KR102006090B1 - Anisotropic conductive film and connection method - Google Patents

Abstract

Provided is an anisotropic conductive film excellent in insulation between adjacent terminals and long-term conductivity between connection terminals even when a substrate subjected to anti-corrosive treatment is connected. Containing layer containing a conductive particle, a thermosetting resin, and a curing agent, and a thermoplastic layer containing a phosphoric acid ester compound.

Description

TECHNICAL FIELD [0001] The present invention relates to an anisotropic conductive film,

The present invention relates to an anisotropic conductive film and a connection method.

Conventionally, a tape-like connecting material (for example, an anisotropic conductive film (ACF)) in which a thermosetting resin in which conductive particles are dispersed is applied to a release film is used as a means for connecting an electronic component to a substrate .

This anisotropic conductive film is used for, for example, connection (FOB: Flex on Board) of a COF (Chip on Film) and a rigid substrate (for example, PWB (Printed Wiring Board)).

In order to improve the solderability of components such as an IC chip and a capacitor to be mounted on the rigid substrate, a rust-preventive treatment using a rust preventive called an OSP (Organic Solderability Preservative) may be performed. As the free flux, for example, an imidazole-based free flux is known.

However, the substrate subjected to the rust-preventive treatment has a problem that adhesiveness of the anisotropic conductive film is deteriorated.

Therefore, in order to provide stable connection reliability to the connection of the substrate subjected to the rust-preventive treatment, a curing agent that generates a free radical, a radical polymerizable substance, a phosphate ester, and conductive particles, A circuit connecting material has been proposed in which the proportion of the phosphoric acid ester occupying in the circuit connecting material is in the range of 0.5 to 2.5 parts by weight when the entire circuit connecting material is made up to 100 parts by weight (for example, see Patent Document 1).

However, in the technique of this proposal, the insulation between neighboring terminals is excellent, but the long-term conductivity between the connection terminals is not sufficient.

Japanese Patent Application Laid-Open No. 2009-277769

It is an object of the present invention to solve the above-mentioned conventional problems and to achieve the following objects. That is, an object of the present invention is to provide an anisotropic conductive film excellent in insulation between adjacent terminals and long-term conductivity between connection terminals, and a junction body using the same, even when a substrate subjected to anti-corrosive treatment is connected.

Means for solving the above problems are as follows. In other words,

≪ 1 > A conductive particle composition comprising a conductive particle-containing layer containing conductive particles, a thermosetting resin, and a curing agent,

An anisotropic conductive film having a thermoplastic layer containing an acid component.

<2> The anisotropic conductive film according to <1>, wherein the acid component is a phosphate ester compound.

<3> The anisotropic conductive film according to any one of <1> to <2>, wherein the conductive particle-containing layer has a melt viscosity higher than that of the thermoplastic layer.

&Lt; 4 &gt; A connection method for connecting a terminal of a first circuit member to a terminal of a second circuit member,

The first arrangement step of arranging the anisotropic conductive film according to any one of <1> to <3> on the terminal of the first circuit member so that the thermoplastic layer comes into contact with the terminal of the first circuit member,

A second arranging step of disposing the second circuit member on the anisotropic conductive film,

And heating and pressing the second circuit member by a heating and pressing member,

And a terminal of the first circuit member is subjected to an anti-rust treatment with a rust preventive agent.

According to the present invention, it is possible to solve the above-mentioned conventional problems and attain the above object, and even when a substrate subjected to rust-proof treatment is connected, the insulating property between adjacent terminals and the long- An anisotropic conductive film, and a junction body using the same.

1A is a first schematic cross-sectional view for explaining an example of a connection method of the present invention.
1B is a second schematic cross-sectional view for explaining an example of a connection method of the present invention.
1C is a third schematic cross-sectional view for explaining an example of a connection method of the present invention.
1D is a fourth schematic sectional view for explaining an example of a connection method of the present invention.
1E is a fifth schematic sectional view for explaining an example of a connection method of the present invention.

(Anisotropic conductive film)

The anisotropic conductive film of the present invention contains at least a conductive particle-containing layer and a thermoplastic layer, and further contains other components as required.

<Conductive Particle Containing Layer>

The conductive particle-containing layer contains at least conductive particles, a thermosetting resin and a curing agent, and further contains other components as required.

<< Conductive particles >>

The conductive particles are not particularly limited and may be appropriately selected according to the purpose. Examples thereof include metal particles and metal-coated resin particles.

The metal particles are not particularly limited and may be appropriately selected according to the purpose. Examples thereof include nickel, cobalt, silver, copper, gold, palladium, and solder. These may be used alone, or two or more kinds may be used in combination.

Of these, nickel, silver and copper are preferable. In order to prevent surface oxidation, these metal particles may be subjected to gold or palladium on their surfaces. It is also possible to use an insulating film having a metal protrusion or an organic material on its surface.

The metal-coated resin particle is not particularly limited as long as the surface of the resin particle is covered with a metal. The metal-coated resin particle can be appropriately selected according to the purpose. For example, the surface of the resin particle is coated with nickel, silver, Gold, and palladium, and the like. It is also possible to use an insulating film having a metal protrusion or an organic material on its surface. In the case of a connection considering a low resistance, particles in which the surface of the resin particle is coated with silver are preferable.

The method of coating the metal on the resin particles is not particularly limited and may be appropriately selected depending on the purpose. Examples of the method include electroless plating and sputtering.

The material of the resin particle is not particularly limited and may be appropriately selected according to the purpose. Examples of the resin particle include a styrene-divinylbenzene copolymer, a benzoguanamine resin, a crosslinked polystyrene resin, an acrylic resin, a styrene- And the like.

The conductive particles may have conductivity at the time of anisotropic conductive connection. For example, even when the surface of the metal particles is coated with an insulating coating, the particles are deformed at the time of anisotropic conductive connection, and the metal particles are exposed.

The average particle diameter of the conductive particles is not particularly limited and may be appropriately selected according to the purpose. The average particle diameter is preferably 1 탆 to 50 탆, more preferably 2 탆 to 25 탆, particularly preferably 2 탆 to 10 탆 .

The average particle diameter is an average value of the particle diameters measured arbitrarily for 10 conductive particles.

The particle diameter can be measured by, for example, scanning electron microscope observation.

The content of the conductive particles in the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose. The content is preferably 0.5% by mass to 10% by mass, and more preferably 1% by mass to 5% .

<< Thermosetting Resin >>

The thermosetting resin is not particularly limited and may be appropriately selected in accordance with the purpose. Examples thereof include an epoxy resin and a polymerizable acrylic compound.

- Epoxy resin -

The epoxy resin is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, modified epoxy resins thereof, alicyclic epoxy Resins and the like. These may be used alone, or two or more kinds may be used in combination.

- Polymerizable acrylic compound -

The polymerizable acrylic compound is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include polyethylene glycol diacrylate, phosphoric ester type acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl Acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, bisphenoxyethanol fluorene diacrylate, 2-acryloyloxyethyl succinic acid, lauryl acrylate Acrylates such as stearyl acrylate, isobornyl acrylate, tricyclodecane dimethanol dimethacrylate, cyclohexyl acrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, tetrahydrofurfuryl acrylate , o-phthalic acid diglycidyl ether acrylate, ethoxylated bisphenol A dimethacrylate, bisphenol A type epoxy acrylate, urethane acrylate, epoxy acrylate and the like, and methacrylates corresponding to these. These may be used alone, or two or more kinds may be used in combination.

The content of the thermosetting resin in the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose. It is preferably 20 mass% to 60 mass%, more preferably 30 mass% to 50 mass% Do.

<< Hardener >>

The curing agent is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include imidazoles, organic peroxides, anionic curing agents, cationic curing agents and the like.

The imidazoles include, for example, 2-ethyl 4-methylimidazole and the like.

Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauryl peroxide, dibutyl peroxide, peroxydicarbonate, benzoyl peroxide and the like.

Examples of the anion-based curing agent include organic amines and the like.

Examples of the cationic curing agent include a sulfonium salt, an onium salt, and an aluminum chelating agent.

Of these, organic peroxides are preferable, and dirauroyl peroxide is more preferable because of excellent storage stability.

The combination of the thermosetting resin and the curing agent is not particularly limited and may be appropriately selected according to the purpose. However, a combination of the epoxy resin and the cationic curing agent, and a combination of the polymerizable acrylic compound and the organic peroxide are preferable .

The content of the curing agent in the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose. The content is preferably 1% by mass to 15% by mass, and more preferably 2% by mass to 10% by mass.

<< Other Ingredients >>

Examples of the other components contained in the conductive particle-containing layer include film-forming resins, fillers and the like.

- film forming resin -

The film forming resin is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide Resins, and polyolefin resins. The above film-forming resins may be used singly or in combination of two or more. Of these, phenoxy resins are preferable in terms of film formability, workability, and connection reliability.

Examples of the phenoxy resin include resins synthesized from bisphenol A and epichlorohydrin.

The phenoxy resin may be suitably synthesized, or a commercially available product may be used.

The content of the film-forming resin in the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose. It is preferably 20% by mass to 60% by mass, more preferably 30% by mass to 50% Do.

-filler-

The filler is not particularly limited and may be appropriately selected according to the purpose. Examples of the filler include alumina, silica, talc, mica, kaolin, zeolite, barium sulfate, and calcium carbonate.

The content of the filler in the conductive particle-containing layer is not particularly limited and may be appropriately selected according to the purpose. The content is preferably 0.5% by mass to 15% by mass, and more preferably 1% by mass to 10% by mass.

It is preferable that the conductive particle-containing layer does not contain an acid component. The acid component includes an acid component described later.

The average thickness of the conductive particle-containing layer is not particularly limited and may be appropriately selected, but is preferably 10 탆 to 50 탆, more preferably 20 탆 to 40 탆.

Here, the average thickness is an average value when the thickness of five points of the conductive particle-containing layer is optionally measured.

&Lt; Thermoplastic layer &gt;

The thermoplastic layer contains at least an acid component and, if necessary, other components.

The thermoplastic layer is a layer exhibiting reversibility by heat.

The thermoplastic layer may contain a compound having a reactive functional group such as an epoxy resin or a polymerizable acrylic compound, but does not contain a curing agent for curing them.

<< Ingredients >>

The acid component is not particularly limited as long as it is an acidic component and can be appropriately selected depending on the purpose. Examples of the acidic group in the acid component include a phosphoric acid ester group, a carboxyl group and a sulfone group. Examples of the compound having an acidic group include (meth) acrylate having an acidic group and the like.

The acid component may be rosin (abietic acid). The rosin generates an acid by melting.

Of these, phosphoric acid ester compounds are preferable in view of strong acidity and easy removal of rust-preventive agent. As the phosphate ester compound, for example, phosphoric acid ester type acrylate and the like can be given.

The content of the acid component in the thermoplastic layer is not particularly limited and may be appropriately selected according to the purpose. The content is preferably 1% by mass to 10% by mass, and more preferably 2% by mass to 6% by mass . If the content is less than 1% by mass, the removal of the rust preventive agent may be insufficient. When the content exceeds 10% by mass, the balance of the composition with other components of the thermoplastic layer may not be well balanced.

<< Other Ingredients >>

Examples of the other components in the thermoplastic layer include film-forming resins and other resins.

- film forming resin -

The film-forming resin is not particularly limited and may be appropriately selected depending on the purpose. For example, the film-forming resin exemplified in the explanation of the conductive particle-containing layer may be mentioned. The same is true of preferred embodiments.

The content of the film-forming resin in the thermoplastic layer is not particularly limited and may be appropriately selected according to the purpose. It is preferably 0 mass% to 20 mass%, more preferably 0 mass% to 10 mass% Do.

- Other resin -

The other resin is not particularly limited as long as it is a resin other than the film forming resin, and can be appropriately selected in accordance with the purpose. Examples thereof include an epoxy resin and a polymerizable acrylic compound. Since these are components commonly used in anisotropic conductive films, they can also be used as the material of the thermoplastic layer in the anisotropic conductive film of the present invention. However, when the thermoplastic layer contains a compound having a reactive functional group, the thermoplastic layer generally does not contain a curing agent for curing the thermoplastic layer.

The content of the other resin in the thermoplastic layer is not particularly limited and may be appropriately selected according to the purpose. It is preferably 60 mass% to 99 mass%, more preferably 80 mass% to 97 mass% Do.

The average thickness of the thermoplastic layer is not particularly limited and may be appropriately selected, but is preferably from 1 탆 to 10 탆, more preferably from 2 탆 to 7 탆. When the average thickness is within the more preferable range, it is advantageous in that the control of the fluidity is easy and does not remain in the connection portion after the compression.

Here, the average thickness is an average value when the thickness of five points of the thermoplastic layer is arbitrarily measured.

The melt viscosity of the conductive particle-containing layer is preferably larger than the melt viscosity of the thermoplastic layer in that the thermoplastic layer is easily removed from between the connection terminals. It is preferable that the melt viscosity of the conductive particle-containing layer is 10 times or more of the melt viscosity of the thermoplastic layer, and 15 times or more of the melt viscosity of the thermoplastic layer because the thermoplastic layer is more likely to be excluded from between the connection terminals To 70 times, and particularly preferably 20 times to 70 times.

Here, the melt viscosity is measured using, for example, a rheometer (manufactured by HAAKE). The measurement is carried out using, for example, each layer. The measurement is carried out at the temperature in the flow region, and the result at a set temperature of 85 占 폚 at the viscosity measurement is taken as the melt viscosity.

(Connection method)

The connection method according to the present invention includes at least a first batch process, a second batch process, and a heating and pressurizing process, and further includes other processes as required.

The connection method is a method of connecting the terminals of the first circuit member and the terminals of the second circuit member.

<First Circuit Member and Second Circuit Member>

The first circuit member and the second circuit member are not particularly limited and may be appropriately selected in accordance with the purpose as long as they have a terminal and a circuit member to be subjected to anisotropic conductive connection using the anisotropic conductive film. For example, a plastic substrate having terminals, a Flex-on-Board (FLEX), a Flex-on-Flex (FlexOnflex, FOF), and the like.

The material of the terminal is not particularly limited and may be appropriately selected according to the purpose. For example, Cu, plated with Cu, Ni and Au plated with Au, Cu plated with Sn, .

The material and the structure of the plastic substrate having the terminal are not particularly limited and can be appropriately selected according to the purpose. Examples thereof include a rigid substrate having terminals, and a flexible substrate having terminals. Examples of the rigid substrate having the terminal include a glass epoxy substrate having a copper wiring. Examples of the flexible substrate having the terminal include a polyimide substrate having a copper wiring.

The shape and size of the first circuit member and the second circuit member are not particularly limited and can be appropriately selected according to the purpose.

The first circuit member and the second circuit member may be the same circuit member or different circuit members.

The terminal of the first circuit member is rust-proofed with a rust preventive agent.

It is preferable that the terminal of the second circuit member is not rust-proofed by a rust preventive agent.

The rust inhibitor is not particularly limited and may be appropriately selected depending on the purpose. The rust inhibitor is generally referred to as free flux or OSP (Organic Solderability Preservative).

The rust preventive agent contains at least an imidazole compound, a copper ion and an organic acid, for example. Examples of the imidazole compound include benzoimidazole and the like. The benzimidazole may have a substituent.

The rust inhibitor is preferably water-soluble.

The method of the rust preventive treatment is not particularly limited and can be appropriately selected according to the purpose. For example, a method of immersing the treated circuit member in the rust preventive or an aqueous solution obtained by diluting the rust preventive agent have.

By performing the anti-corrosive treatment, the terminals on the circuit member and the circuit portion are protected.

&Lt; First batch process &gt;

The first arranging step is not particularly limited as long as it is a step of disposing the anisotropic conductive film of the present invention on the terminal of the first circuit member so that the thermoplastic layer is in contact with the terminal of the first circuit member , And can be appropriately selected according to the purpose.

<Second Arrangement Process>

The second disposing step is not particularly limited as long as the step of disposing the second circuit member on the anisotropic conductive film can be appropriately selected according to the purpose.

<Heating and pressing step>

The heating and pressing step is not particularly limited as long as the second circuit member is heated and pressed by the heating and pressing member. The heating and pressing step can be appropriately selected according to the purpose. For example, heating and pressing can do.

The heating and pressing member may be, for example, a pressing member having a heating mechanism. As a pressing member having the heating mechanism, for example, a heat tool and the like can be mentioned.

The temperature for the heating is not particularly limited and may be appropriately selected depending on the purpose, and it is preferably 140 占 폚 to 200 占 폚.

The pressure for the pressurization is not particularly limited and can be appropriately selected according to the purpose, but it is preferably 0.1 MPa to 80 MPa.

The time for heating and pressurizing is not particularly limited and may be appropriately selected according to the purpose. For example, the time may be from 0.5 seconds to 120 seconds.

Here, an example of the connection method of the present invention will be described with reference to the drawings.

1A to 1E are schematic cross-sectional views for explaining an example of a connection method of the present invention.

First, as shown in Fig. 1A, a first circuit member 1 is prepared. The first circuit member 1 has a base material 1A and a terminal 1B on the base material 1A. In addition, the terminal 1B is rust-proofed with the rust preventive agent 1C.

Subsequently, as shown in Fig. 1 (b), the anisotropic conductive film 2 is disposed on the first circuit member 1. Then, as shown in Fig. The anisotropic conductive film 2 is formed by laminating the thermoplastic layer 2A and the conductive particle-containing layer 2B. The anisotropic conductive film 2 is disposed on the first circuit member 1 so that the thermoplastic layer 2A is in contact with the terminal 1B of the first circuit member 1. [ Further, the conductive particle-containing layer 2B contains the conductive particles 2C. At this time, as shown in Fig. 1C, the acid component in the thermoplastic layer 2A removes the rust preventive 1C from the terminal 1B.

Subsequently, as shown in Fig. 1 (d), the second circuit member 3 is disposed on the conductive particle-containing layer 2B of the anisotropic conductive film 2. The second circuit member 3 has a base 3A and a terminal 3B on the base 3A. The second circuit member 3 is arranged so that the terminal 3B is in contact with the conductive particle containing layer 2B on the conductive particle containing layer 2B of the anisotropic conductive film 2.

Subsequently, as shown in Fig. 1E, the first circuit member 1 and the second circuit member 3 are connected by heating and pressing the second circuit member 3. At this time, since no rust preventive agent 1C is present on the terminal 1B, good connectivity can be obtained. Since the thermoplastic layer 2A is extruded at least between the terminal 1B and the terminal 3B during heating and pressing, the acid component in the thermoplastic layer 2A flows into the terminal 1B and the terminal 3B (For example, corrosion, dissolution, migration, etc.).

Therefore, by the connection method of the present invention, even when the substrate subjected to the anti-corrosive treatment is connected, it is possible to perform the insulation between the adjacent terminals and the connection excellent in long-term conductivity between the connection terminals.

In the above description with reference to Figs. 1A to 1E, the embodiment in which the rust preventive agent 1C is removed is shown in Fig. 1C, but the connection method of the present invention is not limited to this embodiment. For example, in the first batch process, even if the rust preventive agent is not removed from the terminal, the rust inhibitor may be removed from the terminal in the heating and pressing process. Such an aspect is also included in the connection method of the present invention.

Example

Examples of the present invention will be described below, but the present invention is not limited to these examples at all.

(Example 1)

&Lt; Preparation of anisotropic conductive film &

<< Manufacture of Layer 1 >>

, 55 parts by mass of bisphenol F type epoxy resin (trade name: jER-4004P, manufactured by Mitsubishi Chemical Corporation), 25 parts by mass of bifunctional acrylic monomer (Shin-Nakamura Chemical Co., (Trade name: U-2PPA) and 4 parts by mass of phosphoric acid ester type acrylate (trade name: PM-2, manufactured by Nippon Kayaku Co., Ltd.) were uniformly mixed by a conventional method to prepare a first layer composition Respectively. The obtained composition was applied to a peeled polyester film, and hot air at 70 占 폚 was sprayed for 3 minutes and dried to prepare a first layer having an average thickness of 5 占 퐉.

<< Manufacturing of Layer 2 >>

, 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Shin-Nittsu Chemical Co., Ltd.), 20 parts by mass of a bifunctional acrylic monomer (Shin-Nakamura Chemical Co., , 5 parts by mass of a silica filler (average particle size: 5 占 퐉, trade name: Aerosil RY200, manufactured by Nippon Aerosil Co., Ltd.), 10 parts by mass of diarooyl peroxide : Perlowil L) and 3 parts by mass of nickel plated resin particles having an average particle size of 10 mu m were uniformly mixed by a conventional method to prepare a composition for a second layer. The obtained composition was applied to a peeled polyester film, and hot air at 70 캜 was sprayed for 5 minutes and dried to prepare a second layer having an average thickness of 30 탆.

The first layer and the second layer were laminated using a laminator to obtain an anisotropic conductive film having a two-layer structure.

(Example 2)

An anisotropic conductive film was produced in the same manner as in Example 1 except that the average thickness of the first layer was 3 占 퐉 and the average thickness of the second layer was 32 占 퐉.

(Example 3)

An anisotropic conductive film was produced in the same manner as in Example 1 except that the composition of the first layer was changed to the composition shown in Table 1. [

(Example 4)

The procedure of Example 1 was repeated except that the composition of the first layer, the average thickness of the first layer, and the average thickness of the second layer were changed as shown in Table 1, .

(Example 5)

An anisotropic conductive film was produced in the same manner as in Example 1 except that the composition of the first layer was changed as shown in Table 1. [

(Example 6)

An anisotropic conductive film was produced in the same manner as in Example 1 except that the composition of the first layer was changed as shown in Table 1. [

(Comparative Example 1)

An anisotropic conductive film was produced in the same manner as in Example 1 except that the composition of the first layer was changed as shown in Table 1. [

(Comparative Example 2)

The procedure of Example 1 was repeated except that the composition of the first layer, the average thickness of the first layer, and the average thickness of the second layer were changed as shown in Table 1, .

(Comparative Example 3)

, 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Shin-Nittsu Chemical Co., Ltd.), 20 parts by mass of a bifunctional acrylic monomer (Shin-Nakamura Chemical Co., (Trade name: U-2PPA), 4 parts by mass of phosphoric ester type acrylate (trade name: PM-2, manufactured by Nippon Kayaku Co., Ltd.), silica filler (average particle diameter: 5 μm, trade name: 5 parts by mass of distilled water (Aerosil RY200), 5 parts by mass of dilauryl peroxide (manufactured by Nichikari Co., Ltd., trade name: PEROIL L) and 3 parts by mass of nickel plated resin particles having an average particle size of 10 μm were mixed by a conventional method The composition for the second layer was prepared by uniformly mixing. The obtained composition was applied to a peeled polyester film, and hot air at 70 캜 was sprayed for 5 minutes and dried, thereby producing an anisotropic conductive film having an average thickness of 35 탆.

&Lt; Preparation of a conjugate &

As the first circuit member, PWB (base material for evaluation by Dexterz Corporation, 200 탆 P, Cu 35 탆 t-rust-proofing treatment, FR-4 substrate)

As a second circuit member, COF (a substrate for evaluation by Dextelles Co., 200 μm P, Cu 8 μm t-Sn plating, and 38 μm t-S'perflex substrate) was used.

Using the produced anisotropic conductive film, connection of the first circuit member and the second circuit member was performed.

The first circuit member used was one which had passed through a reflow furnace having a Top temperature of 250 占 폚 three times.

First, an anisotropic conductive film sliced with a width of 2.0 mm was attached to the first circuit member such that the first layer was in contact with the terminal of the first circuit member, and the second circuit member was aligned thereon. Then, Compression bonding material 250 탆 t silicone rubber, 2.0 mm width) was used and compression bonding was performed at 170 캜 -3 MPa - 5 sec to complete the bonded body.

&Lt; Measurement of melt viscosity &gt;

The melt viscosity of the first layer and the second layer in Examples and Comparative Examples was measured using a rheometer (manufactured by HAAKE). The measurement was carried out using the respective layers before the first layer and the second layer were bonded using a laminator. The measurement was carried out at the temperature in the flow region, and as a result of the set temperature at the time of measuring the viscosity at 85 캜, the results are shown in Table 1.

<THB evaluation>

The THB evaluation was carried out using the thus-obtained bonded body. The bonded body was exposed in an environment of 60 ° C-95% RH, and a DC voltage of 50 V was applied for 250 hours. After the completion of the test, the presence or absence of insulation deterioration due to corrosion and migration was checked and evaluated according to the following evaluation criteria. The results are shown in Table 1.

[Evaluation standard]

O: Insulation resistance value of 1.0 x 10 &lt; ⁹ &gt;

DELTA: Insulation resistance value of 1.0 x 10 ⁸ Ω or more and less than 1.0 x 10 ⁹ Ω

X: Insulation resistance value less than 1.0 x 10 ⁸ Ω

&Lt; Measurement of continuity resistance &

The connection resistance when the current of 1 mA was passed through the four-terminal method was measured at both the initial and after 85 ° C, 85% RH and 500 h, and evaluated according to the following evaluation criteria. The results are shown in Table 1.

[Evaluation standard]

○: less than 0.3 Ω

?: 0.3? Or more and less than 0.6?

×: 0.6 Ω or more

The unit of the compounding amount shown in Table 1 is the mass part.

jER-4004P: Bisphenol F type epoxy resin, manufactured by Mitsubishi Chemical Corporation

YP-70: Bisphenol A / F type epoxy type phenoxy resin, manufactured by Shin-Nittsu Chemical Co., Ltd.

YP-50: bisphenol A type epoxy type phenoxy resin, manufactured by Shinnitetsu Chemical Industry Co., Ltd.

A-200: bifunctional acrylic monomer, manufactured by Shin Nakamura Chemical Co., Ltd.

U-2PPA: urethane acrylate, manufactured by Shin Nakamura Chemical Co., Ltd.

PM-2: phosphoric ester type acrylate, manufactured by Nippon Chemical Industry Co., Ltd.

KE-604: manufactured by Rosin, Arakawa Chemical Industries, Ltd.

Peroil L: De lauroyl peroxide, Nichi-like manufacturing

Aerosil RY200: silica filler, manufactured by Nippon Aerosil Inc.

In Examples 1 to 6, the insulation between adjacent terminals and the long-term conductivity between connection terminals were excellent.

In Comparative Example 1, the first layer contains an acid component, but since it is not a thermoplastic layer in that it contains a curing component and a curing agent, insulation resistance is insufficient. It is considered that this is because the acid component in the first layer damages the terminal and migrates to the terminal since the first layer is not extruded from the terminal surface after the assembly is manufactured.

In Comparative Example 2, the conduction resistance was insufficient. This is thought to be because the first layer is a thermoplastic layer but contains no acid component, so that the rust-preventive agent on the terminal can not be removed, and consequently, the rust-preventive agent deteriorates the connectivity between the terminals.

In Comparative Example 3, the insulation resistance was insufficient. This is thought to be attributable to the fact that, after manufacturing the bonded body, the acid component damages the terminal, causing the terminal to migrate.

Industrial availability

The anisotropic conductive film of the present invention is excellent in the insulating property between the adjacent terminals and the long-term conductivity between the connection terminals even when the substrate subjected to the anti-corrosive treatment is connected. Therefore, Can be preferably used.

1: first circuit member
1A: substrate
1B: terminal
1C: Antirust agent
2: Anisotropic conductive film
2A: thermoplastic layer
2B: Conductive particle containing layer
2C: conductive particles
3: second circuit member
3A: substrate
3B: terminal

Claims (5)

A conductive particle-containing layer containing conductive particles, a thermosetting resin, and a curing agent;
And a thermoplastic layer containing an acid component,
Wherein the conductive particle-containing layer has a melt viscosity higher than that of the thermoplastic layer. The method according to claim 1,
Wherein the acid component is a phosphoric acid ester compound. delete A connection method for connecting a terminal of a first circuit member to a terminal of a second circuit member,
A first arranging step of arranging the anisotropic conductive film according to claim 1 or 2 on a terminal of the first circuit member such that the thermoplastic layer is in contact with a terminal of the first circuit member;
A second arranging step of disposing the second circuit member on the anisotropic conductive film,
And heating and pressing the second circuit member by a heating and pressing member,
Wherein the terminal of the first circuit member is rust-proofed with a rust preventive agent. Wherein the first circuit member and the second circuit member are bonded to each other via the anisotropic conductive film according to claim 1 or 2.

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