KR101993950B1 - 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 - Google Patents

위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 Download PDF

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KR101993950B1
KR101993950B1 KR1020150167023A KR20150167023A KR101993950B1 KR 101993950 B1 KR101993950 B1 KR 101993950B1 KR 1020150167023 A KR1020150167023 A KR 1020150167023A KR 20150167023 A KR20150167023 A KR 20150167023A KR 101993950 B1 KR101993950 B1 KR 101993950B1
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South Korea
Prior art keywords
substrate
light
mark
light receiving
unit
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Korean (ko)
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KR20160065019A (ko
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코이치 타무라
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • H01L21/0274—
    • H01L21/68—

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020150167023A 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 Expired - Fee Related KR101993950B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014242526 2014-11-28
JPJP-P-2014-242526 2014-11-28
JP2015171202A JP6590599B2 (ja) 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法
JPJP-P-2015-171202 2015-08-31

Publications (2)

Publication Number Publication Date
KR20160065019A KR20160065019A (ko) 2016-06-08
KR101993950B1 true KR101993950B1 (ko) 2019-06-27

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KR1020150167023A Expired - Fee Related KR101993950B1 (ko) 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법

Country Status (4)

Country Link
JP (1) JP6590599B2 (https=)
KR (1) KR101993950B1 (https=)
CN (1) CN105652611B (https=)
TW (1) TWI620039B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2019007A (en) * 2016-06-13 2017-12-20 Asml Netherlands Bv Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6490771B1 (ja) * 2017-09-27 2019-03-27 株式会社アルバック 位置検出装置、位置検出方法、および、蒸着装置
CN109585351B (zh) * 2018-10-29 2021-06-22 苏州腾晖光伏技术有限公司 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法
CN111355541A (zh) * 2020-04-02 2020-06-30 Oppo广东移动通信有限公司 网络设备、搜寻网络信号的方法
JP7508313B2 (ja) * 2020-08-27 2024-07-01 キヤノン株式会社 搬送装置、露光装置、及び物品の製造方法
JP7609676B2 (ja) * 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法
CN118641478B (zh) * 2024-08-14 2024-11-05 江苏福拉特自动化设备有限公司 Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法

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US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20090130784A1 (en) * 2007-09-06 2009-05-21 Vistec Semiconductor Systems Gmbh Method for determining the position of the edge bead removal line of a disk-like object

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US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JPH0629698B2 (ja) * 1990-06-26 1994-04-20 株式会社ニレコ 端部検出装置
JP3218984B2 (ja) * 1995-10-02 2001-10-15 ウシオ電機株式会社 半導体ウエハ上の不要レジストを除去するためのウエハ周辺露光方法および装置
JPH09139342A (ja) * 1995-11-15 1997-05-27 Nikon Corp プリアライメント方法及び装置
JPH11162833A (ja) * 1997-11-25 1999-06-18 Nikon Corp 基板周縁露光方法
TWI250556B (en) * 2001-07-20 2006-03-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7566893B2 (en) * 2004-06-22 2009-07-28 Nikon Corporation Best focus detection method, exposure method, and exposure apparatus
US7626701B2 (en) * 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
SG124407A1 (en) * 2005-02-03 2006-08-30 Asml Netherlands Bv Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
CN102402127B (zh) * 2010-09-17 2014-01-22 上海微电子装备有限公司 一种硅片预对准装置及方法
JP5875335B2 (ja) * 2011-11-15 2016-03-02 キヤノン株式会社 位置検出装置および露光装置
TWI581055B (zh) * 2012-10-02 2017-05-01 聯華電子股份有限公司 形成光罩的方法

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US20080013089A1 (en) * 2004-08-31 2008-01-17 Nikon Corporation Positioning method, processing system, measurement method of substrate loading repeatability, position measurement method, exposure method, substrate processing apparatus, measurement method, and measurement apparatus
US20090130784A1 (en) * 2007-09-06 2009-05-21 Vistec Semiconductor Systems Gmbh Method for determining the position of the edge bead removal line of a disk-like object

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Publication number Publication date
CN105652611B (zh) 2018-05-08
CN105652611A (zh) 2016-06-08
JP6590599B2 (ja) 2019-10-16
KR20160065019A (ko) 2016-06-08
JP2016110066A (ja) 2016-06-20
TWI620039B (zh) 2018-04-01
TW201621481A (zh) 2016-06-16

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