KR102647469B1 - Micro LED inspection device - Google Patents
Micro LED inspection device Download PDFInfo
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- KR102647469B1 KR102647469B1 KR1020210167153A KR20210167153A KR102647469B1 KR 102647469 B1 KR102647469 B1 KR 102647469B1 KR 1020210167153 A KR1020210167153 A KR 1020210167153A KR 20210167153 A KR20210167153 A KR 20210167153A KR 102647469 B1 KR102647469 B1 KR 102647469B1
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- probe
- probe member
- vertical
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- soldering
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- 238000007689 inspection Methods 0.000 title claims abstract description 31
- 239000000523 sample Substances 0.000 claims abstract description 74
- 238000005476 soldering Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2844—Fault-finding or characterising using test interfaces, e.g. adapters, test boxes, switches, PIN drivers
Abstract
본 발명은 가로×세로가 15㎛×5㎛인 R,G,B(Red, Green, Blue) 독립방식의 마이크로 LED를 검사하기 위하여 3㎛ 크기의 탐침을 갖는 탐침부재를 MEMS공정으로 구현하되 상기 탐침부재를 2단으로 제작하여 두꺼운 1단에 3㎛의 얇은 2단을 포개는 방식으로 구성하고 상기 탐침부재를 검사장비와 연결되는 회로기판에 납땜부를 이용하여 납땜함으로써, 초소형의 싱글방식 마이크로 LED 검사가 가능하고 또한 3㎛의 탐침이 2단으로 제작되어서 내구성이 향상되는 마이크로 LED 검사장치에 관한 것이다.
이를 위하여 본 발명은 R,G,B들이 독립적으로 구성되어 접촉부 3㎛인 싱글방식의 마이크로 LED가 무수히 많이 형성된 웨이퍼를 직접 검사하기 위하여 27㎛ 두께의 1단에 3㎛ 두께의 2단을 동일형상으로 접착하되 상기 2단의 일부를 돌출시켜 두께 3㎛의 탐침을 갖는 탐침부재를 형성하고; 상기 탐침을 제외하고 상기 탐침부재를 수용하는 케이스부가 구비되며; 상기 케이스부의 개방된 양측에 결합되어서 상기 탐침부재를 보호하는 덮개부가 구비되고; 상기 탐침부재, 케이스부 및 덮개부를 관통하여 회로적으로 연결된 하나의 조립체로 만드는 수평납땜부 및 수직납땜부들이 구비되며; 상기 조립체는 검사장비와 연결된 회로기판의 밑면에 놓이고, 상기 회로기판의 단자와 상기 수평납땜부 및 수직납땜부들이 납땜되는 특징이 있다.The present invention implements a probe member with a probe of 3㎛ in size using a MEMS process to inspect a R, G, B (Red, Green, Blue) independent micro LED with a width × height of 15㎛ × 5㎛. By manufacturing the probe member in two stages and stacking the second thick stage with two thin stages of 3㎛, and soldering the probe member to the circuit board connected to the inspection equipment using a soldering part, an ultra-small single-type micro LED is produced. It is about a micro LED inspection device that enables inspection and has improved durability by producing a 3㎛ probe in two stages.
For this purpose, the present invention is to directly inspect a wafer on which countless single-type micro LEDs with R, G, and B independently configured and a contact area of 3 ㎛ are formed, by forming a 27 ㎛ thick first stage and a 3 ㎛ thick second stage of the same shape. adhering, but protruding part of the second stage to form a probe member having a probe with a thickness of 3㎛; A case portion accommodating the probe member, excluding the probe, is provided; a cover part coupled to both open sides of the case part to protect the probe member; Horizontal soldering portions and vertical soldering portions are provided to form a single assembly that is circuitically connected through the probe member, case portion, and cover portion; The assembly is placed on the bottom of a circuit board connected to the inspection equipment, and the terminals of the circuit board are soldered to the horizontal solder portion and the vertical solder portion.
Description
본 발명은 마이크로 LED 검사장치에 관한 것으로서, 더욱 상세하게는 가로×세로가 15㎛×5㎛인 R,G,B(Red, Green, Blue) 독립방식의 마이크로 LED를 검사하기 위하여 3㎛ 크기의 탐침을 갖는 탐침부재를 MEMS공정으로 구현하되 상기 탐침부재를 2단으로 제작하여 두꺼운 1단에 3㎛의 얇은 2단을 포개는 방식으로 구성하고 상기 탐침부재를 검사장비와 연결되는 회로기판에 납땜부를 이용하여 납땜함으로써, 초소형의 싱글방식 마이크로 LED 검사가 가능하고 또한 3㎛의 탐침이 2단으로 제작되어서 내구성이 향상되는 마이크로 LED 검사장치에 관한 것이다.The present invention relates to a micro LED inspection device, and more specifically, to inspect an R, G, B (Red, Green, Blue) independent micro LED with a width of 15 ㎛ × 5 ㎛, a 3 ㎛ sized micro LED. A probe member with a probe is implemented using the MEMS process, and the probe member is manufactured in two stages by superimposing two thin stages of 3㎛ on a thick stage, and the probe member is soldered to a circuit board connected to the inspection equipment. This relates to a micro LED inspection device that enables ultra-small single-type micro LED inspection by soldering using a part and improves durability by manufacturing a 3㎛ probe in two stages.
최근 OLED 단점을 극복하고 액정 디스플레이와 비교할 수 없는 높은 성능을 제공하는 마이크로 LED 디스플레이가 상용화될 예정인데, 이러한 마이크로 LED는 기존에 사용되던 LED 칩의 1/10 수준인 100㎛이하의 크기를 가지는 것으로 이를 이용하여 자체발광의 디스플레이를 구현할 수 있다. 이러한 마이크로 LED 디스플레이는 백색 LED 백라이트를 이용하는 기존 액정 디스플레이에 비해 R,G,B 색상의 마이크로 LED가 독립 구동 방식으로 자체 발광하므로 명암비, 반응속도, 시야각, 밝기, 한계 해상도 및 수명 등에서도 월등할 것으로 기대되고 있다.Recently, micro LED displays that overcome the shortcomings of OLED and provide high performance incomparable to liquid crystal displays are scheduled to be commercialized. These micro LEDs are expected to have a size of less than 100㎛, which is 1/10th of the size of the existing LED chips. Using this, a self-luminous display can be implemented. Compared to existing liquid crystal displays that use white LED backlights, these micro LED displays are expected to be superior in terms of contrast ratio, response speed, viewing angle, brightness, limit resolution, and lifespan because micro LEDs in R, G, and B colors emit their own light in an independent driving manner. I'm looking forward to it.
다만 이러한 마이크로 LED는 아직까지 생산 단가가 매우 높은데 초소형 크기의 LED 품질을 측정하여 불량품을 선별한 후 이들을 적절히 디스플레이 매트릭스에 배열하는 과정이 어렵고 복잡하기 때문이다. 특히 웨이퍼에서 생산된 칩 상태에서 각 마이크로 LED의 전기적 특성과 광학적 특성 및 각종 온도에 따른 특성까지 모두 측정하는 품질검사 과정이 복잡하며, 이를 통해 개별 마이크로 LED에 대한 복합적 특성을 모두 고려하여 디스플레이 기판에 전사해야 하므로 그 구현이 복잡하고 어렵다.However, the production cost of these micro LEDs is still very high because the process of measuring the quality of ultra-small LEDs, selecting defective products, and then arranging them appropriately in the display matrix is difficult and complicated. In particular, the quality inspection process is complex, measuring all the electrical and optical characteristics of each micro LED and various temperature-dependent characteristics in the chip state produced from the wafer. Through this, the complex characteristics of each individual micro LED are taken into consideration and the display substrate Since it must be transcribed, its implementation is complex and difficult.
종래 특허 제2318507호는 마이크로 LED 패키지 검사장치를 제안한 바 있다. 이는 복수 개의 능동형 매트릭스(Active Matrix, AM) 구동용 마이크로 LED 유닛을 패키지 단위별로 절단하여 생성된마이크로 LED 패키지가 로딩되는 스테이지; 상기 스테이지의 상부에 설치되어 상기 복수 개의 마이크로 LED 유닛의 패드들에 각각 대응되면서 각각의 마이크로 LED 유닛과 마주하도록 배치되고, 각 마이크로 LED 유닛의 패드에 접촉되는 스테이션; 상기 스테이션의 일측에 설치되어 외부의 제어 명령에 따라 상기 복수 개의 프로브에 상기 마이크로 LED 유닛을 구동시키기 위한 전기적 신호를 전송하는 AM 구동 드라이버; 상기 스테이지의 하부에 설치되어 상기 마이크로 LED 유닛의 구동에 의해 발생되는 빛을 수광하여 광도를 측정하는 측정유닛; 및 상기 측정 유닛에 의해 측정된 광도가 기설정된 정상 범위에 포함되는지를 확인하여 픽셀별 불량/양품을 평가하는 검사 장비로 구성된다.Previous patent No. 2318507 proposed a micro LED package inspection device. This is a stage where a micro LED package generated by cutting a plurality of active matrix (AM) driving micro LED units for each package is loaded; a station installed on the upper part of the stage, corresponding to pads of the plurality of micro LED units and facing each micro LED unit, and contacting the pads of each micro LED unit; an AM driving driver installed on one side of the station and transmitting an electrical signal for driving the micro LED unit to the plurality of probes according to an external control command; A measurement unit installed at the bottom of the stage to measure light intensity by receiving light generated by driving the micro LED unit; and inspection equipment that evaluates defective/defective products for each pixel by checking whether the luminance measured by the measurement unit is within a preset normal range.
그러나 종래 특허는 웨이퍼에 형성된 마이크로 LED를 직접 검사하지 않고 마이크로 LED 유닛을 패키지 단위별로 절단하여 마이크로 LED 패키지를 생성하고, 생성된 마이크로 LED 패키지가 로딩되는 스테이지를 구현해야 되므로 웨이퍼의 절단 및 스테이지의 형성에 따른 제조공정이 추가되어 검사장치가 복잡해지는 단점이 있었다. 또한 종래 특허는 R,G,B(Red, Green, Blue)가 하나의 단일칩에 형성되는 방식이기 때문에 R,G,B(Red, Green, Blue)가 분리된 독립방식의 마이크로 LED를 검사할 수 없는 등의 단점이 있었다.However, the conventional patent does not directly inspect the micro LED formed on the wafer, but cuts the micro LED unit by package to create a micro LED package, and a stage on which the generated micro LED package is loaded must be implemented, so cutting the wafer and forming a stage are required. There was a disadvantage in that the inspection device became complicated due to the additional manufacturing process. In addition, since the conventional patent is a method in which R, G, B (Red, Green, Blue) are formed on a single chip, it is possible to inspect an independent micro LED with R, G, B (Red, Green, Blue) separated. There were disadvantages such as not being able to use it.
본 발명은 종래의 문제점을 감안하여 개발한 것으로서, 본 발명의 목적은 가로×세로가 15㎛×5㎛인 R,G,B(Red, Green, Blue) 독립방식의 마이크로 LED를 검사하기 위하여 3㎛ 크기의 탐침을 갖는 탐침부재를 MEMS공정으로 구현하되 상기 탐침부재를 2단으로 제작하여 두꺼운 1단에 3㎛의 얇은 2단을 포개는 방식으로 구성하고 상기 탐침부재를 검사장비와 연결되는 회로기판에 납땜부를 이용하여 납땜함으로써, 초소형의 싱글방식 마이크로 LED 검사가 가능하고 또한 3㎛의 탐침이 2단으로 제작되어서 내구성이 향상되는 마이크로 LED 검사장치를 제공함에 있다.The present invention was developed in consideration of conventional problems, and the purpose of the present invention is to inspect R, G, B (Red, Green, Blue) independent micro LEDs with a width × height of 15㎛ × 5㎛. A probe member with a ㎛-sized probe is implemented using the MEMS process, but the probe member is manufactured in two stages, and the thick 1st stage is overlapped with the 2 thin stages of 3㎛, and the probe member is connected to the inspection equipment. By soldering the board using a soldering part, ultra-small single-type micro LED inspection is possible, and the 3㎛ probe is manufactured in two stages to provide a micro LED inspection device with improved durability.
이를 위하여 본 발명은 R,G,B들이 독립적으로 구성되어 접촉부 3㎛인 싱글방식의 마이크로 LED가 무수히 많이 형성된 웨이퍼를 직접 검사하기 위하여 27㎛ 두께의 1단에 3㎛ 두께의 2단을 동일형상으로 접착하되 상기 2단의 일부를 돌출시켜 두께 3㎛의 탐침을 갖는 탐침부재를 형성하고; 상기 탐침을 제외하고 상기 탐침부재를 수용하는 케이스부가 구비되며; 상기 케이스부의 개방된 양측에 결합되어서 상기 탐침부재를 보호하는 덮개부가 구비되고; 상기 탐침부재, 케이스부 및 덮개부를 관통하여 회로적으로 연결된 하나의 조립체로 만드는 수평납땜부 및 수직납땜부들이 구비되며; 상기 조립체는 검사장비와 연결된 회로기판의 밑면에 놓이고, 상기 회로기판의 단자와 상기 수평납땜부 및 수직납땜부들이 납땜되는 특징이 있다.For this purpose, the present invention is to directly inspect a wafer on which countless single-type micro LEDs with R, G, and B independently configured and a contact area of 3 ㎛ are formed, by forming a 27 ㎛ thick first stage and a 3 ㎛ thick second stage of the same shape. adhering, but protruding part of the second stage to form a probe member having a probe with a thickness of 3㎛; A case portion accommodating the probe member, excluding the probe, is provided; a cover part coupled to both open sides of the case part to protect the probe member; Horizontal soldering portions and vertical soldering portions are provided to form a single assembly that is circuitically connected through the probe member, case portion, and cover portion; The assembly is placed on the bottom of a circuit board connected to the inspection equipment, and the terminals of the circuit board are soldered to the horizontal solder portion and the vertical solder portion.
본 발명에 따르면 탐침부재는 MEMS공정을 통하여 27㎛의 1단에 3㎛의 2단을 형성하는 방식으로 제작되는데, 이때 2단의 일부를 1단에서 돌출시켜 3㎛의 두께를 갖는 탐침이 제작된다. 따라서 가로×세로가 15㎛×5㎛이고 접촉부가 3㎛ 정도 되는 R,G,B(Red, Green, Blue) 독립방식의 마이크로 LED를 검사할 수 있으며, 특히 탐침부재는 1단의 두께가 2단보다 크기 때문에 반복사용하더라도 충분한 내구성을 갖는다.According to the present invention, the probe member is manufactured through a MEMS process by forming a first stage of 27㎛ and a second stage of 3㎛. At this time, a portion of the second stage protrudes from the first stage to produce a probe with a thickness of 3㎛. do. Therefore, it is possible to inspect R, G, B (Red, Green, Blue) independent micro LEDs with a width of 15㎛ × 5㎛ and a contact area of about 3㎛. In particular, the thickness of the first stage of the probe member is 2. Because it is larger than a single piece, it has sufficient durability even when used repeatedly.
또한 탐침부재는 검사장비와 통하는 회로기판에 수평납땜부 및 수직납땜부를 통하여 납땜되므로 자세가 틀어지지 않으며, 마이크로 LED를 웨이퍼 상에서 직접 콘텍트할 수 있기 때문에 웨이퍼를 절단할 필요가 없으며, 또한 절단된 웨이퍼를 고정시키는 별도 스테이지가 불필요한 등의 이점이 있다.In addition, the probe member is soldered to the circuit board connected to the inspection equipment through horizontal soldering and vertical soldering, so its posture does not change. Since the micro LED can be contacted directly on the wafer, there is no need to cut the wafer, and the cut wafer There are advantages such as no need for a separate stage to fix the .
도 1은 본 발명 한 실시예의 마이크로 LED가 형성된 웨이퍼의 예시도
도 2는 본 발명 한 실시예의 검사장치의 분리 사시도
도 3은 본 발명 한 실시예의 검사장치의 탐침부재의 분리사시도
도 4는 본 발명 한 실시예의 검사장치의 조립 사시도
도 5는 본 발명 한 실시예의 검사장치의 단면도1 is an illustration of a wafer on which micro LEDs according to an embodiment of the present invention are formed.
Figure 2 is an exploded perspective view of an inspection device according to an embodiment of the present invention.
Figure 3 is an exploded perspective view of the probe member of the inspection device of one embodiment of the present invention.
Figure 4 is an assembled perspective view of the inspection device of one embodiment of the present invention.
5 is a cross-sectional view of an inspection device according to an embodiment of the present invention.
도 1 내지 도 5에서 본 발명 한 실시예의 검사장치는 R,G,B가 독립된 싱글 방식의 마이크로 LED(2)를 직접 콘택트하기 위한 탐침부재(10), 상기 탐침부재(10)를 수용하는 케이스부(20), 상기 케이스부(20)의 개방된 양쪽을 덮는 한쌍의 덮개부(30) 및 상기 탐침부재(10), 케이스부(20) 및 덮개부(30)를 회로기판(50)에 회로적으로 연결하는 수평납땜부(40) 및 수직납땜부(41)들이 MEMS 공정을 통하여 형성된다. 상기 탐침부재(10)는 MEMS공정을 통하여 형태가 동일한 1단(11) 및 2단(12)으로 구성되는데 1단(11)은 27㎛ 두께로 형성되고, 2단(12)은 3㎛ 두께로 형성된다. 상기 2단(12)은 1단(11)에서 하향으로 7㎛ 돌출된 탐침(13)을 갖는다. 상기 탐침(13)은 2단(12)에 형성되므로 두께 3㎛로 구성되는데, 이는 가로×세로가 15㎛×5㎛이고 접촉부가 3㎛ 정도 되는 R,G,B(Red, Green, Blue) 독립방식의 마이크로 LED를 검사할때 사용된다.1 to 5, the inspection device of one embodiment of the present invention includes a probe member 10 for directly contacting a single micro LED 2 with independent R, G, and B, and a case for accommodating the probe member 10. part 20, a pair of cover parts 30 covering both open sides of the case part 20, and the probe member 10, case part 20, and cover part 30 on the circuit board 50. Horizontal solder portions 40 and vertical solder portions 41 that are connected in a circuit manner are formed through a MEMS process. The probe member 10 is composed of a first stage 11 and a second stage 12 of the same shape through a MEMS process. The first stage 11 is formed with a thickness of 27㎛, and the second stage 12 is formed with a thickness of 3㎛. is formed by The second stage (12) has a probe (13) that protrudes downward by 7㎛ from the first stage (11). Since the probe 13 is formed in the second stage 12, it is composed of a thickness of 3㎛, which is R, G, B (Red, Green, Blue) with a width × height of 15㎛ × 5㎛ and a contact area of about 3㎛. It is used when inspecting independent micro LED.
상기 탐침부재(10)는 상기 수평납땜부(40)가 관통되는 수평구멍(15)이 상부에 형성되고, 양쪽에는 원호형의 끼움홈(14)이 잘록하게 형성된다. 그리고 상기 탐침(13)은 다수의 절개홈을 갖는 탄성부(16) 끝단에 형성되어서 LED와 접촉시 탄성복원력을 가지며 접촉성이 향상된다.The probe member 10 has a horizontal hole 15 formed at the top through which the horizontal soldering part 40 passes, and arc-shaped fitting grooves 14 are formed on both sides. In addition, the probe 13 is formed at the end of the elastic part 16 having a plurality of cut grooves, so that it has elastic recovery force and improves contact properties when in contact with the LED.
상기 케이스부(20)는 상기 탐침부재(10)가 끼워지는 탐침자리(21)가 중앙에 관통 형성되고, 양측에는 상기 수직납땜부(41)가 각각 끼워지는 수직구멍(23)이 형성되며, 상기 탐침자리(21)의 내주면 양측에는 상기 탐침부재(10)의 끼움홈(14)에 들어가는 원호형의 끼움구(22)가 형성된다.The case portion 20 has a probe seat 21 into which the probe member 10 is inserted through the center, and vertical holes 23 into which the vertical soldering portions 41 are respectively inserted are formed on both sides, Arc-shaped fitting holes 22 that fit into the fitting grooves 14 of the probe member 10 are formed on both sides of the inner peripheral surface of the probe seat 21.
상기 덮개부(30)는 상기 케이스부(20)의 양측에 구비되어서 상기 탐침자리(21)에 놓인 탐침부재(10)를 가려주는 역할을 하며, 상부에는 상기 탐침부재(10)의 수평구멍(15)과 일치되는 수평구멍(31)이 천공되고, 양측에는 상기 케이스부(20)의 수직구멍(23)과 일치되는 수직구멍(32)이 천공된다. 그리고 상기 각 수평구멍(15)(31) 및 수직구멍(23)(32)으로 끼워지는 수평납땜부(40) 및 수직납땜부(41)는 각 덮개부(30)의 양측으로 돌출된 뒤 회로기판(50)의 밑면에 형성된 단자에 납땜(52)된다. 상기 탐침부재(10), 케이스부(20) 및 덮개부(30)는 포개진 상태에서 상기 회로기판(50)에 형성된 체결구멍(51)에 상단부가 끼워지며 이때 상기 수평납땜부(40)는 회로기판(50)의 밑면에 닿아 단자와 회로적으로 접촉된 뒤 납땜(52)된다.The cover part 30 is provided on both sides of the case part 20 and serves to cover the probe member 10 placed on the probe seat 21, and has a horizontal hole of the probe member 10 at the top ( A horizontal hole 31 corresponding to 15) is drilled, and vertical holes 32 matching the vertical holes 23 of the case portion 20 are drilled on both sides. And the horizontal soldering portion 40 and the vertical soldering portion 41 inserted into each of the horizontal holes 15, 31 and the vertical holes 23, 32 protrude on both sides of each cover portion 30, and the back circuit It is soldered (52) to a terminal formed on the bottom of the board (50). The probe member 10, case part 20, and cover part 30 are overlapped and their upper ends are inserted into the fastening hole 51 formed in the circuit board 50, and at this time, the horizontal soldering part 40 is It touches the bottom of the circuit board 50, makes circuit contact with the terminal, and then is soldered (52).
이처럼 구성된 본 발명 한 실시예는 웨이퍼(1)에 형성된 무수히 많은 마이크로 LED(2)가 디스플레이에 전사되기 전에 상기 검사장치를 통하여 선별된다. 상기 회로기판(20)은 검사장치와 회로적으로 연결되고, 상기 회로기판(20)은 수평납땜부(40) 및 수직납땜부(41)를 통하여 탐침부재(10)와 회로적으로 연결된다. 따라서 상기 검사장치에서 각종 검사신호를 보내면 상기 마이크로 LED(2) 구동에 의해 발생되는 R,G,B LED 소자의 빛을 통하여 광발광 및 전기발광 등의 광도를 측정할 수 있다.In one embodiment of the present invention configured in this way, countless micro LEDs 2 formed on the wafer 1 are selected through the inspection device before being transferred to the display. The circuit board 20 is connected in a circuit with the inspection device, and the circuit board 20 is connected in a circuit with the probe member 10 through the horizontal soldering part 40 and the vertical soldering part 41. Therefore, when various inspection signals are sent from the inspection device, the luminous intensity such as photoluminescence and electroluminescence can be measured through the light of the R, G, and B LED elements generated by driving the micro LED (2).
이러한 본 발명 한 실시예의 조립과정은 다음과 같다. 먼저 1단(11)과 2단(12)이 동일 형태가 되도록 MEMS공정을 통하여 탐침부재(10)가 형성된다. 이때 2단(12)은 1단(11)에서 7㎛ 돌출되게 탐침(13)이 형성된다. 이후 상기 탐침부재(10)는 케이스부(20)의 탐침자리(21)에 끼워지는데, 이때 끼움홈(14)이 끼움구(22)로 끼워져 상하측 및 좌우측으로 움직이지 않고 고정된다. 이후 상기 케이스부(20) 양측에 덮개부(30)가 놓이면 상기 덮개부(30)의 수직구멍(32)과 케이스부(20)의 수직구멍(23)이 일치되고, 상기 덮개부(30)의 수평구멍(31)과 탐침부재(10)의 수평구멍(15)이 일치된다.The assembly process of this embodiment of the present invention is as follows. First, the probe member 10 is formed through a MEMS process so that the first stage 11 and the second stage 12 have the same shape. At this time, the probe 13 of the second stage 12 is formed to protrude 7㎛ from the first stage 11. Thereafter, the probe member 10 is inserted into the probe seat 21 of the case portion 20. At this time, the fitting groove 14 is inserted into the fitting hole 22 and is fixed without moving up and down and left and right. Afterwards, when the cover part 30 is placed on both sides of the case part 20, the vertical hole 32 of the cover part 30 and the vertical hole 23 of the case part 20 coincide, and the cover part 30 The horizontal hole 31 of and the horizontal hole 15 of the probe member 10 coincide.
따라서 상기 수직구멍(23)(32) 및 수평구멍(15)(31)으로 수직납땜부(41) 및 수평납땜부(40)를 끼우면 이들 탐침부재(10), 케이스부(20) 및 덮개부(30)가 수직납땜부(41) 및 수평납땜부(40)들과 회로적으로 접촉된다. 이후 조립된 탐침부재(10), 케이스부(20) 및 덮개부(30)를 회로기판(50)의 체결구멍(51)에 끼우고 수평납땜부(40) 및 수직납땜부(41)를 납땜(52)하면 회로기판(50)의 단자들이 수평납땜부(40) 및 수직납땜부(41)를 통하여 탐침부재(10)와 회로적으로 연결된다.Therefore, when the vertical soldering portion 41 and the horizontal soldering portion 40 are inserted into the vertical holes 23 and 32 and the horizontal holes 15 and 31, the probe member 10, case portion 20 and cover portion are formed. (30) is in circuit contact with the vertical soldering portion 41 and the horizontal soldering portion 40. Afterwards, the assembled probe member 10, case part 20, and cover part 30 are inserted into the fastening hole 51 of the circuit board 50, and the horizontal soldering part 40 and the vertical soldering part 41 are soldered. At (52), the terminals of the circuit board 50 are connected in a circuit to the probe member 10 through the horizontal soldering portion 40 and the vertical soldering portion 41.
이처럼 조립되는 본 발명 한 실시예의 검사장치는 탐침부재(10)에 3㎛ 크기의 탐침(11)이 MEMS 공정을 통하여 형성되므로 가로×세로가 15㎛×5㎛이고 접촉부가 3㎛ 정도되는 마이크로 LED(2)를 검사할 수 있다. 또한 상기 탐침(13)은 탄성부(16) 끝단에 형성되기 때문에 웨이퍼(1)에 접촉되는 과정에서 탄성적으로 각 마이크로 LED(2)를 검사할 수 있으므로 접촉불량이 발생되지 않는 등의 이점이 있다.In the inspection device of one embodiment of the present invention assembled in this way, the probe 11 with a size of 3㎛ is formed on the probe member 10 through the MEMS process, so the micro LED has a width × height of 15㎛ × 5㎛ and a contact area of about 3㎛. (2) can be checked. In addition, since the probe 13 is formed at the end of the elastic portion 16, each micro LED 2 can be elastically inspected during the process of contacting the wafer 1, so there is an advantage such as preventing contact defects from occurring. there is.
10 : 탄성부재 11 : 1단
12 : 2단 13 : 탐침
14 : 끼움홈 15 : 수평구멍
20 : 케이스부 21 : 탐침자리
22 : 끼움구 23 : 수직구멍
30 : 덮개부 31 : 수평구멍
32 : 수직구멍 40 : 수평납땜부
41 : 수직납땜부 50 : 회로기판
51 : 체결구멍 52 : 납땜10: elastic member 11: 1st stage
12: 2nd stage 13: Probe
14: Fitting groove 15: Horizontal hole
20: Case part 21: Probe site
22: Fitting hole 23: Vertical hole
30: cover part 31: horizontal hole
32: Vertical hole 40: Horizontal soldering part
41: vertical soldering part 50: circuit board
51: fastening hole 52: soldering
Claims (3)
상기 탐침을 제외하고 상기 탐침부재를 수용하는 케이스부가 구비되며;
상기 케이스부의 개방된 양측에 결합되어서 상기 탐침부재를 보호하는 덮개부가 구비되고;
상기 탐침부재, 케이스부 및 덮개부를 관통하여 회로적으로 연결된 하나의 조립체로 만드는 수평납땜부 및 수직납땜부들이 구비되며;
상기 조립체는 검사장비와 연결된 회로기판의 밑면에 놓이고, 상기 회로기판의 단자와 상기 수평납땜부 및 수직납땜부들이 납땜됨을 특징으로 하는 마이크로 LED 검사장치.In order to directly inspect a wafer on which countless single-type micro LEDs with R, G, and B are independently configured and the contact area is 3 ㎛ are formed, a 27 ㎛ thick first stage and a 3 ㎛ thick second stage are glued in the same shape, but the above 2 A probe member having a probe with a thickness of 3㎛ was formed using a MEMS process by protruding part of the end;
A case portion accommodating the probe member, excluding the probe, is provided;
a cover part coupled to both open sides of the case part to protect the probe member;
Horizontal soldering portions and vertical soldering portions are provided to form a single assembly that is circuitically connected through the probe member, case portion, and cover portion;
The assembly is placed on the bottom of a circuit board connected to the inspection equipment, and the terminals of the circuit board and the horizontal solder portion and the vertical solder portion are soldered.
상기 탐침부재의 양측에 원호형의 끼움홈이 형성되고;
상기 케이스부는 상기 탐침부재가 끼워지는 탐침자리 양측에 각 상기 끼움홈에 들어가는 끼움구가 구비되어서 상기 탐침부재가 상기 케이스부에 상하측 및 좌우측으로 고정됨을 특징으로 하는 마이크로 LED 검사장치.According to claim 1,
Arc-shaped fitting grooves are formed on both sides of the probe member;
A micro LED inspection device, wherein the case part is provided with fittings that fit into each of the fitting grooves on both sides of the probe seat where the probe member is inserted, so that the probe member is fixed to the case part up and down and to the left and right.
상기 탐침부재의 상부에 상기 수평납땜부가 관통되는 수평구멍이 천공되고;
상기 케이스부의 양측에는 상기 수직납땜부들이 관통되는 수직구멍이 천공되며;
상기 덮개부에는 상기 케이스부의 수직구멍과 일치되는 수직구멍이 천공되며;
상기 수평납땜부 및 수직납땜부들은 각 상기 수평구멍 및 수직구멍으로 끼워지면 양단이 각 덮개부의 외측으로 돌출되고, 돌출된 부분이 납땜됨을 특징으로 하는 마이크로 LED 검사장치.According to claim 1,
A horizontal hole through which the horizontal soldering part passes is drilled in the upper part of the probe member;
Vertical holes through which the vertical soldering portions pass are drilled on both sides of the case portion;
The cover portion is drilled with a vertical hole that matches the vertical hole of the case portion;
A micro LED inspection device, wherein when the horizontal soldering portion and the vertical soldering portion are inserted into the horizontal hole and the vertical hole, both ends protrude to the outside of each cover portion, and the protruding portion is soldered.
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| KR102647469B1 true KR102647469B1 (en) | 2024-03-13 |
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| KR20080023893A (en) * | 2006-09-12 | 2008-03-17 | 주식회사 세지 | Connector of assembling type and its manufacturing method |
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| KR100684045B1 (en) | 2005-08-08 | 2007-02-16 | 주식회사 프로텍 | Probe assembly for a tester of the liquid crystal display |
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| KR20230079923A (en) | 2023-06-07 |
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