KR101950959B1 - 증착률을 측정하기 위한 방법 및 증착률 제어 시스템 - Google Patents

증착률을 측정하기 위한 방법 및 증착률 제어 시스템 Download PDF

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Publication number
KR101950959B1
KR101950959B1 KR1020177034155A KR20177034155A KR101950959B1 KR 101950959 B1 KR101950959 B1 KR 101950959B1 KR 1020177034155 A KR1020177034155 A KR 1020177034155A KR 20177034155 A KR20177034155 A KR 20177034155A KR 101950959 B1 KR101950959 B1 KR 101950959B1
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KR
South Korea
Prior art keywords
deposition rate
measurement
measuring
deposition
vaporized material
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KR1020177034155A
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English (en)
Korean (ko)
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KR20170141230A (ko
Inventor
요제 마누엘 디이게츠-캄포
하이케 란드그라프
토마스 코흐
슈테판 반게르트
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20170141230A publication Critical patent/KR20170141230A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B21/00—Systems involving sampling of the variable controlled
    • G05B21/02—Systems involving sampling of the variable controlled electric

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020177034155A 2015-06-17 2015-06-17 증착률을 측정하기 위한 방법 및 증착률 제어 시스템 KR101950959B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2015/063636 WO2016202387A1 (fr) 2015-06-17 2015-06-17 Procédé de mesure de taux de dépôt et système de contrôle de taux de dépôt

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187028708A Division KR20180112123A (ko) 2015-06-17 2015-06-17 증착률을 측정하기 위한 방법 및 증착률 제어 시스템

Publications (2)

Publication Number Publication Date
KR20170141230A KR20170141230A (ko) 2017-12-22
KR101950959B1 true KR101950959B1 (ko) 2019-02-21

Family

ID=53489935

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187028708A KR20180112123A (ko) 2015-06-17 2015-06-17 증착률을 측정하기 위한 방법 및 증착률 제어 시스템
KR1020177034155A KR101950959B1 (ko) 2015-06-17 2015-06-17 증착률을 측정하기 위한 방법 및 증착률 제어 시스템

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020187028708A KR20180112123A (ko) 2015-06-17 2015-06-17 증착률을 측정하기 위한 방법 및 증착률 제어 시스템

Country Status (5)

Country Link
JP (1) JP6411675B2 (fr)
KR (2) KR20180112123A (fr)
CN (1) CN107709604A (fr)
TW (1) TWI612167B (fr)
WO (1) WO2016202387A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112912533B (zh) * 2018-11-28 2023-10-24 应用材料公司 用于沉积蒸发的材料的沉积源、沉积装置及其方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030140858A1 (en) * 2001-04-20 2003-07-31 Marcus Michael A. Reusable mass-sensor in manufacture of organic light-emitting devices
US20040133387A1 (en) 2001-07-12 2004-07-08 Thomas Volkel Monitoring of measuring signal, in particular in automation technology
US20100086681A1 (en) 2007-03-06 2010-04-08 Tokyo Electron Limited Control device of evaporating apparatus and control method of evaporating apparatus
US20100316788A1 (en) * 2009-06-12 2010-12-16 Applied Materials, Inc. Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793193B2 (ja) * 1990-05-30 1995-10-09 シャープ株式会社 薄膜ｅｌ素子の製造方法
JPH11222670A (ja) * 1998-02-06 1999-08-17 Ulvac Corp 膜厚モニター及びこれを用いた成膜装置
JP4706380B2 (ja) * 2005-08-04 2011-06-22 ソニー株式会社 蒸着装置及び蒸着方法
JP2009185344A (ja) * 2008-02-07 2009-08-20 Sony Corp 蒸着方法、蒸着装置、および表示装置の製造方法
US8229691B2 (en) * 2008-06-09 2012-07-24 International Business Machines Corporation Method for using real-time APC information for an enhanced lot sampling engine
EP2508645B1 (fr) * 2011-04-06 2015-02-25 Applied Materials, Inc. Système d'évaporation avec unité de mesure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030140858A1 (en) * 2001-04-20 2003-07-31 Marcus Michael A. Reusable mass-sensor in manufacture of organic light-emitting devices
US20040133387A1 (en) 2001-07-12 2004-07-08 Thomas Volkel Monitoring of measuring signal, in particular in automation technology
US20100086681A1 (en) 2007-03-06 2010-04-08 Tokyo Electron Limited Control device of evaporating apparatus and control method of evaporating apparatus
US20100316788A1 (en) * 2009-06-12 2010-12-16 Applied Materials, Inc. Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device

Also Published As

Publication number Publication date
KR20180112123A (ko) 2018-10-11
CN107709604A (zh) 2018-02-16
JP2018519415A (ja) 2018-07-19
TW201710536A (zh) 2017-03-16
JP6411675B2 (ja) 2018-10-24
WO2016202387A1 (fr) 2016-12-22
TWI612167B (zh) 2018-01-21
KR20170141230A (ko) 2017-12-22

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