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JPH02221881A - Probe for testing integrated circuit device - Google Patents

Probe for testing integrated circuit device

Info

Publication number
JPH02221881A
JPH02221881A JP4112189A JP4112189A JPH02221881A JP H02221881 A JPH02221881 A JP H02221881A JP 4112189 A JP4112189 A JP 4112189A JP 4112189 A JP4112189 A JP 4112189A JP H02221881 A JPH02221881 A JP H02221881A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
conductive
connection
projections
conductors
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4112189A
Inventor
Hidetoshi Fujimoto
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To test a semiconductor chip for an integrated circuit device where connection points are arrayed at narrow pitch by providing conductive projections at the tip parts of respective connecting conductors in an arrangement corresponding to connection points on the integrated circuit device as contacts for testing.
CONSTITUTION: The probe 10 is constituted by utilizing a printed wiring board. An insulating substrate for a wiring board is utilized as the substrate 11. Thin sheets of different metal, i.e. copper and are used for connection conductors 12 and conductive projections 13 and the composite metallic sheet formed by sticking both the sheets is stuck or adhered on the substrate 11. Then the composite metallic sheet is photoetched in stripes including the connection conductors 12 and conductive projections 13. Then a photoresist film is formed in a pattern surrounding the range wherein the conductive projections 13 are arrayed and used as a mask to remove the upper metal in the composite sheet which is formed in the stripes for the connection conductors 12 by using an etchant having selectivity to the lower metal, thereby forming the respective conductive projections 13.
COPYRIGHT: (C)1990,JPO&Japio
JP4112189A 1989-02-21 1989-02-21 Probe for testing integrated circuit device Granted JPH02221881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4112189A JPH02221881A (en) 1989-02-21 1989-02-21 Probe for testing integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4112189A JPH02221881A (en) 1989-02-21 1989-02-21 Probe for testing integrated circuit device

Publications (1)

Publication Number Publication Date
JPH02221881A true true JPH02221881A (en) 1990-09-04

Family

ID=12599620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4112189A Granted JPH02221881A (en) 1989-02-21 1989-02-21 Probe for testing integrated circuit device

Country Status (1)

Country Link
JP (1) JPH02221881A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307392B1 (en) 1997-10-28 2001-10-23 Nec Corporation Probe card and method of forming a probe card
WO2003071289A1 (en) * 2002-02-19 2003-08-28 Advantest Corporation Contact structure having silicon finger contactor
US6727580B1 (en) 1993-11-16 2004-04-27 Formfactor, Inc. Microelectronic spring contact elements
JP2007183250A (en) * 2005-12-06 2007-07-19 Enplas Corp Probe chip and probe card
US7579269B2 (en) 1993-11-16 2009-08-25 Formfactor, Inc. Microelectronic spring contact elements
JP2010002184A (en) * 2008-06-18 2010-01-07 Japan Electronic Materials Corp Contact probe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727580B1 (en) 1993-11-16 2004-04-27 Formfactor, Inc. Microelectronic spring contact elements
US7579269B2 (en) 1993-11-16 2009-08-25 Formfactor, Inc. Microelectronic spring contact elements
US6307392B1 (en) 1997-10-28 2001-10-23 Nec Corporation Probe card and method of forming a probe card
WO2003071289A1 (en) * 2002-02-19 2003-08-28 Advantest Corporation Contact structure having silicon finger contactor
JP2007183250A (en) * 2005-12-06 2007-07-19 Enplas Corp Probe chip and probe card
JP2010002184A (en) * 2008-06-18 2010-01-07 Japan Electronic Materials Corp Contact probe

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