KR101924241B1 - Cmp 패드 컨디셔닝 공구 - Google Patents

Cmp 패드 컨디셔닝 공구 Download PDF

Info

Publication number
KR101924241B1
KR101924241B1 KR1020137015870A KR20137015870A KR101924241B1 KR 101924241 B1 KR101924241 B1 KR 101924241B1 KR 1020137015870 A KR1020137015870 A KR 1020137015870A KR 20137015870 A KR20137015870 A KR 20137015870A KR 101924241 B1 KR101924241 B1 KR 101924241B1
Authority
KR
South Korea
Prior art keywords
tool
cmp pad
conditioning
diamond
preform
Prior art date
Application number
KR1020137015870A
Other languages
English (en)
Korean (ko)
Other versions
KR20130132480A (ko
Inventor
개리 이 룰랜드
찰스 랠리
토마스 찰스 이슬리
제임스 그레이엄
마크 슈바이처
Original Assignee
다이아몬드 이노베이션즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이아몬드 이노베이션즈, 인크. filed Critical 다이아몬드 이노베이션즈, 인크.
Publication of KR20130132480A publication Critical patent/KR20130132480A/ko
Application granted granted Critical
Publication of KR101924241B1 publication Critical patent/KR101924241B1/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020137015870A 2010-12-20 2011-12-20 Cmp 패드 컨디셔닝 공구 KR101924241B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061424870P 2010-12-20 2010-12-20
US61/424,870 2010-12-20
PCT/US2011/065970 WO2012088004A2 (en) 2010-12-20 2011-12-20 Cmp pad conditioning tool

Publications (2)

Publication Number Publication Date
KR20130132480A KR20130132480A (ko) 2013-12-04
KR101924241B1 true KR101924241B1 (ko) 2018-11-30

Family

ID=45953217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015870A KR101924241B1 (ko) 2010-12-20 2011-12-20 Cmp 패드 컨디셔닝 공구

Country Status (8)

Country Link
US (1) US20120171935A1 (ja)
EP (1) EP2655015A2 (ja)
JP (1) JP6022477B2 (ja)
KR (1) KR101924241B1 (ja)
CN (1) CN103269831B (ja)
AU (1) AU2011349393B2 (ja)
SG (1) SG190811A1 (ja)
WO (1) WO2012088004A2 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103688343B (zh) * 2011-03-07 2016-09-07 恩特格里公司 化学机械抛光垫修整器
CN104684686A (zh) * 2012-08-02 2015-06-03 3M创新有限公司 具有精确成形特征部的研磨元件、用其制成的研磨制品及其制造方法
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
JP6715006B2 (ja) 2012-08-02 2020-07-01 スリーエム イノベイティブ プロパティズ カンパニー 精密に成形された構造部を有する研磨物品及びその作製方法
KR102350350B1 (ko) * 2014-04-03 2022-01-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
GB201504759D0 (en) * 2015-03-20 2015-05-06 Rolls Royce Plc Abrading tool for a rotary dresser
WO2018204556A1 (en) * 2017-05-02 2018-11-08 M Cubed Technologies, Inc. Inert gas-assisted laser machining of ceramic-containing articles
TWI621503B (zh) * 2017-05-12 2018-04-21 Kinik Company Ltd. 化學機械研磨拋光墊修整器及其製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
JP2801326B2 (ja) * 1988-08-17 1998-09-21 ザ・オーストラリアン・ナショナル・ユニバーシティ 低電気抵抗を有するダイアモンド成形体
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US20030109204A1 (en) * 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
US6852016B2 (en) * 2002-09-18 2005-02-08 Micron Technology, Inc. End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
KR100636793B1 (ko) * 2004-12-13 2006-10-23 이화다이아몬드공업 주식회사 Cmp 패드용 컨디셔너
BRPI0615020A2 (pt) * 2005-08-25 2009-08-04 Hiroshi Ishizuka ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma
JP4791121B2 (ja) 2005-09-22 2011-10-12 新日鉄マテリアルズ株式会社 研磨布用ドレッサー
US7241206B1 (en) * 2006-02-17 2007-07-10 Chien-Min Sung Tools for polishing and associated methods
US7815495B2 (en) * 2007-04-11 2010-10-19 Applied Materials, Inc. Pad conditioner
CN101327578A (zh) * 2007-06-22 2008-12-24 钻面奈米科技股份有限公司 研磨工具及其制造方法
JP5311178B2 (ja) * 2007-10-15 2013-10-09 株式会社ニコン 研磨装置及び研磨装置における研磨パッドのドレス方法
US8382557B2 (en) * 2007-11-14 2013-02-26 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and methods of forming thereof
WO2009114413A1 (en) 2008-03-10 2009-09-17 Morgan Advanced Ceramics, Inc. Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing
JP2010125567A (ja) * 2008-11-28 2010-06-10 Mitsubishi Materials Corp Cmpパッドコンディショナー
US20100186479A1 (en) 2009-01-26 2010-07-29 Araca, Inc. Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법

Also Published As

Publication number Publication date
KR20130132480A (ko) 2013-12-04
US20120171935A1 (en) 2012-07-05
CN103269831B (zh) 2017-06-09
WO2012088004A3 (en) 2012-12-13
SG190811A1 (en) 2013-07-31
WO2012088004A2 (en) 2012-06-28
EP2655015A2 (en) 2013-10-30
AU2011349393B2 (en) 2016-11-10
AU2011349393A1 (en) 2013-06-06
JP6022477B2 (ja) 2016-11-09
CN103269831A (zh) 2013-08-28
JP2014504458A (ja) 2014-02-20

Similar Documents

Publication Publication Date Title
KR101924241B1 (ko) Cmp 패드 컨디셔닝 공구
TWI522447B (zh) 延長壽命之研磨物件及方法
US7658666B2 (en) Superhard cutters and associated methods
US7762872B2 (en) Superhard cutters and associated methods
EP2845221B1 (en) Cmp conditioner pads with superabrasive grit enhancement
US6540597B1 (en) Polishing pad conditioner
US20050227590A1 (en) Fixed abrasive tools and associated methods
US20220297260A1 (en) Methods of forming diamond composite cmp pad conditioner
US20190091832A1 (en) Composite conditioner and associated methods
US20090120009A1 (en) Polycrystalline Grits and Associated Methods
JP7191153B2 (ja) ダイヤモンド粒子を含む反応結合型炭化ケイ素を有するセラミック基板
TW200906555A (en) Improved chemical mechanical polishing pad and methods of making and using same
WO2008063599A2 (en) Superhard cutters and associated methods
TWI791028B (zh) 包括可適形塗層之磨料物品及來自其之拋光系統
ES2918458T3 (es) Proceso para la preparación de partículas de nitruro de boro cúbico
CN113199400A (zh) 一种化学机械研磨抛光垫整修器及其制备方法
KR100502574B1 (ko) 연마공구 및 그의 제조방법
CN118235035A (zh) 接触件及使用该接触件的单晶金刚石的微小磨损特性的评价方法
CN113172553A (zh) 一种化学机械研磨抛光垫整修器及其制备方法
Tsai et al. Effect of Dressing Load and Speed on Removal Rate in the Chemical Mechanical Polishing Process

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant