KR101944734B1 - 광활성화가능한 질소 염기 - Google Patents

광활성화가능한 질소 염기 Download PDF

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Publication number
KR101944734B1
KR101944734B1 KR1020147033474A KR20147033474A KR101944734B1 KR 101944734 B1 KR101944734 B1 KR 101944734B1 KR 1020147033474 A KR1020147033474 A KR 1020147033474A KR 20147033474 A KR20147033474 A KR 20147033474A KR 101944734 B1 KR101944734 B1 KR 101944734B1
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South Korea
Prior art keywords
compound
alkyl
formula
compounds
base
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Expired - Fee Related
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KR1020147033474A
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English (en)
Korean (ko)
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KR20150005683A (ko
Inventor
쿠르트 디틀리커
카타리나 미스텔리
캬티아 스뛰데르
툰야 융
로타르 알렉산더 엥겔브레흐트
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바스프 에스이
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
    • C07D487/04—Ortho-condensed systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Indole Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
KR1020147033474A 2007-04-03 2008-03-25 광활성화가능한 질소 염기 Expired - Fee Related KR101944734B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07105510.7 2007-04-03
EP07105510 2007-04-03
PCT/EP2008/053456 WO2008119688A1 (en) 2007-04-03 2008-03-25 Photoactivable nitrogen bases

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097022890A Division KR101514093B1 (ko) 2007-04-03 2008-03-25 광활성화가능한 질소 염기

Publications (2)

Publication Number Publication Date
KR20150005683A KR20150005683A (ko) 2015-01-14
KR101944734B1 true KR101944734B1 (ko) 2019-02-07

Family

ID=38016564

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020147033474A Expired - Fee Related KR101944734B1 (ko) 2007-04-03 2008-03-25 광활성화가능한 질소 염기
KR1020097022890A Expired - Fee Related KR101514093B1 (ko) 2007-04-03 2008-03-25 광활성화가능한 질소 염기

Family Applications After (1)

Application Number Title Priority Date Filing Date
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Country Status (9)

Country Link
US (3) US9921477B2 (enExample)
EP (1) EP2145231B1 (enExample)
JP (1) JP5606308B2 (enExample)
KR (2) KR101944734B1 (enExample)
CN (1) CN101641643B (enExample)
AT (1) ATE524765T1 (enExample)
CA (1) CA2681201C (enExample)
MX (1) MX2009010309A (enExample)
WO (1) WO2008119688A1 (enExample)

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CN101967343A (zh) * 2010-10-22 2011-02-09 广州市博兴化工科技有限公司 一种光固化色漆
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US10538031B2 (en) 2015-12-22 2020-01-21 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
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WO2017112682A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Fabrication of compound products from multiple intermediates by additive manufacturing with dual cure resins
US10787583B2 (en) 2015-12-22 2020-09-29 Carbon, Inc. Method of forming a three-dimensional object comprised of a silicone polymer or co-polymer
EP3341792A1 (en) 2015-12-22 2018-07-04 Carbon, Inc. Dual precursor resin systems for additive manufacturing with dual cure resins
US10500786B2 (en) 2016-06-22 2019-12-10 Carbon, Inc. Dual cure resins containing microwave absorbing materials and methods of using the same
US11098151B2 (en) 2016-10-14 2021-08-24 Basf Se Hardenable polymer composition
CN110023056B (zh) * 2016-11-21 2021-08-24 卡本有限公司 通过递送反应性组分用于后续固化来制造三维物体的方法
JP7109438B2 (ja) 2016-12-05 2022-07-29 アーケマ・インコーポレイテッド 重合開始剤ブレンド物、およびそのような重合開始剤ブレンド物を含む３ｄプリンティングに有用な光硬化性組成物
WO2018165090A1 (en) 2017-03-09 2018-09-13 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10367228B2 (en) * 2017-04-07 2019-07-30 Seeo, Inc. Diester-based polymer electrolytes for high voltage lithium ion batteries
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
JP6894015B2 (ja) 2017-06-21 2021-06-23 カーボン，インコーポレイテッド 積層造形の方法
CN111971040B (zh) 2017-11-24 2022-05-27 卢内拉生物技术有限公司 用于根除癌症干细胞的三苯基鏻衍生物化合物
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Also Published As

Publication number Publication date
KR20150005683A (ko) 2015-01-14
US9921477B2 (en) 2018-03-20
CN101641643A (zh) 2010-02-03
CA2681201A1 (en) 2008-10-09
MX2009010309A (es) 2009-10-16
US20180217498A1 (en) 2018-08-02
US20210033972A1 (en) 2021-02-04
US10928728B2 (en) 2021-02-23
CN101641643B (zh) 2013-08-07
KR20100016136A (ko) 2010-02-12
EP2145231B1 (en) 2011-09-14
JP2010523515A (ja) 2010-07-15
JP5606308B2 (ja) 2014-10-15
KR101514093B1 (ko) 2015-04-21
ATE524765T1 (de) 2011-09-15
CA2681201C (en) 2016-06-14
EP2145231A1 (en) 2010-01-20
WO2008119688A1 (en) 2008-10-09
US20100105794A1 (en) 2010-04-29

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