JP5892707B2 - Ｏｌｅｄデバイス及び同デバイスを製造する方法 - Google Patents

Ｏｌｅｄデバイス及び同デバイスを製造する方法 Download PDF

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Publication number
JP5892707B2
JP5892707B2 JP2013519198A JP2013519198A JP5892707B2 JP 5892707 B2 JP5892707 B2 JP 5892707B2 JP 2013519198 A JP2013519198 A JP 2013519198A JP 2013519198 A JP2013519198 A JP 2013519198A JP 5892707 B2 JP5892707 B2 JP 5892707B2
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Japan
Prior art keywords
conductive
layer
protective layer
transfer
oled device
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Expired - Fee Related
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JP2013519198A
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English (en)
Japanese (ja)
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JP2013534706A5 (enExample
JP2013534706A (ja
Inventor
ホルゲル シュヴァプ
ホルゲル シュヴァプ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
JP2013519198A 2010-07-16 2011-07-11 Ｏｌｅｄデバイス及び同デバイスを製造する方法 Expired - Fee Related JP5892707B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10169821.5 2010-07-16
EP10169821 2010-07-16
PCT/IB2011/053071 WO2012007893A1 (en) 2010-07-16 2011-07-11 An oled device and a method of manufacturing the same

Publications (3)

Publication Number Publication Date
JP2013534706A JP2013534706A (ja) 2013-09-05
JP2013534706A5 JP2013534706A5 (enExample) 2014-08-28
JP5892707B2 true JP5892707B2 (ja) 2016-03-23

Family

ID=44544293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013519198A Expired - Fee Related JP5892707B2 (ja) 2010-07-16 2011-07-11 Ｏｌｅｄデバイス及び同デバイスを製造する方法

Country Status (6)

Country Link
US (1) US8829787B2 (enExample)
EP (1) EP2593980B1 (enExample)
JP (1) JP5892707B2 (enExample)
KR (1) KR101947194B1 (enExample)
CN (1) CN102986053B (enExample)
WO (1) WO2012007893A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014199673A1 (ja) * 2013-06-11 2014-12-18 シャープ株式会社 有機エレクトロルミネッセンス表示装置
FR3017996A1 (fr) * 2014-02-25 2015-08-28 Commissariat Energie Atomique Dispositif a composant electronique
KR102422061B1 (ko) 2017-11-28 2022-07-18 엘지디스플레이 주식회사 Oled 조명 장치
KR102338064B1 (ko) 2021-06-11 2021-12-13 주식회사 올레드링크 Oled 패널 제조방법
KR102337855B1 (ko) 2021-09-03 2021-12-13 주식회사 올레드링크 개선된 증착 효과를 가지는 oled 패널 제조방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1336207A1 (en) * 2000-11-08 2003-08-20 Koninklijke Philips Electronics N.V. Electro-optical device
JP4551592B2 (ja) * 2001-08-14 2010-09-29 パイオニア株式会社 配線付き基体
JP2003272832A (ja) 2002-03-13 2003-09-26 Denso Corp 有機ｅｌ素子およびその製造方法
JP2003297584A (ja) * 2002-04-04 2003-10-17 Asahi Glass Co Ltd 配線付き基体形成用積層体、配線付き基体およびその形成方法
JP4469126B2 (ja) * 2002-06-14 2010-05-26 龍男 内田 ディスプレイとそれに用いる配線基板
JP2004047316A (ja) * 2002-07-12 2004-02-12 Sharp Corp 有機ｌｅｄ素子とその製造方法および表示装置
US7169461B2 (en) * 2002-10-17 2007-01-30 Asahi Glass Company, Limited Laminate, a substrate with wires, an organic EL display element, a connection terminal for the organic EL display element and a method for producing each
JP3649238B2 (ja) * 2002-10-17 2005-05-18 旭硝子株式会社 積層体、配線付き基体、有機ｅｌ表示素子、有機ｅｌ表示素子の接続端子及びそれらの製造方法
JP2005305714A (ja) * 2004-04-19 2005-11-04 Asahi Glass Co Ltd 配線付き基体形成用積層体とその形成方法および配線付き基体
JP2008515143A (ja) * 2004-09-27 2008-05-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 照明システム
KR100647677B1 (ko) * 2005-02-04 2006-11-23 삼성에스디아이 주식회사 금속 보강층을 포함하는 유기 전계 발광 소자 및 그제조방법
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
KR20070050804A (ko) * 2006-08-28 2007-05-16 주식회사 대우일렉트로닉스 오엘이디 디스플레이 패널
KR20160150648A (ko) * 2006-09-29 2016-12-30 오스람 실바니아 인코포레이티드 유기 발광 소자 및 조명 장치
JP2008166232A (ja) 2007-01-05 2008-07-17 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法
CN101681998B (zh) * 2007-03-20 2012-08-08 Otb太阳能有限公司 用于制造有机发光装置的方法以及这样的装置
WO2008135902A2 (en) * 2007-05-02 2008-11-13 Philips Intellectual Property & Standards Gmbh Method for manufacturing an oled device and such an oled device
JP2009076437A (ja) * 2007-08-31 2009-04-09 Toshiba Matsushita Display Technology Co Ltd 表示装置
JP4950870B2 (ja) * 2007-12-21 2012-06-13 ローム株式会社 有機発光装置
JP5049213B2 (ja) * 2008-07-08 2012-10-17 株式会社ジャパンディスプレイイースト 有機ｅｌパネルおよびその製造方法
US20100118243A1 (en) 2008-11-12 2010-05-13 Debasis Majumdar Polymeric conductive donor and transfer method
JP4849279B2 (ja) * 2009-05-28 2012-01-11 Ｔｄｋ株式会社 有機ｅｌ表示装置

Also Published As

Publication number Publication date
KR20130041945A (ko) 2013-04-25
KR101947194B1 (ko) 2019-02-12
US8829787B2 (en) 2014-09-09
CN102986053A (zh) 2013-03-20
EP2593980B1 (en) 2019-03-27
EP2593980A1 (en) 2013-05-22
CN102986053B (zh) 2016-03-02
WO2012007893A1 (en) 2012-01-19
JP2013534706A (ja) 2013-09-05
US20130119858A1 (en) 2013-05-16

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