KR102066362B1 - 프린트 배선판의 제조 방법, 표면 처리 동박, 적층체, 프린트 배선판, 반도체 패키지 및 전자기기 - Google Patents

프린트 배선판의 제조 방법, 표면 처리 동박, 적층체, 프린트 배선판, 반도체 패키지 및 전자기기 Download PDF

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Publication number
KR102066362B1
KR102066362B1 KR1020187006355A KR20187006355A KR102066362B1 KR 102066362 B1 KR102066362 B1 KR 102066362B1 KR 1020187006355 A KR1020187006355 A KR 1020187006355A KR 20187006355 A KR20187006355 A KR 20187006355A KR 102066362 B1 KR102066362 B1 KR 102066362B1
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KR
South Korea
Prior art keywords
copper foil
group
resin
convex part
layer
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Expired - Fee Related
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KR1020187006355A
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English (en)
Korean (ko)
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KR20180037252A (ko
Inventor
마사유키 다카모리
마사후미 이시이
Original Assignee
제이엑스금속주식회사
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Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Priority claimed from PCT/JP2016/072848 external-priority patent/WO2017022807A1/ja
Publication of KR20180037252A publication Critical patent/KR20180037252A/ko
Application granted granted Critical
Publication of KR102066362B1 publication Critical patent/KR102066362B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020187006355A 2015-08-03 2016-08-03 프린트 배선판의 제조 방법, 표면 처리 동박, 적층체, 프린트 배선판, 반도체 패키지 및 전자기기 Expired - Fee Related KR102066362B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2015-153753 2015-08-03
JP2015153753 2015-08-03
JPJP-P-2015-187489 2015-09-24
JP2015187489A JP6438370B2 (ja) 2015-08-03 2015-09-24 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
PCT/JP2016/072848 WO2017022807A1 (ja) 2015-08-03 2016-08-03 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Publications (2)

Publication Number Publication Date
KR20180037252A KR20180037252A (ko) 2018-04-11
KR102066362B1 true KR102066362B1 (ko) 2020-01-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187006355A Expired - Fee Related KR102066362B1 (ko) 2015-08-03 2016-08-03 프린트 배선판의 제조 방법, 표면 처리 동박, 적층체, 프린트 배선판, 반도체 패키지 및 전자기기

Country Status (4)

Country Link
JP (1) JP6438370B2 (enExample)
KR (1) KR102066362B1 (enExample)
CN (1) CN107710890A (enExample)
TW (1) TWI619413B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334034B1 (ja) * 2017-06-09 2018-05-30 Ｊｘ金属株式会社 表面処理銅箔及びその製造方法、並びに銅張積層板
JP7196914B2 (ja) * 2018-05-30 2022-12-27 Ａｇｃ株式会社 樹脂付金属箔、積層体の製造方法、積層体及びプリント基板
CN110691501B (zh) * 2018-07-06 2024-08-20 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN114503789B (zh) 2019-10-25 2025-05-16 纳美仕有限公司 复合铜部件
CN116745462A (zh) * 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
CN115413118B (zh) * 2022-09-30 2024-12-13 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法

Citations (2)

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JP2012039111A (ja) * 2010-08-03 2012-02-23 Samsung Electro-Mechanics Co Ltd メッキ層の形成方法及びこれを用いた回路基板の製造方法
WO2014051122A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付金属箔

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Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
JP4740692B2 (ja) 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP4829647B2 (ja) 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 プリント配線板及びその製造方法
US8658473B2 (en) * 2012-03-27 2014-02-25 General Electric Company Ultrathin buried die module and method of manufacturing thereof
WO2013183607A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
TWI627876B (zh) * 2012-08-06 2018-06-21 Jx Nippon Mining & Metals Corp Metal foil with carrier
CN104684727B (zh) * 2012-08-08 2017-05-17 3M创新有限公司 阻隔膜构造及其制造方法
TWI571193B (zh) * 2012-10-04 2017-02-11 Ｊｘ日鑛日石金屬股份有限公司 Method for manufacturing multilayer printed wiring board and base substrate
MY168616A (en) * 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
JP5793720B1 (ja) * 2014-04-11 2015-10-14 パナソニックＩｐマネジメント株式会社 金属箔付き接着シート、金属箔付き積層板、金属箔付き多層基板、回路基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039111A (ja) * 2010-08-03 2012-02-23 Samsung Electro-Mechanics Co Ltd メッキ層の形成方法及びこれを用いた回路基板の製造方法
WO2014051122A1 (ja) * 2012-09-28 2014-04-03 Jx日鉱日石金属株式会社 キャリア付金属箔

Also Published As

Publication number Publication date
TW201709782A (zh) 2017-03-01
CN107710890A (zh) 2018-02-16
JP6438370B2 (ja) 2018-12-12
JP2017034216A (ja) 2017-02-09
KR20180037252A (ko) 2018-04-11
TWI619413B (zh) 2018-03-21

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