KR102055972B1 - 임프린트 장치, 재료 분포에 관한 데이터 작성 방법, 임프린트 방법 및 제품 제조 방법 - Google Patents

임프린트 장치, 재료 분포에 관한 데이터 작성 방법, 임프린트 방법 및 제품 제조 방법 Download PDF

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KR102055972B1
KR102055972B1 KR1020160038093A KR20160038093A KR102055972B1 KR 102055972 B1 KR102055972 B1 KR 102055972B1 KR 1020160038093 A KR1020160038093 A KR 1020160038093A KR 20160038093 A KR20160038093 A KR 20160038093A KR 102055972 B1 KR102055972 B1 KR 102055972B1
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South Korea
Prior art keywords
imprint
substrate
imprint material
pattern
shot
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KR1020160038093A
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Korean (ko)
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KR20160117322A (ko
Inventor
도모미 후나요시
다쿠로 야마자키
마사요시 후지모토
히로미츠 야마구치
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020160038093A 2015-03-31 2016-03-30 임프린트 장치, 재료 분포에 관한 데이터 작성 방법, 임프린트 방법 및 제품 제조 방법 Active KR102055972B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015074495A JP6602033B2 (ja) 2015-03-31 2015-03-31 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法
JPJP-P-2015-074495 2015-03-31

Publications (2)

Publication Number Publication Date
KR20160117322A KR20160117322A (ko) 2016-10-10
KR102055972B1 true KR102055972B1 (ko) 2019-12-13

Family

ID=57015896

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160038093A Active KR102055972B1 (ko) 2015-03-31 2016-03-30 임프린트 장치, 재료 분포에 관한 데이터 작성 방법, 임프린트 방법 및 제품 제조 방법

Country Status (4)

Country Link
US (1) US20160291486A1 (enExample)
JP (1) JP6602033B2 (enExample)
KR (1) KR102055972B1 (enExample)
CN (1) CN106019824A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131923B2 (en) * 2018-10-10 2021-09-28 Canon Kabushiki Kaisha System and method of assessing surface quality by optically analyzing dispensed drops
JP7286400B2 (ja) * 2019-04-24 2023-06-05 キヤノン株式会社 成形装置、決定方法、および物品製造方法
JP2024078506A (ja) * 2022-11-30 2024-06-11 キヤノン株式会社 インプリント装置、物品製造方法、決定方法及びプログラム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050064054A1 (en) * 2003-09-24 2005-03-24 Canon Kabushiki Kaisha Pattern forming apparatus
US20070228593A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
US20100072653A1 (en) * 2008-09-25 2010-03-25 Canon Kabushiki Kaisha Imprinting apparatus and method therefor
US20110057354A1 (en) * 2009-09-10 2011-03-10 Canon Kabushiki Kaisha Imprinting method and imprinting apparatus
JP2012004354A (ja) * 2010-06-17 2012-01-05 Canon Inc インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101604124B (zh) * 2005-06-08 2011-07-27 佳能株式会社 模子、图案形成方法以及图案形成设备
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
JP4908369B2 (ja) * 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
JP2010239118A (ja) * 2009-03-11 2010-10-21 Canon Inc インプリント装置および方法
JP5563243B2 (ja) * 2009-06-01 2014-07-30 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP2010283207A (ja) * 2009-06-05 2010-12-16 Toshiba Corp パターン形成装置およびパターン形成方法
JP5214683B2 (ja) * 2010-08-31 2013-06-19 株式会社東芝 インプリントレシピ作成装置及び方法並びにインプリント装置及び方法
JP5337776B2 (ja) * 2010-09-24 2013-11-06 富士フイルム株式会社 ナノインプリント方法およびそれを利用した基板の加工方法
JP2012114157A (ja) * 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
CN103624992B (zh) * 2013-11-22 2016-05-25 北京化工大学 一种聚合物微结构的片材压制设备及压制加工方法
JP6313591B2 (ja) * 2013-12-20 2018-04-18 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050064054A1 (en) * 2003-09-24 2005-03-24 Canon Kabushiki Kaisha Pattern forming apparatus
US20070228593A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
US20100072653A1 (en) * 2008-09-25 2010-03-25 Canon Kabushiki Kaisha Imprinting apparatus and method therefor
US20110057354A1 (en) * 2009-09-10 2011-03-10 Canon Kabushiki Kaisha Imprinting method and imprinting apparatus
JP2012004354A (ja) * 2010-06-17 2012-01-05 Canon Inc インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法

Also Published As

Publication number Publication date
JP2016195184A (ja) 2016-11-17
JP6602033B2 (ja) 2019-11-06
US20160291486A1 (en) 2016-10-06
KR20160117322A (ko) 2016-10-10
CN106019824A (zh) 2016-10-12

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