KR101980215B1 - Nozzle manufacturing method for cleaning substrate using vibrating body - Google Patents

Nozzle manufacturing method for cleaning substrate using vibrating body Download PDF

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Publication number
KR101980215B1
KR101980215B1 KR1020150132462A KR20150132462A KR101980215B1 KR 101980215 B1 KR101980215 B1 KR 101980215B1 KR 1020150132462 A KR1020150132462 A KR 1020150132462A KR 20150132462 A KR20150132462 A KR 20150132462A KR 101980215 B1 KR101980215 B1 KR 101980215B1
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South Korea
Prior art keywords
nozzle
cleaning liquid
plate
flow path
liquid flow
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KR1020150132462A
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Korean (ko)
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KR20170034143A (en
Inventor
김범진
김응서
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주식회사 일진저스템
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Priority to KR1020150132462A priority Critical patent/KR101980215B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H01L41/08—
    • H01L41/22—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

According to one embodiment of the present invention, the liquid droplets can be uniformly discharged by the hydrophilic treatment, and the damage of the substrate can be minimized through the liquid droplets uniformly discharged. In particular, the present invention provides a method of manufacturing a substrate cleaning nozzle using a vibrating body for vibrating a high-pressure cleaning liquid stored therein to discharge droplets of a predetermined size to the outside, comprising the steps of: preparing a nozzle upper plate and a lower nozzle plate; (S120) forming a cleaning liquid flow path through which the cleaning liquid can flow on the upper surface of the nozzle upper plate or the upper surface of the lower nozzle plate; (S130) forming a plurality of discharge holes vertically penetrating the cleaning liquid flow path by irradiating the laser light along the cleaning liquid flow path; (S140) of vertically coupling the nozzle upper plate and the lower nozzle plate with the cleaning liquid flow path therebetween; And a step (S150) of hydrophilizing the surface of the lower nozzle plate to form a substrate cleaning nozzle.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for manufacturing a substrate cleaning nozzle using a vibrating body,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a nozzle manufacturing method of a substrate cleaning apparatus, and more particularly, to a method of manufacturing a substrate cleaning nozzle using a vibrating body that can simplify a manufacturing process and prevent clogging of a discharge hole.

Conventionally, a method of cleaning a substrate by using a method of filling a water tank with a cleaning liquid and dipping and unloading the substrate, or cleaning the substrate by using a roller and a brush has been widely used.

However, recently, as semiconductors have become highly integrated and the pattern of the substrate has become highly detailed, the semiconductor cleaning process has been further elaborated and elaborately developed. Particularly, there are many studies to minimize the damage of the substrate.

In accordance with this tendency, a cleaning apparatus employing a method of spraying a cleaning liquid onto a substrate by using the principle of jetting an inkjet print is widely used instead of moving the substrate or applying a cleaning method using a brush or the like.

For example, in the prior art, Korean Patent Laid-Open No. 10-2010-0055767 discloses a spray nozzle for spraying a cleaning liquid on a lower surface of a concavo-convex shape to clean a substrate.

In this case, when the cleaning liquid is injected through the injection port, the contact angle between the lower flat surface and the injected cleaning liquid is formed to be larger than the size of the cleaning liquid to be injected. Thus, The substrate may be damaged.

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a method of manufacturing a substrate cleaning nozzle using a vibrating body in which liquid droplets are uniformly discharged by hydrophilizing treatment.

A second object of the present invention is to provide a method of manufacturing a substrate cleaning nozzle using a vibrating body that minimizes damage to a substrate through liquid droplets that are uniformly discharged.

According to another aspect of the present invention, there is provided a substrate cleaning nozzle manufacturing method using a vibrating body vibrating a high-pressure cleaning liquid stored therein to discharge droplets of a predetermined size to the outside, comprising the steps of: preparing a nozzle upper plate and a lower nozzle plate ); (S120) forming a cleaning liquid flow path through which the cleaning liquid can flow on the upper surface of the nozzle upper plate or the upper surface of the lower nozzle plate; (S130) forming a plurality of discharge holes vertically penetrating the cleaning liquid flow path by irradiating the laser light along the cleaning liquid flow path; (S140) of vertically coupling the nozzle upper plate and the lower nozzle plate with the cleaning liquid flow path therebetween; And a step (S150) of hydrophilizing the surface of the lower plate of the nozzle by using a vibrating body.

In the step of forming the cleaning liquid flow path (S120), the cleaning liquid flow path may have a width equal to or smaller than that of the upper end, and the cross-sectional surface may have a shape of at least one of a rectangular shape, a trapezoid shape, and a semicircular shape.

Further, in the step S140 of joining the nozzle upper plate and the nozzle lower plate, the nozzle upper plate and the lower nozzle plate may be joined by ultrasonic welding. The nozzle upper plate may have a supply port for supplying the cleaning liquid and a discharge port for discharging the cleaning liquid And the like.

In addition, the step (S140) of joining the lower nozzle plate and the nozzle upper plate may be such that the piezoelectric element is mounted on the upper surface of the nozzle upper plate.

According to one embodiment of the present invention, the liquid droplets can be uniformly discharged by hydrophilizing treatment, and damage to the substrate can be minimized through liquid droplets uniformly discharged.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flowchart showing a nozzle manufacturing process according to an embodiment of the present invention,
FIG. 2 is a flowchart showing a sequence of a hydrophilic treatment process according to an embodiment of the present invention,
FIG. 3 is a plan view of a lower plate of a nozzle manufactured according to an embodiment of the present invention,
4 is a plan view of a nozzle top plate manufactured according to an embodiment of the present invention,
5 is a cross-sectional view taken along a direction A-A 'shown in FIG. 3,
FIG. 6 is a cross-sectional view taken along the line B-B 'of FIG. 4,
7 is a perspective view of a nozzle manufactured according to an embodiment of the present invention,
8 is a cross-sectional view taken along the line C-C 'shown in FIG.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The terminologies used herein are terms used to properly represent preferred embodiments of the present invention, which may vary depending on the user, the intent of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification. The same reference numerals in the drawings denote the same components.

≪ Method for manufacturing substrate cleaning nozzle using oscillator >

FIG. 1 is a flowchart sequentially illustrating a nozzle manufacturing process according to an embodiment of the present invention, and FIG. 2 is a flowchart sequentially showing a hydrophilic treatment process according to an embodiment of the present invention. As shown in FIGS. 1 and 2, in a substrate cleaning nozzle manufacturing method using a vibrating body that vibrates a high-pressure cleaning liquid stored therein to discharge droplets of a predetermined size to the outside, the nozzle top plate 100, (200) is prepared (S110). Here, the nozzle lower plate 200 may be prepared as a disc having a predetermined thickness using quartz, sapphire made of aluminum oxide, engineering plastic, and the material, thickness, shape, And the nozzle top plate 100 may have a supply port for supplying the cleaning liquid and a discharge port for discharging the cleaning liquid.

The engineering plastics described above have a tensile strength of 500 kgf / cm 2 or more, a flexural modulus of 20,000 kgf / cm 2 or more, heat resistance of 100 ° C or more, and are thermoplastic entrapers capable of being formed by heating and thermosetting entrapers . Examples of such thermoplastic encapses include polyamides, POM (polyacetal), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), synthetically polystyrene (SPS), polyether sulfone (PES), and polyetheretherketone (PEEK) Examples include phenol, urea, melamine, alkyd, unsaturated polyester, epoxy, diaryl phthalate, silicone, and polyurethane.

Next, the cleaning liquid flow paths 300a and 300b, through which the cleaning liquid can flow, are formed on the lower surface of the nozzle upper plate 100 or the upper surface of the lower nozzle plate 200 (S120). The cleaning liquid flow paths 300a and 300b are formed on both the lower surface of the nozzle upper plate 100 and the upper surface of the lower nozzle plate 200. However, the lower surface of the nozzle upper plate 100 and the lower nozzle plate 200 ) Top surface. Here, the widths of the cleaning liquid flow paths 300a and 300b may be formed in the shape of at least one of a rectangular shape, a trapezoidal shape, and a semicircular shape with the lower end being equal to or smaller than the upper end, And may be processed to be tapered from the upper end to the lower end in order to hurry the cleaning liquid toward the discharge hole 310. In addition, the cleaning liquid flow paths 300a and 300b may have a shape in which the O type is repeatedly formed in the shape viewed from the plane, and will be described in more detail later with reference to FIG. 4 to FIG.

Next, a plurality of discharge holes 310 vertically penetrating the cleaning liquid flow paths 300a and 300b are formed by irradiating laser light along the cleaning liquid flow paths 300a and 300b (S130). The plurality of discharge holes 310 are formed at regular intervals along the cleaning liquid flow paths 300a and 300b, and will be described in more detail later with reference to FIGS. 3 to 8. FIG.

Next, a substrate cleaning nozzle manufacturing method using the vibrating body can be performed by vertically coupling the nozzle upper plate 100 and the lower nozzle plate 200 with the cleaning liquid flow paths 300a and 300b interposed therebetween (S140). More specifically, the nozzle upper plate 100 and the lower nozzle plate 200 may be joined by ultrasonic welding. Here, the ultrasonic welding is a process in which two or more plastic bonding surfaces come into close contact with each other due to heat generation, softening and melting phenomenon due to ultrasonic vibration of the plastic itself, and a diffusion action occurs thereon, And can be classified into a method such as welding, sealing, inserting, swaging, and slitting. The ultrasonic welding machine for ultrasonic welding is to convert the power of 100 ~ 250V, 50 ~ 60Hz into the electric energy of 20KHz and 35KHz through the generator, convert it into mechanical vibration energy through the converter, Booster), and the ultrasonic vibration energy thus generated is transmitted to the welding compound through the horn, and instantaneous frictional heat is generated from the bonding surface of the welding product, thereby dissolving and bonding the plastic. .

Finally, the surface of the coupled lower nozzle plate 200 is hydrophilized (S150).

Here, in the hydrophilic treatment, first, the nozzle lower plate 200 is dipped in a phenyl-type chemical liquid (S151). Next, the UV lamp is irradiated while the nozzle lower plate 200 is dipped in the acrylamide mixed solution (S152). Next, the nozzle lower plate 200 is ultrasonically cleaned using an organic solvent (S153). Next, the nozzle lower plate 200 is rinsed with DIWater (S154). That is, the lower nozzle plate 200 is rinsed with clean water and finally the lower nozzle plate 200 is dried (S155), so that the surface of the lower nozzle plate 200 can be hydrophilized. By this process, the contact angle between the lower surface of the lower nozzle plate 200 and the cleaning liquid to be discharged does not decrease or does not occur in the lower nozzle plate 200 which has been hydrophilized. More specifically, since the cleaning liquid does not develop on the lower surface of the lower nozzle plate 200, uniform size and constant speed can be maintained, thereby minimizing damage to the substrate.

The nozzle top plate 100 manufactured according to the present embodiment may have a piezoelectric element mounted on the top surface thereof, which imparts vibration generated by the piezoelectric element to a cleaning liquid flowing through the cleaning liquid flow paths 300a and 300b, (Not shown).

FIG. 3 is a plan view of a nozzle lower plate 200 manufactured according to an embodiment of the present invention. FIG. 4 is a plan view of a nozzle upper plate 100 manufactured in accordance with an embodiment of the present invention. FIG. 6 is a cross-sectional view taken along a line B-B 'in FIG. 4, FIG. 7 is a perspective view of a nozzle manufactured according to an embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the direction C-C 'shown in FIG. 3 to 8, the nozzle upper plate 100 and the lower nozzle plate 200 are formed in a cylindrical shape and have a circular shape in plan view. In contrast, the nozzle upper plate 100 and the lower nozzle plate 200 are formed in a circular shape, It may be changed into various shapes. The cleaning liquid flow paths 300a and 300b are formed on the lower surface of the nozzle upper plate 100 and on the upper surface of the lower nozzle plate 200. The cleaning liquid flow paths 300a and 300b have at least one O- Or may be formed in a shape having a symmetrical structure such as H, S, X, or may be variously changed depending on the droplet to be discharged, the discharge hole 310, and the like.

A plurality of discharge holes 310 vertically penetrating the cleaning liquid flow paths 300a and 300b by irradiating laser light may be formed. In this embodiment, the shapes of the discharge holes 310 are formed in a circle having a minute size and are arranged at regular intervals, but this can be changed in consideration of the type of the cleaning liquid and the shape of the cleaning liquid flow paths 300a and 300b.

As described above, the widths of the cleaning liquid flow paths 300a and 300b may be at least one of a rectangular shape, a trapezoid shape, and a semicircular shape with the lower end being formed to be equal to or smaller than the upper end, and the nozzle upper plate 100, The width and shape of the cleaning liquid flow paths 300a and 300b formed in the cleaning liquid flow path 200 may or may not be the same and may be changed according to design conditions and the like.

Further, the nozzle top plate 100 may be provided with a supply port for supplying a cleaning liquid and a discharge port for discharging the cleaning liquid. Further, a piezoelectric element may be further mounted on the upper surface of the nozzle top plate 100, So that high-pressure cleaning liquid flowing through the flow paths 300a and 300b is discharged through the discharge holes 310. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

100: nozzle top plate
200: nozzle bottom plate
300a and 300b:
310: Discharge hole
W: welded mountain

Claims (6)

1. A substrate cleaning nozzle manufacturing method using a vibrating body for vibrating a cleaning liquid having a high pressure stored therein and discharging droplets of a predetermined size to the outside,
Preparing a nozzle upper plate and a lower nozzle plate (S110);
(S120) forming a cleaning liquid flow path through which the cleaning liquid can flow on the upper surface of the lower nozzle plate;
Forming a plurality of discharge holes vertically through the cleaning liquid flow path by irradiating laser light (S 130);
A step (S140) of vertically coupling the nozzle upper plate and the lower nozzle plate with the cleaning liquid flow path interposed therebetween; And
(S150) of hydrophilizing the surface of the lower nozzle plate adjacent to the discharge hole through which the cleaning liquid is discharged,
In the step S110 of preparing the nozzle upper plate and the lower nozzle plate,
Wherein the nozzle top plate is provided with a supply port for supplying the cleaning liquid and a discharge port for discharging the cleaning liquid,
The hydrophilization treatment step (S150)
(S152) irradiating the UV lamp with the bottom plate of the nozzle dipped in the acrylamide mixed solution,
In the step of forming the cleaning liquid flow path (S120)
Wherein the cleaning liquid flow path has a width smaller than an upper end and is inclined from the upper end to the lower end so as to converge the cleaning liquid toward the discharge hole,
In the step of forming the discharge hole (S130)
Wherein the discharge hole is vertically penetrated by irradiating the laser light along the cleaning liquid flow path that is inclined from the upper end to the lower end so that the high-pressure cleaning liquid flowing into the cleaning liquid flow path is discharged through the discharge hole. A method of manufacturing a nozzle for cleaning substrates. delete The method according to claim 1,
The step (S140) of joining the nozzle upper plate and the lower nozzle plate,
Wherein the nozzle upper plate and the lower nozzle plate are coupled by ultrasonic welding. delete The method according to claim 1,
In the step (S140) of joining the lower nozzle plate and the nozzle upper plate,
Wherein the nozzle top plate has a piezoelectric element mounted on an upper surface thereof. The method according to claim 1,
The hydrophilization treatment step (S150)
Dipping (S151) the lower nozzle plate into the phenyl ring liquid before irradiating the UV lamp (S152);
And a nozzle for cleaning the substrate.
KR1020150132462A 2015-09-18 2015-09-18 Nozzle manufacturing method for cleaning substrate using vibrating body KR101980215B1 (en)

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KR1020150132462A KR101980215B1 (en) 2015-09-18 2015-09-18 Nozzle manufacturing method for cleaning substrate using vibrating body

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Application Number Priority Date Filing Date Title
KR1020150132462A KR101980215B1 (en) 2015-09-18 2015-09-18 Nozzle manufacturing method for cleaning substrate using vibrating body

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KR101980215B1 true KR101980215B1 (en) 2019-05-20

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341105B2 (en) * 2009-07-30 2013-11-13 ハリマ化成株式会社 Photocurable hydrophilic coating, hydrophilic coating, and hydrophilic article

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1120173A (en) * 1997-07-01 1999-01-26 Brother Ind Ltd Manufacture of nozzle plate of recording head
KR100839775B1 (en) * 2006-06-20 2008-06-19 다이니폰 스크린 세이조우 가부시키가이샤 Coating nozzle and method for manufacturing the same
JP5261077B2 (en) * 2008-08-29 2013-08-14 大日本スクリーン製造株式会社 Substrate cleaning method and substrate cleaning apparatus
KR101536722B1 (en) * 2012-11-06 2015-07-15 세메스 주식회사 Method for treating substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341105B2 (en) * 2009-07-30 2013-11-13 ハリマ化成株式会社 Photocurable hydrophilic coating, hydrophilic coating, and hydrophilic article

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