JP6438370B2 - プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器 - Google Patents

プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器 Download PDF

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Publication number
JP6438370B2
JP6438370B2 JP2015187489A JP2015187489A JP6438370B2 JP 6438370 B2 JP6438370 B2 JP 6438370B2 JP 2015187489 A JP2015187489 A JP 2015187489A JP 2015187489 A JP2015187489 A JP 2015187489A JP 6438370 B2 JP6438370 B2 JP 6438370B2
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JP
Japan
Prior art keywords
copper foil
group
resin
layer
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015187489A
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English (en)
Japanese (ja)
Other versions
JP2017034216A5 (enExample
JP2017034216A (ja
Inventor
雅之 高森
雅之 高森
雅史 石井
雅史 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to PCT/JP2016/072848 priority Critical patent/WO2017022807A1/ja
Priority to TW105124600A priority patent/TWI619413B/zh
Priority to CN201680038794.8A priority patent/CN107710890A/zh
Priority to KR1020187006355A priority patent/KR102066362B1/ko
Publication of JP2017034216A publication Critical patent/JP2017034216A/ja
Publication of JP2017034216A5 publication Critical patent/JP2017034216A5/ja
Application granted granted Critical
Publication of JP6438370B2 publication Critical patent/JP6438370B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2015187489A 2015-08-03 2015-09-24 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器 Expired - Fee Related JP6438370B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2016/072848 WO2017022807A1 (ja) 2015-08-03 2016-08-03 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
TW105124600A TWI619413B (zh) 2015-08-03 2016-08-03 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器
CN201680038794.8A CN107710890A (zh) 2015-08-03 2016-08-03 印刷配线板的制造方法、表面处理铜箔、积层体、印刷配线板、半导体封装及电子机器
KR1020187006355A KR102066362B1 (ko) 2015-08-03 2016-08-03 프린트 배선판의 제조 방법, 표면 처리 동박, 적층체, 프린트 배선판, 반도체 패키지 및 전자기기

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015153753 2015-08-03
JP2015153753 2015-08-03

Publications (3)

Publication Number Publication Date
JP2017034216A JP2017034216A (ja) 2017-02-09
JP2017034216A5 JP2017034216A5 (enExample) 2018-04-26
JP6438370B2 true JP6438370B2 (ja) 2018-12-12

Family

ID=57988941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015187489A Expired - Fee Related JP6438370B2 (ja) 2015-08-03 2015-09-24 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Country Status (4)

Country Link
JP (1) JP6438370B2 (enExample)
KR (1) KR102066362B1 (enExample)
CN (1) CN107710890A (enExample)
TW (1) TWI619413B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4317532A4 (en) * 2021-03-25 2025-07-09 Namics Corp LAMINATE MANUFACTURING PROCESS

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6334034B1 (ja) * 2017-06-09 2018-05-30 Ｊｘ金属株式会社 表面処理銅箔及びその製造方法、並びに銅張積層板
KR102715822B1 (ko) * 2018-05-30 2024-10-10 에이지씨 가부시키가이샤 수지가 부착된 금속박의 제조 방법, 수지가 부착된 금속박, 적층체 및 프린트 기판
CN110691501B (zh) * 2018-07-06 2024-08-20 广州方邦电子股份有限公司 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法
CN114503789B (zh) 2019-10-25 2025-05-16 纳美仕有限公司 复合铜部件
CN115413118B (zh) * 2022-09-30 2024-12-13 深圳市米韵科技有限公司 一种hdi线路板基板材料及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
JP4740692B2 (ja) 2004-12-14 2011-08-03 三菱瓦斯化学株式会社 プリント配線板の製造法
JP4829647B2 (ja) 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 プリント配線板及びその製造方法
KR101081588B1 (ko) * 2010-08-03 2011-11-08 삼성전기주식회사 도금층 형성방법 및 이를 이용한 회로기판 제조방법
US8658473B2 (en) * 2012-03-27 2014-02-25 General Electric Company Ultrathin buried die module and method of manufacturing thereof
CN104334346B (zh) * 2012-06-04 2017-05-03 Jx日矿日石金属株式会社 附载体金属箔
KR20170034947A (ko) * 2012-06-04 2017-03-29 제이엑스금속주식회사 캐리어 부착 금속박
TWI627876B (zh) * 2012-08-06 2018-06-21 Jx Nippon Mining & Metals Corp Metal foil with carrier
US20150213990A1 (en) * 2012-08-08 2015-07-30 3M Innovative Properties Company Barrier film constructions and methods of making same
TW201622995A (zh) * 2012-09-28 2016-07-01 Jx Nippon Mining & Metals Corp 附載子金屬箔
TWI571193B (zh) * 2012-10-04 2017-02-11 Ｊｘ日鑛日石金屬股份有限公司 Method for manufacturing multilayer printed wiring board and base substrate
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP5793720B1 (ja) * 2014-04-11 2015-10-14 パナソニックＩｐマネジメント株式会社 金属箔付き接着シート、金属箔付き積層板、金属箔付き多層基板、回路基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4317532A4 (en) * 2021-03-25 2025-07-09 Namics Corp LAMINATE MANUFACTURING PROCESS

Also Published As

Publication number Publication date
KR20180037252A (ko) 2018-04-11
TW201709782A (zh) 2017-03-01
JP2017034216A (ja) 2017-02-09
KR102066362B1 (ko) 2020-01-14
TWI619413B (zh) 2018-03-21
CN107710890A (zh) 2018-02-16

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