KR101924233B1 - 밀봉용 에폭시 수지 조성물 및 전자 부품 장치 - Google Patents

밀봉용 에폭시 수지 조성물 및 전자 부품 장치 Download PDF

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Publication number
KR101924233B1
KR101924233B1 KR1020110144162A KR20110144162A KR101924233B1 KR 101924233 B1 KR101924233 B1 KR 101924233B1 KR 1020110144162 A KR1020110144162 A KR 1020110144162A KR 20110144162 A KR20110144162 A KR 20110144162A KR 101924233 B1 KR101924233 B1 KR 101924233B1
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KR
South Korea
Prior art keywords
group
epoxy resin
mass
resin composition
formula
Prior art date
Application number
KR1020110144162A
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English (en)
Korean (ko)
Other versions
KR20120080128A (ko
Inventor
겐지 다나카
미츠요시 하마다
후미오 후루사와
Original Assignee
히타치가세이가부시끼가이샤
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Publication of KR20120080128A publication Critical patent/KR20120080128A/ko
Application granted granted Critical
Publication of KR101924233B1 publication Critical patent/KR101924233B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020110144162A 2011-01-06 2011-12-28 밀봉용 에폭시 수지 조성물 및 전자 부품 장치 KR101924233B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011001130A JP5630652B2 (ja) 2011-01-06 2011-01-06 封止用エポキシ樹脂成形材料および電子部品装置
JPJP-P-2011-001130 2011-01-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180145908A Division KR102013533B1 (ko) 2011-01-06 2018-11-23 밀봉용 에폭시 수지 조성물 및 전자 부품 장치

Publications (2)

Publication Number Publication Date
KR20120080128A KR20120080128A (ko) 2012-07-16
KR101924233B1 true KR101924233B1 (ko) 2018-11-30

Family

ID=46474716

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020110144162A KR101924233B1 (ko) 2011-01-06 2011-12-28 밀봉용 에폭시 수지 조성물 및 전자 부품 장치
KR1020180145908A KR102013533B1 (ko) 2011-01-06 2018-11-23 밀봉용 에폭시 수지 조성물 및 전자 부품 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020180145908A KR102013533B1 (ko) 2011-01-06 2018-11-23 밀봉용 에폭시 수지 조성물 및 전자 부품 장치

Country Status (5)

Country Link
JP (1) JP5630652B2 (ja)
KR (2) KR101924233B1 (ja)
CN (2) CN106085316B (ja)
MY (1) MY161129A (ja)
TW (2) TWI554538B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768023B2 (ja) 2012-08-29 2015-08-26 日東電工株式会社 電子部品封止用熱硬化性樹脂シート、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
KR20200106562A (ko) * 2012-10-26 2020-09-14 헨켈 아이피 앤드 홀딩 게엠베하 접착제 조성물
JP6263835B2 (ja) * 2012-12-13 2018-01-24 日立化成株式会社 熱硬化性樹脂成形材料及び電子部品装置
JP6246050B2 (ja) * 2014-04-14 2017-12-13 オリンパス株式会社 樹脂組成物、超音波振動子用バッキング材、超音波振動子及び超音波内視鏡
HUE051779T2 (hu) * 2015-04-30 2021-03-29 Sumitomo Bakelite Co Kapszulázó gyanta kompozíció és elektronikus alkatrész eszköz
WO2018181600A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP6500947B2 (ja) * 2017-08-10 2019-04-17 日清紡ケミカル株式会社 一液型接着剤及び燃料電池セパレータ
KR20200103756A (ko) * 2017-12-28 2020-09-02 히타치가세이가부시끼가이샤 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
JP7400473B2 (ja) * 2017-12-28 2023-12-19 株式会社レゾナック ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置
NL2021145B1 (en) * 2018-06-18 2020-01-06 Besi Netherlands Bv Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020065872A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7279333B2 (ja) * 2018-10-17 2023-05-23 株式会社レゾナック 硬化性樹脂組成物用添加剤、硬化性樹脂組成物及び電子部品装置
KR102669548B1 (ko) * 2021-03-31 2024-05-29 스미또모 베이크라이트 가부시키가이샤 봉지용 수지 조성물 및 이것을 이용한 전자 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089607A (ja) * 2003-09-17 2005-04-07 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2010242074A (ja) * 2009-03-19 2010-10-28 Nippon Soda Co Ltd 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2985701B2 (ja) * 1995-01-27 1999-12-06 松下電工株式会社 液状エポキシ樹脂組成物
JP2003286395A (ja) * 2002-03-28 2003-10-10 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料並びに半導体装置
US8623942B2 (en) * 2009-03-11 2014-01-07 Nippon Soda Co., Ltd. Epoxy resin composition, curing agent, and curing accelerator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089607A (ja) * 2003-09-17 2005-04-07 Sumitomo Bakelite Co Ltd 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2010242074A (ja) * 2009-03-19 2010-10-28 Nippon Soda Co Ltd 新規な包接錯体、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物

Also Published As

Publication number Publication date
MY161129A (en) 2017-04-14
TW201241029A (en) 2012-10-16
TWI554538B (zh) 2016-10-21
CN106085316A (zh) 2016-11-09
TWI589617B (zh) 2017-07-01
JP5630652B2 (ja) 2014-11-26
KR102013533B1 (ko) 2019-08-22
JP2012140566A (ja) 2012-07-26
TW201619230A (zh) 2016-06-01
KR20120080128A (ko) 2012-07-16
CN102585438A (zh) 2012-07-18
CN106085316B (zh) 2020-03-13
CN102585438B (zh) 2016-07-06
KR20180131517A (ko) 2018-12-10

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