JP6602033B2 - インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法 - Google Patents

インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法 Download PDF

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Publication number
JP6602033B2
JP6602033B2 JP2015074495A JP2015074495A JP6602033B2 JP 6602033 B2 JP6602033 B2 JP 6602033B2 JP 2015074495 A JP2015074495 A JP 2015074495A JP 2015074495 A JP2015074495 A JP 2015074495A JP 6602033 B2 JP6602033 B2 JP 6602033B2
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Japan
Prior art keywords
substrate
pattern
shot
imprint material
supply amount
Prior art date
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Active
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JP2015074495A
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English (en)
Japanese (ja)
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JP2016195184A5 (enExample
JP2016195184A (ja
Inventor
智美 舩吉
拓郎 山▲崎▼
正敬 藤本
裕充 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015074495A priority Critical patent/JP6602033B2/ja
Priority to US15/082,985 priority patent/US20160291486A1/en
Priority to KR1020160038093A priority patent/KR102055972B1/ko
Priority to CN201610195961.1A priority patent/CN106019824A/zh
Publication of JP2016195184A publication Critical patent/JP2016195184A/ja
Publication of JP2016195184A5 publication Critical patent/JP2016195184A5/ja
Application granted granted Critical
Publication of JP6602033B2 publication Critical patent/JP6602033B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2015074495A 2015-03-31 2015-03-31 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法 Active JP6602033B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015074495A JP6602033B2 (ja) 2015-03-31 2015-03-31 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法
US15/082,985 US20160291486A1 (en) 2015-03-31 2016-03-28 Imprinting apparatus, method of creating data on material distribution, imprinting method, and article manufacturing method
KR1020160038093A KR102055972B1 (ko) 2015-03-31 2016-03-30 임프린트 장치, 재료 분포에 관한 데이터 작성 방법, 임프린트 방법 및 제품 제조 방법
CN201610195961.1A CN106019824A (zh) 2015-03-31 2016-03-31 压印装置和方法、材料分配数据创建方法及物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015074495A JP6602033B2 (ja) 2015-03-31 2015-03-31 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2016195184A JP2016195184A (ja) 2016-11-17
JP2016195184A5 JP2016195184A5 (enExample) 2018-05-17
JP6602033B2 true JP6602033B2 (ja) 2019-11-06

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JP2015074495A Active JP6602033B2 (ja) 2015-03-31 2015-03-31 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法

Country Status (4)

Country Link
US (1) US20160291486A1 (enExample)
JP (1) JP6602033B2 (enExample)
KR (1) KR102055972B1 (enExample)
CN (1) CN106019824A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131923B2 (en) * 2018-10-10 2021-09-28 Canon Kabushiki Kaisha System and method of assessing surface quality by optically analyzing dispensed drops
JP7286400B2 (ja) * 2019-04-24 2023-06-05 キヤノン株式会社 成形装置、決定方法、および物品製造方法
JP2024078506A (ja) * 2022-11-30 2024-06-11 キヤノン株式会社 インプリント装置、物品製造方法、決定方法及びプログラム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
US20070228593A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
CN100503265C (zh) * 2005-06-08 2009-06-24 佳能株式会社 模子、图案形成方法以及图案形成设备
US8011916B2 (en) * 2005-09-06 2011-09-06 Canon Kabushiki Kaisha Mold, imprint apparatus, and process for producing structure
JP4908369B2 (ja) * 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
JP5361309B2 (ja) * 2008-09-25 2013-12-04 キヤノン株式会社 インプリント装置およびインプリント方法
JP2010239118A (ja) * 2009-03-11 2010-10-21 Canon Inc インプリント装置および方法
JP5563243B2 (ja) * 2009-06-01 2014-07-30 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP2010283207A (ja) * 2009-06-05 2010-12-16 Toshiba Corp パターン形成装置およびパターン形成方法
JP2011061029A (ja) * 2009-09-10 2011-03-24 Canon Inc インプリント方法および装置
JP5744422B2 (ja) * 2010-06-17 2015-07-08 キヤノン株式会社 インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法
JP5214683B2 (ja) * 2010-08-31 2013-06-19 株式会社東芝 インプリントレシピ作成装置及び方法並びにインプリント装置及び方法
JP5337776B2 (ja) * 2010-09-24 2013-11-06 富士フイルム株式会社 ナノインプリント方法およびそれを利用した基板の加工方法
JP2012114157A (ja) * 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
CN103624992B (zh) * 2013-11-22 2016-05-25 北京化工大学 一种聚合物微结构的片材压制设备及压制加工方法
JP6313591B2 (ja) * 2013-12-20 2018-04-18 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法

Also Published As

Publication number Publication date
CN106019824A (zh) 2016-10-12
KR102055972B1 (ko) 2019-12-13
KR20160117322A (ko) 2016-10-10
US20160291486A1 (en) 2016-10-06
JP2016195184A (ja) 2016-11-17

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