KR101963805B1 - Probe for micro-LED - Google Patents

Abstract

The present invention relates to a probe for a micro-LED (μ-LED), which is to minimize an area where light is emitted to be covered by a probe in a process of probing when stably probing a μ-LED. The probe comprises: a joining unit joined to a printed circuit board; an elastic unit connected to the joining unit and extending to one side with respect to the joining unit; a support unit connected to one end of the elastic unit and extending downward with respect to the elastic unit; a tip support unit formed to protrude by having reduced thickness from an outer surface of a dead-end of the support unit to multiple ends; and a tip unit formed on a lower part of the most outer end of the tip support unit to be probed to an electrode pad of a μ-LED.

Description

Probe for micro-LED < RTI ID = 0.0 >

The present invention relates to a probe for a semiconductor device, and more particularly, to a probe for a micro-LED, which can minimize the area where light is output in the process of probing a micro-LED (μ-LED) .

Recently, OLED is emerging in the display market due to commercialization of LCD, increased price volatility, and concerns over oversupply. In addition, μ-LED displays are emerging as next-generation displays, which have advantages in terms of power efficiency, flexible implementation, high resolution and long life compared to conventional displays.

μ-LEDs are theoretically compatible with low power, ultra-large, and flexible. Although μ-LEDs are similar in structure to conventional LEDs, the micro-LEDs are smaller in size than 5 to 10 μm, while the core materials of LCD and OLED are liquid crystal and organic materials, respectively. Can be used as a pixel.

μ-LEDs do not require backlighting like OLEDs, and each LED can represent red, green, and blue, and is also more flexible than conventional LEDs. Because μ-LED is inorganic rather than organic, it has long life due to its high durability and its power efficiency is 5 times higher than that of OLED due to its LED characteristics, so it has excellent power efficiency and can realize various panel sizes and shapes.

μ-LED is similar to Quantum Dot, which is regarded as a counterpart of OLED in that it uses ultra-small particles as a light emitting material, but it is evaluated as being more advantageous in terms of low power, small size and light weight.

In addition, μ-LEDs have been evaluated as a significant advancement in overall brightness, contrast, energy efficiency, and response time compared to other existing displays. In particular, VR and AR devices can be made lighter and clearer and larger And various applications such as being attracted attention in the TV and signage market are expected.

Such a μ-LED is subjected to a test process after it is manufactured. In the test process, LEDs which are not normally operated can be excluded, and a process of classifying normally operated LEDs into classes according to performance can be performed together.

In the test process for the μ-LED, there are a step of checking the electrical performance of the μ-LED and a step of checking the light emitting performance of the μ-LED.

Testing for these μ-LEDs is done through probing using a probe card. The probe card is equipped with a probe for probing the μ-LED. The tip of the probe probes the electrode pad formed on the upper surface of the μ-LED. The tip portion is formed at the center of the support portion and is supported by the support portion.

However, since the tip of the probe covers the upper surface of the μ-LED where the light is output during the probing of the electrode pad of the μ-LED, it serves as an obstacle to the inspection of the light emitting performance of the μ-LED.

Of course, when the probe is manufactured, it is desirable to form the support portion at the size of the tip portion, but in this case, the support portion may not support the tip portion. Furthermore, if the tip and the support have a small cross-sectional area and are formed to have a long cross-sectional area, a problem may occur in the process of manufacturing the tip and the support.

Korean Registered Patent No. 10-1254732 (Registered on April 03, 2013)

Accordingly, it is an object of the present invention to provide a probe for a μ-LED, which can minimize the covering of the upper surface of the μ-LED where the supporting part outputs light during probing while stably supporting the tip.

Another object of the present invention is to provide a probe for a μ-LED which is formed to have a size capable of probing an electrode pad of a μ-LED while forming a tip portion on the outermost portion of the probe.

It is still another object of the present invention to provide a probe for a μ-LED which can easily perform alignment of a probe to an electrode pad of a μ-LED.

According to an aspect of the present invention, there is provided a printed circuit board including: a bonding portion bonded to a printed circuit board; An elastic part connected to the joining part and extending to one side with respect to the joining part; A supporting portion connected to one end of the elastic portion and extending downward with respect to the elastic portion; A tip supporter formed to protrude from the outer surface of the end of the supporter while being reduced in thickness in multiple stages; And a tip portion formed on the lower end of the outermost end of the tip supporting portion and probed on the electrode pad of the μ-LED.

The tip supporting portion may be formed in two or more stages in a direction in which the elastic portion extends.

The tip supporting portion may be formed in a shape in which the front end is half-cut with respect to the rear end.

The multi-step forming the tip supporting portion may be formed in a zigzag shape.

The tip portion may protrude outward in a diagonal direction at an edge of an outermost end of the tip supporting portion.

The tip portion may have the same thickness as the outermost end of the tip supporting portion.

The tip portion may protrude downward from the outermost end of the tip supporting portion.

The tip portion may be formed thinner than the outermost end of the tip supporting portion.

The probe for μ-LED according to the present invention may further include an alignment key connected to the tip portion and protruding outward from the side of the outermost end of the tip support portion.

The tip portion may be located at a central portion with respect to the width direction of the support portion.

The supporting portion may include a first supporting portion connected to one end of the elastic portion and extending downwardly in the vertical direction with respect to the elastic portion; And a second support portion connected to the first support portion and extending outwardly in an oblique direction with respect to the first support portion, wherein the tip support portion and the tip portion are formed.

The present invention also provides a semiconductor device comprising: a junction having one side joined to a printed circuit board and extending downward; An elastic part connected at one side to the other side of the connection part and bent to one side with respect to a direction in which the connection part extends; A supporting part having one side connected to the other side of the elastic part and extending downward; A tip supporter formed to protrude from the outer surface of the end of the supporter while being reduced in thickness in multiple stages; And a tip portion formed at the lower end of the outermost end of the tip supporting portion and probed on the electrode pad of the μ-LED.

According to the present invention, the tip support portion is formed so as to protrude outwardly in multiple steps from the outer surface of the support portion, and the tip portion is protruded to the lower portion of the outermost end of the tip support portion, thereby probing the tip portion while stably supporting the tip portion In the process, it is possible to minimize the covering of the upper surface of the μ-LED in which the support outputs light.

The tip supporting portion is formed so as to protrude from the outer surface of the supporting portion while reducing the thickness thereof. The tip portion is protruded to the lower portion of the outermost end of the tip supporting portion, so that the tip portion can be probed on the electrode pad of the- Size.

It is possible to confirm the alignment tip at the upper portion of the support by using the tip portion as an alignment tip to protrude from the outermost portion of the probe or to form a separate alignment tip to protrude outwardly of the tip portion. As a result, it is possible to arrange the probe on the electrode pad of the μ-LED so that the tip of the probe can be stably probed on the electrode pad of the μ-LED through the positioning of the alignment tip. That is, since the position of the tip portion to be probed can be confirmed through the through hole formed in the printed circuit board on which the probe is mounted, the tip portion of the probe can be stably aligned and probed on the electrode pad of the μ-LED.

1 is a view showing a probe card for a μ-LED having a probe according to a first embodiment of the present invention.
FIG. 2 is a view showing a state in which the probe of FIG. 1 probes the electrode pad of the .mu.-LED.
3 is a perspective view showing a probe according to a first embodiment of the present invention.
4 is an enlarged view of a portion A in Fig.
5 is a plan view of Fig.
6 to 11 are views showing steps of a method of manufacturing a probe according to the first embodiment of the present invention.
12 is a perspective view showing a probe according to a second embodiment of the present invention.
13 is an enlarged view of a portion B in Fig.
14 is a perspective view showing a probe according to a third embodiment of the present invention.
15 is an enlarged view of a portion C in Fig.

In the following description, only parts necessary for understanding embodiments of the present invention will be described, and descriptions of other parts will be omitted to the extent that they do not disturb the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]

1 is a view showing a probe card for a μ-LED having a probe according to a first embodiment of the present invention. FIG. 2 is a view showing a state in which the probe of FIG. 1 probes the electrode pad of the .mu.-LED.

1 and 2, a probe card 100 for μ-LED according to the first embodiment includes a printed circuit board 90 and a plurality of probes 10.

The printed circuit board 90 is a circuit board for applying a bias to the μ-LED 200. The printed circuit board 90 is electrically connected to a prober through a circuit connection formed on one side and controlled. The printed circuit board 90 is formed with conductive circuit patterns that are electrically connected to the circuit connection portions formed on the top and bottom surfaces, and via holes are formed therein to connect the conductive circuit patterns. A through hole 91 is formed in the central portion of the printed circuit board 90 so as to penetrate vertically. The light emitted from the μ-LED 200 positioned under the through hole 91 passes through the through hole 91 through the through hole 91. Here, the size of the through hole 91 may be sufficient to allow the light emitted from the μ-LED 200 to pass through.

Although not shown, there is provided an apparatus for measuring the optical characteristics of the μ-LED 200 by receiving the light emitted from the μ-LED 200 on the through hole 91.

A plurality of probes 10 are installed around the through holes 91 of the printed circuit board 90 and probes the μ-LEDs 200 located under the through holes 91. At this time, one side of the probe 10 is bonded to the printed circuit board 90, and the tip portion 60 formed on the other side extends to the through hole 91.

The probe 10 according to the first embodiment includes a bonding portion 20, an elastic portion 30, a supporting portion 40, a tip supporting portion 50, and a tip portion 60. The junction 20 is bonded to the printed circuit board 90. The elastic portion 30 is connected to the joint portion 20 and extends to one side with respect to the joint portion 20. The support portion 40 is connected to one end of the elastic portion 30 and extends downward with respect to the elastic portion 30. [ The tip supporting portion 50 is formed so as to protrude from the outer surface 49 of the end of the supporting portion 40 while being reduced in thickness in multiple steps. The tip portion 60 is formed under the outermost end of the tip supporter 50 and is probed on the electrode pad 201 of the μ-LED 200.

The probe 10 may be fabricated by a MEMS (Micro Electro Mechanical Systems) process using a photolithography technique. The MEMS process is a technology process for manufacturing a micro-scale electromechanical structure by using a photolithography process. The remaining portion except for a desired shape can be micro-fabricated through a photolithography process. Through this MEMS process, a plurality of aligned probes 10 can be collectively manufactured at a time without using a conventional manual or semi-automated process.

As the material of the probe 10, a material having good electrical conductivity and flexibility, for example, a nickel alloy such as Ni-Co, Ni-Fe, Ni-W and Ni-Mn may be used.

The probe 10 according to the first embodiment has the tip supporting portion 50 formed so as to protrude in multiple stages outward with respect to the outer surface 49 of the supporting portion 40 and the distal end of the tip supporting portion 50 The tip portion 60 is formed so as to protrude downward so that the tip portion 60 is stably supported by the tip supporter 50 while the supporting portion 40 probes the upper surface of the μ- It is possible to minimize the shading.

The tip supporting portion 50 is formed so as to protrude from the outer surface 49 of the supporting portion 40 while being reduced in thickness and formed into a tip portion 60 protruding to the lower portion of the outermost end of the tip supporting portion 50 The tip portion 60 can be formed small enough to be probed on the electrode pad 201 of the μ-LED 200.

The probe 10 according to the first embodiment will now be described with reference to FIGS. 1 to 5. FIG. 3 is a perspective view showing the probe 10 according to the first embodiment of the present invention. 4 is an enlarged view of a portion A in Fig. And Fig. 5 is a plan view of Fig. 5 is a plan view of the probe 10 viewed in the -Y-axis direction in FIG.

The joint portion 20 has a shape in which one side is bonded to the printed circuit board 90 and extends downward. The bonding portion 20 is bonded to the printed circuit board 90 in the form of surface mounting or face insertion. For example, the joint portion 20 extends in the Y-axis direction. The bonding portion 20 is bonded to the lower surface of the printed circuit board 90 by way of example.

One side of the elastic part 30 is connected to the other side of the joining part 20 and is bent to one side with respect to the direction in which the joining part 20 extends. The elastic part 30 is brought into contact with the electrode pad 201 of the μ-LED 200 to provide a certain level of elasticity to the probe 10 so that the tip part 60 contacts the electrode pad 201 So that the test process can be carried out stably while applying a constant pressure. The elastic portion 30 may be formed with at least one slot in the longitudinal direction so as to provide stable elasticity. The elastic portion 30 may comprise a plurality of beams by at least one slot. For example, the elastic portion 30 extends in the X-axis direction. At least one slot and a plurality of beams may be elongated in the X-axis direction.

One side of the support portion 40 is connected to the other side of the elastic portion 30 and extends downward. The lower end of the support 40 may be formed to have a narrower width than the upper end. For example, the support portion 40 extends in the -Y-axis direction opposite to the Y-axis direction in which the joint portion 20 is formed.

The tip supporting portion 50 is formed so as to protrude from the outer surface 49 of the end of the supporting portion 40 while being reduced in thickness in multiple steps. That is, the tip supporting portion 50 is formed in two or more stages in the direction in which the elastic portion 30 extends, that is, in the X-axis direction.

Here, the tip supporter 50 is formed in a shape in which the front end is half-cut with respect to the rear end. The multistage forming the tip support 50 is formed in a zigzag shape. The reason why the tip supporting portion 50 is formed in a multi-tiered manner is that the tip portion 60 of the electrode pad 201 of the μ-LED 200 can be used for probing the electrode pad 201 of the μ- To make the tip portion 60 smaller than the size. In addition, the tip portion 60 formed at the tip of the tip supporter 50 is located at the center of the supporter 40 and can be stably supported.

The tip supporting portion 50 includes a first end 51 protruding from the outer surface 49 of the end portion of the support portion 40 in a half cut shape and a second end 51 protruding from the outer surface of the first end 51 in a heart- And a second end (53). The first end 51 and the second end 53 are formed in a zigzag shape and the second end 53 is located at a central portion in the width direction of the support portion 40.

The tip portion 60 is formed to protrude outward in the oblique direction at the outermost end of the tip supporter 50, that is, at the edge of the second end 53.

As described above, the probe 10 according to the first embodiment has the tip portion 60 formed at the outermost portion in the X-axis direction. By forming the tip portion 60 as described above, in the process of probing while the tip portion 60 is stably supported by the tip supporter 50, the supporter 40 shields the upper surface of the μ-LED 200 from which light is output Can be minimized.

Since the electrode pads 201 of the μ-LED 200 having a size of 100 μm or less have a size of 10 μm or less, the tip 60 is preferably formed to a size of 4 μm or less.

 The tip 10 of the probe 10 is viewed from the upper portion of the through hole 91 of the probe card 100 with a high magnification microscope so that the tip 10 of the probe 10 -LED (200). ≪ / RTI > That is, the probe 10 according to the first embodiment can use the tip portion 60 as an alignment key.

Since the thickness of the tip portion 60 is gradually reduced from the supporting portion 40 to the tip portion 60, it is possible to minimize the possibility of covering the upper surface of the μ-LED 200 from which the probe 10 outputs light during probing have.

The probes 10 according to the first embodiment have the elastic portions 30 so that the joint portions 20 are joined to the lower surface of the printed circuit board 90 so that the tip portions 70 can be positioned below the through holes 91. [ The supporting portion 40 and the tip supporting portion 50 are formed, but the present invention is not limited thereto. For example, the elastic portion, the support portion, and the tip support portion may be formed such that the joint portion is joined to the upper surface of the printed circuit board and the tip portion can be positioned below the through hole. That is, the elastic portion connected to the joint portion extends toward the through hole through the upper surface of the printed circuit board, and partly protrudes into the through hole. The support portion is connected to the end of the elastic portion and extends through the through hole to below the lower surface of the printed circuit board. And a tip supporting portion and a tip portion may be formed at an end of the supporting portion.

A method of manufacturing the probe 10 according to the first embodiment will now be described with reference to FIGS. 6 to 11. FIG. 6 to 11 are views showing steps of a method of manufacturing the probe 10 according to the first embodiment of the present invention.

First, as shown in FIG. 6, a photosensitive layer is coated on a base substrate 70, and exposed and developed to form a first photosensitive layer 81 having a first window 82 formed thereon. At this time, a silicon substrate may be used as the base substrate 70. At this time, the first window 82 may be formed to have a size capable of forming a first end of the tip supporting part and a part of the supporting part connected to the first end.

Next, as shown in FIG. 7, the first window 82 is filled with a metal to form a first metal layer 11. In this case, the seed metal layer may be formed before the first metal layer 11 is formed in the first window 82. The seed metal layer may be made of Ti Cu, Au, or the like, but is not limited thereto. As the material of the first metal layer 11, a nickel alloy such as Ni-Co, Ni-Fe, Ni-W, and Ni-Mn may be used.

The seed metal layer and the first metal layer 11 may be formed using a physical vapor deposition method used in a general semiconductor manufacturing process such as vapor deposition or sputtering.

Next, as shown in FIG. 8, a second photosensitive layer 83 having a second window 84 is formed on the first photosensitive layer 81. The second window 84 is partially overlapped with the first window 82. The second window 84 may have a size that can form a tip portion, a tip support portion connected to the tip portion, and a portion of the support portion connected to the tip support portion.

Next, as shown in FIG. 9, the second window 84 is filled with a metal to form a second metal layer 13. As the material of the second metal layer 13, a nickel alloy such as Ni-Co, Ni-Fe, Ni-W, or Ni-Mn may be used.

Here, a portion of the support portion connected to the tip portion 60, the tip support portion, and the tip support portion is formed through the process of forming the first and second metal layers 11 and 13.

Next, as shown in FIG. 10, after the first and second photosensitive layers are removed, a third photosensitive layer 85 having a third window 86 is formed. The third window 86 is formed of the first and second metal layers 11 and 13 and is formed in a shape capable of forming the remaining portion of the probe 10 according to the first embodiment. That is, the third window 86 is formed in a shape corresponding to the shape of the joining portion 20, the elastic portion 30, and the support portion 40. The tip portion 60 and the tip supporter 50 are covered with the third photosensitive layer 85.

Next, as shown in FIG. 11, a third metal layer 15 is formed by filling the third window 86 with a metal. As the material of the third metal layer 15, a nickel alloy such as Ni-Co, Ni-Fe, Ni-W, or Ni-Mn may be used.

By removing the third photosensitive layer 85 and the base substrate 70, the probe 10 according to the first embodiment can be obtained.

On the other hand, in the method of manufacturing the probe 10 according to the first embodiment, the example of manufacturing the probe 10 by the MEMS process using the three-step photolithography process is described. However, in the MEMS process using the three- (10).

[Second Embodiment]

On the other hand, in the first embodiment, the tip portion 60 is protruded obliquely from the edge of the second end 53, which is the outermost end of the tip supporter 50, but the present invention is not limited thereto. 12 and 13, the tip portion 60 may be formed to protrude downward from the outermost end of the tip supporter 50. As shown in FIG.

12 is a perspective view showing a probe 110 according to a second embodiment of the present invention. 13 is an enlarged view of a portion B in Fig.

12 and 13, a probe 110 according to the second embodiment includes a bonding portion 20, an elastic portion 30, a supporting portion 40, a tip supporting portion 50 and a tip portion 60, And further includes an alignment tip (69). The junction 20 is bonded to the printed circuit board 90. The elastic portion 30 is connected to the joint portion 20 and extends to one side with respect to the joint portion 20. The support portion 40 is connected to one end of the elastic portion 30 and extends downward with respect to the elastic portion 30. [ The tip supporting portion 50 is formed so as to protrude from the outer surface 49 of the end of the supporting portion 40 while being reduced in thickness in multiple steps. The tip portion 60 is formed under the outermost end of the tip supporter 50 and is probed on the electrode pad 201 of the μ-LED 200.

At this time, the tip portion 60 is formed to protrude downward from the outermost end of the tip supporting portion 50, that is, the second end 53. The tip portion 60 may be formed to be thinner than the second end 53 of the tip support portion 50.

The alignment tip 69 is connected to the tip portion 60 and is formed to protrude outward from the outer surface 49 of the second end 53 of the tip support portion 50. Since the tip portion 60 according to the second embodiment is formed so as to protrude below the second end 53 of the tip supporting portion 50, an alignment tip 69 is separately provided. The position of the tip portion 60 at the upper portion of the probe 110 can not be precisely confirmed because the tip portion 60 is covered by the tip supporter 50 in the absence of the alignment tip. Therefore, by forming the alignment tips 69 so as to protrude outward of the tip portion 60, the position of the tip portion 60 can be accurately confirmed.

As described above, the probe 110 according to the second embodiment can identify the alignment tip 69 at the upper portion of the support portion 40 by forming the alignment tip 69 so as to protrude outwardly of the tip portion 60. LED 200 can be stably probed at the electrode pad 201 of the μ-LED 200 by stably positioning the tip 60 of the probe 110 through the alignment of the alignment tips 69. Therefore, The probes 110 can be aligned on the substrate 201. The positions of the tip portions 60 of the probes 110 to be probed are confirmed by checking the positions of the alignment tips 69 through the through holes 91 formed in the printed circuit board 90 on which the probes 110 are installed The tip portion 60 of the probe 110 can be stably aligned and probed on the electrode pad 201 of the μ-LED 200.

[Third Embodiment]

On the other hand, in the first embodiment, the example in which the support portion 40 is linearly formed in the -Y-axis direction is described, but the present invention is not limited to this. For example, as shown in FIGS. 14 and 15, the lower end of the support portion 40 may be formed so as to protrude obliquely.

14 is a perspective view showing a probe 210 according to a third embodiment of the present invention. 15 is an enlarged view of a portion C in Fig.

14 and 15, the probe 210 according to the third embodiment includes a bonding portion 20, an elastic portion 30, a supporting portion 40, a tip supporting portion 50, and a tip portion 60. [ The junction 20 is bonded to the printed circuit board 90. The elastic portion 30 is connected to the joint portion 20 and extends to one side with respect to the joint portion 20. The support portion 40 is connected to one end of the elastic portion 30 and extends downward with respect to the elastic portion 30. [ The tip supporting portion 50 is formed so as to protrude from the outer surface 49 of the end of the supporting portion 40 while being reduced in thickness in multiple steps. The tip portion 60 is formed under the outermost end of the tip supporter 50 and is probed on the electrode pad 201 of the μ-LED 200.

At this time, the support portion 40 may include a first support portion 41 and a second support portion 43. The first support portion 41 is connected to one end of the elastic portion 30 and extends downward to the elastic portion 30 in the vertical direction, that is, in the -Y axis direction. The second support portion 43 is connected to the first support portion 41 and extends outwardly in a diagonal direction with respect to the first support portion 41 and a tip support portion 50 and a tip portion 60 are formed.

The tip supporting portion 50 is formed to protrude from the outer surface 49 of the end of the second supporting portion 43 while being reduced in thickness in multiple steps. In the third embodiment, the tip supporting portion 50 is formed in two stages.

The tip portion 60 is formed to protrude downward from the second end 53 of the tip supporter 50, and is formed to protrude in a diagonal direction. The tip portion 60 may be formed to be thinner than the outermost end of the tip supporting portion 50.

As described above, since the probe 210 according to the third embodiment has the tip portion 60 at the outermost position in the X-axis direction, the same effect as that of the probe according to the first embodiment (10 in FIG. 3) can be expected.

That is, by forming the tip portion 60 so as to protrude to the outermost portion of the probe 210, the probes 210 can stably support the tip portion 60 with the tip supporter 50, It is possible to minimize the covering of the upper surface of the substrate 200.

 The tip 210 of the probe 210 is viewed from the top of the through hole 91 of the probe card 100 with a high magnification microscope while the probe 210 has the tip portion 60 at the outermost position in the X- -LED (200). ≪ / RTI > That is, the probe 210 according to the third embodiment can use the tip portion 60 as an alignment key.

The probes 210 can minimize the clogging of the upper surface of the μ-LED 200 from which the light is output in the probing process because the thickness of the probes 210 is gradually reduced from the support 40 to the tips 60. [ have.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10, 110, 210: probes
20:
30:
40: Support
41: first supporting part
43: second support portion
49: Outer side
50: tip support
51: First stage
53: second stage
60: Tip
69: Sort key
70: Base substrate
81, 83, 85:
82,84,86: Windows
90: printed circuit board
91: Through hole
100: Probe card
200: μ-LED
201: Electrode pad

Claims (12)

A junction bonded to a printed circuit board;
An elastic part connected to the joining part and extending to one side with respect to the joining part;
A supporting portion connected to one end of the elastic portion and extending downward with respect to the elastic portion;
A tip supporting part formed to protrude in a direction in which the elastic part extends in an outer side of an end of the supporting part, And
A tip portion formed at the bottom of the outermost end of the tip supporting portion and probed on the electrode pad of the LED;
And a probe for a μ-LED. The method according to claim 1,
Wherein the tip supporting portion is formed in two or more stages in a direction in which the elastic portion extends. 3. The method of claim 2,
Wherein the tip supporting portion is formed in a shape in which the front end is half-cut with respect to the rear end. The method of claim 3,
And the multi-step forming the tip supporting portion is formed in a zigzag shape. 3. The method of claim 2,
Wherein the tip portion protrudes outward in an oblique direction at an edge of an outermost end of the tip supporting portion. 6. The method of claim 5,
And the tip portion has the same thickness as the outermost end of the tip supporting portion. 3. The method of claim 2,
And the tip portion protrudes downward from the outermost end of the tip supporting portion. 8. The method of claim 7,
And the tip portion is thinner than the outermost end of the tip supporting portion. 9. The method of claim 8,
An alignment key connected to the tip portion and protruding outward from the side of the outermost end of the tip support portion;
Further comprising: a probe for a μ-LED. The method according to claim 1,
And the tip portion is located at a central portion with respect to the width direction of the support portion. The apparatus according to claim 1,
A first support portion connected to one end of the elastic portion and extending in a downward direction with respect to the elastic portion; And
A second support portion connected to the first support portion and extending outwardly in a diagonal direction with respect to the first support portion, the tip support portion and the tip portion being formed;
And a probe for a μ-LED. A junction having one side joined to the printed circuit board and extending downward;
An elastic part connected at one side to the other side of the connection part and bent to one side with respect to a direction in which the connection part extends;
A supporting part having one side connected to the other side of the elastic part and extending downward;
A tip supporting part formed to protrude in a direction in which the elastic part extends in an outer side of an end of the supporting part, And
A tip portion formed at the lower end of the outermost end of the tip supporting portion and probed on the electrode pad of the μ-LED;
And a probe for a μ-LED.

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