KR101972196B1 - 적외선 센서 - Google Patents
적외선 센서 Download PDFInfo
- Publication number
- KR101972196B1 KR101972196B1 KR1020147021179A KR20147021179A KR101972196B1 KR 101972196 B1 KR101972196 B1 KR 101972196B1 KR 1020147021179 A KR1020147021179 A KR 1020147021179A KR 20147021179 A KR20147021179 A KR 20147021179A KR 101972196 B1 KR101972196 B1 KR 101972196B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- wiring
- insulating film
- infrared
- wiring film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2098—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using light, e.g. UV photohardening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J2005/103—Absorbing heated plate or film and temperature detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J2005/206—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices on foils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/20—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat
- G03G15/2003—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat
- G03G15/2014—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat
- G03G15/2039—Apparatus for electrographic processes using a charge pattern for fixing, e.g. by using heat using heat using contact heat with means for controlling the fixing temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/00362—Apparatus for electrophotographic processes relating to the copy medium handling
- G03G2215/00535—Stable handling of copy medium
- G03G2215/00717—Detection of physical properties
- G03G2215/00772—Detection of physical properties of temperature influencing copy sheet handling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09136—Means for correcting warpage
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/10—Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-019431 | 2012-02-01 | ||
| JP2012019431A JP5892368B2 (ja) | 2012-02-01 | 2012-02-01 | 赤外線センサ |
| PCT/JP2013/000467 WO2013114861A1 (ja) | 2012-02-01 | 2013-01-29 | 赤外線センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140128973A KR20140128973A (ko) | 2014-11-06 |
| KR101972196B1 true KR101972196B1 (ko) | 2019-04-24 |
Family
ID=48904908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147021179A Expired - Fee Related KR101972196B1 (ko) | 2012-02-01 | 2013-01-29 | 적외선 센서 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9568371B2 (enExample) |
| EP (1) | EP2811271B1 (enExample) |
| JP (1) | JP5892368B2 (enExample) |
| KR (1) | KR101972196B1 (enExample) |
| CN (1) | CN104011519B (enExample) |
| IN (1) | IN2014DN05780A (enExample) |
| TW (1) | TWI568997B (enExample) |
| WO (1) | WO2013114861A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5488751B1 (ja) * | 2013-08-30 | 2014-05-14 | 富士ゼロックス株式会社 | 温度センサ、定着装置、および画像形成装置 |
| WO2017131151A1 (ja) * | 2016-01-29 | 2017-08-03 | 三菱マテリアル株式会社 | 赤外線センサ |
| JP6677925B2 (ja) * | 2016-01-29 | 2020-04-08 | 三菱マテリアル株式会社 | 赤外線センサ |
| JP6860812B2 (ja) * | 2017-01-05 | 2021-04-21 | 三菱マテリアル株式会社 | 赤外線センサ |
| CN106525270A (zh) * | 2016-11-22 | 2017-03-22 | 合肥舒实工贸有限公司 | 温度传感器 |
| CN106556470A (zh) * | 2016-11-22 | 2017-04-05 | 合肥舒实工贸有限公司 | 温度传感器 |
| JP6743737B2 (ja) * | 2017-03-24 | 2020-08-19 | 三菱マテリアル株式会社 | 赤外線センサ |
| JP6743741B2 (ja) * | 2017-03-29 | 2020-08-19 | 三菱マテリアル株式会社 | 赤外線センサ |
| JP7030420B2 (ja) * | 2017-04-10 | 2022-03-07 | 日本特殊陶業株式会社 | 保持装置 |
| EP3734242B1 (en) * | 2017-12-28 | 2023-12-13 | Murata Manufacturing Co., Ltd. | Photodetector |
| WO2019155565A1 (ja) * | 2018-02-08 | 2019-08-15 | 株式会社芝浦電子 | 赤外線温度センサ |
| JP7188436B2 (ja) | 2018-03-07 | 2022-12-13 | Tdk株式会社 | 電磁波センサ |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962854A (en) | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
| JP2002071451A (ja) | 2000-08-29 | 2002-03-08 | Sharp Corp | 熱型赤外線検出素子及びそれを用いた赤外線撮像素子 |
| JP2009180682A (ja) | 2008-01-31 | 2009-08-13 | Ritsumeikan | 赤外線センサ |
| JP2011013213A (ja) | 2009-06-02 | 2011-01-20 | Mitsubishi Materials Corp | 赤外線センサ |
| JP2011102791A (ja) | 2009-10-17 | 2011-05-26 | Mitsubishi Materials Corp | 赤外線センサ及びこれを備えた回路基板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0763585A (ja) * | 1993-08-26 | 1995-03-10 | Hokuriku Electric Ind Co Ltd | 環境センサ |
| JP3327668B2 (ja) * | 1994-03-24 | 2002-09-24 | 石塚電子株式会社 | 赤外線検出器 |
| JP3494747B2 (ja) * | 1995-03-31 | 2004-02-09 | 石塚電子株式会社 | 薄膜温度センサ及びその製造方法 |
| JPH08278192A (ja) * | 1995-04-07 | 1996-10-22 | Ishizuka Denshi Kk | 赤外線検出器 |
| JP4628540B2 (ja) | 2000-11-20 | 2011-02-09 | 石塚電子株式会社 | 赤外線温度センサ |
| JP2003194630A (ja) * | 2001-12-27 | 2003-07-09 | Ishizuka Electronics Corp | 非接触温度センサおよび非接触温度センサ用検出回路 |
| JP5079211B2 (ja) * | 2004-10-13 | 2012-11-21 | 浜松ホトニクス株式会社 | 赤外線検出装置及びその製造方法 |
| JP4483521B2 (ja) | 2004-10-21 | 2010-06-16 | Tdk株式会社 | 非接触温度センサ |
| JP5832007B2 (ja) * | 2009-12-25 | 2015-12-16 | 三菱マテリアル株式会社 | 赤外線センサ及びその製造方法 |
| JP2011220939A (ja) * | 2010-04-13 | 2011-11-04 | Panasonic Electric Works Co Ltd | 赤外線センサの製造方法 |
-
2012
- 2012-02-01 JP JP2012019431A patent/JP5892368B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-29 WO PCT/JP2013/000467 patent/WO2013114861A1/ja not_active Ceased
- 2013-01-29 IN IN5780DEN2014 patent/IN2014DN05780A/en unknown
- 2013-01-29 EP EP13743471.8A patent/EP2811271B1/en active Active
- 2013-01-29 KR KR1020147021179A patent/KR101972196B1/ko not_active Expired - Fee Related
- 2013-01-29 CN CN201380004514.8A patent/CN104011519B/zh not_active Expired - Fee Related
- 2013-01-29 US US14/375,065 patent/US9568371B2/en not_active Expired - Fee Related
- 2013-01-30 TW TW102103482A patent/TWI568997B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962854A (en) | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
| JP2002071451A (ja) | 2000-08-29 | 2002-03-08 | Sharp Corp | 熱型赤外線検出素子及びそれを用いた赤外線撮像素子 |
| JP2009180682A (ja) | 2008-01-31 | 2009-08-13 | Ritsumeikan | 赤外線センサ |
| JP2011013213A (ja) | 2009-06-02 | 2011-01-20 | Mitsubishi Materials Corp | 赤外線センサ |
| JP2011102791A (ja) | 2009-10-17 | 2011-05-26 | Mitsubishi Materials Corp | 赤外線センサ及びこれを備えた回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5892368B2 (ja) | 2016-03-23 |
| EP2811271A1 (en) | 2014-12-10 |
| TW201344166A (zh) | 2013-11-01 |
| IN2014DN05780A (enExample) | 2015-04-10 |
| KR20140128973A (ko) | 2014-11-06 |
| US20140374596A1 (en) | 2014-12-25 |
| WO2013114861A1 (ja) | 2013-08-08 |
| US9568371B2 (en) | 2017-02-14 |
| JP2013156235A (ja) | 2013-08-15 |
| CN104011519B (zh) | 2016-03-23 |
| TWI568997B (zh) | 2017-02-01 |
| CN104011519A (zh) | 2014-08-27 |
| EP2811271A4 (en) | 2015-09-30 |
| EP2811271B1 (en) | 2019-04-24 |
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| KR101972197B1 (ko) | 적외선 센서 및 적외선 센서 장치 | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
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| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
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St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20230419 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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