CN111094487A - Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module - Google Patents

Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module Download PDF

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Publication number
CN111094487A
CN111094487A CN201880058646.1A CN201880058646A CN111094487A CN 111094487 A CN111094487 A CN 111094487A CN 201880058646 A CN201880058646 A CN 201880058646A CN 111094487 A CN111094487 A CN 111094487A
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CN
China
Prior art keywords
adhesive layer
adhesive film
curable composition
circuit connection
circuit
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Pending
Application number
CN201880058646.1A
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Chinese (zh)
Inventor
森尻智树
大当友美子
工藤直
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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Publication of CN111094487A publication Critical patent/CN111094487A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

An adhesive film 1 for circuit connection, comprising: the adhesive sheet comprises a first adhesive layer 2 containing conductive particles 4, and a second adhesive layer 3 laminated on the first adhesive layer 2, wherein the ratio of the DSC heat release amount of the first adhesive layer 2 to the DSC heat release amount of the second adhesive layer 3 is less than or equal to 0.4.

Description

Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module
Technical Field
The present invention relates to an adhesive film for circuit connection and a method for manufacturing the same, a method for manufacturing a circuit connection structure, and an adhesive film housing module.
Background
Conventionally, various adhesive materials have been used for circuit connection. For example, an adhesive film for circuit connection, which has conductive particles dispersed in an adhesive and has anisotropic conductivity, is used as an adhesive material for connecting a liquid crystal display and a Tape Carrier Package (TCP), connecting a flexible printed circuit board (FPC) and a TCP, or connecting an FPC and a printed wiring board. Specifically, the circuit connecting structure is obtained by adhering the circuit members to each other at the circuit connecting portion formed of the adhesive film for circuit connection, and electrically connecting the electrodes on the circuit members to each other via the conductive particles in the circuit connecting portion.
In the field of precision electronic devices using an adhesive film for circuit connection having anisotropic conductivity, the density of circuits has been increased, and the electrode width and the electrode interval have become extremely narrow. Therefore, it is not always easy to capture conductive particles efficiently (to increase the capture rate of conductive particles) on the microelectrode to obtain high connection reliability.
In contrast, for example, patent document 1 proposes a method of segregating conductive particles from each other by segregating the conductive particles on one side of an anisotropic conductive adhesive sheet.
Documents of the prior art
Patent document
Patent document 1: international publication No. 2005/54388
Disclosure of Invention
Problems to be solved by the invention
However, in the method of patent document 1, since the conductive particles flow at the time of circuit connection, the conductive particles may flow out from between the opposing electrode circuits, and there is room for improvement in the capture rate of the conductive particles. In addition, when a circuit connection structure obtained using a conventional adhesive film for circuit connection is placed in a high-temperature and high-humidity environment (for example, 85 ℃ and 85% RH), peeling may occur between the circuit member and the circuit connection portion. Such peeling may cause a decrease in connection reliability of the circuit connection structure.
Accordingly, an object of the present invention is to provide an adhesive film for circuit connection, which can increase the capture rate of conductive particles between opposing electrodes of a circuit connection structure and can provide a circuit connection structure in which peeling between a circuit member and a circuit connection portion is less likely to occur under a high-temperature and high-humidity environment, a method for producing the adhesive film, a method for producing a circuit connection structure using the adhesive film, and an adhesive film housing module including the adhesive film.
Means for solving the problems
An adhesive film for circuit connection according to one aspect of the present invention includes: the adhesive composition comprises a first adhesive layer containing conductive particles and a second adhesive layer laminated on the first adhesive layer, wherein the ratio of the DSC heat release amount of the first adhesive layer to the DSC heat release amount of the second adhesive layer is less than or equal to 0.4.
According to the adhesive film for circuit connection, the capture rate of conductive particles between the counter electrodes of the circuit connection structure can be increased. Therefore, the circuit connecting adhesive film can reduce the connection resistance of the counter electrode of the circuit connecting structure. Further, according to the adhesive film for circuit connection, a circuit connection structure in which peeling between the circuit member and the circuit connection portion is less likely to occur under a high-temperature and high-humidity environment (for example, 85 ℃ C., 85% RH) can be obtained. In other words, the adhesive film for circuit connection can improve the adhesion between the circuit member and the circuit connection portion in a high-temperature and high-humidity environment. Further, the adhesive film for circuit connection can maintain a low connection resistance even under a high-temperature and high-humidity environment (for example, 85 ℃ C., 85% RH). That is, the adhesive film for circuit connection can improve the connection reliability of the circuit connection structure.
A method for manufacturing an adhesive film for circuit connection according to one aspect of the present invention includes: a preparation step of preparing a first adhesive layer; and a laminating step of laminating a second adhesive layer made of a second curable composition on the first adhesive layer, the preparing step including a curing step of: the first curable composition is cured by irradiating or heating a layer composed of the first curable composition containing conductive particles with light to obtain a first adhesive layer, and in the curing step, the first curable composition is cured so that the ratio of the DSC heat release amount of the first adhesive layer to the DSC heat release amount of the second adhesive layer is 0.4 or less. According to this method, it is possible to obtain an adhesive film for circuit connection which can improve the capturing rate of conductive particles between the counter electrodes of the circuit connection structure and can obtain a circuit connection structure in which peeling between the circuit member and the circuit connection portion is less likely to occur under a high-temperature and high-humidity environment.
The first adhesive layer may be formed of a cured product of a first curable composition, and the first curable composition may contain a radical polymerizable compound having a radical polymerizable group.
The second adhesive layer may be composed of a second curable composition, and the second curable composition may contain a radical polymerizable compound having a radical polymerizable group.
The thickness of the first adhesive layer may be 0.2 to 0.8 times the average particle diameter of the conductive particles.
A method for manufacturing a circuit connection structure according to an aspect of the present invention includes: the adhesive film for circuit connection is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and the second circuit member are thermocompression bonded to electrically connect the first electrode and the second electrode to each other. According to this method, a circuit connection structure can be obtained which has an excellent trapping rate of conductive particles between the counter electrodes of the circuit connection structure and in which separation between the circuit member and the circuit connection portion is less likely to occur in a high-temperature and high-humidity environment.
An adhesive film housing module according to an aspect of the present invention includes the above adhesive film for circuit connection, and a housing member housing the adhesive film, the housing member having a viewing portion allowing the inside of the housing member to be viewed from the outside, the viewing portion having a transmittance of light having a wavelength of 365nm of 10% or less.
In general, an environment in which an adhesive film for circuit connection is used is a room called a clean room, in which the temperature, humidity, and cleanliness in the room are controlled at a certain level. When the adhesive film for circuit connection is shipped from a production site, the adhesive film for circuit connection is stored in a storage member such as a packaging bag so as not to be directly exposed to outdoor air and to prevent deterioration in quality due to dust and moisture. In general, a viewing portion formed of a transparent material is provided on a receiving member so that various information such as a product name, a lot number, and a term of validity attached to an adhesive film inside can be confirmed from the outside of the receiving member.
However, according to the studies of the present inventors, it has been found that when the above-mentioned adhesive film for circuit connection is stored in a conventional storage member and then used after being stored or transported, the following problems may occur: peeling between the circuit member and the circuit connection portion is likely to occur in a high-temperature and high-humidity environment, and the effect of improving the capture rate is reduced, and the effect of reducing the connection resistance of the adhesive film is reduced due to the reduction in fluidity. As a result of further studies based on the above-described results, the present inventors have found that when the first adhesive layer is composed of a cured product of a photocurable composition and the second adhesive layer is composed of a curable composition containing a polymerizable compound that can react with a photopolymerization initiator in the photocurable composition, the second adhesive layer is cured during storage and transportation of the adhesive film, and the above-described problems occur. Therefore, the present inventors have further studied based on the assumption that the polymerizable compound in the second adhesive layer is polymerized by radicals derived from the photopolymerization initiator remaining in the first adhesive layer, and as a result, have found that: by forming the adhesive film housing module having the specific housing member, curing of the second adhesive layer during storage or transportation can be suppressed, and occurrence of the above-described problems can be suppressed.
That is, according to the adhesive film housing module of one aspect of the present invention, when a compound reactive with the photopolymerization initiator in the first adhesive layer is used as the polymerizable compound in the second adhesive layer, it is possible to suppress curing of the second adhesive layer during storage or transportation of the adhesive film, and it is possible to suppress occurrence of problems such as easy occurrence of peeling between the circuit member and the circuit connecting portion under a high-temperature and high-humidity environment, and reduction of the effect of improving the capture rate and reduction of the effect of reducing the connection resistance of the adhesive film due to reduction of the fluidity.
Effects of the invention
According to the present invention, it is possible to provide an adhesive film for circuit connection, which can increase the capture rate of conductive particles between opposing electrodes of a circuit connection structure and can obtain a circuit connection structure in which peeling between a circuit member and a circuit connection portion is less likely to occur in a high-temperature and high-humidity environment, a method for producing the adhesive film, a method for producing a circuit connection structure using the adhesive film, and an adhesive film housing module including the adhesive film.
Drawings
Fig. 1 is a schematic cross-sectional view showing an adhesive film for circuit connection according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view showing a circuit connection structure according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view showing a manufacturing process of a circuit connection structure according to an embodiment of the present invention.
Fig. 4 is a perspective view showing an adhesive film housing assembly according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In the present specification, the upper limit and the lower limit described individually may be arbitrarily combined. In the present specification, "(meth) acrylate" means at least one of an acrylate and a corresponding methacrylate. The same applies to other similar expressions such as "(meth) acryloyl group".
< adhesive film for circuit connection >
Fig. 1 is a schematic cross-sectional view showing an adhesive film for circuit connection according to one embodiment. As shown in fig. 1, an adhesive film 1 for circuit connection (hereinafter also simply referred to as "adhesive film 1") includes a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2. The first adhesive layer 2 contains conductive particles 4.
In the adhesive film 1, the conductive particles 4 are dispersed in the first adhesive layer 2. Therefore, the adhesive film 1 is an anisotropic conductive adhesive film having anisotropic conductivity. The adhesive film 1 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and is used for thermocompression bonding the first circuit member and the second circuit member to electrically connect the first electrode and the second electrode to each other.
In the present embodiment, the ratio (Cx/Cy) of the DSC heat release Cx of the first adhesive layer to the DSC heat release Cy of the second adhesive layer 3 is 0.4 or less. Here, the "DSC heat release amount" refers to a heat release amount (J/g) measured by DSC (differential scanning calorimetry), and a large DSC heat release amount of the adhesive layer means a large heat release amount of the adhesive layer when circuit members are connected to each other. The DSC heat release amount tends to increase as the amount of remaining components (for example, uncured components such as polymerizable compounds) in the adhesive layer that react by an exothermic reaction increases. The DSC heat release Cx and the DSC heat release Cy can be obtained by performing DSC measurement of the first adhesive layer 2 and the second adhesive layer 3 by the method described in the examples.
According to the adhesive film 1, since the ratio of DSC heat release amounts (Cx/Cy) is 0.4 or less, the capture rate of conductive particles between the counter electrodes of the circuit connection structure can be increased. Therefore, the adhesive film 1 can reduce the connection resistance of the counter electrode of the circuit connection structure.
Further, according to the adhesive film 1, since the ratio of DSC heat release amount (Cx/Cy) is 0.4 or less, a circuit connection structure in which peeling between the circuit member and the circuit connection portion is not easily generated under a high-temperature and high-humidity environment (for example, 85 ℃ c, 85% RH) can be obtained.
Further, according to the adhesive film 1, since the ratio of DSC heat release (Cx/Cy) is 0.4 or less, the low connection resistance can be maintained even in a high-temperature and high-humidity environment (for example, 85 ℃, 85% RH). That is, the adhesive film 1 can improve the connection reliability of the circuit connection structure.
The adhesive film 1 may be cut into a narrow width in a state of being attached to a base material formed on one surface of the base material, and then wound around a core, thereby being stored and used in the form of an adhesive roll. The adhesive reel is required to have good blocking resistance, that is, the adhesive film 1 is not easily peeled off from the base material when the adhesive film with the base material is fed from the adhesive reel. However, in the case of a conventional adhesive film, when the adhesive film is cut into a narrow width of about 0.4 to 1.0mm in width, it may be difficult to obtain good blocking resistance. On the other hand, in the adhesive film 1 of the present embodiment, since the ratio of the DSC heat release amounts (Cx/Cy) is 0.4 or less, sticking (blocking) of the first adhesive layer 2 to the base material can be suppressed. Therefore, by providing the base material on the surface of the second adhesive layer 3 opposite to the first adhesive layer 2, it is possible to obtain good blocking resistance even when the adhesive layer is cut to a narrow width as described above. The blocking resistance can be evaluated by, for example, a test for confirming whether or not the adhesive roll is pulled out without any problem after being left at 30 ℃ for 24 hours.
From the viewpoint of further improving the capture rate of the conductive particles and the viewpoint of making it less likely to cause peeling between the circuit member and the circuit connection portion in a high-temperature and high-humidity environment (for example, 85 ℃ and 85% RH), the ratio of the DSC heat release amount (Cx/Cy) is preferably 0.40 or less, more preferably 0.30 or less, and still more preferably 0.20 or less. From the viewpoint of improving the affinity between the first adhesive layer and the second adhesive layer and obtaining more excellent connection reliability, the ratio of DSC heat release (Cx/Cy) may be 0.01 or more, or 0.05 or more. From these viewpoints, the ratio of DSC heat release amount (Cx/Cy) may be 0.01 to 0.40, 0.01 to 0.30, 0.01 to 0.20, 0.05 to 0.40, 0.05 to 0.30, or 0.05 to 0.20.
(first adhesive layer)
The first adhesive layer 2 is composed of, for example, a cured product of a first curable composition. The first curable composition may be a photocurable composition or a thermosetting composition. The first curable composition contains, for example, (a) a polymerizable compound (hereinafter also referred to as "component (a)"), and (B) a polymerization initiator (hereinafter also referred to as "component (B)"), and (C) the conductive particles 4 (hereinafter also referred to as "component (C)"). In the case where the first curable composition is a photocurable composition, the first curable composition contains a photopolymerization initiator as the component (B), and in the case where the first curable composition is a thermosetting composition, the first curable composition contains a thermal polymerization initiator as the component (B). Such a first adhesive layer 2 can be obtained, for example, as follows: the first curable composition is cured by polymerizing the component (a) by irradiating or heating a layer composed of the first curable composition with light. That is, the first adhesive layer 2 may contain the conductive particles 4 and the adhesive component 5 obtained by curing the components of the first curable composition other than the conductive particles 4. The first adhesive layer 2 may be a cured product obtained by completely curing the first curable composition or a cured product obtained by partially curing the first curable composition. That is, when the first curable composition contains the component (a) and the component (B), the adhesive component 5 may contain or may not contain the unreacted component (a) and the unreacted component (B).
[ (A) ingredient: polymerizable Compound ]
(A) The component (b) is, for example, a compound which is polymerized by a radical, cation or anion generated by irradiation of light (for example, ultraviolet light) or heating of a polymerization initiator (photopolymerization initiator or thermal polymerization initiator). (A) The component (b) may be any of a monomer, an oligomer, or a polymer. As the component (a), one compound may be used alone, or a plurality of compounds may be used in combination.
(A) The component (B) has at least one polymerizable group. The polymerizable group is, for example, a group containing a polymerizable unsaturated double bond (ethylenically unsaturated bond). The polymerizable group is preferably a radical polymerizable group that reacts with a radical, from the viewpoint of easily obtaining a desired DSC heat release and from the viewpoint of further improving the effect of reducing the connection resistance and further improving the connection reliability. That is, the component (A) is preferably a radical polymerizable compound. Examples of the radical polymerizable group include a vinyl group, an allyl group, a styryl group, an alkenyl group, an alkenylene group, (meth) acryloyl group, and a maleimide group. The number of polymerizable groups of component (a) may be 2 or more from the viewpoint of easily obtaining physical properties and crosslinking density required for reducing connection resistance after polymerization, and the number of polymerizable groups of component (a) may be 10 or less from the viewpoint of suppressing curing shrinkage during polymerization. In order to balance the crosslinking density and the curing shrinkage, a polymerizable compound having a number of polymerizable groups within the above range may be used, and a polymerizable compound outside the above range may be additionally used.
Specific examples of the component (A) include: (meth) acrylate compounds, maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadimide derivatives, natural rubber, isoprene rubber, butyl rubber, nitrile rubber, butadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, carboxylated nitrile rubber, and the like.
Examples of the (meth) acrylate compound include: epoxy (meth) acrylate, (poly) urethane (meth) acrylate, methyl (meth) acrylate, polyether (meth) acrylate, polyester (meth) acrylate, polybutadiene (meth) acrylate, silicone acrylate, ethyl (meth) acrylate, 2-cyanoethyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, isopropyl (meth) acrylate, hydroxypropyl (meth) acrylate, isobutyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, urethane (meth) acrylate, polyether (meth) acrylate, N-lauryl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, N-dimethylaminoethyl (meth) acrylate, N-dimethylaminopropyl (meth) acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, and mixtures thereof, Dipentaerythritol hexa (meth) acrylate, isocyanuric acid-modified difunctional (meth) acrylate, isocyanuric acid-modified trifunctional (meth) acrylate, tricyclodecanyl acrylate, dimethylol-tricyclodecane diacrylate, 2-hydroxy-1, 3-diacryloyloxypropane, 2-bis [4- (acryloyloxymethyl) phenyl ] propane, 2-bis [4- (acryloyloxypolyethoxy) phenyl ] propane, 2-bis (meth) acryloyloxydiethylphosphate, 2- (meth) acryloyloxyethyl acid phosphate and the like.
As the maleimide compound, there can be mentioned: 1-methyl-2, 4-bismaleimide benzene, N '-m-phenylenebismaleimide, N' -p-phenylenebismaleimide, N '-m-tolylenedimaleimide, N' -4, 4-biphenylenedimaleimide, N '-4,4- (3,3' -dimethylbiphenylene) bismaleimide, N '-4,4- (3,3' -dimethyldiphenylmethane) bismaleimide, N '-4,4- (3,3' -diethyldiphenylmethane) bismaleimide, N '-4, 4-diphenylmethane bismaleimide, N' -4, 4-diphenylpropane bismaleimide, N, N '-4, 4-diphenylether bismaleimide, N' -3, 3-diphenylsulfone bismaleimide, 2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2-bis (3-sec-butyl-4-8 (4-maleimidophenoxy) phenyl) propane, 1-bis (4- (4-maleimidophenoxy) phenyl) decane, 4 '-cyclohexylene-bis (1- (4-maleimidophenoxy) -2-cyclohexylbenzene, 2' -bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane, and the like.
Examples of the vinyl ether compound include diethylene glycol divinyl ether, dipropylene glycol divinyl ether, cyclohexanedimethanol divinyl ether, trimethylolpropane trivinyl ether, and the like.
Examples of the allyl compound include 1, 3-diallyl phthalate, 1, 2-diallyl phthalate, and triallyl isocyanurate.
The component (a) is preferably a (meth) acrylate compound from the viewpoint of an excellent balance between the curing reaction rate and the physical properties after curing. The component (a) may be a (poly) urethane (meth) acrylate compound (urethane (meth) acrylate compound or urethane (meth) acrylate compound) from the viewpoint of achieving both a cohesive force for reducing the connection resistance and an elongation for improving the adhesive force and obtaining more excellent adhesive properties. The component (a) may be a (meth) acrylate compound having a high Tg skeleton such as dicyclopentadiene, from the viewpoint of improving the cohesive force and reducing the connection resistance.
From the viewpoint of achieving a balance between the crosslinking density and the curing shrinkage, further reducing the connection resistance, and improving the connection reliability, the component (a) may be a compound (for example, urethane (meth) acrylate) obtained by introducing a polymerizable group such as a vinyl group, an allyl group, or a (meth) acryloyl group into a terminal or a side chain of a thermoplastic resin such as an acrylic resin, a phenoxy resin, or a urethane resin. In this case, the weight average molecular weight of the component (a) may be 3000 or more, 5000 or more, or 1 ten thousand or more from the viewpoint of excellent balance between the crosslinking density and the curing shrinkage. The weight average molecular weight of the component (a) may be 100 ten thousand or less, 50 ten thousand or less, or 25 ten thousand or less, from the viewpoint of excellent compatibility with other components. The weight average molecular weight is a value measured by Gel Permeation Chromatography (GPC) using a calibration curve based on standard polystyrene under the conditions described in examples.
(A) The component (b) preferably contains a radical polymerizable compound having a phosphate structure represented by the following general formula (1) as the (meth) acrylate compound. In this case, since the adhesive strength to the surface of an inorganic substance (metal or the like) is improved, it is suitable for, for example, adhesion between electrodes (for example, between circuit electrodes).
[ solution 1]
Figure BDA0002405816230000091
[ in the formula, n represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group. ]
The radical polymerizable compound having a phosphate structure can be obtained by, for example, reacting anhydrous phosphoric acid with 2-hydroxyethyl (meth) acrylate. Specific examples of the radical polymerizable compound having a phosphate structure include mono (2- (meth) acryloyloxyethyl) acid phosphate, di (2- (meth) acryloyloxyethyl) acid phosphate and the like.
The content of the component (a) may be 5% by mass or more, 10% by mass or more, or 20% by mass or more based on the total mass of the first curable composition, from the viewpoint of easily obtaining a crosslinking density necessary for reducing the connection resistance and improving the connection reliability. From the viewpoint of suppressing the curing shrinkage at the time of polymerization, the content of the component (a) may be 90% by mass or less, 80% by mass or less, or 70% by mass or less, based on the total mass of the first curable composition.
[ (B) ingredient: polymerization initiator
(B) The component (b) may be a photopolymerization initiator (photo radical polymerization initiator, photo cation polymerization initiator or photo anion polymerization initiator) which generates radicals, cations or anions by irradiation with light having a wavelength in the range of 150 to 750nm, preferably light having a wavelength in the range of 254 to 405nm, more preferably light having a wavelength of 365nm (e.g., ultraviolet light), or may be a thermal polymerization initiator (thermal radical polymerization initiator, thermal cation polymerization initiator or thermal anion polymerization initiator) which generates radicals, cations or anions by heat. The component (B) is preferably a radical polymerization initiator (photo radical polymerization initiator or thermal radical polymerization initiator) from the viewpoint of easily obtaining a desired DSC heat release amount, from the viewpoint of further improving the effect of reducing the connection resistance and further improving the connection reliability, and from the viewpoint of facilitating curing at a low temperature in a short time. As the component (B), one compound may be used alone, or a plurality of compounds may be used in combination. For example, the first curable composition may contain both a photopolymerization initiator and a thermal polymerization initiator as the component (B).
The photo radical polymerization initiator is a compound that generates a radical by giving light energy from the outside, and examples of the photo radical polymerization initiator include compounds having a structure such as an oxime ester structure, a biimidazole structure, an acridine structure, an α -aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzildimethylketal structure, and a α -hydroxyalkylphenone structure.
Specific examples of the compound having an oxime ester structure include: 1-phenyl-1, 2-butanedione-2- (O-methoxycarbonyl) oxime, 1-phenyl-1, 2-propanedione-2- (O-ethoxycarbonyl) oxime, 1-phenyl-1, 2-propanedione-2-O-benzoyl oxime, 1, 3-diphenylpropanetrione-2- (O-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (O-benzoyl) oxime, 1, 2-octanedione, 1- [4- (phenylthio) phenyl-, 2- (O-benzoyl oxime) ], ethanone, 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -,1- (O-acetyloxime), and the like.
Specific examples of the compound having the α -aminoalkylphenone structure include 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-morpholinophenylbutanone-1, and the like.
Specific examples of the compound having an acylphosphine oxide structure include: bis (2, 6-dimethoxybenzoyl) -2,4, 4-trimethylpentylphosphine oxide, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide and the like.
The thermal radical polymerization initiator is decomposed by heat to generate a radical. That is, the thermal radical polymerization initiator is a compound that generates radicals by applying external thermal energy. The thermal radical polymerization initiator may be optionally selected from conventionally known organic peroxides and azo compounds. The thermal radical polymerization initiator is preferably an organic peroxide having a 1-minute half-life temperature of 90 to 175 ℃ and a weight-average molecular weight of 180 to 1000, from the viewpoint of stability, reactivity and compatibility. When the 1-minute half-life temperature is in this range, the storage stability is further excellent, the radical polymerizability is sufficiently high, and the curing can be performed in a short time.
Specific examples of the organic peroxide include: 1,1,3, 3-tetramethylbutyl peroxyneodecanoate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, bis (2-ethylhexyl) peroxydicarbonate, cumyl peroxyneodecanoate, dilauroyl peroxide, 1-cyclohexyl-1-methylethyl peroxyneodecanoate, tert-hexyl peroxyneodecanoate, tert-butyl peroxypivalate, 1,3, 3-tetramethylbutyl peroxy2-ethylhexanoate, 2, 5-dimethyl-2, 5-di (2-ethylhexanoylperoxy) hexane, tert-hexyl peroxy2-ethylhexanoate, tert-butyl peroxyneoheptanoate, and mixtures thereof, T-amyl peroxy-2-ethylhexanoate, di-t-butyl peroxyhexahydrophthalate, t-amyl peroxy-3, 5, 5-trimethylhexanoate, 3-hydroxy-1, 1-dimethylbutyl peroxyneodecanoate, t-amyl peroxy-2-ethylhexanoate, bis (3-methylbenzoyl) peroxide, dibenzoyl peroxide, bis (4-methylbenzoyl) peroxide, t-hexyl peroxyisopropylmonocarbonate, t-butylperoxymaleic acid, t-butyl peroxy-3, 5, 5-trimethylhexanoate, t-butyl peroxylaurate, 2, 5-dimethyl-2, 5-bis (3-methylbenzoyl peroxide) hexane, t-butyl peroxy-2-ethylhexyl monocarbonate, t-butyl peroxy2-ethylhexylmonocarbonate, t-butyl peroxycarbonate, t-butyl peroxydicarbonate, di-3, 5, 5-trimethylhexanoate, di-3-methylbenzoyl peroxide, tert-hexyl peroxybenzoate, 2, 5-dimethyl-2, 5-di (benzoylperoxy) hexane, tert-butyl peroxybenzoate, trimethyl dibutyl peroxyadipate, tert-amyl n-octanoate peroxide, tert-amyl isononanoate peroxide, tert-amyl peroxybenzoate, and the like.
Specific examples of the azo compound include: 2,2 '-azobis-2, 4-dimethylvaleronitrile, 1' -azobis (1-acetoxy-1-phenylethane), 2 '-azobisisobutyronitrile, 2' -azobis (2-methylbutyronitrile), 4 '-azobis (4-cyanovaleric acid), 1' -azobis (1-cyclohexanecarbonitrile) and the like.
The content of the component (B) may be 0.1% by mass or more, or 0.5% by mass or more, based on the total mass of the first curable composition, from the viewpoint of excellent rapid curability and from the viewpoint of excellent reduction effect of connection resistance. The content of the component (B) may be 20% by mass or less, 10% by mass or less, or 5% by mass or less based on the total mass of the first curable composition, from the viewpoint of improving storage stability and from the viewpoint of having an excellent effect of reducing connection resistance.
The first curable composition preferably contains at least one of a photopolymerization initiator and a thermal polymerization initiator as the component (B) from the viewpoint of easily obtaining a desired viscosity, and more preferably contains a photopolymerization initiator from the viewpoint of easily producing an adhesive film for circuit connection.
[ (C) ingredient: conductive particles
(C) The component is not particularly limited as long as it is a particle having conductivity, and may be a metal particle made of a metal such as Au, Ag, Ni, Cu, or solder; conductive carbon particles made of conductive carbon, and the like. (C) The component (c) may be coated conductive particles including a core and a coating layer for coating the core, the core including non-conductive glass, ceramic, plastic (polystyrene, etc.), and the coating layer including the metal or conductive carbon. Among these, it is preferable to use a coated conductive particle having a core containing a metal particle or plastic made of a heat-fusible metal and a coating layer containing a metal or conductive carbon. In this case, since the cured product of the first curable composition is easily deformed by heating or pressing, when the electrodes are electrically connected to each other, the contact area between the electrodes and the component (C) can be increased, and the conductivity between the electrodes can be further improved.
(C) The component (b) may be an insulating coated conductive particle comprising the metal particle, a conductive carbon particle or a coated conductive particle, and an insulating layer for coating the surface of the particle, wherein the insulating layer contains an insulating material such as a resin. If component (C) is an insulating coated conductive particle, even when the content of component (C) is large, the surface of the particle is coated with a resin, so that occurrence of short circuit due to contact between components (C) can be suppressed, and the insulation between adjacent electrode circuits can be improved. (C) The component (c) may be one of the above-mentioned various conductive particles alone or two or more of them may be used in combination.
(C) The maximum particle size of the component needs to be smaller than the minimum spacing of the electrodes (the shortest distance between adjacent electrodes). The maximum particle diameter of the component (C) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The maximum particle diameter of the component (C) may be 50 μm or less, 30 μm or less, or 20 μm or less from the viewpoint of excellent dispersibility and electrical conductivity. In the present specification, the particle size of 300 (pcs) arbitrary conductive particles is measured by observation using a Scanning Electron Microscope (SEM), and the maximum value obtained is set as the maximum particle size of the component (C). When the component (C) is not spherical, for example, when the component (C) has protrusions, the particle diameter of the component (C) is the diameter of a circle circumscribing the conductive particles in the SEM image.
The average particle diameter of the component (C) may be 1.0 μm or more, 2.0 μm or more, or 2.5 μm or more from the viewpoint of excellent dispersibility and conductivity. The average particle diameter of the component (C) may be 50 μm or less, 30 μm or less, or 20 μm or less from the viewpoint of excellent dispersibility and electrical conductivity. In the present specification, the particle diameter of an arbitrary 300 (pcs) conductive particles is measured by observation using a Scanning Electron Microscope (SEM), and the average value of the obtained particle diameters is defined as an average particle diameter.
In the first adhesive layer 2, the component (C) is preferably uniformly dispersed. The particle density of the component (C) in the first adhesive layer 2 may be 100pcs/mm or more from the viewpoint of obtaining stable connection resistance2And may be greater than or equal to 1000pcs/mm2And may be greater than or equal to 2000pcs/mm2. The particle density of the component (C) in the first adhesive layer 2 may be 100000pcs/mm or less from the viewpoint of improving the insulation between adjacent electrodes2May be less than or equal to 50000pcs/mm2And may be less than or equal to 10000pcs/mm2。
From the viewpoint of further improving the conductivity, the content of the component (C) may be 0.1 vol% or more, 1 vol% or more, or 5 vol% or more, based on the total volume in the first adhesive layer. From the viewpoint of easily suppressing short-circuiting, the content of the component (C) may be 50 vol% or less, 30 vol% or less, or 20 vol% or less, based on the total volume in the first adhesive layer. The content of the component (C) in the first curable composition (based on the total volume of the first curable composition) may be in the same range as described above.
From the viewpoint of further improving the conductivity, the content of the component (C) may be 0.05% by mass or more, 0.5% by mass or more, or 2.5% by mass or more, based on the total mass of the first adhesive layer. From the viewpoint of easily suppressing short-circuiting, the content of the component (C) may be 25% by mass or less, 15% by mass or less, or 10% by mass or less, based on the total mass of the first adhesive layer. When the content of the component (C) is within the above range, the effects of the present invention tend to be remarkably exhibited. The content of the component (C) may be the same as the above range based on the total mass of the first curable composition.
[ other ingredients ]
The first curable composition may further contain other components in addition to the component (a), the component (B), and the component (C). Examples of the other components include a thermoplastic resin, a coupling agent, and a filler. These components may be contained in the first adhesive layer 2.
Examples of the thermoplastic resin include phenoxy resins, polyester resins, polyamide resins, polyurethane resins, polyester polyurethane resins, and acrylic rubbers. When the first curable composition contains a thermoplastic resin, the first adhesive layer can be easily formed. In addition, when the first curable composition contains a thermoplastic resin, the stress of the first adhesive layer generated when the first curable composition is cured can be relaxed. In addition, when the thermoplastic resin has a functional group such as a hydroxyl group, adhesiveness of the first adhesive layer is easily improved. The content of the thermoplastic resin may be, for example, 5% by mass or more and 80% by mass or less, based on the total mass of the first curable composition.
Examples of the coupling agent include silane coupling agents having an organic functional group such as a (meth) acryloyl group, mercapto group, amino group, imidazolyl group, or epoxy group; silane compounds such as tetraalkoxysilane; tetraalkoxy titanate derivatives, polydialkyl titanate derivatives, and the like. When the first curable composition contains a coupling agent, the adhesiveness can be further improved. The content of the coupling agent may be, for example, 0.1% by mass or more and 20% by mass or less, based on the total mass of the first curable composition.
Examples of the filler include non-conductive fillers (e.g., non-conductive particles). When the first curable composition contains a filler, further improvement in connection reliability can be expected. The filler may be either an inorganic filler or an organic filler. Examples of the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; inorganic fine particles such as nitride fine particles. Examples of the organic filler include organic fine particles such as silicone fine particles, methacrylate-butadiene-styrene fine particles, acrylic silicone fine particles, polyamide fine particles, and polyimide fine particles. These fine particles may have a uniform structure or a core-shell structure. The maximum diameter of the filler is preferably smaller than the minimum particle diameter of the conductive particles 4. The content of the filler may be, for example, 0.1% by volume or more and 50% by volume or less, based on the total volume of the first curable composition. The content of the filler may be, for example, 0.05% by mass or more and 25% by mass or less, based on the total mass of the first curable composition.
The first curable composition may contain other additives such as a softening agent, an accelerator, an anti-deterioration agent, a colorant, a flame retardant, and a thixotropic agent. The content of these additives may be, for example, 0.1 to 10% by mass based on the total mass of the first curable composition. These additives may also be contained in the first adhesive layer 2.
The first curable composition may contain a thermosetting resin instead of or in addition to the components (a) and (B). The thermosetting resin is a resin that is cured by heat, and has at least one thermosetting group. The thermosetting resin is, for example, a compound that reacts with a curing agent by heat to crosslink. As the thermosetting resin, one compound may be used alone, or a plurality of compounds may be used in combination.
The thermosetting group may be, for example, an epoxy group, an oxetanyl group, an isocyanate group, or the like, from the viewpoint of easily obtaining a desired DSC heat release amount and from the viewpoint of further improving the effect of reducing the connection resistance and further improving the connection reliability.
Specific examples of the thermosetting resin include bisphenol type epoxy resins which are reaction products of epichlorohydrin and bisphenol A, F, AD or the like; epoxy novolac resins as reaction products of epichlorohydrin with phenol novolac, cresol novolac, and the like; a naphthalene-based epoxy resin having a skeleton containing a naphthalene ring; epoxy resins such as various epoxy compounds having two or more glycidyl groups in one molecule, for example, glycidyl amine and glycidyl ether.
In the case where a thermosetting resin is used instead of the (a) component and the (B) component, for example, the content of the thermosetting resin in the first curable composition may be 20% by mass or more and may be 80% by mass or less, based on the total mass of the first curable composition. In the case where a thermosetting resin is used in addition to the component (a) and the component (B), for example, the content of the thermosetting resin in the first curable composition may be greater than or equal to 30 mass% and may be less than or equal to 70 mass% based on the total mass of the first curable composition.
When the first curable composition contains a thermosetting resin, the first curable composition may contain a curing agent for the thermosetting resin. Examples of the curing agent for thermosetting resins include a thermal radical generator, a thermal cation generator, and a thermal anion generator. The content of the curing agent may be, for example, 0.1 part by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the thermosetting resin.
The first adhesive layer 2 may contain unreacted components derived from the first curable composition, such as the component (a) and the component (B). Presume that: when the adhesive film 1 of the present embodiment is stored in a conventional storage member and stored or transported, the unreacted component (B) remains in the first adhesive layer 2, and therefore, during storage and transportation, a part of the second curable composition in the second adhesive layer 3 is cured, and the following problems occur: peeling between the circuit member and the circuit connection portion is likely to occur in a high-temperature and high-humidity environment, and the effect of improving the capture rate is reduced, and the effect of reducing the connection resistance of the adhesive film 1 due to a reduction in fluidity is reduced. Therefore, from the viewpoint of suppressing the occurrence of the above-described problems, the content of the component (B) in the first adhesive layer 2 may be 15% by mass or less, 10% by mass or less, or 5% by mass or less, based on the total mass of the first adhesive layer. The content of the component (B) in the first adhesive layer 2 may be 0.1% by mass or more based on the total mass of the first adhesive layer. When the first adhesive layer 2 contains a photopolymerization initiator as the component (B), the adhesive film 1 is stored in a storage member described later, whereby the occurrence of the above-described problem can be suppressed.
The DSC heat release of the first curable composition may be 5J/g or more, 10J/g or more, or 30J/g or more, from the viewpoint of easily obtaining a cohesive force required for obtaining good reliability after curing. From the viewpoint of reducing curing shrinkage during curing and obtaining good reliability, the DSC heat release of the first curable composition may be 300J/g or less, 200J/g or less, or 150J/g or less.
From the viewpoint of improving the adhesion to the second adhesive layer 3 and obtaining good reliability, the DSC heat release Cx of the first adhesive layer 2 may be equal to or greater than 0.1J/g, equal to or greater than 1J/g, or equal to or greater than 2.5J/g. From the viewpoint of further improving the capture rate of the conductive particles and from the viewpoint of making the peeling between the circuit member and the circuit connection portion less likely to occur in a high-temperature and high-humidity environment (for example, 85 ℃ C., 85% RH), the DSC heat release amount Cx may be 100J/g or less, 50J/g or less, or 35J/g or less. The DSC heat release amount Cx can be adjusted by changing the composition of the first curable composition, changing the curing conditions of the first curable composition, and the like.
The thickness d1 of the first adhesive layer 2 may be 0.2 times or more, or 0.3 times or more the average particle diameter of the conductive particles 4, from the viewpoint of easily suppressing short circuits caused by aggregation of the conductive particles 4. From the viewpoint of facilitating the trapping of the conductive particles 4 between the electrodes, making the conductive particles highly efficient to be flat at the time of thermocompression bonding, and further reducing the connection resistance, the thickness d1 of the first adhesive layer 2 may be equal to or less than 0.8 times the average particle diameter of the conductive particles 4, or equal to or less than 0.7 times the average particle diameter of the conductive particles 4. From these viewpoints, the thickness d1 of the first adhesive layer 2 may be 0.2 to 0.8 times, or 0.3 to 0.7 times the average particle diameter of the conductive particles 4. When the thickness d1 of the first adhesive layer 2 and the average particle diameter of the conductive particles 4 satisfy the relationship described above, for example, as shown in fig. 1, a part of the conductive particles 4 in the first adhesive layer 2 may protrude from the first adhesive layer 2 toward the second adhesive layer 3. In this case, the boundary S between the first adhesive layer 2 and the second adhesive layer 3 is located at the separation portion between the adjacent conductive particles 4 and 4. The conductive particles 4 may not be exposed on the surface 2a of the first adhesive layer 2 opposite to the second adhesive layer 3, and the surface 2a opposite to the surface may be a flat surface.
The thickness d1 of the first adhesive layer 2 can be set as appropriate according to the height of the electrodes of the circuit members to be adhered and the like. The thickness d1 of the first adhesive layer 2 may be, for example, 0.5 μm or more and 20 μm or less. When the conductive particles 4 are partially exposed from the surface of the first adhesive layer 2 (for example, protruding toward the second adhesive layer 3), the distance from the surface 2a of the first adhesive layer 2 opposite to the second adhesive layer 3 to the boundary S between the first adhesive layer 2 and the second adhesive layer 3 at the spaced portion between the adjacent conductive particles 4,4 (distance indicated by d1 in fig. 1) is the thickness of the first adhesive layer 2, and the exposed portions of the conductive particles 4 are not included in the thickness of the first adhesive layer 2. The length of the exposed portion of the conductive particle 4 may be, for example, 0.1 μm or more and 20 μm or less.
(second adhesive layer)
The second adhesive layer 3 is made of, for example, a second curable composition. The second curable composition contains, for example, (a) a polymerizable compound (hereinafter also referred to as a component (a)), and (b) a polymerization initiator (hereinafter also referred to as a component (b)). The second curable composition may be a thermosetting composition containing a thermal polymerization initiator as the component (b), a photocurable composition containing a photopolymerization initiator as the component (b), or a mixture of a thermosetting composition and a photocurable composition. The second curable composition constituting the second adhesive layer 3 is an uncured curable composition that can flow during circuit connection, and is, for example, an uncured curable composition.
[ (a) ingredient: polymerizable Compound ]
(a) The component (b) is, for example, a compound which is polymerized by a radical, cation or anion generated by irradiation of light (for example, ultraviolet light) or heating of a polymerization initiator (photopolymerization initiator or thermal polymerization initiator). As the component (a), the compounds exemplified as the component (a) can be used. The component (a) is preferably a radical polymerizable compound having a radical polymerizable group that reacts with a radical, from the viewpoint of facilitating connection at low temperature in a short time and easily obtaining a desired DSC heat release, and from the viewpoint of further improving the effect of reducing connection resistance and further improving connection reliability. (a) Examples of the preferable radical polymerizable compound in component (a) and combinations of the preferable radical polymerizable compounds are the same as in component (a). When the component (a) is a radical polymerizable compound and the component (B) in the first adhesive layer is a photo radical polymerization initiator, the adhesive film is stored in a storage member described later, and thus curing of the second curable composition tends to be significantly suppressed during storage or transportation of the adhesive film.
(a) The component (b) may be any of a monomer, an oligomer, or a polymer. As the component (a), one compound may be used alone, or a plurality of compounds may be used in combination. (a) The component (A) may be the same as or different from the component (A).
The content of the component (a) may be 10% by mass or more, 20% by mass or more, or 30% by mass or more based on the total mass of the second curable composition, from the viewpoint of easily obtaining a crosslinking density necessary for reducing the connection resistance and improving the connection reliability. From the viewpoint of suppressing curing shrinkage during polymerization and obtaining good reliability, the content of the component (a) may be 90% by mass or less, 80% by mass or less, or 70% by mass or less, based on the total mass of the second curable composition.
[ (b) component: polymerization initiator
As the component (B), the same polymerization initiator as the polymerization initiator exemplified as the component (B) can be used. (b) The component (B) is preferably a radical polymerization initiator. (b) Examples of preferred radical polymerization initiators in component (a) are the same as in component (B). As the component (b), one compound may be used alone, or a plurality of compounds may be used in combination.
The content of the component (b) may be 0.1% by mass or more, 0.5% by mass or more, or 1% by mass or more, based on the total mass of the second curable composition, from the viewpoint of facilitating connection at a low temperature in a short time and from the viewpoint of further improving connection reliability. From the viewpoint of pot life (pot life), the content of the component (b) may be 30% by mass or less, 20% by mass or less, or 10% by mass or less, based on the total mass of the second curable composition.
[ other ingredients ]
The second curable composition may further contain other components in addition to the component (a) and the component (b). Examples of the other components include thermoplastic resins, coupling agents, fillers, softeners, accelerators, deterioration prevention agents, colorants, flame retardants, and thixotropic agents. The details of the other components are the same as those of the other components in the first adhesive layer 2.
The second curable composition may contain a thermosetting resin instead of or in addition to the components (a) and (b). When the second curable composition contains a thermosetting resin, the second curable composition may contain a curing agent for curing the thermosetting resin. As the thermosetting resin and the curing agent, the same thermosetting resin and curing agent as those exemplified as the other components in the first curable composition can be used. In the case where a thermosetting resin is used instead of the (a) component and the (b) component, for example, the content of the thermosetting resin in the second curable composition may be 20% by mass or more and may be 80% by mass or less, based on the total mass of the second curable composition. In the case where a thermosetting resin is used in addition to the component (a) and the component (b), for example, the content of the thermosetting resin in the second curable composition may be 20% by mass or more and may be 80% by mass or less, based on the total mass of the second curable composition. The content of the curing agent may be the same as the range described as the content of the curing agent in the first curable composition.
The content of the conductive particles 4 in the second adhesive layer 3 may be, for example, 1% by mass or less and may be 0% by mass based on the total mass of the second adhesive layer. The second adhesive layer 3 preferably does not contain the conductive particles 4.
The DSC heat emission Cy of the second adhesive layer 3 may be 10J/g or more, 30J/g or more, or 50J/g or more, from the viewpoint of easily obtaining a cohesive force necessary for obtaining good reliability after curing and easily improving connection reliability. From the viewpoint of suppressing curing shrinkage during polymerization and obtaining good reliability, the DSC heat emission Cy may be 300J/g or less, 200J/g or less, or 150J/g or less. The DSC heat release amount Cy can be adjusted by changing the composition of the second curable composition, and the like.
The thickness d2 of the second adhesive layer 3 can be set as appropriate according to the electrode height of the circuit member to be adhered and the like. From the viewpoint of sufficiently filling the gap between the electrodes to seal the electrodes and obtain more excellent reliability, the thickness d2 of the second adhesive layer 3 may be 5 μm or more and 200 μm or less. When a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 2 (for example, protrudes toward the second adhesive layer 3 side), the distance from the surface 3a of the second adhesive layer 3 opposite to the first adhesive layer 2 side to the boundary S between the first adhesive layer 2 and the second adhesive layer 3 at the spaced part of the adjacent conductive particles 4,4 (distance indicated by d2 in fig. 1) is the thickness of the second adhesive layer 3.
From the viewpoint of being able to sufficiently fill the inter-electrode gap to seal the electrodes and obtain better reliability, the ratio of the thickness d1 of the first adhesive layer 2 to the thickness d2 of the second adhesive layer 3 (thickness d1 of the first adhesive layer 2/thickness d2 of the second adhesive layer 3) may be greater than or equal to 1 and may be less than or equal to 1000.
The thickness of the adhesive film 1 (the sum of the thicknesses of all layers constituting the adhesive film 1. in fig. 1, the sum of the thickness d1 of the first adhesive layer 2 and the thickness d2 of the second adhesive layer 3) may be, for example, 5 μm or more and 200 μm or less.
The circuit connecting adhesive film of the present embodiment has been described above, but the present invention is not limited to the above embodiment.
For example, the adhesive film for circuit connection may be composed of two layers of the first adhesive layer and the second adhesive layer, or may be composed of three or more layers including a layer other than the first adhesive layer and the second adhesive layer (for example, a third adhesive layer). The third adhesive layer may have the same composition as that described above for the first adhesive layer or the second adhesive layer, may have the same physical properties (for example, DSC heat release) as those described above for the first adhesive layer or the second adhesive layer, or may have the same thickness as those described above for the first adhesive layer or the second adhesive layer. The circuit-connecting adhesive film may further include a third adhesive layer on a surface of the first adhesive layer opposite to the second adhesive layer, for example. That is, the circuit-connecting adhesive film is formed by laminating a second adhesive layer, a first adhesive layer, and a third adhesive layer in this order, for example. In this case, the third adhesive layer is made of a second curable composition (e.g., a thermosetting composition) as in the case of the second adhesive layer, for example.
The circuit connecting adhesive film of the above embodiment is an anisotropic conductive adhesive film having anisotropic conductivity, but the circuit connecting adhesive film may be a conductive adhesive film having no anisotropic conductivity.
< method for producing adhesive film for circuit connection >
The method for manufacturing the adhesive film 1 for circuit connection according to the present embodiment includes, for example: a preparation step (first preparation step) of preparing the first adhesive layer 2; and a laminating step of laminating the second adhesive layer 3 on the first adhesive layer 2. The method for producing the adhesive film 1 for circuit connection may further include: a preparation step (second preparation step) of preparing the second adhesive layer 3.
In the first preparation step, for example, the first adhesive layer 2 is prepared by forming the first adhesive layer 2 on a base material to obtain a first adhesive film. Specifically, the varnish composition is prepared by first adding the component (a), the component (B), and the component (C) and other components added as needed to an organic solvent, and dissolving or dispersing the components by stirring, mixing, kneading, or the like. Then, after the varnish composition is applied to the substrate subjected to the release treatment using a knife coater, a roll coater, an applicator, or the like, the organic solvent is volatilized by heating, and a layer composed of the first curable composition is formed on the substrate. Next, the first curable composition is cured by irradiating or heating the layer composed of the first curable composition with light, thereby forming the first adhesive layer 2 on the substrate (curing step). Thereby, the first adhesive film can be obtained.
The organic solvent used for the preparation of the varnish composition preferably has a property of uniformly dissolving or dispersing each component, and examples thereof include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, and butyl acetate. These organic solvents may be used alone or in combination of two or more. The stirring, mixing and kneading in the preparation of the varnish composition may be carried out by using, for example, a stirrer, a sand mill, a three-roll mill, a ball mill, a bead mill or a homogenizer.
The substrate is not particularly limited as long as it has heat resistance that can withstand heating conditions when the organic solvent is volatilized when the first curable composition is cured by light, and is not particularly limited as long as it has heat resistance that can withstand heating conditions when the organic solvent is volatilized and heating conditions when the first curable composition is cured by heating. As the substrate, for example, a substrate (e.g., a film) containing stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, or the like can be used.
The heating condition for volatilizing the organic solvent from the varnish composition applied to the substrate is preferably a condition under which the organic solvent is sufficiently volatilized. The heating condition may be, for example, 40 ℃ or more and 120 ℃ or less, and 0.1 minute or more and 10 minutes or less.
For the light irradiation in the curing step, it is preferable to use irradiation light (for example, ultraviolet light) having a wavelength in the range of 150 to 750 nm. The light irradiation can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like. The amount of light irradiation can be adjusted so that the ratio of the DSC heat release (Cx/Cy) is 0.4 or less. The irradiation amount of light may be 100mJ/cm or more, for example, in terms of the integrated dose of light having a wavelength of 365nm2And may be greater than or equal to 200mJ/cm2And may be 300mJ/cm or more2. For example, the irradiation amount of light may be less than or equal to 10000mJ/cm in terms of the integrated dose of light having a wavelength of 365nm2May be less than or equal to5000mJ/cm2And may be less than or equal to 3000mJ/cm2. The larger the amount of light irradiation (the cumulative amount of light), the smaller the DSC heat release Cx, and the smaller the ratio of the DSC heat release (Cx/Cy).
The heating conditions in the curing step may be adjusted so that the ratio of DSC heat release (Cx/Cy) is 0.4 or less. The heating condition may be, for example, 30 ℃ or higher and 300 ℃ or lower, 0.1 minute or higher and 5000 minutes or lower, or 50 ℃ or higher and 150 ℃ or lower, 0.1 minute or higher and 3000 minutes or lower. The higher the heating temperature, the smaller the DSC heat release Cx tends to be, and the smaller the ratio of the DSC heat release (Cx/Cy) tends to be. Further, the longer the heating time, the smaller the DSC heat release Cx tends to be, and the smaller the ratio of the DSC heat release (Cx/Cy) tends to be.
In the second preparation step, the second adhesive layer 3 is prepared by forming the second adhesive layer 3 on the base material to obtain a second adhesive film in the same manner as in the first preparation step, except that the component (a) and the component (b) and other components added as needed are used and the curing step is not performed (the light irradiation and heating are not performed).
In the laminating step, the second adhesive layer 3 may be laminated on the first adhesive layer 2 by bonding the first adhesive film and the second adhesive film, or the second adhesive layer 3 may be laminated on the first adhesive layer 2 by applying a varnish composition obtained by using the components (a) and (b) and other components added as needed to the first adhesive layer 2 and volatilizing an organic solvent.
Examples of the method for bonding the first adhesive film and the second adhesive film include a method of heating and pressing, a method of roll lamination, and a method of vacuum lamination. The lamination can be carried out, for example, under heating conditions of 0 to 80 ℃.
< Circuit connection Structure and method for manufacturing the same >
A circuit connection structure using the adhesive film 1 for circuit connection as a circuit connection material and a method for manufacturing the same will be described below.
Fig. 2 is a schematic cross-sectional view showing a circuit connection structure according to an embodiment. As shown in fig. 2, the circuit connection structure 10 includes: a first circuit member 13 having a first circuit substrate 11 and a first electrode 12 formed on a main surface 11a of the first circuit substrate 11; a second circuit member 16 having a second circuit substrate 14 and a second electrode 15 formed on a principal surface 14a of the second circuit substrate 14; and a circuit connecting portion 17 disposed between the first circuit member 13 and the second circuit member 16 and electrically connecting the first electrode 12 and the second electrode 15 to each other.
The first circuit member 13 and the second circuit member 16 may be the same as or different from each other. The first circuit member 13 and the second circuit member 16 may be a glass substrate or a plastic substrate on which electrodes are formed, a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor silicon IC chip, or the like. The first circuit board 11 and the second circuit board 14 may be formed of inorganic substances such as semiconductors, glass, and ceramics, organic substances such as polyimide and polycarbonate, and composites such as glass and epoxy. The first electrode 12 and the second electrode 15 may be formed of gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium, Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Gallium Zinc Oxide (IGZO), or the like. The first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode. In fig. 2, the second electrode 15 is a bump electrode.
The circuit connection portion 17 is formed by the adhesive film 1. The circuit connection portion 17 is formed of, for example, a cured product of the adhesive film 1. The circuit connection portion 17 includes, for example: a first region 18 located on the first circuit member 13 side in a direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as "facing direction"), the first region being composed of a cured product of components of the first curable composition, such as the component (a) and the component (B), other than the conductive particles 4; a second region 19 located on the second circuit member 16 side in the opposing direction and composed of a cured product of the second curable composition containing the component (a), the component (b), and the like; and conductive particles 4 interposed at least between the first electrode 12 and the second electrode 15, electrically connecting the first electrode 12 and the second electrode 15 to each other. The circuit connecting portion may not have two regions like the first region 18 and the second region 19, and may be formed of, for example, a cured product in which a cured product of a component other than the conductive particles 4 of the first curable composition and a cured product of the second curable composition are mixed.
Fig. 3 is a schematic cross-sectional view showing a method of manufacturing the circuit connection structure 10. As shown in fig. 3, the method for manufacturing the circuit connection structure 10 includes, for example, the steps of: the adhesive film 1 is interposed between the first circuit member 13 having the first electrode 12 and the second circuit member 16 having the second electrode 15, and the first circuit member 13 and the second circuit member 16 are thermally pressed, thereby electrically connecting the first electrode 12 and the second electrode 15 to each other.
Specifically, as shown in fig. 3(a), first, a first circuit member 13 including a first circuit substrate 11 and a first electrode 12 formed on a main surface 11a of the first circuit substrate 11, and a second circuit member 16 including a second circuit substrate 14 and a second electrode 15 formed on a main surface 14a of the second circuit substrate 14 are prepared.
Next, the first circuit member 13 and the second circuit member 16 are disposed so that the first electrode 12 and the second electrode 15 face each other, and the adhesive film 1 is disposed between the first circuit member 13 and the second circuit member 16. For example, as shown in fig. 3(a), the adhesive film 1 is laminated on the first circuit member 13 so that the first adhesive layer 2 side faces the mounting surface 11a of the first circuit member 13. Next, the second circuit member 16 is disposed on the first circuit member 13 on which the adhesive film 1 is laminated, so that the first electrode 12 on the first circuit substrate 11 and the second electrode 15 on the second circuit substrate 14 face each other. For example, the adhesive film 1 may be laminated on the second circuit member 16 so that the first adhesive layer 2 side faces the mounting surface 14a of the second circuit member 16. In this case, the first circuit member 13 is disposed on the second circuit member 16 on which the adhesive film 1 is laminated, so that the first electrode 12 on the first circuit substrate 11 and the second electrode 15 on the second circuit substrate 14 face each other.
Then, as shown in fig. 3(b), the first circuit member 13, the adhesive film 1, and the second circuit member 16 are heated and pressed in the thickness direction against the first circuit member 13 and the second circuit member 16, thereby thermally bonding the first circuit member 13 and the second circuit member 16 to each other. At this time, as shown by the arrows in fig. 3(b), the second adhesive layer 3 is cured by the heating while flowing so as to fill the gap between the second electrodes 15, 15. Thereby, the first electrode 12 and the second electrode 15 are electrically connected to each other by the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are bonded to each other, so that the circuit connection structure 10 shown in fig. 2 is obtained. When the second curable composition includes the photocurable composition, the first circuit member 13 and the second circuit member 16 may be bonded by applying pressure and light irradiation, or applying pressure, heat, and light irradiation, instead of thermocompression bonding by heating.
< adhesive film housing Assembly >
Fig. 4 is a perspective view showing an adhesive film housing assembly according to an embodiment. As shown in fig. 4, the adhesive film housing module 20 includes: an adhesive film 1 for circuit connection, a reel 21 formed by winding the adhesive film 1, and a housing member 22 housing the adhesive film 1 and the reel 21.
As shown in fig. 4, the adhesive film 1 is, for example, in a tape shape. The tape-shaped adhesive film 1 is produced by, for example, cutting a sheet-shaped original plate into long strips having a width suitable for the application. A substrate may be provided on one surface of the adhesive film 1. As the substrate, the above-mentioned substrate such as PET film can be used.
The reel 21 includes: the adhesive sheet includes a first side plate 24 having a winding core 23 around which the adhesive film 1 is wound, and a second side plate 25 disposed so as to face the first side plate 24 with the winding core 23 interposed therebetween.
First side plate 24 is a circular plate made of, for example, plastic, and an opening having a circular cross section is provided in a central portion of first side plate 24.
The winding core 23 of the first side plate 24 is a portion around which the adhesive film 1 is wound. The winding core 23 is made of, for example, plastic, and is formed in an annular shape having the same thickness as the width of the adhesive film 1. Winding core 23 is fixed to the inner surface of first side plate 24 so as to surround the opening of first side plate 24. A shaft hole 26 is provided in the center of the spool 21 as a portion into which a rotation shaft of a winding device or an output device (not shown) is inserted. When the rotating shaft of the winding device or the unwinding device is driven in a state of being inserted into the shaft hole 26, the spool 21 is rotated without idling. A desiccant container that contains a desiccant may be fitted into the shaft hole 26.
Second side plate 25 is, for example, a circular plate made of plastic, similarly to first side plate 24, and an opening having a circular cross section and the same diameter as the opening of first side plate 24 is provided in the center of second side plate 25.
The housing member 22 is formed in a bag shape, for example, and houses the adhesive film 1 and the reel 21. The housing member 22 has an insertion port 27 for housing (inserting) the adhesive film 1 and the reel 21 into the housing member 22.
The housing member 22 has a viewing portion 28 that enables the interior of the housing member 22 to be viewed from the outside. The storage member 22 shown in fig. 4 is configured such that the entire storage member 22 becomes the viewing portion 28.
The viewing portion 28 has transparency to visible light. For example, when the transmittance of the viewer 28 with respect to light is measured in a wavelength range of 450 to 750nm, at least one region having a wavelength width of 50nm and an average value of the transmittance of light of 30% or more exists between the wavelengths of 450 to 750 nm. The transmittance of the viewing portion 28 for light can be obtained as follows: a sample obtained by cutting the viewing portion 28 into a predetermined size was prepared, and the transmittance of the sample with respect to light was measured by an ultraviolet-visible spectrophotometer. Since the storage member 22 has such a viewing portion 28, various information such as a product name, a lot number, a term of validity, etc. of the reel 21 attached to the inside of the storage member 22 can be confirmed even from the outside of the storage member 22. This can prevent the mixing of wrong products and improve the efficiency of sorting work.
The transmittance of the viewing portion 28 for light having a wavelength of 365nm is 10% or less. Since the transmittance of the viewing portion 28 with respect to light having a wavelength of 365nm is 10% or less, curing of the second curable composition by light incident from the outside to the inside of the housing member 22 and the photopolymerization initiator remaining in the first adhesive layer 2 when the photopolymerization initiator is used as the component (B) can be suppressed. As a result, the following problems can be suppressed: peeling between the circuit member and the circuit connection portion is likely to occur in a high-temperature and high-humidity environment, and the effect of improving the capture rate is reduced, and the effect of reducing the connection resistance of the adhesive film is reduced due to the reduction in fluidity. From the viewpoint of further suppressing generation of active species (for example, radicals) from the photopolymerization initiator, the transmittance of the viewing portion 28 for light having a wavelength of 365nm is preferably 10% or less, more preferably 5% or less, still more preferably 1% or less, and particularly preferably 0.1% or less.
From the same viewpoint, the maximum value of the transmittance of the viewing portion 28 for light in a wavelength region in which radicals, cations, or anions can be generated from the photopolymerization initiator (component (B)) is preferably 10% or less, more preferably 5% or less, still more preferably 1% or less, and particularly preferably 0.1% or less. Specifically, the maximum value of the transmittance of the viewing portion 28 for light having a wavelength of 254 to 405nm is preferably 10% or less, more preferably 5% or less, still more preferably 1% or less, and particularly preferably 0.1% or less.
The viewing section 28 (the housing member 22) is formed of a sheet having a thickness of 10 to 5000 μm, for example. The sheet is composed of a material having a transmittance of the viewing portion 28 for light having a wavelength of 365nm of 10% or less. Such materials may comprise one component or may comprise multiple components. Examples of the material include low-density polyethylene, linear low-density polyethylene, polycarbonate, polyester, acrylic resin, polyamide, and glass. These materials may also contain uv absorbers. The viewing portion 28 may have a laminated structure formed by laminating a plurality of layers having different light transmittances. In this case, each layer constituting the viewing portion 28 may contain the above-mentioned material.
The insertion port 27 can be sealed by, for example, sealing with a sealer or the like in order to prevent air from entering from the outside during storage. In this case, it is preferable to suck and remove air in the storage member 22 in advance before closing the insertion port 27. It is expected that moisture in the housing member 22 becomes less from the initial stage of housing, and air is prevented from entering from the outside. Further, since the inner surface of the housing member 22 is in close contact with the spool 21, it is possible to prevent the inner surface of the housing member 22 and the surface of the spool 21 from rubbing against each other due to vibration during transportation to generate foreign matter, and to prevent scratches on the outer surfaces of the side plates 24 and 25 of the spool 21.
In the above embodiment, the storage member is configured such that the entirety of the storage member becomes the viewing portion, but in another embodiment, the storage member may have the viewing portion in a part of the storage member. For example, the housing member may have a rectangular viewing portion at substantially the center of the side surface of the housing member. In this case, the portion of the receiving member other than the viewing portion may be black so as not to transmit, for example, ultraviolet light and visible light.
In the above embodiment, the storage member is shaped like a bag, but the storage member may be shaped like a box, for example. The receiving member is preferably provided with a cut for unsealing. In this case, the unsealing operation at the time of use becomes easy.
Examples
The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples.
< Synthesis of urethane acrylate (UA1) >
2500 parts by mass (2.50mol) of poly (1, 6-hexanediol carbonate) (trade name: Duranol T5652, manufactured by Asahi Kasei K.K., having a number average molecular weight of 1000) and 666 parts by mass (3.00mol) of isophorone diisocyanate (manufactured by Sigma-Aldrich) were uniformly added dropwise to a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser having a calcium chloride drying tube, and a nitrogen gas inlet tube over a period of 3 hours. Then, after sufficiently introducing nitrogen gas into the reaction vessel, the reaction vessel is heated to 70 to 75 ℃ to carry out a reaction. Then, 0.53 parts by mass (4.3mmol) of hydroquinone monomethyl ether (manufactured by Sigma-Aldrich) and 5.53 parts by mass (8.8mmol) of dibutyltin dilaurate (manufactured by Sigma-Aldrich) were added to the reaction vessel, and then 238 parts by mass (2.05mol) of 2-hydroxyethyl acrylate (manufactured by Sigma-Aldrich) were added thereto, followed by reaction at 70 ℃ for 6 hours under an air atmosphere. A urethane acrylate (UA1) was obtained. The weight-average molecular weight of the urethane acrylate (UA1) was 15000. The weight average molecular weight was measured by Gel Permeation Chromatography (GPC) using a standard curve based on standard polystyrene under the following conditions.
(measurement conditions)
The device comprises the following steps: GPC-8020 available from Tosoh corporation
A detector: RI-8020 manufactured by Tosoh corporation
A chromatographic column: gelpack GLA160S + GLA150S, manufactured by Hitachi chemical Co., Ltd
Sample concentration: 120mg/3mL
Solvent: tetrahydrofuran (THF)
Injection amount: 60 μ L
Pressure: 2.94X 106Pa(30kgf/cm2)
Flow rate: 1.00mL/min
< production of conductive particles >
On the surface of the polystyrene particles, a layer containing nickel was formed so that the thickness of the layer became 0.2 μm. Thus, conductive particles having an average particle diameter of 4 μm, a maximum particle diameter of 4.5 μm and a specific gravity of 2.5 were obtained.
< preparation of varnish (varnish composition) of first curable composition >
The following components were mixed in the blending amounts (parts by mass) shown in table 1 to prepare varnishes of the first curable compositions 1 to 4. The content (vol%) of the conductive particles and the content (vol%) of the filler described in table 1 are based on the total volume of the first curable composition.
(polymerizable Compound)
A1: dicyclopentadiene diacrylate (trade name: DCP-A, manufactured by Toyo SeiyｃA Kabushiki KaishｃA)
A2: urethane acrylate synthesized as described above (UA1)
A3: 2-Methacryloyloxyethyl acid phosphate (trade name: Light Ester P-2M, product of Kyoeisha chemical Co., Ltd.)
(polymerization initiator)
B1: 1, 2-octanedione, 1- [4- (phenylthio) phenyl-, 2- (O-benzoyloxime) ] (trade name: Irgacure (registered trademark) OXE01, manufactured by BASF corporation)
B2: benzoyl peroxide (trade name: NYPER BMT-K40, manufactured by Nichikoku K.K.)
(conductive particles)
C1: conductive particles produced as described above
(thermoplastic resin)
D1: bisphenol A type phenoxy resin (trade name: PKHC, manufactured by Union carbide Co., Ltd.)
(coupling agent)
E1: 3-methacryloxypropyltrimethoxysilane (trade name: KBM 503, manufactured by shin-Etsu chemical Co., Ltd.)
(Filler)
F1: silica Fine particles (trade name: R104, manufactured by AEROSIL Co., Ltd., average particle diameter (primary particle diameter): 12nm, specific gravity: 2)
(solvent)
G1: methyl ethyl ketone
[ Table 1]
Figure BDA0002405816230000281
< preparation of varnish (varnish composition) of second curable composition >
The same polymerizable compounds a1 to A3, polymerization initiator B2, thermoplastic resin D1, coupling agent E1, filler F1 and solvent G1 in the first curable composition were used as polymerizable compounds a1 to A3, polymerization initiator B1, thermoplastic resin D1, coupling agent E1, filler F1 and solvent G1, and these components were mixed in the blending amounts (parts by mass) shown in table 2 to prepare a varnish of the second curable composition 1. The content (vol%) of the filler shown in table 2 is based on the total volume of the second curable composition.
[ Table 2]
Figure BDA0002405816230000291
(example 1)
[ production of first adhesive film ]
The varnish of the first curable composition 1 was coated on a PET film having a thickness of 50 μm using a coating apparatus. Subsequently, hot air drying was performed at 70 ℃ for 3 minutes to form a layer containing the first curable composition 1 having a thickness (thickness after drying) of 2 μm on the PET film. Next, for the layer containing the first curable composition 1, a metal halide lamp was used so that the cumulative amount of light was 2000mJ/cm2The method (3) is a method of polymerizing the polymerizable compound by irradiation with light. Thereby, the first curable composition 1 is cured to form the first adhesive layer. In this way, a first adhesive film having a first adhesive layer with a thickness of 2 μm on a PET film was obtained. The density of the conductive particles at this time was about 7000pcs/mm2. The thickness of the first adhesive layer was measured using a laser microscope OLS4100 manufactured by olympus corporation.
[ production of second adhesive film ]
The varnish of the second curable composition 1 was coated on a PET film having a thickness of 50 μm using a coating apparatus. Subsequently, hot air drying was performed at 70 ℃ for 3 minutes to form a second adhesive layer (layer containing the second curable composition 1) having a thickness of 10 μm on the PET film. In this way, a second adhesive film having a second adhesive layer on the PET film was obtained.
[ production of adhesive film for Circuit connection ]
The first adhesive film and the second adhesive film were laminated by a roll laminator while being heated at 40 ℃. Thus, a circuit-connecting adhesive film with a base material, which is provided with a circuit-connecting adhesive film composed of two layers of a first adhesive layer and a second adhesive layer laminated on each other, was produced.
[ measurement of DSC exotherm ]
From the obtained adhesive film for circuit connection, a part of the first adhesive layer and a part of the second adhesive layer were cut off, and 5mg each of the evaluation samples of the first adhesive layer and the evaluation samples of the second adhesive layer was obtained. Subsequently, the evaluation samples of the first adhesive layer and the second adhesive layer were measured using a Differential Scanning Calorimetry (DSC) apparatus (product name DSC7, PERKIN ELMER) under a nitrogen gas flow at a measurement temperature range of 30 ℃ to 250 ℃ and a temperature rise rate of 10 ℃/min, respectively, and DSC heat release was calculated.
The DSC heat release amount (DSC heat release amount Cx) of the first adhesive layer was 36J/g. The DSC heat release amount (DSC heat release amount Cy) of the second adhesive layer was 120J/g. From these results, the ratio of DSC exothermic amounts (Cx/Cy) was 0.30.
[ production of Circuit connection Structure ]
With the prepared adhesive film for circuit connection, an AlNd film (thickness:
Figure BDA0002405816230000301
) Cr film (thickness:
Figure BDA0002405816230000302
) And an Indium Zinc Oxide (IZO) film (thickness:
Figure BDA0002405816230000303
) The glass substrate 1 with a thin film electrode (manufactured by geomantec) or the glass substrate having a thin film electrode (height:
Figure BDA0002405816230000304
) The glass substrate with a thin film electrode 2 (manufactured by geomantec corporation) of (1) was heated and pressed using a thermal press bonding apparatus (heating system: contact heat (contact heat) type, manufactured by sun machine corporation), was heated and pressed at 170 ℃, 6MPa, and 4 seconds to connect the circuit connection structures 1 (connection structure 1) and 2 (connection structure 2) having circuit connection portions formed of an adhesive film for circuit connection over the entire width of 1 mm. Need toIn the case of connection, the circuit-connecting adhesive film is disposed on the glass substrate so that the surface of the circuit-connecting adhesive film on the first adhesive layer side faces the glass substrate.
[ evaluation of Capture Rate ]
The phase difference of the connection appearance of the obtained circuit connection structure 1 was observed using an optical microscope, and the capture rate was evaluated. Specifically, the number of conductive particles on the thin film electrode containing AlNd, Cr, and IZO was measured from the glass substrate side with the thin film electrode, and the capture rate of the conductive particles was calculated based on the following equation.
Capture rate (%) (number of conductive particles on the thin film electrode/(1 mm)2Area of thin film electrode)/per 1mm2Number of conductive particles of adhesive film for circuit connection) × 100
In the above measurement, the number of conductive particles was actually measured at 100 points of the thin-film electrode, and the average value thereof was defined as the number of conductive particles on the thin-film electrode. The results are shown in table 3.
[ evaluation of connection resistance ]
The obtained circuit connection structure 1 was measured for the connection resistance value between the opposing electrodes immediately after connection by a multimeter. The connection resistance value was determined as an average value of the resistance at 16 points between the opposing electrodes. The results are shown in table 3.
[ evaluation of peeling ]
The obtained circuit connection structure 2 was observed with an optical microscope for the appearance of the connection after the high temperature and high humidity test, and the peeling evaluation was performed. Specifically, the area (peeling area) where peeling occurred between the glass substrate and the circuit connection portion was measured from the glass substrate side with the thin film electrode. The high temperature and high humidity test was carried out by placing the sample in a constant temperature and humidity chamber at 85 ℃ and 85% RH for 200 hours. The results are shown in table 3.
[ evaluation of anti-blocking Property ]
The adhesive film with a base material for circuit connection thus produced was cut into 0.6mm pieces, to obtain a tape-shaped adhesive film with a base material. A reel for an adhesive tape including a core having a width of 0.7mm, an inner diameter of 40mm and an outer diameter of 65mm and an annular side plate having one sheet (two sheets in total) at each end of the core, a thickness of 2mm, an inner diameter of 40mm and an outer diameter of 125mm and made of plastic is prepared, and the adhesive film of the tape-shaped tape base material is wound around the reel for an adhesive tape with the surface on the adhesive film side being the inner side. In this manner, an adhesive reel was obtained in which the adhesive film with the base material having a length of 50m and a width of 0.6mm was wound around the core.
The obtained adhesive roll was left in a thermostatic bath at 30 ℃ for 24 hours, and then it was confirmed whether or not the adhesive film was pulled out without any problem. The case where the film was pulled out without any problem was evaluated as a, and the case where a problem such as sticking (blocking) to the substrate occurred during pulling out was evaluated as B. The results are shown in table 3.
(example 2)
An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1 except that the first curable composition 2 was used in place of the first curable composition 1 and that the layer containing the first curable composition 2 was heated at 100 ℃ for 180 minutes in place of light irradiation and cured at the time of producing the first adhesive film, and the DSC heat release amount, the capture rate, the connection resistance, the peeling and the blocking resistance were measured, in the same manner as in example 1. The results are shown in table 3.
(example 3)
When the first curable composition 3 was used in place of the first curable composition 1, the layer containing the first curable composition 3 was cured by heating at 100 ℃ for 180 minutes in place of light irradiation, and the varnish of the first curable composition 3 was applied to a thickness of 3 μm, and the density of conductive particles in the first adhesive film was 3000pcs/mm2Except for this, an adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1, and DSC heat release amount measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 3.
(example 4)
When the first curable composition 4 was used in place of the first curable composition 1, the layer containing the first curable composition 4 was heated at 100 ℃ for 180 minutes to cure the layer instead of light irradiation, and the varnish of the first curable composition 4 was applied so that the thickness thereof became 1 μm, and the density of conductive particles in the first adhesive film was 10000pcs/mm2Except for this, an adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1, and DSC heat release amount measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 3.
Comparative example 1
An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1 except that light irradiation was not performed (the layer containing the first curable composition 1 was not cured) at the time of producing the first adhesive film, and DSC heat release amount measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 4.
Comparative example 2
When the first adhesive film was produced, the cumulative quantity of light was 50mJ/cm2An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1 except that light irradiation was performed, and DSC heat release measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 4.
Comparative example 3
An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1 except that the first curable composition 2 was used in place of the first curable composition 1 and that the layer containing the first curable composition 2 was heated at 60 ℃ for 30 minutes in place of light irradiation and cured in the production of the first adhesive film, and the DSC heat release amount, the capture rate, the connection resistance, the peeling and the blocking resistance were measured in the same manner as in example 1. The results are shown in table 4.
Comparative example 4
The first curable composition 3 was used in place of the first curable composition 1, and the varnish of the first curable composition 3 was applied so that the thickness thereof became 3 μm without light irradiation at the time of producing the first adhesive film, and the conductive particle density in the first adhesive film was 3000pcs/mm2Except for this, an adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1, and DSC heat release amount measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 4.
Comparative example 5
The first curable composition 4 was used in place of the first curable composition 1, and the varnish of the first curable composition 4 was applied so that the thickness thereof became 1 μm without light irradiation at the time of producing the first adhesive film, and the density of conductive particles in the first adhesive film was 10000pcs/mm2Except for this, an adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1, and DSC heat release amount measurement, an evaluation of a capture rate, an evaluation of connection resistance, a peeling evaluation, and an evaluation of blocking resistance were performed in the same manner as in example 1. The results are shown in table 4.
Comparative example 6
An adhesive film for circuit connection and a circuit connection structure were produced in the same manner as in example 1 except that the first curable composition 2 was used in place of the first curable composition 1, and the layer containing the first curable composition 2 was heated at 100 ℃ for 180 minutes in order to cure the layer instead of light irradiation when the first adhesive film was produced, and the layer containing the second curable composition 1 was heated at 100 ℃ for 180 minutes in order to cure the layer when the second adhesive film was produced, and DSC heat release amount measurement, capture rate evaluation, connection resistance evaluation, peeling evaluation, and blocking resistance evaluation were performed in the same manner as in example 1. The results are shown in table 4.
[ Table 3]
Example 1 Example 2 Example 3 Example 4
First curable composition 1 2 3 4
DSC exotherm Cx (J/g) 36 15 17 7
DSC exotherm Cy (J/g) 120 120 120 120
Exothermic ratio Cx/Cy 0.30 0.13 0.14 0.06
Capture Rate (%) 94 95 95 95
Connecting resistance (omega) 2 2 2.3 1.9
Area of peeling (%) 5 5 5 5
Evaluation of blocking resistance A A A A
[ Table 4]
Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5 Comparative example 6
First curable composition 1 1 2 3 4 2
DSC exotherm Cx (J/g) 88 76 82 110 60 15
DSC exotherm Cy (J/g) 120 120 120 120 120 20
Exothermic ratio Cx/Cy 0.73 0.63 0.68 0.92 0.50 0.75
Capture Rate (%) 35 38 36 35 35 Can not measure
Connecting resistance (omega) 2.9 2.5 2.7 3.4 2.3 ＞100
Area of peeling (%) 40 30 30 40 40 5
Evaluation of blocking resistance B B B B B A
Description of the symbols
1: an adhesive film for circuit connection; 2: a first adhesive layer; 3: a second adhesive layer; 4: conductive particles; 10: a circuit connection structure; 12: a circuit electrode (first electrode); 13: a first circuit member; 15: a bump electrode (second electrode); 16: a second circuit member; 20: an adhesive film housing assembly; 22: a receiving member; 28: a viewing section.

Claims (10)

1. An adhesive film for circuit connection, comprising: a first adhesive layer containing conductive particles, and a second adhesive layer laminated on the first adhesive layer,
a ratio of the DSC heat release amount of the first adhesive layer to the DSC heat release amount of the second adhesive layer is less than or equal to 0.4.
2. The adhesive film for circuit connection according to claim 1, wherein the first adhesive layer is composed of a cured product of a first curable composition,
the first curable composition contains a radically polymerizable compound having a radically polymerizable group.
3. The adhesive film for circuit connection according to claim 1 or 2, wherein the second adhesive layer is composed of a second curable composition,
the second curable composition contains a radically polymerizable compound having a radically polymerizable group.
4. The adhesive film for circuit connection according to any one of claims 1 to 3, wherein the thickness of the first adhesive layer is 0.2 to 0.8 times the average particle diameter of the conductive particles.
5. A method for manufacturing an adhesive film for circuit connection, comprising:
a preparation step of preparing a first adhesive layer; and
a laminating step of laminating a second adhesive layer made of a second curable composition on the first adhesive layer,
the preparation step includes a curing step: the first adhesive layer is obtained by curing a layer composed of a first curable composition containing conductive particles by light irradiation or heating,
in the curing step, the first curable composition is cured so that the ratio of the DSC heat release of the first adhesive layer to the DSC heat release of the second adhesive layer is 0.4 or less.
6. The method for producing an adhesive film for circuit connection according to claim 5, wherein the first curable composition contains a radically polymerizable compound having a radically polymerizable group.
7. The method for producing an adhesive film for circuit connection according to claim 5 or 6, wherein the second curable composition contains a radically polymerizable compound having a radically polymerizable group.
8. The method for producing an adhesive film for circuit connection according to any one of claims 5 to 7, wherein the thickness of the first adhesive layer is 0.2 to 0.8 times the average particle diameter of the conductive particles.
9. A method for manufacturing a circuit connection structure, comprising the steps of: the circuit connecting adhesive film according to any one of claims 1 to 4 is interposed between a first circuit member having a first electrode and a second circuit member having a second electrode, and the first circuit member and the second circuit member are thermocompression bonded to electrically connect the first electrode and the second electrode to each other.
10. An adhesive film housing module, comprising: the adhesive film for circuit connection according to any one of claims 1 to 4, and a housing member for housing the adhesive film,
the receiving member has a viewing portion capable of viewing the inside of the receiving member from the outside,
the transmittance of the viewing portion for light having a wavelength of 365nm is less than or equal to 10%.
CN201880058646.1A 2017-09-11 2018-09-07 Adhesive film for circuit connection and method for producing same, method for producing circuit connection structure, and adhesive film housing module Pending CN111094487A (en)

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