JP2017200735A - Method for forming hard-to-bond material film and system for forming hard-to-bond material film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form a hard-to-bond material film on various substrates in a wide range.SOLUTION: A method for forming a hard-to-bond material film includes: a base formation step of forming a plurality of bases on a target surface by disposing and curing a first ink comprising a molding material on the target surface of a substrate; a support formation step of forming a support by disposing a second ink comprising a support material at positions of the target surface respectively in contact with the bases; a flange formation step of forming a flange integrated with the base by disposing and curing a third ink comprising a molding material on the base to straddle over the support; a removal step of removing the support to form a void between the target surface and the flanges respectively formed on adjoining bases; a disposition step of disposing a hard-to-bond material on the flanges; and a film formation step of forming a hard-to-bond material film of the hard-to-bond material on the target surface side, partially deforming the hard-to-bond material film to intrude into the void, and engaging the hard-t-bond material film and the flange in a direction perpendicular to the target surface.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for forming a hardly adhesive material film and a system for forming a hardly adhesive material film.

  A metal substrate having a film of a difficult-to-adhere material such as polytetrafluoroethylene on its surface is known. As a technique for forming a difficult-to-adhere material film on the surface of a metal substrate, for example, as described in Patent Document 1, a technique of depositing metal atoms and a hardly-adhesive material on the surface of a metal substrate by eutectoid plating is known. Yes.

JP-A-8-41688

  With the technique described in Patent Document 1, it is possible to form a hardly-adhesive material on the surface of a metal substrate, but it is difficult to form a hardly-adhesive material film on other types of base materials.

  The present invention has been made in view of the above, and a method for forming a difficult-to-adhere material film and a system for forming a difficult-to-adhere material film that can easily form a difficult-to-adhere material film on a wide range of materials The purpose is to provide.

  The method of forming a difficult-to-adhere material film according to the present invention includes a base forming step of forming a plurality of bases on the target surface by arranging and curing a first ink containing a modeling material on the target surface of the base material, and a support A support part forming step of forming a support part by arranging a second ink containing a material at a position in contact with the base part of the target surface, and a modeling material on the base part so as to straddle the support part By arranging and curing the third ink, a flange forming step of integrally forming the flange in a state of projecting from the respective base toward the support portion and the base, the support is removed, The removal step of forming a gap between the flange portion and the target surface respectively formed on the matching base portion, the disposing step of disposing a hardly adhesive material on the flange portion, and the object by the hardly adhesive material Difficult adhesive material on the surface side Forming a film, deforming a part of the difficult-to-adhere material film to enter the gap, and engaging the hardly-adhesive material film and the flange in a direction perpendicular to the target surface; ,including.

  According to the present invention, the base portion and the collar portion for engaging with the hardly adhesive material film can be easily formed on the target surface of the substrate using the first ink, the second ink, and the third ink. Therefore, for example, a difficult-to-adhere material film can be easily placed on a substrate formed using a metal material or a substrate formed using a material other than a metal, such as a resin material. can do. Therefore, it is possible to easily form a difficult-to-adhere material film on a wide range of materials.

  Further, in the base portion forming step and the support portion forming step, the arrangement of the first ink and the arrangement of the second ink are unified using a common inkjet head capable of discharging the first ink and the second ink. It may be performed by operation.

  According to the present invention, the base portion and the support portion can be efficiently formed. Further, since the ink jet head can eject the first ink, the ink jet head can also be used when forming the collar portion.

  Moreover, the said support part formation process may form the said support part in the both sides of one direction with respect to the said base.

  According to the present invention, since the collar portion can be arranged so as to protrude from the base portion to both sides in one direction, more engagement portions between the collar portion and the hardly adhesive material film can be secured.

  In the base forming step, a plurality of the bases may be formed so as to be aligned in the one direction.

  According to the present invention, since the plurality of base portions are formed side by side in one direction, it is possible to ensure the engagement portion between the collar portion and the hardly adhesive material film along one direction. Thereby, a difficult-to-adhere material film can be made difficult to peel from a base material.

  Further, the support material is formed using a material that dissolves in a predetermined solution, the modeling material is formed using a material that does not dissolve in the solution in a cured state, and the removal step includes the support The part may be immersed in the solution together with the base material.

  According to the present invention, after forming the collar part, the support part can be efficiently removed while leaving the base part and the collar part.

  The base material may be formed using a resin.

  According to the present invention, since a difficult-to-adhere material film can be easily formed on the target surface of a substrate formed using a resin, it is possible to use difficult-to-adhere materials in a wide range of fields.

  The base material may be a sheet-like substrate.

  According to the present invention, a difficult-to-adhere material film can be easily formed on the target surface of a sheet-like substrate, so that the hardly-adhesive material can be used in a wide range of fields.

  The substrate may be a substrate used for a nozzle plate of an inkjet head.

  According to the present invention, since a difficult-to-adhere material film can be easily formed on the target surface of a substrate used for a nozzle plate of an inkjet head, for example, a nozzle plate having excellent liquid repellency can be easily manufactured. .

  The system for forming a difficult-to-adhere material film according to the present invention includes forming a plurality of bases on the target surface by arranging and curing the first ink including the modeling material on the target surface of the base material, and including a support material. Two inks are arranged at positions in contact with the respective bases on the target surface to form support parts, and a third ink containing a modeling material is arranged and cured on the bases so as to straddle the support parts. Thus, the three-dimensional modeling apparatus that integrally forms the flange portion protruding from the respective base portions toward the support portion side, and the support portions are removed, and the base portions are respectively formed on the adjacent base portions. A support portion removing device that forms a gap between the collar and the target surface, a difficult-to-adhere material supply device that disposes a difficult-to-adhere material on the collar, and the difficult-to-adhere material to the target surface. Form an adhesive material film Together, to deform the portion of the flame-adhesive material film intruded in the gap portion, and a film forming apparatus to engage in the vertical direction of the said flange portion and said flame-adhesive material film the object surface.

  According to the present invention, the base portion, the support portion, and the collar portion can be easily formed on the target surface of the base material by the three-dimensional modeling apparatus. Therefore, for example, a difficult-to-adhere material film can be easily placed on a substrate formed using a metal material or a substrate formed using a material other than a metal, such as a resin material. can do. Therefore, it is possible to easily form a difficult-to-adhere material film on a wide range of materials.

  According to the present invention, it is possible to easily form a difficult-to-adhere material film on a wide variety of substrates.

FIG. 1 is a cross-sectional view showing an example of a resin layer forming member according to the first embodiment. FIG. 2 is a flowchart showing an example of a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 3 is a process diagram showing a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 4 is a process diagram showing a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 5 is a process diagram showing a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 6 is a process diagram showing a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 7 is a process diagram showing a method for forming a difficult-to-adhere material film according to the first embodiment. FIG. 8 is a cross-sectional view showing an example of a resin layer forming member according to the second embodiment. FIG. 9 is a cross-sectional view showing an example of a substrate according to the second embodiment. FIG. 10 is a diagram illustrating an example of an inkjet head according to the third embodiment. FIG. 11 is a diagram illustrating an example of a system for manufacturing a difficult-to-adhere material film according to the fourth embodiment. FIG. 12 is a cross-sectional view illustrating an example of a resin layer forming member according to a modification.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a method for forming a hardly-adherent material film and a system for forming a hardly-adherent material film according to the present invention will be described with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.

<First Embodiment>
FIG. 1 is a cross-sectional view showing an example of a resin layer forming member 100 according to the first embodiment. As shown in FIG. 1, the resin layer forming member 100 includes a base material 10 and a hardly adhesive material film 20 disposed on the target surface 10 a of the base material 10.

  The base material 10 is formed using resin materials, such as a polyimide, for example. In addition, the base material 10 is not limited to a resin material, The base material of wide materials, such as synthetic resins, such as a plastics, ceramics, a metal material, is applicable. An engagement portion 11 is provided on the target surface 10 a of the base material 10. The engaging portion 11 has a base portion 12 and a flange portion 13. As for the engaging part 11, the base 12 and the collar part 13 are integrally formed.

  The base 12 is bonded to the target surface 10a. The base 12 is arranged on the target surface 10a, for example, in one direction at a constant pitch. The shape of the base 12 when viewed from a direction perpendicular to the target surface 10a is not particularly limited, and may be, for example, a circular shape, an elliptical shape, a polygonal shape, or a belt shape. Further, the base 12 is not limited to a constant pitch, and is not limited to a configuration in which the base 12 is arranged in one direction.

  The collar portion 13 is disposed on the base portion 12. For example, the flange 13 protrudes on both sides in one direction with respect to the base 12. As for the collar part 13, the protrusion part is arrange | positioned facing the target surface 10a. The flange portion 13 is not limited to a configuration that protrudes on both sides in one direction with respect to the base portion 12, and may be a configuration that protrudes so that at least a portion thereof faces the target surface 10 a with respect to the base portion 12. That's fine. Moreover, although the adjacent collar parts 13 are arrange | positioned in the state which left | separated, for example, it is not limited to this. For example, the structure by which the collar parts 13 are connected, ie, the structure by which one collar part 13 was constructed between the adjacent base parts 12, may be sufficient.

  The difficult-to-adhere material film 20 is formed of a difficult-to-adhere material such as polytetrafluoroethylene, polypropylene, polyethylene, polyoxymethylene, acetal resin, silicon rubber, or the like. Hereinafter, although the case where polytetrafluoroethylene (PTFE) is used is described as an example as a difficult-to-adhere material, the present invention is not limited to this, and other difficult-to-adhere materials may be used. The difficult-to-adhere material film 20 is in a state in which the insertion portion 21 is inserted between the flange portion 13 and the target surface 10a. The insertion portion 21 is engaged with the engagement portion 11 in a direction perpendicular to the target surface 10a. Thus, since the difficult-to-adhere material film 20 is in a state in which the insertion portion 21 and the engagement portion 11 are engaged, it is arranged in a state of being in close contact with the target surface 10a of the base material 10 due to the anchor effect. Yes.

  Next, a method of forming a difficult-to-adhere material film 20 that forms the hardly-adhesive material film 20 on the substrate 10 will be described. FIG. 2 is a flowchart showing an example of a method for forming a difficult-to-adhere material film according to this embodiment. 3 to 7 are process diagrams showing a method of forming a hardly-adherent material film according to this embodiment. Hereinafter, a method for forming a difficult-to-adhere material film will be described with reference to FIGS.

  First, as shown in FIG. 2, the base 12 and the support part 14 are formed on the target surface 10a of the base material 10 (steps S10 and S20). FIG. 3 is a diagram illustrating a state in which the base portion 12 and the support portion 14 are formed on the target surface 10 a of the base material 10. As shown in FIG. 3, steps S <b> 10 and S <b> 20 are performed using the inkjet head 101 and the ultraviolet irradiation device 102.

  The inkjet head 101 discharges the first ink Q1 and the second ink Q2. The first ink Q1 includes, for example, an ultraviolet curable resin that is cured by being irradiated with ultraviolet rays. As the ultraviolet curable resin, for example, an acrylic resin that is cured by irradiation with ultraviolet rays is used, but other materials may be used. The second ink Q2 includes a support material capable of supporting, for example, the first ink Q1 and a cured ultraviolet curable resin. As the support material, for example, a material that dissolves in a predetermined solution such as water or an aqueous solution is used. In this case, a material that does not dissolve in the solution in a cured state is used as the ultraviolet curable resin. The ultraviolet irradiation device 102 irradiates the ultraviolet light L toward the target surface 10 a of the substrate 10.

  The inkjet head 101 ejects the first ink Q1 and the second ink Q2 toward the target surface 10a of the substrate 10 while moving in a predetermined scanning direction. The inkjet head 101 discharges the first ink Q1 to a region preset as a region where the base portion 12 is disposed in the target surface 10a. For example, the ink jet head 101 discharges the first ink Q1 to a plurality of regions arranged with a predetermined interval in one direction on the target surface 10a. Further, the inkjet head 101 discharges the second ink Q2 to a region of the target surface 10a that is in contact with the first ink Q1, that is, a region where a support portion for forming the collar portion 13 is disposed. In addition, the inkjet head 101 ejects the second ink Q2 to a region corresponding to the shape of the collar portion 13. For example, when forming the collar portion 13 having a shape protruding from both sides in one direction with respect to the base portion 12, the second ink Q2 is ejected to both sides in one direction with respect to the first ink Q1. By this operation, the first ink Q1 and the second ink Q2 are arranged in a predetermined portion of the target surface 10a.

  Thereafter, the ultraviolet irradiation device 102 irradiates the first ink Q1 disposed on the target surface 10a with ultraviolet L. By irradiating the ultraviolet light L, the ultraviolet curable resin contained in the first ink Q1 is cured, and the ultraviolet curable resin layer 12A is formed. Further, the support layer 14A is formed by the second ink Q2 disposed on the target surface 10a. Thus, one layer of the ultraviolet curable resin layer 12A and the support layer 14A is formed on the target surface 10a (step S10).

  After forming one layer of the ultraviolet curable resin layer 12A and the support layer 14A on the target surface 10a, the inkjet head 101 ejects the first ink Q1 onto the ultraviolet curable resin layer 12A while moving in a predetermined scanning direction, and supports it. The second ink Q2 is ejected on the layer 14A. Then, the ultraviolet irradiation device 102 irradiates the first ink Q1 with ultraviolet L. By this operation, the ultraviolet curable resin 12A and the support layer 14A are laminated. When at least one of the ultraviolet curable resin layer 12A and the support layer 14A has not reached a predetermined height (for example, about 30 μm) from the target surface 10a, the inkjet head 101 and the ultraviolet irradiation device 102 (No in step S20), The UV curable resin layer 12A and the support layer 14A are repeatedly formed until they are stacked at the predetermined height. When one of the ultraviolet curable resin layer 12A and the support layer 14A reaches the predetermined height first and the other does not reach the predetermined height, the predetermined height is reached in step S10. Only the missing layer is formed. Moreover, in step S10 and step S20, the ultraviolet curable resin layer 12A and the support layer 14A may be formed to be flush with each other, or a step may be formed between them.

  When the ultraviolet curable resin layer 12A and the support layer 14A are stacked at a predetermined height from the target surface 10a (Yes in step S20), the base portion is arranged on the target surface 10a with a predetermined interval in one direction. 12 is formed (step S30). Further, the support portion 14 is formed in a state in which the base surface 12 is in contact with the base surface 12 at a position sandwiching the base portions 12 in one direction (Step S30).

  Next, as shown in FIG. 2, the collar part 13 is formed on the base part 12 and the support part 14 (step S40). FIG. 4 is a diagram illustrating a state in which the flange 13 is formed. As shown in FIG. 4, step S40 is performed using the inkjet head 101 and the ultraviolet irradiation device 102 as in step S10.

  The inkjet head 101 ejects the third ink toward the base portion 12 and the support portion 14 while moving in a predetermined scanning direction. The third ink may be the first ink Q1 described above, or may be ink of other components. Hereinafter, the case where the first ink Q1 is ejected as the third ink will be described as an example. In this case, the inkjet head 101 discharges the first ink Q1 over, for example, the entire surface on each base portion 12 and the entire surface on the support portion 14 in contact with the base portion 12. By this operation, the first ink Q1 is disposed on each base portion 12 so as to straddle the support portion 14. Next, the ultraviolet irradiation device 102 irradiates the arranged first ink Q1 with ultraviolet L. By irradiating with ultraviolet rays L, one ultraviolet curable resin layer 13 </ b> A is formed on the base portion 12 so as to straddle the support portion 14.

  The inkjet head 101 laminates the ultraviolet curable resin layer 13A by repeatedly performing the above-described ejection and irradiation. The inkjet head 101 and the ultraviolet irradiation device 102 repeatedly perform the above discharge and irradiation until the ultraviolet curable resin layer 13 </ b> A reaches a predetermined height (for example, about 30 μm) on the base 12. Then, the ultraviolet curable resin layer 13A is laminated on the base 12 at a predetermined height, so that the flange portion 13 protruding from the base 12 toward the support portion 14 is formed integrally with the base 12 (step S40). ).

  Next, as shown in FIG. 2, the support part 14 is removed from the target surface 10a of the base material 10 (step S50). FIG. 5 is a diagram showing how the support unit 14 is removed. As shown in FIG. 5, in step S <b> 50, for example, the entire base material 10 in which the base portion 12, the support portion 14, and the flange portion 13 are formed is immersed in the solution W. Although FIG. 5 shows the case where the base material 10 is immersed in the solution W stored in the container 103, the present invention is not limited to this. Alternatively, the substrate 10 may be immersed in the solution W by exposing the substrate 10 to the flow of the solution W. The solution W is immersed so that the support unit 14 contacts the solution W. The support portion 14 that has come into contact with the solution W is dissolved and removed by the solution W. Thus, in step S40, the support part 14 is removed by immersing the support part 14 together with the base material 10 in the solution W. By removing the support portion 14, a gap portion 15 is formed between the flange portion 13 and the target surface 10 a respectively formed on the adjacent base portions 12.

  Next, as shown in FIG. 2, after the base material 10 is taken out from the solution W, washed and dried, the hardly-adhesive material 22 is placed on the collar 13 (step S60). FIG. 6 is a diagram illustrating a state in which the hardly adhesive material 22 is disposed. As shown in FIG. 6, in step S <b> 60, for example, the mold frame 104 is disposed above the collar portion 13 of the base material 10, and the hardly adhesive material 22 made of powdery PTEF is surrounded by the mold frame 104. . Thereby, the hardly-adhesive material 22 is arrange | positioned over the some collar part 13. As shown in FIG.

  Next, as shown in FIG. 2, the hard-to-adhere material 22 arranged on the collar 13 is compressed toward the target surface 10a (step S70). FIG. 7 is a diagram illustrating a state in which the hardly adhesive material 22 is compressed. As shown in FIG. 7, in step S <b> 70, for example, pressure is applied to the object surface 10 a side with respect to the hardly adhesive material 22 in the mold 104 by the roller 105 or the like. By this operation, a part (deformation part 23) of the difficult-to-adhere material 22 is deformed and enters the gap part 15. When pressure is continuously applied to the difficult-to-adhere material 22, the deformable portion 23 is further inserted into the gap portion 15 and is in close contact with the target surface 10 a, the base portion 12, and the flange portion 13. Thereby, the deformation | transformation part 23 and the collar part 13 will be in the state engaged in the direction perpendicular | vertical to the target surface 10a. Thereafter, pressurization by the roller 105 is terminated, and the mold 104 and the roller 105 are removed, whereby the hardly adhesive material film 20 is formed on the target surface 10 a of the base material 10. When a thermoplastic resin such as polypropylene or polyethylene is used as the hardly adhesive material, polypropylene or polyethylene in a heated and melted state is disposed over the plurality of flanges 13 to form the hardly adhesive material film 20. It may be formed.

  As described above, in the method for manufacturing the hardly adhesive material film according to the present embodiment, the first ink Q1 and the second ink Q2 are used as the base 12 and the collar 13 for engaging with the hardly adhesive material film 20. It can form easily in the target surface 10a of the base material 10 with an inkjet system. Therefore, the hardly adhesive material film 20 is formed on the base material 10 formed using, for example, a metal material and also on the base material 10 formed using a material other than metal, such as a resin material. It can be easily arranged. Therefore, it becomes possible to easily form the difficult-to-adhere material film 20 on a wide range of materials.

Second Embodiment
FIG. 8 is a cross-sectional view showing an example of the resin layer forming member 200 according to the second embodiment. As shown in FIG. 8, the resin layer forming member 200 includes a sheet-like base material 110 and a hardly adhesive material film 20 disposed on the target surface 110 a of the base material 110. The base material 110 is a flexible substrate formed of, for example, a resin such as polyimide or polyester. The base material 110 can be used, for example, for a flexible substrate on which wiring or the like is formed. On the target surface 110a of the base 110, a base portion 12 and a flange portion 13 which are engaging portions 11 are formed.

  The difficult-to-adhere material film 20 is in a state in which the insertion portion 21 enters between the target surface 110a and the flange portion 13. The insertion portion 21 is engaged with the engagement portion 11 in a direction perpendicular to the target surface 110a. Since the insertion portion 21 and the engagement portion 11 are engaged in this manner, the difficult-to-adhere material film 20 is disposed in close contact with the target surface 110a of the substrate 110 due to the anchor effect. Yes.

  Further, an adhesive layer 30 is formed on the surface of the substrate 110 opposite to the target surface 110a. The adhesive layer 30 is formed over almost the entire surface, for example. The adhesive layer 30 can be formed using an adhesive resin material. The adhesive layer 30 may not be provided.

  When the difficult-to-adhere material film 20 is formed on the sheet-like base material 110, the base material 110 is in a flexible state, and thus the base material 110 is placed on the surface of the rigid body. The surface of the rigid body may be flat or curved such as a cylindrical surface. The specific procedure is the same as the method for forming the hardly adhesive material film of the first embodiment, and will be described briefly.

  First, the base portion 12 and the support portion (not shown) are formed on the target surface 110a of the base 110 using the inkjet head 101 and the ultraviolet irradiation device 102 as in the first embodiment. After forming the base portion 12 and the support portion, the collar portion 13 is formed on the base portion 12 and the support portion using the inkjet head 101 and the ultraviolet irradiation device 102 as in the first embodiment. After forming the collar part 13, the support part is removed. Then, the difficult-to-adhere material 22 is arrange | positioned on the collar part 13, and the hardly-adhesive material 22 arrange | positioned on the collar part 13 is compressed to the object surface 10a side. Thereafter, the adhesive layer 30 is formed on the surface of the substrate 110.

  The resin layer forming member 200 according to the present embodiment can arrange the resin layer forming member 200 on another base material by bonding the adhesive layer 30 to the other base material. FIG. 9 is a diagram illustrating a substrate 300 in which the resin layer forming member 200 is bonded to another base material. A substrate 300 shown in FIG. 9 has a resin layer forming member 200 attached to a base material 40 formed using a material such as a resin material, ceramics, or metal material.

  On the surface of the resin layer forming member 200, a hardly adhesive material film 20 is disposed. By sticking the resin layer forming member 200 to the surface 40 a of the base material 40, the hardly adhesive material film 20 is disposed on the surface of the substrate 300. Thus, in this embodiment, the hard-to-adhere material film 20 can be arrange | positioned on the surface of another base material by affixing the resin layer forming member 200 to another base material.

<Third Embodiment>
FIG. 10 is a diagram illustrating an example of the inkjet head 106 according to the third embodiment. As shown in FIG. 10, the inkjet head 106 has a nozzle plate 100B. The nozzle plate 100B has nozzles NZ that eject ink. As the nozzle plate 100B, for example, the resin layer forming member 100 according to the first embodiment is used, and the nozzle NZ is formed on the resin layer forming member 100. As the nozzle plate 100B, the resin layer forming member 200 or the substrate 300 according to the second embodiment may be used.

  The hardly adhesive material film 20 is disposed on the surface 106a of the nozzle plate 100B. In this case, the surface 106a of the nozzle plate 100B has a liquid repellent property with respect to ink. Therefore, for example, when the surface 106a of the nozzle plate 100B is slid with a wiper or the like, the ink attached to the surface 106a is easily removed. Moreover, since the resin layer forming member 100 includes the base material 10 formed using a resin material such as polyimide, the nozzle plate 100B can be easily manufactured at low cost.

<Fourth embodiment>
FIG. 11 is a diagram illustrating an example of a difficult-to-adhere material film manufacturing system 400 according to the fourth embodiment. As shown in FIG. 11, the difficult-to-adhere material film manufacturing system 400 includes a three-dimensional modeling apparatus 401, a support portion removing apparatus 402, a hardly-adhesive material supply apparatus 403, and a pressurizing apparatus 404.

  The three-dimensional modeling apparatus 401 includes, for example, the inkjet head 101 and the ultraviolet irradiation apparatus 102 described in the first embodiment. The three-dimensional modeling apparatus 401 forms the base portion 12, the support portion 14, and the collar portion 13 on the target surface 10 a of the base material 10.

  The support part removing device 402 includes, for example, a container 103 in which the solution W described in the first embodiment is stored. The support part removing device 402 removes the support part 14 among the base part 12, the support part 14, and the collar part 13 formed on the target surface 10 a of the base material 10 by the three-dimensional modeling apparatus 401.

  The hardly-adhesive material supply device 403 includes, for example, the mold 104 described in the first embodiment and a supply source of the hardly-adhesive material. The hardly-adhesive material supply device 403 supplies and arranges the hardly-adhesive material 22 on the flange 13.

  The pressure device 404 includes, for example, the roller 105 described in the first embodiment or a press (not shown). The pressurizing device 404 compresses the difficult-to-adhere material 22 disposed on the collar unit 13 toward the target surface 10a. The hardly adhesive material supply device 403 and the pressure device 404 may be configured as one device.

  The manufacturing system 400 according to the present embodiment can easily form the base portion 12, the support portion 14, and the collar portion 13 on the target surface 10 a of the base material 10 by the three-dimensional modeling apparatus 401. Therefore, the difficult-to-adhere material film 20 can be easily formed on a base material formed using, for example, a metal material and also on a base material formed using a material other than metal, such as a resin material. Can be arranged. Therefore, it becomes possible to easily form the difficult-to-adhere material film 20 on a wide range of materials. In addition, since the manufacturing system 400 includes the three-dimensional modeling apparatus 401, the support portion removing apparatus 402, the hardly adhesive material supply apparatus 403, and the pressurizing apparatus 404, the difficult adhesive material film 20 is efficiently applied to the base material. Can be formed.

  The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention. For example, in the first embodiment, the case where the arrangement of the first ink Q1 and the second ink Q2 is performed in one operation using the inkjet head 101 capable of discharging the first ink Q1 and the second ink Q2 is given as an example. However, the present invention is not limited to this, and the first ink Q1 and the second ink Q2 may be arranged in separate operations. For example, in step S10, the first ink Q1 may be placed and irradiated with ultraviolet rays to form the base 12 first, and then the second ink Q2 may be placed in step S20.

  Moreover, in the said embodiment, although the material which melt | dissolves in the solution W is used as a support material, it demonstrated as an example the case where the support part 14 was removed by being immersed in the solution W, However, it does not limit to this. Absent. For example, other materials may be used as the support material, and the support material may be removed by other methods according to the material of the support material.

  Moreover, in the said embodiment, the 1st ink Q1 is a photocurable ink containing the ultraviolet curing resin hardened | cured, for example by irradiating an ultraviolet-ray, and the base 12 and the collar part 13 are formed with the said photocurable ink. Although described as an example, the present invention is not limited to this. For example, at least one of the base portion 12 and the flange portion 13 may be formed by a screen printing method.

  Moreover, in the said embodiment, although the structure in which the collar part 13 was formed over the whole upper surface of the base part 12 was mentioned as an example, it demonstrated, It does not limit to this. FIG. 12 is a cross-sectional view showing an example of a resin layer forming member 100B according to a modification. In the resin layer forming member 100B shown in FIG. 12, the flange portion 13B is arranged in two parts on the upper surface of the base portion 12. Even if the resin layer forming member 100B has a configuration in which the flange portion 13B is arranged in two parts, the difficult-to-adhere material film 20 can obtain an anchor effect similarly to the resin layer forming member 100 described above. . In this configuration, it is possible to save the ink (for example, the first ink Q1) for forming the collar portion 13B.

10, 40, 110 Base material 10a, 110a Target surface 11 Engagement part 12 Base part 13 Gutter part 14 Support part 15 Gap part 20 Difficult adhesion material film 21 Insertion part 22 Difficult adhesion material 23 Deformation part 30 Adhesive layers 40a, 106a Surface 100 , 200 Resin layer forming members 101, 106 Inkjet head 102 Ultraviolet irradiation device 103 Container 104 Mold 105 Roller 100B Nozzle plate 300 Substrate 400 Manufacturing system 401 Three-dimensional modeling device 402 Support part removing device 403 Difficult adhesive material supply device 404 Pressure device L Ultraviolet Q1 First ink Q2 Second ink W Dissolving solution NZ Nozzle

Claims (9)

A base forming step of forming a plurality of bases on the target surface by arranging and curing the first ink containing the modeling material on the target surface of the substrate;
A support portion forming step of forming a support portion by arranging a second ink containing a support material at a position in contact with the base portion of the target surface;
By arranging and curing a third ink containing a modeling material on the base so as to straddle the support, the flanges in a state of protruding from the base to the support part are integrated with the base. A collar forming step to be formed;
A removal step of removing the support portion and forming a gap between the flange portion and the target surface respectively formed on the adjacent base portions;
An arrangement step of arranging a difficult-to-adhere material on the buttocks;
A difficult-to-adhere material film is formed on the target surface side with the hardly-adhesive material, and a part of the hardly-adhesive material film is deformed to enter the gap, and the hardly-adhesive material film and the flange portion are A film forming step for engaging in a direction perpendicular to the target surface;
A method of forming a difficult-to-adhere material film including:   In the base formation step and the support portion formation step, the arrangement of the first ink and the arrangement of the second ink can be performed in one operation using a common inkjet head capable of ejecting the first ink and the second ink. The method for forming a hardly adhesive material film according to claim 1 to be performed.   The method of forming a difficult-to-adhere material film according to claim 1, wherein the support part forming step forms the support part on both sides in one direction with respect to the base part.   The method of forming a difficult-to-adhere material film according to claim 3, wherein in the base formation step, a plurality of the bases are formed so as to be aligned in the one direction. The support material is formed using a material that dissolves in a predetermined solution.
The modeling material is formed using a material that does not dissolve in the solution in a cured state,
The said removal process is a formation method of the hard-to-adhere material film as described in any one of Claims 1-4 in which the said support part is immersed in the said solution with the said base material.   The said base material is a formation method of the difficult-to-adhere material film as described in any one of Claims 1-5 formed using resin.   The method of forming a difficult-to-adhere material film according to any one of claims 1 to 6, wherein the base material is a sheet-like substrate.   The method of forming a difficult-to-adhere material film according to claim 1, wherein the base material is a substrate used for a nozzle plate of an inkjet head. A plurality of bases are formed on the target surface by arranging and curing the first ink including the modeling material on the target surface of the substrate, and the second ink including the support material is applied to each of the base surfaces of the target surface. A support part is formed at a position where it comes into contact, and a third ink containing a modeling material is placed and cured on the base part so as to straddle the support part. A three-dimensional modeling apparatus for integrally forming the protruding collar with the base; and
A support part removing device that removes the support part and forms a gap part between the flange part and the target surface respectively formed on the adjacent base parts;
A hard-to-adhere material supply device for disposing a hard-to-adhere material on the collar;
A difficult-to-adhere material film is formed on the target surface side with the hardly-adhesive material, and a part of the hardly-adhesive material film is deformed to enter the gap, and the hardly-adhesive material film and the flange portion are A film forming apparatus to be engaged in a direction perpendicular to the target surface;
A system for forming a difficult-to-adhere material film.

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