JP2018519415A - 堆積速度を測定するための方法及び堆積速度制御システム - Google Patents
堆積速度を測定するための方法及び堆積速度制御システム Download PDFInfo
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- JP2018519415A JP2018519415A JP2017557378A JP2017557378A JP2018519415A JP 2018519415 A JP2018519415 A JP 2018519415A JP 2017557378 A JP2017557378 A JP 2017557378A JP 2017557378 A JP2017557378 A JP 2017557378A JP 2018519415 A JP2018519415 A JP 2018519415A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B21/00—Systems involving sampling of the variable controlled
- G05B21/02—Systems involving sampling of the variable controlled electric
Abstract
【選択図】図4
Description
Claims (15)
- 蒸発材料の堆積速度を測定するための方法(100)であって、
第1の測定と第2の測定との時間間隔で前記堆積速度を測定すること(110)と、
測定された前記堆積速度に依存して前記時間間隔を調節すること(120)と
を含む方法(100)。 - 測定された前記堆積速度への前記依存が、前記堆積速度の関数である、請求項1に記載の方法(100)。
- 測定された前記堆積速度の関数は、前記堆積速度の傾き、所定の範囲内にある前記堆積速度のブール決定、測定された前記堆積速度の所定の堆積速度の公称/設定値に対する差の多項式関数、及び測定された前記堆積速度の発振関数から成る群から選択される、請求項1又は2に記載の方法(100)。
- 前記第1の測定と前記第2の測定との間に、堆積速度測定デバイスを蒸発材料から遮蔽すること(130)を更に含む、請求項1から3の何れか一項に記載の方法(100)。
- 前記遮蔽すること(130)が、前記堆積速度測定デバイス(211)と、前記蒸発材料を前記堆積速度測定デバイス(211)に供給するための測定出口(230)との間でシャッター(213)を移動させることを含む、請求項4に記載の方法(100)。
- 前記第1の測定と前記第2の測定との間に、堆積速度測定デバイス(211)を堆積材料から洗浄すること(140)を更に含む、請求項1から5の何れか一項に記載の方法(100)。
- 前記洗浄すること(140)が、前記堆積材料を前記堆積速度測定デバイス(211)から蒸発させることを含む、請求項6に記載の方法(100)。
- 前記堆積材料を前記堆積速度測定デバイス(211)から蒸発させることが、前記堆積速度測定デバイスを加熱することによって実行される、請求項7に記載の方法(100)。
- 蒸発材料の堆積速度を測定するための堆積速度測定アセンブリ(210)と、
前記堆積速度測定アセンブリ(210)及び蒸発源(300)に結合されたコントローラ(220)と
を備え、前記コントローラが、制御信号を前記堆積速度測定アセンブリ(210)に提供するように構成されており、特に
前記コントローラが、プログラムコードを実行するように構成されており、前記プログラムコードが実行されると、請求項1から8に記載の方法が実行される、堆積速度制御システム(200)。 - 前記コントローラ(220)が、前記堆積速度を制御するための少なくとも1つの比例積分微分(PID)コントローラを含む閉ループ制御を含む、請求項9に記載の堆積速度制御システム(200)。
- 前記堆積速度測定アセンブリ(210)が、前記堆積速度を測定するための発振水晶(212)を含む堆積速度測定デバイス(211)を備える、請求項9又は10に記載の堆積速度制御システム(200)。
- 前記堆積速度測定アセンブリ(210)が、蒸発材料を堆積速度測定デバイス(211)に供給するための測定出口(230)から供給された前記蒸発材料から前記堆積速度測定デバイス(211)を遮蔽するための、シャッター(213)、特に可動シャッターを備える、請求項9から11の何れか一項に記載の堆積速度制御システム(200)。
- 前記堆積速度測定アセンブリ(210)が、堆積速度測定デバイス(211)の上に堆積した材料が蒸発する温度まで、前記堆積速度測定デバイス(211)を加熱するための少なくとも1つの加熱要素(214)を備える、請求項9から12の何れか一項に記載の堆積速度制御システム(200)。
- 材料を蒸発させるように構成されている蒸発るつぼ(310)と、
堆積速度で蒸発材料を基板に供給するための分配管の長さに沿って設けられた一又は複数の出口を有する分配管(320)であって、前記蒸発るつぼ(310)と流体連通している分配管(320)と
請求項9から13の何れか一項に記載の堆積速度制御システム(200)と
を備える、材料蒸発のための蒸発源(300)。 - 請求項14に記載の少なくとも1つの蒸発源(300)を備える、堆積速度で真空チャンバ(410)の中の基板(444)に材料を塗布するための堆積装置(400)。
Applications Claiming Priority (1)
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PCT/EP2015/063636 WO2016202387A1 (en) | 2015-06-17 | 2015-06-17 | Method for measuring a deposition rate and deposition rate control system |
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JP2018519415A true JP2018519415A (ja) | 2018-07-19 |
JP6411675B2 JP6411675B2 (ja) | 2018-10-24 |
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JP (1) | JP6411675B2 (ja) |
KR (2) | KR20180112123A (ja) |
CN (1) | CN107709604A (ja) |
TW (1) | TWI612167B (ja) |
WO (1) | WO2016202387A1 (ja) |
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CN112912533B (zh) * | 2018-11-28 | 2023-10-24 | 应用材料公司 | 用于沉积蒸发的材料的沉积源、沉积装置及其方法 |
US11823964B2 (en) * | 2021-04-16 | 2023-11-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Deposition system and method |
Citations (7)
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JPH0434891A (ja) * | 1990-05-30 | 1992-02-05 | Sharp Corp | 薄膜el素子の製造方法 |
JPH11222670A (ja) * | 1998-02-06 | 1999-08-17 | Ulvac Corp | 膜厚モニター及びこれを用いた成膜装置 |
US20040133387A1 (en) * | 2001-07-12 | 2004-07-08 | Thomas Volkel | Monitoring of measuring signal, in particular in automation technology |
JP2007039762A (ja) * | 2005-08-04 | 2007-02-15 | Sony Corp | 蒸着装置及び蒸着方法 |
JP2009185344A (ja) * | 2008-02-07 | 2009-08-20 | Sony Corp | 蒸着方法、蒸着装置、および表示装置の製造方法 |
US20090306803A1 (en) * | 2008-06-09 | 2009-12-10 | International Business Machines Corporation | Method for using real-time apc information for an enhanced lot sampling engine |
US20100316788A1 (en) * | 2009-06-12 | 2010-12-16 | Applied Materials, Inc. | Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6558735B2 (en) * | 2001-04-20 | 2003-05-06 | Eastman Kodak Company | Reusable mass-sensor in manufacture of organic light-emitting devices |
KR101123706B1 (ko) * | 2007-03-06 | 2012-03-20 | 도쿄엘렉트론가부시키가이샤 | 증착 장치의 제어 장치 및 증착 장치의 제어 방법 |
EP2508645B1 (en) * | 2011-04-06 | 2015-02-25 | Applied Materials, Inc. | Evaporation system with measurement unit |
-
2015
- 2015-06-17 WO PCT/EP2015/063636 patent/WO2016202387A1/en active Application Filing
- 2015-06-17 CN CN201580080549.9A patent/CN107709604A/zh active Pending
- 2015-06-17 KR KR1020187028708A patent/KR20180112123A/ko active Application Filing
- 2015-06-17 KR KR1020177034155A patent/KR101950959B1/ko active IP Right Grant
- 2015-06-17 JP JP2017557378A patent/JP6411675B2/ja not_active Expired - Fee Related
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2016
- 2016-06-16 TW TW105119014A patent/TWI612167B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434891A (ja) * | 1990-05-30 | 1992-02-05 | Sharp Corp | 薄膜el素子の製造方法 |
JPH11222670A (ja) * | 1998-02-06 | 1999-08-17 | Ulvac Corp | 膜厚モニター及びこれを用いた成膜装置 |
US20040133387A1 (en) * | 2001-07-12 | 2004-07-08 | Thomas Volkel | Monitoring of measuring signal, in particular in automation technology |
JP2007039762A (ja) * | 2005-08-04 | 2007-02-15 | Sony Corp | 蒸着装置及び蒸着方法 |
JP2009185344A (ja) * | 2008-02-07 | 2009-08-20 | Sony Corp | 蒸着方法、蒸着装置、および表示装置の製造方法 |
US20090306803A1 (en) * | 2008-06-09 | 2009-12-10 | International Business Machines Corporation | Method for using real-time apc information for an enhanced lot sampling engine |
US20100316788A1 (en) * | 2009-06-12 | 2010-12-16 | Applied Materials, Inc. | Deposition rate monitor device, evaporator, coating installation, method for applying vapor to a substrate and method of operating a deposition rate monitor device |
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Publication number | Publication date |
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WO2016202387A1 (en) | 2016-12-22 |
TW201710536A (zh) | 2017-03-16 |
TWI612167B (zh) | 2018-01-21 |
KR20170141230A (ko) | 2017-12-22 |
KR20180112123A (ko) | 2018-10-11 |
JP6411675B2 (ja) | 2018-10-24 |
KR101950959B1 (ko) | 2019-02-21 |
CN107709604A (zh) | 2018-02-16 |
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