KR102021603B1 - Phosphore in glass structure having heat dissipation feature and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a PIG structure having a heat dissipation structure and a method of manufacturing the same, the method of manufacturing a PIG structure according to an embodiment of the present invention comprises the steps of preparing a glass substrate including a heat conductive layer and a plurality of grooves formed on one surface, Injecting a phosphor into a plurality of grooves, seating a glass lead coated with a sealing material on one surface of a glass substrate having a plurality of grooves, and bonding the glass lead and the glass substrate to a structure unit along sidewalls formed around the glass substrate. Separating and applying a heat dissipation layer to the outer surface of the structure and connecting the heat dissipation member.

Description

PIG structure with heat dissipation structure and manufacturing method thereof {PHOSPHORE IN GLASS STRUCTURE HAVING HEAT DISSIPATION FEATURE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a PIG structure having a heat dissipation structure and a method of manufacturing the same, and more particularly, a PIG structure having a heat conduction layer, a heat dissipation layer connected to the heat conduction layer, and a heat dissipation member, and a manufacture of the PIG structure that can effectively release heat. It is about a method.

Light emitting diodes (hereinafter referred to as 'LED') are semiconductors made of gallium (Ga), phosphorus (P), arsenic (As), and the like, and have a property of emitting light when a current flows. LEDs have been widely used as light sources of various display devices because they have a longer lifespan and a faster response time than conventional light bulbs, and can be miniaturized and emit bright colored light. For example, an LED package including an LED chip is used as a light emitting device in a backlight unit (BLU) that emits light behind a liquid crystal display of a liquid crystal display (LCD).

In general, an LED package used for a backlight unit is formed by mounting an LED chip on a lead frame, encapsulating it with an encapsulant, and then attaching a lens. Here, the encapsulant basically serves to transmit the light from the LED chip to the outside while protecting the LED chip from external impact or the like. In addition, a phosphor may be disposed on a path of light emitted from the LED chip to convert the emission color of the LED chip.

As the encapsulating material, epoxy-based and silicon-based resins are used, and phosphors are generally used separately from the encapsulating material or mixed with the encapsulating material, but recently, phosphor-containing glass (PIG) is used. Techniques for performing color conversion functions are known.

As the phosphor used for PIG, a quantum dot (QD), a KSF (K ₂ SiF ₆ : Mn) phosphor, a CASN (CaAlSiN ₃ : Eu) phosphor, and the like can be used. Quantum dots, KSF phosphors and CASN phosphors have excellent color purity and color reproducibility, and thus their utilization is high. However, these phosphors have a disadvantage of being very susceptible to heat and moisture despite their excellent properties.

Therefore, when the phosphor is encapsulated in the glass structure and the LED is used as a color conversion element, there is a problem in that the phosphor is deteriorated by heat generated from an LED chip or the like and the characteristics may be degraded.

An object of the present invention is to provide a PIG structure capable of effectively dissipating heat to the outside by forming a heat conductive layer having a heat dissipation function on a glass substrate and a method of manufacturing the same.

According to one or more exemplary embodiments, a method of manufacturing a PIG structure having a heat dissipation structure may include preparing a glass substrate including a heat conductive layer and having a plurality of grooves formed on one surface thereof, injecting a phosphor into the plurality of grooves, and applying a sealing material. Seating the glass lead on one surface of the glass substrate having a plurality of grooves and bonding the glass lead and the glass substrate to each other, separating the glass lead into structural units along sidewalls formed around the glass substrate, and applying a heat dissipation layer to the outer surface of the structure. And connecting the heat dissipation member.

According to the present exemplary embodiment, the glass substrate may be formed by attaching and firing a second glass sheet having a flat first glass sheet and a heat conductive layer and having a lattice pattern formed thereon. Here, the second glass sheet is a step of preparing a plurality of glass green sheets, to apply a thermal conductive material on one surface of each of the plurality of glass green sheets, to laminate and compress a plurality of glass green sheets coated with the thermal conductive material It can be formed through the step and forming a pattern by hole-processing the laminate. In addition, the second glass sheet may be formed of an opaque glass containing TiO ₂ .

According to the present embodiment, the thermal conductive layer of the glass substrate may include at least one of carbon, gold, silver, platinum, iron, iron, copper, and nickel. It may include ingredients. In addition, the heat dissipation layer may be formed by applying a paste containing glass and ceramic powder, and the paste may be carbon, gold (Au), silver (Hg), platinum (Pt), iron (Fe), copper ( Cu) and nickel (Ni) may further contain at least one component. In addition, the heat dissipation member may be formed of one component selected from gold (Au), silver (Hg), copper (Cu), and aluminum (Al), and the phosphor may be a quantum dot phosphor, a KSF phosphor, a CASN phosphor, or an oxynitride. It may include one of (oxynitride) phosphor, YAG phosphor, silicate (silicate) phosphor, ZnS phosphor, CdSe phosphor.

According to the present embodiment, in the bonding of the glass lead and the glass substrate, the glass lead may be seated on one surface of the glass substrate, and then the glass substrate may be bonded to the glass lead by irradiating a laser onto the sealing material on the glass lead.

PIG structure having a heat dissipation structure according to an embodiment of the present invention is a glass structure having a heat conductive layer and the inner space is formed, a phosphor supported on the inner space of the glass structure, a heat dissipation layer formed on the outer surface of the glass structure and the heat dissipation layer It includes a heat dissipation member connected to.

According to the present embodiment, the glass structure may be formed of a glass substrate having a groove formed on one surface thereof and a glass lead bonded to the glass substrate, and a heat conductive layer may be formed on the glass substrate. In addition, the glass substrate may be formed of an opaque glass containing at least a portion of TiO ₂ .

According to the present embodiment, the heat dissipation member may be connected to the heat sink of the lead frame in which the LED chip is mounted.

According to an embodiment of the present invention, a heat conductive layer is formed on a glass substrate, and the heat conductive layer is connected to a heat dissipation layer and a heat dissipation member formed on an outer surface of the glass substrate to manufacture heat or PIG structure generated in an LED chip or package. The heat generated in the process can be effectively released. Accordingly, it is possible to prevent deterioration of the phosphors supported in the PIG structure, to maintain color reproducibility and color purity, to realize light stability, and ultimately to improve luminous efficiency.

1 is a view schematically showing an LED package including a PIG structure according to an embodiment of the present invention.
2 is a diagram illustrating a PIG structure according to an embodiment of the present invention.
3 is a flow chart sequentially showing a manufacturing process of the PIG structure according to an embodiment of the present invention.
4 is a view showing a manufacturing process of the PIG structure according to an embodiment of the present invention.
5 is a flowchart sequentially illustrating a manufacturing process of a glass sheet having a thermally conductive layer in a PIG structure according to an embodiment of the present invention.
6 is a view illustrating a manufacturing process of a glass sheet having a thermally conductive layer in a PIG structure according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. In order to clearly describe the present invention, parts irrelevant to the present invention are omitted, and like reference numerals designate like elements throughout the specification.

In the present specification, when one component is described as being "on" of another component, this includes not only when the other component is "directly located" but also when there is another component between them. In addition, the size and the like of each configuration shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated.

That is, the specific shapes, structures, and characteristics described in the specification may be embodied by changing from one embodiment to another without departing from the spirit and scope of the present invention. It is to be understood that changes may be made without departing from the scope. Accordingly, the following detailed description is not to be taken in a limiting sense, and the scope of the present invention should be taken as encompassing the scope of the claims of the claims and all equivalents thereto.

1 is a view schematically showing an LED package including a PIG structure according to an embodiment of the present invention.

Referring to FIG. 1, an LED package 100 according to an embodiment of the present invention includes a PIG structure 110 and an LED chip 120. The LED chip 120 may be mounted in a flip-chip form on a lead frame 130, and the PIG structure 110 may be attached to and disposed on the LED chip 120. .

The PIG structure 110 according to the present embodiment is composed of a glass structure as a whole to transmit the light emitted from the LED chip 120, and to carry the phosphor inside the glass structure to convert the color of the light emitted from the LED chip 120 To perform the function.

2 is a view showing a PIG structure according to an embodiment of the present invention. Hereinafter, a detailed configuration of the PIG structure according to the present embodiment will be described with reference to the PIG structure.

The PIG structure 110 according to the present embodiment has a form in which the phosphor 115 is supported in an internal space formed in the glass structure consisting of the glass substrate 111 and the glass lead 113, and the glass substrate 111 of the glass structure. The heat dissipation layer 117 may be formed on the outer side of the heat dissipation layer 1117, and the heat dissipation connecting member 119 may be connected to the heat dissipation layer 1117.

In the glass substrate 111 of the PIG structure 110 according to the present embodiment, grooves are formed to support the phosphor 115 on one surface thereof. To this end, the glass substrate 111 may be formed in the form of two glass sheets are bonded. In detail, the glass substrate 111 may have a shape in which a second glass sheet 111b having a lattice pattern formed on the flat first glass sheet 111a is bonded to each other, whereby the second glass sheet 111b is grooved. It can function as a side wall surrounding the. However, the present invention is not limited thereto, and the side wall and the lower sheet may be integrally formed without being formed separately.

The glass substrate 111 is formed of transparent glass to transmit the light emitted from the LED chip 120. However, at least a portion of the reflective material may be included in order to control the directionality of the light and prevent leakage of the light. For example, the second glass sheet 111b constituting the sidewall of the glass substrate 111 may include a reflective material such as TiO ₂ to prevent light from leaking in the lateral direction of the PIG structure 110 and only light upward. You can let this go.

On the other hand, the glass substrate 111 of the PIG structure 110 according to the present embodiment includes a heat conductive layer at least in part. For example, a plurality of thermal conductive layers may be formed on the second glass sheet 111b forming sidewalls of the glass substrate 111, and the thermal conductive layers may include carbon, gold, and silver (Hg). It may be made of a metal having high thermal conductivity such as platinum (Pt), iron (Fe), copper (Cu), and nickel (Ni). The heat conductive layer formed on the glass substrate 111 is a heat generated from the LED chip 120 or the lead frame 130 together with the heat dissipation layer 117 and the heat dissipation connecting member 119 described later, and the glass substrate 111. And heat generated during laser sealing of the glass lead 113 to the outside.

The glass lead 113 of the PIG structure 110 according to the present embodiment may be bonded to be mounted on the glass substrate 111. Specifically, the bonding may be performed in a manner of irradiating a laser with a sealing material between the glass substrate 111 and the glass lead 113, which will be described in detail later.

The glass lead 113 according to the present exemplary embodiment is formed of transparent glass, such as the glass substrate 111, so that the light emitted from the LED chip 120 and passing through the phosphor 115 may undergo upward color conversion. do.

The phosphor 115 is supported in the internal space between the glass substrate 111 and the glass lead 113 according to the present embodiment. According to the present embodiment, the phosphor is a quantum dot phosphor, KSF phosphor, CASN phosphor, oxynitride phosphor, YAG phosphor, silicate phosphor, ZnS phosphor, CdSe phosphor, which are excellent in color reproducibility, color purity, light stability, etc. Etc. can be used. However, since these phosphors are vulnerable to heat and moisture, in this embodiment, the PIG structure is formed in a form in which the phosphor 115 is contained in the glass structure, and the heat conduction of the glass substrate 111 when the LED package 100 is used. The layer, the heat dissipation layer 117, and the heat dissipation member 119 take a structure in which heat can be released smoothly.

According to the present embodiment, the heat dissipation layer 117 is formed on the glass substrate 111 side of the PIG structure 110, which is connected to the heat dissipation member 119. In the present embodiment, the heat dissipation layer 117 is formed of a copper paste having excellent thermal conductivity, but the present invention is not limited thereto, and carbon, nickel, iron, and silver may be used. The heat dissipation layer 117 may be formed of Ag), gold (Au), platinum (Pt), or the like, or may be formed of the same material as the heat conductive layer of the glass substrate 111.

According to one embodiment of the invention, the heat dissipation layer 117 is in contact with the heat dissipation member 119 to release heat to the outside. The heat dissipation member 119 according to the present embodiment may be formed of metal flakes and may be connected to a heat sink of the lead frame 130 to emit heat. The heat dissipation member 119 may be formed of a material such as gold (Au), silver (Hg), copper (Cu), aluminum (Al), and the like. It is also possible to form.

As described above, the PIG structure 110 according to the embodiment of the present invention includes a heat conductive layer on the glass substrate 111, and the heat conductive layer is formed on the side surface of the glass substrate 111 through the heat dissipation layer 117. It is connected to the heat dissipation member 119 has a structure capable of smoothly dissipating heat to the outside.

Hereinafter, a method of manufacturing such a PIG structure will be described in detail with reference to the accompanying drawings.

3 is a flow chart sequentially showing a manufacturing process of the PIG structure according to an embodiment of the present invention, Figure 4 is a view showing a manufacturing process of the PIG structure according to an embodiment of the present invention through a cross-sectional view illustratively. .

3 and 4, first, a first glass sheet 111a and a second glass sheet 111b are prepared to form a glass substrate of a PIG structure (S100). As shown in FIG. 4A, the second glass sheet 111b is provided with a heat conductive layer and a lattice pattern is formed. A method of manufacturing the second glass sheet 111b will be described with reference to FIGS. 5 and 6.

5 and 6 are each a flow chart sequentially showing the manufacturing process of the glass sheet having a thermal conductive layer, that is, the second glass sheet in the PIG structure according to an embodiment of the present invention and schematically showing it in the cross-sectional shape of the glass sheet. to be.

Referring to these drawings, first, as shown in FIG. 6A, a plurality of glass green sheets are prepared to form the second glass sheet 111b (S110). The glass green sheet is formed by forming a glass frit into a slurry together with a solvent binder, forming, processing, drying and cutting to a predetermined size. On the other hand, the glass green sheet may include a reflective material such as TiO ₂ in order to impart reflection performance.

Thereafter, as shown in (b) of FIG. 6, a thermal conductive material is coated on one surface of each glass green sheet (S120). Here, as the thermally conductive material, a metal having high thermal conductivity such as carbon, gold, silver, Hg, platinum, iron, copper, nickel, or nickel may be used. It can be used as a paste containing some of these materials. Among the thermally conductive materials exemplified above, compositions such as carbon, iron (Fe), copper (Cu) and nickel (Ni), which may be oxidized at a high temperature, are preferably fired in a reducing atmosphere.

Subsequently, as illustrated in FIGS. 6C and 6D, a plurality of glass green sheets coated with a heat conductive material are laminated in a vertical direction, and then compressed to form a heat conductive layer (S130). Hole processing is performed according to the size to form a grid pattern (S140).

Through this process, a second glass sheet 111b having a lattice pattern is formed, and the second glass sheet 111b is attached to each other with the first glass sheet 111a as shown in FIG. 4B. After firing, the glass substrate 111 is formed (S200).

As described above, in the present embodiment, a so-called sheet method of bonding a glass sheet with a lattice pattern and a flat glass sheet is used as a method for manufacturing a grooved glass substrate. However, the present invention is not necessarily limited thereto, and it will be possible to manufacture a patterned glass substrate using other known techniques such as sand blasting and acid etching using a mask.

Referring to FIG. 4C, after the glass substrate 111 is formed, the phosphor 115 is supported in the groove of the glass substrate 111 (S300). As described above, in the present embodiment, quantum dot, KSF phosphor, CASN phosphor, oxynitride phosphor, YAG phosphor, silicate phosphor, ZnS phosphor, CdSe phosphor, etc. may be used as the phosphor 115. Since these phosphors are particularly susceptible to heat and moisture, this embodiment takes the form of sealing the phosphors in the glass structure through local laser sealing as described later.

Specifically, as shown in (d) of FIG. 4, after the sealing material is applied to one surface of the glass lead 113, one surface on which the sealing material is applied is seated on the glass substrate 111, and the upper surface of the glass lead 113 is provided. In operation S400, the glass substrate 111 and the glass lead 113 are bonded by irradiating a laser onto an area where the sealing material is coated.

At this time, a low melting glass frit composition is used as a sealing material, More preferably, a composition with high absorption rate of an infrared laser is used. For example, the composition of the low melting glass frit used as the sealing material may include V ₂ O ₅ , BaO, ZnO, P ₂ O ₅ , TeO ₂ , Cu ₂ O, Fe ₂ O _3, and SeO ₂ . In addition, the laser may use an infrared laser having a wavelength of about 800 ~ 820nm, whereby the sealing material is melted at a low temperature, the bonding of the glass substrate 111 and the glass lead 113 is made and the sealing member 116 is formed Can be. In this embodiment, since the sealing is made by local heating through laser irradiation, there is no heat effect on the phosphor, and as heat is emitted to the outside through the heat conductive layer of the glass substrate 111, the quantum dot phosphor is vulnerable to heat. It is possible to prevent the characteristic change of the.

After the laser sealing, dicing is performed in units of structures along the sidewalls formed between the grooves of the bonded body of the glass substrate 111 and the glass lead 113 as illustrated in FIG. 4E (S500).

After the dicing operation is performed for each structure unit, as shown in FIG. 4F, the heat dissipation layer 117 is formed on the outer side surface of the glass substrate 111 (S600), and the heat dissipation layer 117. Connect the heat dissipation member 119 to the (S700).

The heat dissipation layer 117 may be formed by applying a copper (Cu) paste containing glass and ceramic powder in consideration of the shrinkage of the glass substrate 111, thereby connecting the heat dissipation member 119 formed of metal flakes. To dissipate heat to the outside. As described above, the metal composition included in the heat dissipation layer 117 may include carbon, silver (Ag), gold (Au), platinum (Pt), nickel (Ni), iron (Fe) in addition to copper (Cu). ) May be used, and the heat radiating member 119 may also be formed including the same metal composition.

In the PIG structure 110 manufactured through the above process, the heat conductive layer of the glass substrate 111 performs a heat dissipation function together with the heat dissipation layer 117 and the heat dissipation member 119, and thus the glass substrate 111 and the glass lead 113. By effectively dissipating the heat generated during the bonding and heat generated from the LED chip 120 or the lead frame 130, to maintain the color reproducibility and color stability of the phosphor 115 and to implement a high output, ultimately improve the luminous efficiency Can be improved.

The present invention has been described above by specific embodiments such as specific components and limited embodiments and drawings, but this is only provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from these descriptions. Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, fall within the scope of the spirit of the present invention. will be.

100: LED package
110: PIG Structure
111: glass substrate
113: glass lead
115: phosphor
116: sealing member
117: heat dissipation layer
119: heat dissipation member
120: LED chip
130: leadframe

Claims (17)

As a method for producing a PIG structure having a heat dissipation structure,
Preparing a glass substrate including a heat conductive layer and having a plurality of grooves formed on one surface thereof;
Injecting a phosphor into the plurality of grooves,
Mounting a glass lead coated with a sealing material on one surface of the glass substrate on which the plurality of grooves are formed, and bonding the glass lead and the glass substrate to each other;
Separating the structure into units along sidewalls formed around the glass substrate; and
Applying a heat dissipation layer to the outer surface of the structure and connecting the heat dissipation member,
Including,
The heat conductive layer is formed on a side wall formed around the glass substrate, and is connected to the heat radiating member through the heat radiating layer,
The glass substrate is formed by attaching and firing a second glass sheet having a flat first glass sheet and a heat conductive layer and having a lattice pattern formed thereon,
The second glass sheet,
Preparing a plurality of glass green sheets,
Applying a thermally conductive material to one surface of each of the plurality of glass green sheets,
Stacking and compressing a plurality of glass green sheets coated with the thermal conductive material;
Forming a pattern by hole machining the laminate
Formed through, PIG structure manufacturing method. delete delete The method of claim 1,
And the second glass sheet is formed of an opaque glass containing TiO ₂ . The method of claim 1,
The thermal conductive layer of the glass substrate includes at least one component of carbon, gold, silver, Hg, platinum, iron, iron, copper, and nickel. PIG Structure Manufacturing Method. The method of claim 1,
The heat dissipation layer is formed by applying a paste containing glass and ceramic powder, and the paste is carbon, gold (Au), silver (Hg), platinum (Pt), iron (Fe), copper (Cu) And at least one component of nickel (Ni). The method of claim 1,
The heat radiation member is formed of one component selected from gold (Au), silver (Hg), copper (Cu) and aluminum (Al), PIG structure manufacturing method. The method of claim 1,
The phosphor comprises one of a quantum dot phosphor, a KSF phosphor and a CASN phosphor, an oxynitride phosphor, a YAG phosphor, a silicate phosphor, a ZnS phosphor, and a CdSe phosphor. The method of claim 1,
In the bonding of the glass lead and the glass substrate, the glass lead is seated on one surface of the glass substrate, and then irradiates a laser onto the sealing material on the glass lead to bond the glass substrate and the glass lead. Manufacturing method. delete delete delete delete delete delete delete delete

Images