勾配ポリマー構造及び方法
US8995814B2 (en) * 2012-03-20 2015-03-31 Dow Corning Corporation Light guide and associated light assemblies
US20160032148A1 (en) * 2013-03-15 2016-02-04 Dow Corning Corporation A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof
KR20150132380A (ko) * 2013-03-15 2015-11-25 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체의 조성물
US20140339474A1 (en) * 2013-05-15 2014-11-20 Dow Corning Corporation Silicone composition comprising nanoparticles and cured product formed therefrom
CN105705599B (zh) 2013-09-18 2018-10-23 美国陶氏有机硅公司 树脂-线性有机硅氧烷嵌段共聚物的组合物
JP6497072B2 (ja) * 2013-11-07 2019-04-10 東レ株式会社 積層体およびそれを用いた発光装置の製造方法
WO2015132216A1 (en) 2014-03-07 2015-09-11 IfP Privates Institut für Produktqualität GmbH Method and kit of parts for extraction of nucleic acids
EP3161881A4 (en) * 2014-06-25 2018-02-21 Dow Corning Corporation Layered polymer structures and methods
KR20170058999A (ko) * 2014-09-23 2017-05-29 다우 코닝 코포레이션 접착제 조성물 및 이의 용도
TWI678551B (zh) * 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置
JP6055054B1 (ja) * 2015-09-09 2016-12-27 奥本　健二 発光デバイスおよびその製造方法
US10767016B2 (en) 2016-02-10 2020-09-08 Lumileds Llc Vapor-phase curing catalysis and passivation of siloxane resins in LED applications
DE102016114921A1 (de) * 2016-08-11 2018-02-15 Osram Opto Semiconductors Gmbh Silikonzusammensetzung
US10940105B2 (en) * 2016-10-04 2021-03-09 Dow Silicones Corporation Resin-linear organopolysiloxane block copolymer, use of same, and method for producing same
TWI848915B (zh) 2017-07-28 2024-07-21 日商杜邦東麗特殊材料股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
US20200029403A1 (en) * 2018-07-18 2020-01-23 Appleton Grp Llc Encapsulated led engine and a process for encapsulating an led engine
US11255797B2 (en) * 2019-07-09 2022-02-22 Kla Corporation Strontium tetraborate as optical glass material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062424A1 (en) 2009-09-11 2011-03-17 Nitto Denko Corporation Polymer compositions comprising additive block copolymers

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294737A (en) * 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
US3328481A (en) * 1964-04-20 1967-06-27 Dow Corning Organosilicon resins
US3619229A (en) * 1968-09-05 1971-11-09 Dow Corning Reinforced polystyrene and its copolymers
BE759624A (fr) * 1969-12-01 1971-06-01 Dow Corning Caoutchouc de silicone resistant aux salissures et sa fabrication
BE759618A (fr) * 1969-12-01 1971-06-01 Dow Corning Procede pour promouvoir la reaction entre un radical hydroxyle lie au silicium et un radical alcoxy lie au silicium
BE759619A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes a fonctionnalite cetoxime, vulcanisables a la temperature ambiante et resistant a l'arc
BE759621A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes non corrosifs, vulcanisables a la temperature ambiante
US3670649A (en) * 1970-08-13 1972-06-20 Dow Corning Combustible cartridges
US4419402A (en) * 1982-02-16 1983-12-06 Dow Corning Corporation Flame retardant polyorganopolysiloxane resin compositions
US4443502A (en) * 1983-04-12 1984-04-17 Dow Corning Corporation Liquid organosiloxane resin compositions
US4508887A (en) * 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
NZ238807A (en) * 1990-07-05 1994-03-25 Merrell Dow Pharma Bis[4-(2,6-dialkyl)phenol]silane derivatives and antiatherosclerotic compositions
US5075103A (en) 1990-07-06 1991-12-24 Dow Corning Corporation Hair fixatives comprising nonpolar silsesquioxanes
US7169859B2 (en) * 1999-05-18 2007-01-30 General Electric Company Weatherable, thermostable polymers having improved flow composition
US6842577B2 (en) * 2002-12-02 2005-01-11 Shipley Company L.L.C. Photoimageable waveguide composition and waveguide formed therefrom
KR100882409B1 (ko) * 2003-06-03 2009-02-05 신에쓰 가가꾸 고교 가부시끼가이샤 반사 방지용 실리콘 수지, 반사 방지막 재료, 이것을 이용한 반사 방지막 및 패턴 형성 방법
US7312008B2 (en) * 2005-02-10 2007-12-25 Xerox Corporation High-performance surface layer for photoreceptors
DE602006008259D1 (de) * 2005-12-22 2009-09-17 Rohm & Haas Siloxaneinkapselungen
JP2007270056A (ja) * 2006-03-31 2007-10-18 Jsr Corp 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法
JP5586820B2 (ja) * 2006-07-21 2014-09-10 東京応化工業株式会社 高屈折率材料
US8222352B2 (en) * 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
EP2619249B1 (en) 2010-09-22 2014-05-14 Dow Corning Corporation High refractive index compositions containing resin-linear organosiloxane block copolymers
KR101807190B1 (ko) 2010-09-22 2017-12-08 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체의 제조 방법
CN103189421B (zh) 2010-09-22 2015-03-25 道康宁公司 有机硅氧烷嵌段共聚物
KR101829336B1 (ko) 2010-09-22 2018-02-19 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 열안정성 조성물
JP2012102167A (ja) * 2010-11-05 2012-05-31 Nitto Denko Corp シリコーン樹脂、封止材料および光半導体装置
US9000472B2 (en) 2011-12-30 2015-04-07 Dow Corning Corporation Optical assembly and method of forming an optical assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110062424A1 (en) 2009-09-11 2011-03-17 Nitto Denko Corporation Polymer compositions comprising additive block copolymers

Also Published As

Publication number Publication date
KR20140109462A (ko) 2014-09-15
EP2798024B1 (en) 2016-07-20
JP6001676B2 (ja) 2016-10-05
JP2015510257A (ja) 2015-04-02
WO2013101674A1 (en) 2013-07-04
EP2798024A1 (en) 2014-11-05
US20150001567A1 (en) 2015-01-01
CN104204119A (zh) 2014-12-10
US9000472B2 (en) 2015-04-07
CN104204119B (zh) 2016-10-12

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