KR101924241B1 - Cmp 패드 컨디셔닝 공구 - Google Patents
Cmp 패드 컨디셔닝 공구 Download PDFInfo
- Publication number
- KR101924241B1 KR101924241B1 KR1020137015870A KR20137015870A KR101924241B1 KR 101924241 B1 KR101924241 B1 KR 101924241B1 KR 1020137015870 A KR1020137015870 A KR 1020137015870A KR 20137015870 A KR20137015870 A KR 20137015870A KR 101924241 B1 KR101924241 B1 KR 101924241B1
- Authority
- KR
- South Korea
- Prior art keywords
- tool
- cmp pad
- conditioning
- diamond
- preform
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201061424870P | 2010-12-20 | 2010-12-20 | |
US61/424,870 | 2010-12-20 | ||
PCT/US2011/065970 WO2012088004A2 (en) | 2010-12-20 | 2011-12-20 | Cmp pad conditioning tool |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130132480A KR20130132480A (ko) | 2013-12-04 |
KR101924241B1 true KR101924241B1 (ko) | 2018-11-30 |
Family
ID=45953217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020137015870A KR101924241B1 (ko) | 2010-12-20 | 2011-12-20 | Cmp 패드 컨디셔닝 공구 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120171935A1 (ja) |
EP (1) | EP2655015A2 (ja) |
JP (1) | JP6022477B2 (ja) |
KR (1) | KR101924241B1 (ja) |
CN (1) | CN103269831B (ja) |
AU (1) | AU2011349393B2 (ja) |
SG (1) | SG190811A1 (ja) |
WO (1) | WO2012088004A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103688343B (zh) * | 2011-03-07 | 2016-09-07 | 恩特格里公司 | 化学机械抛光垫修整器 |
CN104684686A (zh) * | 2012-08-02 | 2015-06-03 | 3M创新有限公司 | 具有精确成形特征部的研磨元件、用其制成的研磨制品及其制造方法 |
CN108177094B (zh) | 2012-08-02 | 2021-01-15 | 3M创新有限公司 | 具有精确成形特征部的研磨元件前体及其制造方法 |
JP6715006B2 (ja) | 2012-08-02 | 2020-07-01 | スリーエム イノベイティブ プロパティズ カンパニー | 精密に成形された構造部を有する研磨物品及びその作製方法 |
KR102350350B1 (ko) * | 2014-04-03 | 2022-01-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 |
GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
WO2018204556A1 (en) * | 2017-05-02 | 2018-11-08 | M Cubed Technologies, Inc. | Inert gas-assisted laser machining of ceramic-containing articles |
TWI621503B (zh) * | 2017-05-12 | 2018-04-21 | Kinik Company Ltd. | 化學機械研磨拋光墊修整器及其製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151686A (en) * | 1978-01-09 | 1979-05-01 | General Electric Company | Silicon carbide and silicon bonded polycrystalline diamond body and method of making it |
JP2801326B2 (ja) * | 1988-08-17 | 1998-09-21 | ザ・オーストラリアン・ナショナル・ユニバーシティ | 低電気抵抗を有するダイアモンド成形体 |
US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
US6123612A (en) | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
US6276998B1 (en) * | 1999-02-25 | 2001-08-21 | Applied Materials, Inc. | Padless substrate carrier |
US6439986B1 (en) * | 1999-10-12 | 2002-08-27 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
US20030109204A1 (en) * | 2001-12-06 | 2003-06-12 | Kinik Company | Fixed abrasive CMP pad dresser and associated methods |
US6852016B2 (en) * | 2002-09-18 | 2005-02-08 | Micron Technology, Inc. | End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces |
US20050227590A1 (en) * | 2004-04-09 | 2005-10-13 | Chien-Min Sung | Fixed abrasive tools and associated methods |
US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
KR100636793B1 (ko) * | 2004-12-13 | 2006-10-23 | 이화다이아몬드공업 주식회사 | Cmp 패드용 컨디셔너 |
BRPI0615020A2 (pt) * | 2005-08-25 | 2009-08-04 | Hiroshi Ishizuka | ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma |
JP4791121B2 (ja) | 2005-09-22 | 2011-10-12 | 新日鉄マテリアルズ株式会社 | 研磨布用ドレッサー |
US7241206B1 (en) * | 2006-02-17 | 2007-07-10 | Chien-Min Sung | Tools for polishing and associated methods |
US7815495B2 (en) * | 2007-04-11 | 2010-10-19 | Applied Materials, Inc. | Pad conditioner |
CN101327578A (zh) * | 2007-06-22 | 2008-12-24 | 钻面奈米科技股份有限公司 | 研磨工具及其制造方法 |
JP5311178B2 (ja) * | 2007-10-15 | 2013-10-09 | 株式会社ニコン | 研磨装置及び研磨装置における研磨パッドのドレス方法 |
US8382557B2 (en) * | 2007-11-14 | 2013-02-26 | Saint-Gobain Abrasives, Inc. | Chemical mechanical planarization pad conditioner and methods of forming thereof |
WO2009114413A1 (en) | 2008-03-10 | 2009-09-17 | Morgan Advanced Ceramics, Inc. | Non-planar cvd diamond-coated cmp pad conditioner and method for manufacturing |
JP2010125567A (ja) * | 2008-11-28 | 2010-06-10 | Mitsubishi Materials Corp | Cmpパッドコンディショナー |
US20100186479A1 (en) | 2009-01-26 | 2010-07-29 | Araca, Inc. | Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discs |
KR101091030B1 (ko) * | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | 감소된 마찰력을 갖는 패드 컨디셔너 제조방법 |
-
2011
- 2011-12-15 US US13/326,464 patent/US20120171935A1/en not_active Abandoned
- 2011-12-20 WO PCT/US2011/065970 patent/WO2012088004A2/en unknown
- 2011-12-20 JP JP2013546301A patent/JP6022477B2/ja not_active Expired - Fee Related
- 2011-12-20 SG SG2013037270A patent/SG190811A1/en unknown
- 2011-12-20 EP EP11832158.7A patent/EP2655015A2/en not_active Withdrawn
- 2011-12-20 AU AU2011349393A patent/AU2011349393B2/en not_active Ceased
- 2011-12-20 KR KR1020137015870A patent/KR101924241B1/ko active IP Right Grant
- 2011-12-20 CN CN201180061545.8A patent/CN103269831B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20130132480A (ko) | 2013-12-04 |
US20120171935A1 (en) | 2012-07-05 |
CN103269831B (zh) | 2017-06-09 |
WO2012088004A3 (en) | 2012-12-13 |
SG190811A1 (en) | 2013-07-31 |
WO2012088004A2 (en) | 2012-06-28 |
EP2655015A2 (en) | 2013-10-30 |
AU2011349393B2 (en) | 2016-11-10 |
AU2011349393A1 (en) | 2013-06-06 |
JP6022477B2 (ja) | 2016-11-09 |
CN103269831A (zh) | 2013-08-28 |
JP2014504458A (ja) | 2014-02-20 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant |