KR101947194B1 - Ｏｌｅｄ 장치 및 이를 제조하는 방법 - Google Patents

Ｏｌｅｄ 장치 및 이를 제조하는 방법 Download PDF

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Publication number
KR101947194B1
KR101947194B1 KR1020137003869A KR20137003869A KR101947194B1 KR 101947194 B1 KR101947194 B1 KR 101947194B1 KR 1020137003869 A KR1020137003869 A KR 1020137003869A KR 20137003869 A KR20137003869 A KR 20137003869A KR 101947194 B1 KR101947194 B1 KR 101947194B1
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South Korea
Prior art keywords
conductive
layer
protective layer
oled device
transfer
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Expired - Fee Related
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KR1020137003869A
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English (en)
Korean (ko)
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KR20130041945A (ko
Inventor
홀거 스치웹
Original Assignee
오엘이디워크스 게엠베하
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Publication of KR20130041945A publication Critical patent/KR20130041945A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020137003869A 2010-07-16 2011-07-11 Ｏｌｅｄ 장치 및 이를 제조하는 방법 Expired - Fee Related KR101947194B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10169821.5 2010-07-16
EP10169821 2010-07-16
PCT/IB2011/053071 WO2012007893A1 (en) 2010-07-16 2011-07-11 An oled device and a method of manufacturing the same

Publications (2)

Publication Number Publication Date
KR20130041945A KR20130041945A (ko) 2013-04-25
KR101947194B1 true KR101947194B1 (ko) 2019-02-12

Family

ID=44544293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137003869A Expired - Fee Related KR101947194B1 (ko) 2010-07-16 2011-07-11 Ｏｌｅｄ 장치 및 이를 제조하는 방법

Country Status (6)

Country Link
US (1) US8829787B2 (enExample)
EP (1) EP2593980B1 (enExample)
JP (1) JP5892707B2 (enExample)
KR (1) KR101947194B1 (enExample)
CN (1) CN102986053B (enExample)
WO (1) WO2012007893A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9692008B2 (en) * 2013-06-11 2017-06-27 Sharp Kabushiki Kaisha Organic electroluminescent display device
FR3017996A1 (fr) * 2014-02-25 2015-08-28 Commissariat Energie Atomique Dispositif a composant electronique
KR102422061B1 (ko) 2017-11-28 2022-07-18 엘지디스플레이 주식회사 Oled 조명 장치
KR102338064B1 (ko) 2021-06-11 2021-12-13 주식회사 올레드링크 Oled 패널 제조방법
KR102337855B1 (ko) 2021-09-03 2021-12-13 주식회사 올레드링크 개선된 증착 효과를 가지는 oled 패널 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166232A (ja) 2007-01-05 2008-07-17 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法

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WO2002039513A1 (en) * 2000-11-08 2002-05-16 Koninklijke Philips Electronics N.V. Electro-optical device
JP4551592B2 (ja) * 2001-08-14 2010-09-29 パイオニア株式会社 配線付き基体
JP2003272832A (ja) * 2002-03-13 2003-09-26 Denso Corp 有機ｅｌ素子およびその製造方法
JP2003297584A (ja) * 2002-04-04 2003-10-17 Asahi Glass Co Ltd 配線付き基体形成用積層体、配線付き基体およびその形成方法
JP4469126B2 (ja) * 2002-06-14 2010-05-26 龍男 内田 ディスプレイとそれに用いる配線基板
JP2004047316A (ja) * 2002-07-12 2004-02-12 Sharp Corp 有機ｌｅｄ素子とその製造方法および表示装置
CN100517797C (zh) * 2002-10-17 2009-07-22 旭硝子株式会社 层压体、带配线的基体、有机el显示元件、有机el显示元件的连接端子及它们的制造方法
JP3649238B2 (ja) * 2002-10-17 2005-05-18 旭硝子株式会社 積層体、配線付き基体、有機ｅｌ表示素子、有機ｅｌ表示素子の接続端子及びそれらの製造方法
JP2005305714A (ja) * 2004-04-19 2005-11-04 Asahi Glass Co Ltd 配線付き基体形成用積層体とその形成方法および配線付き基体
EP1797606A1 (en) * 2004-09-27 2007-06-20 Philips Intellectual Property & Standards GmbH Illumination system
KR100647677B1 (ko) * 2005-02-04 2006-11-23 삼성에스디아이 주식회사 금속 보강층을 포함하는 유기 전계 발광 소자 및 그제조방법
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
KR20070050804A (ko) * 2006-08-28 2007-05-16 주식회사 대우일렉트로닉스 오엘이디 디스플레이 패널
KR101460813B1 (ko) * 2006-09-29 2014-11-11 오스람 옵토 세미컨덕터스 게엠베하 유기 발광 소자 및 조명 장치
US8222635B2 (en) * 2007-03-20 2012-07-17 Otb Solar B.V. Method for manufacturing an organic light emitting device as well as such a device
WO2008135902A2 (en) * 2007-05-02 2008-11-13 Philips Intellectual Property & Standards Gmbh Method for manufacturing an oled device and such an oled device
JP2009076437A (ja) * 2007-08-31 2009-04-09 Toshiba Matsushita Display Technology Co Ltd 表示装置
JP4950870B2 (ja) * 2007-12-21 2012-06-13 ローム株式会社 有機発光装置
JP5049213B2 (ja) * 2008-07-08 2012-10-17 株式会社ジャパンディスプレイイースト 有機ｅｌパネルおよびその製造方法
US20100118243A1 (en) * 2008-11-12 2010-05-13 Debasis Majumdar Polymeric conductive donor and transfer method
JP4849279B2 (ja) * 2009-05-28 2012-01-11 Ｔｄｋ株式会社 有機ｅｌ表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166232A (ja) 2007-01-05 2008-07-17 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法

Also Published As

Publication number Publication date
JP5892707B2 (ja) 2016-03-23
EP2593980A1 (en) 2013-05-22
CN102986053A (zh) 2013-03-20
CN102986053B (zh) 2016-03-02
JP2013534706A (ja) 2013-09-05
EP2593980B1 (en) 2019-03-27
US20130119858A1 (en) 2013-05-16
US8829787B2 (en) 2014-09-09
WO2012007893A1 (en) 2012-01-19
KR20130041945A (ko) 2013-04-25

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