JP2012082443A - Thermal spraying apparatus, and coating film forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal spraying apparatus capable of adequately cooling a base material without increasing the size of the apparatus.SOLUTION: When forming a coating film on a coating-film forming face 2a of a semi-conductor module 2 by thermal spraying, the semi-conductor module 2 is held by a holding member 5 so that a part of the semi-conductor module 2 including the coating film forming face 2a is located above the liquid surface of cooling water. Thus, the semi-conductor module 2 can be cooled with cooling water having the specific heat higher than that of a cooling gas such as air, and the cooling efficiency can be enhanced in comparison with a case of cooling the semi-conductor module 2 with air. Therefore, the semi-conductor module 2 does not need to firmly held and fixed by the holding member 5. As a result, a base material can be adequately cooled without increasing the size of the entire thermal spraying apparatus.

Description

  The present invention relates to a thermal spraying apparatus that forms a coating on a surface of a substrate on which a film is to be formed by thermal spraying, and a coating formation method that forms a coating on the surface of a substrate on which a film is to be formed.

  2. Description of the Related Art Conventionally, there is known a thermal spraying apparatus that forms a film of a film material on a substrate by spraying the film material such as metal or ceramic by heating and melting the sprayed film material onto the substrate. For example, Patent Document 1 discloses a thermal spraying apparatus that forms a coating on the outer surface of a cylindrical metal thin pipe (hereinafter simply referred to as a pipe) as a base material.

  In this thermal spraying apparatus of Patent Document 1, a hollow cylindrical core (holding member) for holding and fixing a pipe is fitted into the pipe, and the core is formed when a coating is formed on the outer surface of the pipe. The cooling air is circulated inside the pipe to cool the pipe. Thereby, the thermal deformation and melting loss of the pipe at the time of thermal spraying are suppressed.

JP-A-10-158810

  By the way, the film material sprayed on the base material may reach a high temperature exceeding 10,000 ° C. when it is melted by using plasma as a heat source as in the plasma spraying apparatus of Patent Document 1, for example. Therefore, in the thermal spraying apparatus of Patent Document 1, it is necessary to flow a large flow of cooling air in order to reliably suppress thermal deformation and melting damage of the base material (pipe).

  Further, in Patent Document 1, since a core (holding member) is fitted and held inside the base material (pipe), even if a large amount of cooling air is flowed, the base material is cooled by the cooling air. It is easy to suppress that is blown away. However, when the base material is formed of a plate-like member or the like, a holding member that can firmly hold the base material is required so that the base material is not blown away by a large flow of cooling air. It becomes.

  Employing such a configuration for flowing a large amount of cooling air and a holding member that realizes a firm holding of the base material causes an increase in the size of the thermal spraying apparatus as a whole.

  Furthermore, when the holding member is enlarged in order to hold the base material firmly, the surface area of the holding member in the vicinity of the surface of the base material on which the film is to be formed increases, and a film may be formed on the holding member. . If the coating film is formed on the holding member in this way, a maintenance work for removing the coating film from the holding member after spraying is required, and the work process for forming the coating film on the substrate is complicated.

  In view of the above points, a first object of the present invention is to provide a thermal spraying apparatus capable of appropriately cooling a substrate without causing an increase in size.

  In addition, a second object of the present invention is to provide a film forming method that does not cause a complicated work process when forming a film on a substrate.

In order to achieve the above object, in the invention described in claim 1, the film material is applied to the surface (2a) of the base material (2) by spraying the melted film material onto the base material (2). A thermal spraying device for forming a coating,
Thermal spray gun (3) for injecting a melted film material onto the film formation target surface (2a), a holding member (5) for holding the base material (2), and cooling for cooling the base material (2) A case (4) that forms a cooling liquid passage through which the liquid for liquid flows,
The holding member (5) holds the substrate (2) in a state where a part of the substrate (2) including the film formation target surface (2a) is positioned above the liquid surface of the cooling liquid. Features.

  According to this, when forming the coating film on the base material (2), the base material (2) is cooled by the cooling liquid having a large specific heat with respect to the cooling gas such as air. The cooling efficiency can be increased as compared with the case of doing so. Therefore, the base material (2) can be appropriately cooled by the cooling liquid having a small flow rate.

  Furthermore, it is not necessary to firmly hold and fix the base material (2) by the holding member (5) as in the case of cooling with a large flow rate of cooling gas. As a result, the base material can be appropriately cooled without increasing the size of the thermal spraying apparatus as a whole.

  In addition, when the holding member (5) holds the base material (2), at least a part of the base material (2) including the film formation target surface (2a) is positioned above the liquid level of the cooling liquid. Since the base material (2) is held in the base material (2), the base material (2) other than the film formation target surface (2a) and the holding member (5) are submerged in the cooling liquid. (2) can be held.

  In this state, if the film material is sprayed from the spray gun (3), a coating film is formed on the substrate (2) and the holding member (5) that are submerged in the cooling liquid. There is no. Therefore, it can suppress that a film is formed in a holding member (5), and the maintenance operation | work which removes a film from a holding member (5) after thermal spraying can be made unnecessary. As a result, it is possible to avoid complication of work steps when forming a film on the substrate (2).

  According to a second aspect of the present invention, in the thermal spraying apparatus according to the first aspect, the holding member (5) has a holding surface (5a) that holds and contacts the lower side of the base material (2), and holds the holding member (5). The surface (5a) is formed with a through-hole that passes through the front and back surfaces and allows the cooling liquid to pass therethrough.

  According to this, since the through hole is formed in the holding surface (5a), when the holding member (5) is submerged in the cooling liquid, the holding surface (5a) and the base material (2) Problems such as the formation of a film on a portion other than the film formation target surface (2a) and the displacement of the base material (2) relative to the holding member (5) due to air bubbles mixed in between. Can be suppressed.

  In invention of Claim 3, in the thermal spraying apparatus of Claim 1 or 2, the base material (2) is formed in plate shape, and the holding member (5) was arrange | positioned mutually spaced apart. It is characterized by holding a plurality of base materials (2).

  According to this, a film can be simultaneously formed on a plurality of base materials (2). Furthermore, since a some base material (2) is hold | maintained at the holding member in the state spaced apart from each other, it can suppress that the adjacent base materials (2) are joined by a film.

  In invention of Claim 4, in the thermal spraying apparatus of Claim 3, a holding member (5) is arrange | positioned between several base materials (2), and contact between adjacent base materials (2) is carried out. It has the partition member (7) which prevents that, and the upper side edge part of the partition member (7) is extended to the upper side rather than the upper surface of a base material (2), It is characterized by the above-mentioned. Thereby, it can suppress reliably that the base materials (2) which adjoin by a film will be joined.

In invention of Claim 5, in the thermal spraying apparatus of Claim 4, when a base material (2) and a partition member (7) are seen from a perpendicular direction, a base material (2) and a partition member (7) There is a gap between them, and when the dimension of the gap is S and the thickness dimension in the vertical direction of the substrate (2) is T,
0 <S / T ≦ 0.25
It is characterized by becoming.

  According to this, since a gap is provided between the base material (2) and the partition member (7), the base material (2) and the partition member (7) are joined by the coating film. Can be suppressed. Further, as will be described in detail in the embodiments described later, the base material (2) disposed between the partition member (7) and the partition member (7) is a film material sprayed from the spray gun (3). Can be prevented from being blown off by the jet flow.

  According to a sixth aspect of the present invention, in the thermal spraying apparatus according to the fourth or fifth aspect, the upper end portion of each partition member (7) further includes a protruding portion that protrudes toward the base material (2). 7a) is provided.

  Thereby, the base material (2) arrange | positioned between a partition member (7) and a partition member (7) will be blown away by the injection flow of the film | membrane material injected from a spray gun (3). Can be suppressed.

  According to a seventh aspect of the present invention, in the thermal spraying apparatus according to any one of the first to sixth aspects, a holding member vibrating means (8) for vibrating the holding member (5) is provided.

  Thereby, since a base material (2) can be vibrated with a holding member (5), adjacent base materials (2) or adjacent base materials (2) and a partition member (7) are joined by a film. Can be suppressed.

  According to an eighth aspect of the present invention, in the thermal spraying device according to any one of the first to seventh aspects, the case (4) has a cooling liquid by a flow of film material sprayed from the thermal spray gun (3). It has the wave-control plate (4) which suppresses that the liquid level of undulations.

  According to this, it can suppress that the water droplet of the cooling liquid adheres to the film formation object surface (2a) by the wave surface of a liquid surface, and can suppress film formation defect.

  According to a ninth aspect of the present invention, in the thermal spraying apparatus according to any one of the first to eighth aspects, the cooling liquid pumping means (4c) for flowing the cooling liquid in a predetermined direction, and the substrate (2) is provided with the base material conveyance means (6) which moves to a reverse direction with respect to the horizontal direction component among the flow directions of a cooling liquid, It is characterized by the above-mentioned.

  According to this, since the flow direction of the cooling liquid and the moving direction of the base material (2) are opposite to each other, the base material (2) can be moved to the lower temperature side, and the base material (2) can be moved. It can be cooled efficiently.

  Further, as in the invention described in claim 10, in the thermal spraying apparatus described in claim 9, the base material transport means (6) moves together with the holding member (5) by moving the holding member (5). The material (2) may be moved.

In the invention according to claim 11, the film formation target surface (2a) of the base material (2) held by the holding member (5) by spraying the melted film material from the spray gun (3). A film forming method for forming a film of a film material on
A case (4) for forming a cooling liquid passage through which a cooling liquid for cooling the base material (2) flows is prepared, and a holding step for holding the base material (2) by the holding member (5), and a holding step And a spraying step of spraying a film material from the spray gun (3) onto the film formation target surface (2a). In the holding step, a part of the substrate (2) including the film formation target surface (2a) Is held above the liquid level of the cooling liquid, and the substrate (2) is held.

  According to this, when the holding member (5) holds the base material (2) in the holding step, a part of the base material (2) including the film formation target surface (2a) is removed from the liquid for cooling. Since the substrate (2) is held so as to be positioned above the surface, the substrate (2) can be held in a state where a part of the substrate (2) and the holding member (5) are submerged in the cooling liquid. it can.

  In this state, if the film material is sprayed from the spray gun (3), a coating film is formed on the substrate (2) and the holding member (5) that are submerged in the cooling liquid. Nor. Therefore, it can suppress that a film is formed in a holding member (5), and the maintenance operation | work which removes a film from a holding member (5) after thermal spraying can be made unnecessary. As a result, it is possible to avoid complication of work steps when forming a film on the substrate (2).

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is an external appearance perspective view which shows the whole structure of the thermal spraying apparatus of 1st Embodiment. It is AA sectional drawing of FIG. It is AA sectional drawing of FIG. 1 in 2nd Embodiment. It is a top view of the semiconductor module of 2nd Embodiment, a holding member, and a partition member. It is the B section enlarged view of FIG. It is the B section enlarged view of FIG. 3 when a semiconductor module inclines. It is the B section enlarged view of Drawing 3 in a 3rd embodiment. It is AA sectional drawing of FIG. 1 in 4th Embodiment. It is AA sectional drawing of FIG. 1 in the modification of 4th Embodiment. It is AA sectional drawing of FIG. 1 in 5th Embodiment. It is a top view which shows the modification of the partition member of 2nd Embodiment.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the overall configuration of the thermal spraying apparatus 1 of the present embodiment. In this embodiment, this thermal spraying device 1 is used for forming a ceramic coating on the surface of the semiconductor module 2 formed in a flat plate shape. Therefore, the base material of this embodiment is the semiconductor module 2, and the membrane material is ceramic.

  This semiconductor module 2 is a so-called double-sided cooling type semiconductor card module in which a metal plate as a heat transfer member for radiating heat of a semiconductor chip is joined to both surfaces of a semiconductor chip formed in a plate shape by soldering. Therefore, the film formation target surface 2a of the present embodiment is the outer surface of the heat transfer member bonded to the semiconductor chip.

  The heat transfer member is formed of a metal such as copper or tungsten, and the ceramic coating is formed on the outer surface of the heat transfer member by the thermal spraying apparatus 1 of the present embodiment, so that the heat transfer member and the outside In addition, it is possible to obtain the rust prevention effect of the heat transfer member.

  Next, the thermal spraying apparatus 1 will be described. The thermal spraying apparatus 1 includes a thermal spray gun 3 that injects ceramic onto the coating formation target surface 2 a of the semiconductor module 2, a case 4 in which cooling water that cools the semiconductor module 2 flows, and a semiconductor module 2 that is held and fixed in the case 4. Holding member 5 and the like.

  The thermal spray gun 3 is made of a ceramic melted by using plasma generated by arc discharge between an anode anode and a cathode cathode in a working gas such as argon, nitrogen, helium (inert gas) as a heat source. Injected towards That is, the thermal spraying apparatus 1 of the present embodiment is configured as a plasma spraying apparatus.

  Further, the thermal spray gun 3 is connected to a moving device 3 a that moves the thermal spray gun 3 in parallel with the film formation target surface 2 a of the semiconductor module 2 held by the holding member 5. Thereby, the thermal spray gun 3 can be scanned over the whole area of the film formation target surface 2a of the plurality of semiconductor modules 2, and a ceramic film can be formed over the entire area of the film formation target surface 2a.

  The case 4 is made of stainless steel having excellent corrosion resistance, and has an upper surface on the thermal spray gun 2 side, and forms a cooling liquid passage through which cooling water as cooling water flows. In addition, the case 4 is provided with an inlet 4a through which cooling water flows into the cooling liquid passage and an outlet 4b through which cooling water flows out (discharges) from the cooling liquid passage.

  A cooling water pump 4 c that pumps cooling water from a cooling water tank (not shown) and pumps it to the cooling liquid passage of the case 4 is connected to the inflow port 4 a. Therefore, the cooling water flowing into the cooling liquid passage in the case 4 is. It flows in a certain direction from the inlet 4a to the outlet 4b. As the cooling water, water, an ethylene glycol aqueous solution, a processing oil used for an electric discharge machine, or the like can be used.

  The holding member 5 is formed in a flat plate shape by braiding metal wires into a mesh shape. The holding member 5 and the holding state of the semiconductor module 2 by the holding member 5 will be described with reference to FIG. 2 is a cross-sectional view schematically showing a part of the AA cross section of FIG.

  The holding member 5 is formed with a holding surface 5a for holding the plurality of semiconductor modules 2 on the upper surface thereof, in contact with the bottom surfaces on the lower side of the plurality of semiconductor modules 2 (that is, the surface opposite to the film formation symmetrical surface 2a). Has been. In other words, the plurality of semiconductor modules 2 are arranged side by side on the holding surface 5a of the holding member 5 with the film forming aspect surface 2a as the upper surface.

  At this time, the plurality of semiconductor modules 2 are spaced apart without contacting each other. In addition, the holding member 5 holds the semiconductor module 2 in a state where a part including the film formation target surface 2a of the semiconductor module 2 is positioned above the liquid level of the cooling water. Such adjustment of the coolant level can be realized by adjusting the amount of cooling water in the case 4.

  For example, a liquid level sensor that detects the liquid level of the cooling water in the case 4 is provided, and a part of the semiconductor module 2 including the film formation target surface 2a is based on the detection value of the liquid level sensor. What is necessary is just to adjust the pumping capability of the cooling water pump 4c by a feedback control method etc. so that it may be positioned above a liquid level.

  Further, since the holding member 5 is formed in a mesh shape, the holding surface 5a passes through the front and back surfaces thereof, and allows cooling water to pass from the surface opposite to the holding surface 5a to the holding surface 5a side. A plurality of through holes are formed to ooze out. Furthermore, the lower surface of the holding member 5 (the surface opposite to the holding surface 5 a) is in contact with the cylindrical outer surface of the moving roller 6 as a holding member conveying unit that moves the holding member 5.

  The moving roller 6 rotates by obtaining a driving force from an electric motor (not shown), and moves the holding member 5 along with the rotation. Furthermore, since the semiconductor module 2 of this embodiment is held in a state of being placed on the holding surface 5 a of the holding member 5, the semiconductor module 2 moves together with the holding member 5 as the moving roller 6 rotates. To do.

  That is, the moving roller 6 also has a function as a substrate conveying means. Further, as shown in FIG. 1, the moving roller 6 of the present embodiment is opposite to the horizontal component (white broken arrow) in the flow direction of the cooling liquid flowing through the cooling liquid passage in the case 4. The holding member 5 is moved in the direction (thick practice arrow).

  Next, the operation of the thermal spraying apparatus 1 of the present embodiment having the above configuration will be described. When operating the thermal spraying apparatus 1 of the present embodiment, a plurality of semiconductor modules 2 are arranged on the holding surface 50a of the holding member 5 so as to be separated from each other. Furthermore, the amount of the cooling water in the case 4 is adjusted so that a part including the film formation target surface 2a of the semiconductor module 2 is positioned above the liquid level of the cooling water. Specifically, the pumping capacity of the cooling water pump 4c is adjusted.

  At this time, in order to form a film only on the film formation target surface 2a, it is desirable that only the film formation target surface 2a is positioned above the liquid level of the cooling water. However, when the liquid level of the cooling water and the film formation target surface 2a approach, the cooling water may adhere to the film formation target surface 2a when the cooling water scatters for some reason. Such adhesion of the cooling water to the film formation target surface 2a becomes a cause of poor film formation at the part to which it adheres.

  Therefore, in this embodiment, a part including the film formation target surface 2a of the semiconductor module 2 is positioned above the liquid level of the cooling water. That is, in addition to the film formation target surface 2a, the upper end portion of the side surface of the semiconductor module 2 is positioned above the liquid surface to suppress the adhesion of cooling water to the film formation target surface 2a. Furthermore, the holding member 5 of the present embodiment holds the semiconductor module 2 in a state where it is submerged in the cooling water.

  In this state, the moving roller 6 is rotated to move the semiconductor module 2 together with the holding member 5 in the direction opposite to the flow direction of the cooling liquid flowing through the cooling liquid passage in the case 4. Further, the ceramic melted from the spray gun 3 is sprayed onto the semiconductor module 2. At this time, the moving device 3a scans the spray gun 3 over the entire surface of the film formation target surface 2a to form a ceramic film over the entire region of the film formation target surface 2a.

  Since the thermal spraying apparatus 1 of this embodiment operates as described above, the following excellent effects can be exhibited.

  First, in this embodiment, when the ceramic film is formed on the semiconductor module 2, the semiconductor module 2 is cooled by cooling water having a large specific heat with respect to a cooling gas such as air. In some cases, the cooling efficiency can be increased. Therefore, the semiconductor module 2 can be appropriately cooled with a small flow rate of cooling water.

  Further, unlike the case of cooling with a large flow rate of air, the semiconductor module 2 is not blown away by the large flow rate of air, so there is no need to hold and fix the semiconductor module 2 firmly. As a result, the semiconductor module can be appropriately cooled without increasing the size of the thermal spraying apparatus as a whole.

  In addition, when the holding member 5 holds the semiconductor module 2, a part including the film formation target surface 2 a is held so as to be positioned above the liquid level of the cooling water. A part not including the target surface 2a and the holding member 5 can be submerged in the cooling water.

  And in this state, since the ceramic is sprayed from the spray gun 3, a film is not formed in the part immersed in cooling water. Therefore, it can suppress that a film is formed in the holding member 5, and the maintenance operation | work which removes a film from the holding member 5 after thermal spraying can be made unnecessary. As a result, it is possible to avoid complication of work steps when forming a film on the semiconductor module 2.

  Moreover, since the mesh-shaped flat plate member by which a through-hole is formed in the holding surface 5a is employ | adopted as the holding member 5, when the holding member 5 is submerged in cooling water, the holding surface 5a, the semiconductor module 2, and When bubbles are mixed in between, a film is formed in a portion other than the film formation target surface 2a, and a positional shift of the semiconductor module 2 with respect to the holding member 5 can be suppressed.

  Further, since the holding member 5 holds the plurality of semiconductor modules 2, a film can be formed on the plurality of semiconductor modules 2 at the same time. Furthermore, since the plurality of semiconductor modules 2 are held in a state of being spaced apart from each other, when the ceramic coating is formed, it is possible to prevent the adjacent semiconductor modules 2 from being joined by the coating. .

  Further, when the molten ceramic is sprayed from the spray gun 3, the semiconductor module 2 is moved together with the holding member 5 in the direction opposite to the flow direction of the cooling water flowing through the cooling liquid passage in the case 4. The semiconductor module 2 can be moved to a lower temperature side of the cooling water, and the semiconductor module 2 can be efficiently cooled.

  Furthermore, in this embodiment, it can also be expressed that the following film forming method is realized by using the thermal spraying apparatus 1.

  That is, a case 4 for forming a cooling liquid passage through which cooling water for cooling the semiconductor module 2 flows is prepared, and a holding step for holding the semiconductor module 2 on the holding member 5 is performed. In this holding step, the semiconductor module 2 is held by the holding member 5 in a state where a part of the semiconductor module 2 including the film formation target surface 2a is positioned above the liquid level of the cooling water.

  Furthermore, after performing the holding step, a coating forming method for forming a ceramic coating on the semiconductor module 2 by performing a spraying step of spraying the ceramic melted from the spray gun 3 onto the coating formation target surface 2 a of the semiconductor module 2. Realized.

  According to this film formation method, when the semiconductor member 2 is held by the holding member 5 in the holding step, a part of the semiconductor module 2 including the film formation target surface 2a is positioned above the liquid level of the cooling water. Therefore, the semiconductor module 2 can be held in a state where a part of the semiconductor module 2 and the holding member 5 are submerged in the cooling water.

  In this state, if ceramic is sprayed from the thermal spray gun 3, no coating is formed on the semiconductor module 2 and the holding member 5 that are submerged in the cooling water. Therefore, it can suppress that a film is formed in the holding member 5, and the maintenance operation | work which removes a film from the holding member 5 after thermal spraying can be made unnecessary. As a result, it is possible to avoid complication of work steps when forming a film on the semiconductor module 2.

(Second Embodiment)
In this embodiment, it arrange | positions between the adjacent semiconductor modules 2 among the several semiconductor modules 2 on the holding member 5 with respect to 1st Embodiment, and adjacent semiconductor modules 2 will contact. The example which added the partition member 7 for preventing is demonstrated. The partition member 7 is formed of a plurality of plate-like metals (for example, aluminum, copper, and stainless steel) extending in the arrangement direction of the semiconductor modules 2.

  Specifically, as shown in FIGS. 3 and 4, each of the plate-like metal extending in the moving direction of the holding member 5 and the semiconductor module 2 and the plate-like metal extending in the direction orthogonal to the moving direction, The semiconductor module 2 is combined in a lattice shape so as to surround the periphery. Further, as shown in FIG. 5, the upper end portion of the partition member 7 extends to the upper side from the upper surface of the semiconductor module 2.

  FIG. 3 is a drawing corresponding to FIG. 2 of the first embodiment. FIG. 4 is a top view of the holding member 5 in which the holding member 5 and the partition member 7 are arranged, that is, a view seen from the spraying direction of the thermal spray gun 3 (vertical direction in the present embodiment). FIG. 5 is an enlarged view schematically showing a portion B of FIG. Moreover, in FIGS. 3-5, the same code | symbol is attached | subjected to the same or equivalent part as 1st Embodiment. The same applies to the following drawings.

  Further, as shown in FIG. 5, a gap (for example, 0.1 mm or more) is provided between the semiconductor module 2 and the partition member 7 when the semiconductor module 2 and the partition member 7 are viewed from the vertical direction. When the gap dimension is S and the thickness dimension of the semiconductor module 2 is T, the gap dimension S and the thickness dimension T are set to satisfy the following formula F1.

0 <S / T ≦ 0.25 (F1)
Other configurations and operations are the same as those in the first embodiment.

  Therefore, the same effects as those of the first embodiment can be obtained by the thermal spraying apparatus 1 of the present embodiment. Furthermore, according to the thermal spraying apparatus 1 of the present embodiment, the partition member 7 is formed in a lattice shape so that its upper end extends to the upper side of the upper surface of the semiconductor module 2 and surrounds the periphery of the semiconductor module 2. Therefore, the semiconductor modules 2 adjacent to each other can be reliably prevented from being bonded to each other by the coating film.

  Furthermore, since the clearance gap is provided between the semiconductor module 2 and the partition member 7, it can also suppress that the semiconductor module 2 and the partition member 7 are joined by a film with a film. In addition, since the gap dimension S and the thickness dimension T are set so as to satisfy the formula F1, it is effectively prevented that the semiconductor module 2 is blown away by the jet flow of the film material sprayed from the spray gun 3. Can be suppressed.

  This will be described in detail with reference to FIG. 6 shows a state in which the semiconductor module 2 is tilted in the enlarged view of the B part in FIG. 3, as in FIG.

  According to the examination by the present inventors, even if the semiconductor module 2 is blown up by the jet flow from the thermal spray gun 3, the semiconductor module 2 is not blown away if the inclination angle θ of FIG. Is known. Therefore, in the present embodiment, Formula F1 is determined so that the end of the semiconductor module 2 abuts on the partition member 7 in the range where the inclination angle θ is 30 ° or less.

  Thereby, even if the semiconductor module 2 is blown up by the jet flow from the spray gun 3, the inclination angle θ does not become larger than 30 °, so that the semiconductor module 2 is blown off by the jet flow from the spray gun 3. Can be suppressed.

(Third embodiment)
In the present embodiment, as shown in FIG. 7, a protruding portion 7 a that protrudes toward the semiconductor module 2 is provided on the upper end portion of the partition member 7 as compared with the second embodiment. Further, the projecting portion 7a is formed in a triangular shape that is gradually inclined upward toward the semiconductor module 2 side. FIG. 7 is an enlarged view of part B of FIG. 3 in the present embodiment.

  Thereby, even if the semiconductor module 2 is blown up by the injection flow of the film | membrane material injected from the thermal spray gun 3, it can suppress effectively that the semiconductor module 2 is skipped by the protrusion part 7a. Moreover, since the protrusion part 7a is formed in the cross-sectional triangle shape which inclines upward gradually toward the semiconductor module 2 side, the workability | operativity at the time of removing the semiconductor module 2 from the holding member 5 can be improved after film formation.

(Fourth embodiment)
In the present embodiment, a damping plate 4d is added to the first embodiment to suppress the liquid level of the cooling water in the case 4 from undulating. Specifically, as shown in FIG. 8, it is formed of a flat plate member having a flat surface extending from the inner peripheral wall surface of the case 4 to the holding member 5 side. FIG. 8 is a drawing corresponding to FIG. 2 of the first embodiment.

  Such a damping plate 4d may be formed of the same material as the case 4, or may be formed of other metals, ceramics, or the like. Moreover, the damping plate 4d of this embodiment is arrange | positioned above the water surface of cooling water. According to this, it is possible to suppress the liquid level of the cooling water from undulating due to the jet flow of the film material sprayed from the spray gun 3. Therefore, it is possible to effectively prevent the formation of a coating film by suppressing the water droplets of the cooling water from adhering to the coating surface 2a.

  Further, as shown in FIG. 9, as a modification of the present embodiment, the damping plate 4 d may be submerged below the liquid level. According to this, while being able to suppress that the liquid level of a cooling water undulates, a cooling water can also be discharged | emitted from the upper direction of the damping plate 4d. Furthermore, it is possible to suppress the ceramic coating from being formed on the damping plate 4d.

  In addition, you may use the damping plate 4d demonstrated by this embodiment together with the partition member 7 demonstrated by 2nd, 3rd embodiment.

(Fifth embodiment)
In this embodiment, the cooling mode of the semiconductor module 2 is changed as shown in FIG. 10 with respect to the first embodiment. In this embodiment, the thermal spraying is performed by blowing up the cooling water specifically pumped from the cooling water pump until it reaches the surface opposite to the film formation target surface 2a of the semiconductor module 2 through the cooling water guide pipe 4e. The semiconductor module 2 is cooled when the ceramic coating is formed. FIG. 10 is a drawing corresponding to FIG. 2 of the first embodiment.

  Also in this embodiment, the holding member 5 holds the semiconductor module 2 as in the first embodiment, so that a part of the semiconductor module 2 including the film formation target surface 2a is blown up from the cooling water guide pipe 4e. It is positioned above the liquid level of the cooling water to be produced. Therefore, the same effects as those of the first embodiment can be obtained by the thermal spraying apparatus 1 of the present embodiment. Further, the cooling mode of the present embodiment may be applied to the second to fourth embodiments.

(Other embodiments)
The present invention is not limited to the above-described embodiment, and can be variously modified as follows without departing from the spirit of the present invention.

  (1) In the above-described embodiment, an example in which a plasma spraying apparatus that melts a film material using plasma as a heat source is described as the form of the spraying apparatus 1, but the form of the spraying apparatus is not limited to this. For example, other types of spraying apparatuses such as a flame spraying apparatus using a combustion flame of combustion gas such as acetylene gas as a heat source may be adopted.

  (2) In the above-described embodiment, the example in which the semiconductor module 2 is employed as the base material has been described, but the base material is not limited thereto. For example, a metal plate (aluminum, copper, or the like) or a ceramic plate may be employed, and the substrate may not necessarily be a flat plate shape, but may be an uneven or curved base material. That is, the same effects as those of the above-described embodiment can be obtained as long as at least the surface of the base material on which the film is to be formed is held above the liquid surface of the cooling liquid.

(3) In the above-described embodiment, an example in which ceramic is used as the film material has been described. However, the film material is not limited to this. For example, aluminum, copper, spinel (MgAl ₂ O ₄ ) aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), or the like may be employed.

  (4) In the above-described embodiment, an example in which a metal wire is knitted into a mesh shape and formed into a flat plate shape has been described as the holding member, but the holding member is not limited to this. For example, you may employ | adopt what provided the several through-hole which penetrates the front and back in a metal plate.

  (5) In the above-described embodiment, an example in which the moving roller 6 is employed as the base material transport unit and the holding member 5 is moved to move the semiconductor module 2 as the base material together with the holding member 5 will be described. However, the substrate conveying means is not limited to this. For example, you may employ | adopt the structure of applying a load from the side surface of a holding member and moving a holding member with a base material.

  Moreover, you may employ | adopt the means to move only a base material as a base material conveyance means. For example, a structure in which the base material is sequentially fed onto the holding member and the base material on which the film has been formed is pushed out by the base material on which the film is not formed may be employed.

  (6) You may add the holding member vibration means to vibrate the holding member 5 with respect to the thermal spraying apparatus 1 of each above-mentioned embodiment. As such a holding member vibration means, an ultrasonic vibration device can be adopted. Thereby, since the semiconductor module (base material) 2 can be vibrated with the holding member 5, it is effective that the adjacent semiconductor modules 2 or the adjacent semiconductor modules 2 and the partition member 7 are joined by the film. Can be suppressed.

  (7) In the second embodiment described above, the partition member 7 is configured to surround each semiconductor module 2, but the partition member 7 is not limited to this. For example, as shown in FIG. 11A, the holding member 5 and the semiconductor module 2 may be composed of only a plate-like metal extending in the moving direction, or as shown in FIG. You may comprise only the plate-shaped metal extended in the orthogonal direction.

2 Semiconductor module 2a Film formation target surface 3 Thermal spray gun 4 Case 4c Cooling water pump 4c
4d Damping plate 5 Holding member 5a Holding surface 6 Moving roller 6
7 Partition member 7
7a Protruding part

Claims (11)

A thermal spraying apparatus for forming a film of the film material on the film formation target surface (2a) of the base material (2) by spraying the melted film material on the base material (2),
A spray gun (3) for injecting the film material melted onto the surface (2a) to be coated;
A holding member (5) for holding the substrate (2);
A case (4) forming a cooling liquid passage through which a cooling liquid for cooling the substrate (2) flows;
The holding member (5) is configured so that a part of the base material (2) including the surface (2a) to be coated is positioned above the liquid level of the cooling liquid. A thermal spraying device characterized by holding The holding member (5) has a holding surface (5a) that contacts and holds the lower side of the base material (2),
The thermal spraying device according to claim 1, wherein a through hole is formed in the holding surface (5a) so as to pass through the front and back surfaces and allow the cooling liquid to pass therethrough. The base material (2) is formed in a plate shape,
The thermal spraying device according to claim 1 or 2, wherein the holding member (5) holds a plurality of base materials (2) arranged apart from each other. The holding member (5) has a partition member (7) disposed between the plurality of base materials (2) to prevent contact between the base materials (2).
The thermal spraying device according to claim 3, wherein an upper end portion of the partition member (7) extends to an upper side than an upper surface of the base material (2). When the base material (2) and the partition member (7) are viewed from the vertical direction,
There is a gap between the base material (2) and the partition member (7), and when the dimension of the gap is S and the thickness dimension in the vertical direction of the base material (2) is T ,
0 <S / T ≦ 0.25
The thermal spraying device according to claim 4, wherein   Furthermore, the thermal spraying of Claim 4 or 5 with which the protrusion part (7a) which protrudes in the said base material (2) side is provided in the upper end part of each said partition member (7). apparatus.   The thermal spraying device according to any one of claims 1 to 6, further comprising holding member vibrating means (8) for vibrating the holding member (5).   The case (4) has a wave-damping plate (4) that suppresses undulation of the liquid surface of the cooling liquid by the flow of the film material sprayed from the spray gun (3). The thermal spraying device according to any one of claims 1 to 7, characterized in that A cooling liquid pumping means (4c) for flowing the cooling liquid in a predetermined direction,
The base material conveying means (6) for moving the base material (2) in a direction opposite to a horizontal direction component in the flow direction of the cooling liquid is provided. The thermal spraying apparatus as described in any one.   The said base material conveyance means (6) moves the said base material (2) with the said holding member (5) by moving the said holding member (5), The thermal spraying of Claim 9 characterized by the above-mentioned. apparatus. A film for spraying the melted film material from the spray gun (3) to form a film of the film material on the film formation target surface (2a) of the substrate (2) held by the holding member (5) A forming method comprising:
A case (4) for forming a cooling liquid passage through which a cooling liquid for cooling the substrate (2) flows is prepared,
A holding step of holding the substrate (2) by the holding member (5);
After the holding step, a spraying step of spraying the film material from the spray gun (3) onto the film formation target surface (2a),
In the holding step, the base material (2) is held in a state where a part of the base material (2) including the film formation target surface (2a) is positioned above the liquid surface of the cooling liquid. A film forming method characterized by the above.

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