KR102003630B1 - 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Download PDF

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KR102003630B1
KR102003630B1 KR1020177033477A KR20177033477A KR102003630B1 KR 102003630 B1 KR102003630 B1 KR 102003630B1 KR 1020177033477 A KR1020177033477 A KR 1020177033477A KR 20177033477 A KR20177033477 A KR 20177033477A KR 102003630 B1 KR102003630 B1 KR 102003630B1
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KR
South Korea
Prior art keywords
mold
substrate
trapping
imprint
voltage
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KR1020177033477A
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English (en)
Korean (ko)
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KR20170141734A (ko
Inventor
도시아키 야마자키
히토시 나카노
Original Assignee
캐논 가부시끼가이샤
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Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Priority claimed from PCT/JP2016/001701 external-priority patent/WO2016170729A1/en
Publication of KR20170141734A publication Critical patent/KR20170141734A/ko
Application granted granted Critical
Publication of KR102003630B1 publication Critical patent/KR102003630B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020177033477A 2015-04-22 2016-03-24 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 KR102003630B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2015-087839 2015-04-22
JP2015087839 2015-04-22
JP2016016451A JP6661397B2 (ja) 2015-04-22 2016-01-29 インプリント装置、インプリント方法、および物品の製造方法
JPJP-P-2016-016451 2016-01-29
PCT/JP2016/001701 WO2016170729A1 (en) 2015-04-22 2016-03-24 Imprint apparatus, method of imprinting, and method of manufacturing article

Publications (2)

Publication Number Publication Date
KR20170141734A KR20170141734A (ko) 2017-12-26
KR102003630B1 true KR102003630B1 (ko) 2019-07-24

Family

ID=57487325

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177033477A KR102003630B1 (ko) 2015-04-22 2016-03-24 임프린트 장치, 임프린트 방법, 및 물품 제조 방법

Country Status (3)

Country Link
JP (1) JP6661397B2 (ja)
KR (1) KR102003630B1 (ja)
TW (1) TWI649183B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017134989A1 (ja) * 2016-02-03 2017-08-10 キヤノン株式会社 インプリント装置および物品の製造方法
WO2017145924A1 (ja) * 2016-02-26 2017-08-31 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6603678B2 (ja) 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6802691B2 (ja) * 2016-11-18 2020-12-16 キヤノン株式会社 インプリント装置および物品製造方法
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6884048B2 (ja) * 2017-06-19 2021-06-09 キヤノン株式会社 インプリント装置、および物品製造方法
WO2019078060A1 (ja) * 2017-10-17 2019-04-25 キヤノン株式会社 インプリント装置、及び、物品の製造方法
JP6948924B2 (ja) * 2017-11-21 2021-10-13 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
US11333984B2 (en) 2018-02-13 2022-05-17 Asml Netherlands B.V. Apparatus for and method of in-situ particle removal in a lithography apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090295006A1 (en) 2008-06-02 2009-12-03 Canon Kabushiki Kaisha Transfer apparatus and method of manufacturing device
JP2014110367A (ja) 2012-12-04 2014-06-12 Fujifilm Corp ナノインプリント方法およびそれを用いたパターン化基板の製造方法
JP2014175340A (ja) * 2013-03-06 2014-09-22 Dainippon Printing Co Ltd インプリント方法、インプリント用のモールドおよびインプリント装置
JP2014183069A (ja) * 2013-03-18 2014-09-29 Dainippon Printing Co Ltd インプリント方法およびインプリント装置
JP2014225582A (ja) 2013-05-16 2014-12-04 キヤノン株式会社 インプリント装置および物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
JPH10284471A (ja) * 1997-04-09 1998-10-23 Nec Yamagata Ltd ドライエッチング装置
JP3301408B2 (ja) * 1998-04-13 2002-07-15 日本電気株式会社 半導体製造装置のパーティクル除去装置及びパーティクルの除去方法
JP3578739B2 (ja) * 2001-09-27 2004-10-20 Ｎｅｃエレクトロニクス株式会社 プラズマ装置
US20100078846A1 (en) * 2008-09-30 2010-04-01 Molecular Imprints, Inc. Particle Mitigation for Imprint Lithography
JP5769451B2 (ja) * 2011-03-07 2015-08-26 キヤノン株式会社 インプリント装置および物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090295006A1 (en) 2008-06-02 2009-12-03 Canon Kabushiki Kaisha Transfer apparatus and method of manufacturing device
JP2014110367A (ja) 2012-12-04 2014-06-12 Fujifilm Corp ナノインプリント方法およびそれを用いたパターン化基板の製造方法
JP2014175340A (ja) * 2013-03-06 2014-09-22 Dainippon Printing Co Ltd インプリント方法、インプリント用のモールドおよびインプリント装置
JP2014183069A (ja) * 2013-03-18 2014-09-29 Dainippon Printing Co Ltd インプリント方法およびインプリント装置
JP2014225582A (ja) 2013-05-16 2014-12-04 キヤノン株式会社 インプリント装置および物品の製造方法

Also Published As

Publication number Publication date
TWI649183B (zh) 2019-02-01
JP6661397B2 (ja) 2020-03-11
TW201637820A (zh) 2016-11-01
JP2016208006A (ja) 2016-12-08
KR20170141734A (ko) 2017-12-26

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