KR101924233B1 - Epoxy resin composition for encapsulation and electronic component device - Google Patents

Abstract

(A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a benzophenone derivative having at least one phenolic hydroxyl group in one molecule, . The content of the benzophenone derivative having at least one phenolic hydroxyl group in the molecule (C) is preferably 0.1% by mass or more and 1.0% by mass or less, more preferably the total amount of the silane compound (D) Is more preferable.

Description

[0001] EPOXY RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE [0002]

The present invention relates to an epoxy resin composition for sealing, and an electronic component device having an element sealed with the epoxy resin composition for sealing.

BACKGROUND ART Conventionally, epoxy resin compositions for sealing have been widely used in the field of sealing electronic components such as transistors and ICs. This is because the epoxy resin can balance electric characteristics, moisture resistance, heat resistance, mechanical properties, adhesiveness with the insert product, and the like. Particularly, the combination of the orthocresol novolak type epoxy resin and the novolak type phenol curing agent is excellent in balance and becomes the mainstream of the base resin of the sealing composition.

BACKGROUND ART [0002] In recent years, with the miniaturization, light weight, and high performance of electronic devices, mounting density has been increased, and electronic component devices have been made to be surface mount type packages from conventional pin insertion type packages. In the case of attaching the semiconductor device to the wiring board, since the pins are inserted into the wiring board in the conventional pin insertion type package and then soldered from the back side of the wiring board, the package is not directly exposed to high temperature. However, in the surface mount type package, the package is exposed to the soldering temperature because the whole semiconductor device is processed in a solder bath, a reflow apparatus, or the like. As a result, when the package is moisture-absorbed, there is a problem that the moisture content rapidly expands at the time of soldering, peeling of the adhesive interface or cracking of the package occurs, thereby lowering the reliability of the package at the time of mounting.

As a countermeasure for solving the above problem, there has been adopted a method in which the IC is damp-proofed in order to reduce the moisture content in the semiconductor device, or the IC is dried sufficiently before mounting the IC on the wiring board. However, these methods are time consuming and costly.

Another measure is to increase the content of the filler in the epoxy resin composition for sealing. In this method, however, the moisture content of the sealing portion in the semiconductor device is reduced, but there is a problem that the flowability of the sealing epoxy resin composition is significantly lowered. When the fluidity of the epoxy resin composition for sealing is low, problems such as generation of gold wire, pore, pinhole, and the like occur at the time of molding.

Japanese Patent Application Laid-Open No. 06-224328 discloses a resin composition for semiconductor encapsulation having a particle size distribution of a filler compounded with an epoxy resin within a specific range. According to the resin composition for semiconductor encapsulation, the content of the filler is increased without impairing the fluidity, so that the thermal expansion property, the heat conduction property, the moisture absorption resistance and the bending strength are improved.

Japanese Patent Application Laid-Open No. 09-165433 discloses a method for producing an epoxy resin by reacting polyhydric phenols with epihalohydrin, wherein a mixture of dihydroxybenzophenone and other polyhydric phenols A method for producing an epoxy resin is disclosed. In the present invention, an epoxy resin composition is prepared by using dihydroxybenzophenone in the step of synthesizing an epoxy resin, and mixing the obtained epoxy resin with phenol novolak resin, silica powder and the like. This epoxy resin composition is excellent in curability and fluidity, and is not crystalline.

In the invention disclosed in Japanese Patent Application Laid-Open No. 09-165433, the curability and fluidity are improved, but it has been found that the adhesiveness with the metal at a high temperature is sometimes lowered. From the viewpoint of improving the flowability downward, it is desired to improve the adhesiveness to metal at high temperature.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an epoxy resin composition for sealing which has high adhesiveness to metal at high temperature and excellent flowability, and an electronic component device provided with the sealed element .

The present invention relates to the following.

(1) An epoxy resin composition for sealing comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a benzophenone derivative having at least one phenolic hydroxyl group in one molecule.

(2) The epoxy resin composition for sealing according to (1), wherein the content of the benzophenone derivative having at least one phenolic hydroxyl group in the molecule (C) is 0.1% by mass or more and 1.0%

(3) The epoxy resin composition for sealing as described in (1) or (2) above, which further comprises (D) a silane compound.

(4) The epoxy resin composition for sealing according to any one of (1) to (3), further containing (E) a curing accelerator.

(5) The epoxy resin composition for sealing according to any one of (1) to (4), further comprising (F) an inorganic filler.

(6) An electronic component device comprising an element sealed by the sealing epoxy resin composition according to any one of (1) to (5).

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an epoxy resin composition for sealing which has high adhesiveness to metal at high temperature and excellent flow resistance, and an electronic component device having the element sealed by the composition.

Hereinafter, the present invention will be described in detail.

In the present specification, " to " represents a range including the numerical values described before and after each as a minimum value and a maximum value. In the present specification, the amount of each component in the composition means the total amount of the plural substances in the composition, unless otherwise specified, when a plurality of substances corresponding to each component are present in the composition.

≪ Epoxy resin composition for sealing >

The epoxy resin composition for sealing according to the present invention comprises (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent and (C) a benzophenone derivative having at least one phenolic hydroxyl group in one molecule do. The epoxy resin composition for sealing of the present invention is solid at room temperature (25 캜).

Hereinafter, each component constituting the epoxy resin composition for sealing according to the present invention will be described.

[(A) Epoxy resin]

The epoxy resin containing two or more epoxy groups in the molecule (A) used in the present invention is not particularly limited as long as it is generally used in a sealing epoxy resin composition. Cresol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, alpha -olefin such as phenol novolak type epoxy resin, orthocresol novolak type epoxy resin, epoxy resin having a triphenyl methane skeleton, Novolac resins obtained by condensation or co-condensation of phenols such as naphthol,? -Naphthol and dihydroxynaphthalene with compounds having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde in the presence of an acid catalyst Epoxidized; Diglycidyl ethers such as alkyl-substituted, aromatic-ring-substituted or unsubstituted bisphenol A, bisphenol F, bisphenol S, biphenol and thiodiphenol; Stilbene type epoxy resin; Hydroquinone type epoxy resin; Glycidyl ester type epoxy resins obtained by reaction of polybasic acids such as phthalic acid and dimeric acid with epichlorohydrin; Glycidylamine-type epoxy resins obtained by reacting polyamines such as diaminodiphenylmethane and isocyanuric acid with epichlorohydrin; An epoxide of a cocondensation resin of dicyclopentadiene and a phenol; An epoxy resin having a naphthalene ring; Phenol-aralkyl resins synthesized from phenols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl; Epoxides of aralkyl type phenol resins such as naphthol and aralkyl resins; Trimethylol propane-type epoxy resin; Terpene-modified epoxy resins; A linear aliphatic epoxy resin obtained by oxidizing an olefin bond with peracetic acid such as peracetic acid; And alicyclic epoxy resins. These one species may be used singly or two or more species may be used in combination.

Among them, from the viewpoint of both fluidity and curability, it is preferable to contain a biphenyl type epoxy resin which is an alkyl substituted, aromatic ring substituted or unsubstituted diglycidyl ether of biphenol, and from the viewpoint of curability, a novolak type epoxy It is preferable to contain a naphthalene type epoxy resin and / or a triphenylmethane type epoxy resin from the viewpoint of heat resistance and low bending property. From the viewpoint of both fluidity and flame retardancy, Or a bisphenol F type epoxy resin which is a diglycidyl ether of unsubstituted bisphenol F. From the viewpoints of both fluidity and reflow property, it is preferable to contain an alkyl substituent, an aromatic ring substituted or unsubstituted thiodiphenol It is preferable to contain a thiodiphenol type epoxy resin which is diglycidyl ether, From the viewpoint of compatibility of the flame retardancy, it is preferable that it contains an epoxide of a phenol / aralkyl resin synthesized from an alkyl substituent, an aromatic ring substituted or unsubstituted phenol and bis (methoxymethyl) biphenyl, From the viewpoint of compatibility, it is preferable to contain an epoxide of naphthol-aralkyl resin synthesized from alkyl-substituted, aromatic-ring-substituted or unsubstituted naphthols and dimethoxyparaxylene.

Examples of the biphenyl type epoxy resin include an epoxy resin represented by the following formula (I).

(I)

In the formula (I), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms. R ¹ to R ⁸ may be all the same or different. n represents an integer of 0 to 3;

The biphenyl type epoxy resin represented by the above formula (I) is obtained by reacting a biphenol compound with epichlorohydrin by a known method.

Examples of R ¹ to R ⁸ in the general formula (I) include, for example, independently a hydrogen atom; An alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, isobutyl group and tert-butyl group; An alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group and a butenyl group. Among them, a hydrogen atom or a methyl group is preferable.

Examples of such an epoxy resin include 4,4'-bis (2,3-epoxypropoxy) biphenyl or 4,4'-bis (2,3-epoxypropoxy) -3,3 ' '- tetramethylbiphenyl as a main component, epichlorohydrin with 4,4'-biphenol or 4,4' - (3,3 ', 5,5'-tetramethyl) biphenol And an epoxy resin to be obtained.

Among them, an epoxy resin containing 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl as a main component is preferable. As such an epoxy resin, a trade name YX-4000 manufactured by Mitsubishi Chemical Corporation (formerly Japan Epoxy Resin Co., Ltd.) is available as a commercial product.

When the biphenyl type epoxy resin is used, the content thereof is preferably 20% by mass or more, more preferably 30% by mass or more, further preferably 50% by mass or more in the total amount of the epoxy resin Do.

Examples of the thiodiphenol type epoxy resin include an epoxy resin represented by the following formula (II).

≪

In the formula (II), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms. R ¹ to R ⁸ may be all the same or different. n represents an integer of 0 to 3;

The thiophenol type epoxy resin represented by the above formula (II) is obtained by reacting thiodiphenol compound with epichlorohydrin by a known method.

Examples of R ¹ to R ⁸ in the formula (II) include, for example, independently a hydrogen atom; An alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, isobutyl group and tert-butyl group; An alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group and a butenyl group. Among them, a hydrogen atom, a methyl group or a tert-butyl group is preferable.

Examples of such epoxy resins include epoxy resins containing, as a main component, diglycidyl ether of 4,4'-dihydroxydiphenyl sulfide, 2,2 ', 5,5'-tetramethyl-4,4' -Dihydroxydiphenyl sulfide diglycidyl ether, a 2,2'-dimethyl-4,4'-dihydroxy-5,5'-di-tert-butyl diphenylsulfide And an epoxy resin containing diglycidyl ether as a main component in the feed.

Among them, an epoxy resin mainly composed of an epoxy resin containing diglycidyl ether of 2,2'-dimethyl-4,4'-dihydroxy-5,5'-di-tert-butyldiphenyl sulfide as a main component . As such an epoxy resin, a trade name YSLV-120TE available from Shin-Nittetsu Kagaku Co., Ltd. is available as a commercial product.

When the thiodiphenol type epoxy resin is used, the content thereof is preferably 20 mass% or more, more preferably 30 mass% or more, and more preferably 50 mass% or more in the total amount of the epoxy resin desirable.

Examples of the bisphenol F type epoxy resin include an epoxy resin represented by the following formula (III).

(III)

In formula (III), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms. R ¹ to R ⁸ may be all the same or different. n represents an integer of 0 to 3;

The bisphenol F type epoxy resin represented by the above formula (III) is obtained by reacting bisphenol F compound with epichlorohydrin by a known method.

Examples of R ¹ to R ⁸ in formula (III) include, for example, independently a hydrogen atom; An alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, isobutyl group and tert-butyl group; An alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group and a butenyl group. Among them, a hydrogen atom or a methyl group is preferable.

Examples of such epoxy resins include epoxy resins containing, as a main component, diglycidyl ether of 4,4'-methylenebis (2,6-dimethylphenol), 4,4'-methylenebis (2,3,6- Trimethylphenol), and an epoxy resin containing, as a main component, diglycidyl ether of 4,4'-methylenebisphenol. Among them, an epoxy resin containing a diglycidyl ether of 4,4'-methylenebis (2,6-dimethylphenol) as a main component is preferable. As such an epoxy resin, a trade name YSLV-80XY available from Shin-Nittsu Chemical Co., Ltd. is available as a commercial product.

When the above-mentioned bisphenol F type epoxy resin is used, the content thereof is preferably 20% by mass or more, more preferably 30% by mass or more, further preferably 50% by mass or more in the total amount of the epoxy resin Do.

Examples of the novolak-type epoxy resin include an epoxy resin represented by the following formula (IV).

(IV)

In formula (IV), each R independently represents a hydrogen atom; Or a substituted or unsubstituted monovalent group of 1 to 10 carbon atoms consisting of an element selected from a carbon atom, a hydrogen atom and an oxygen atom, and n represents an integer of 0 to 10.

The novolak type epoxy resin represented by the above formula (IV) is obtained by reacting novolak type phenol resin with epichlorohydrin.

In the formula (IV), each R independently represents a hydrogen atom; An alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isopropyl group and isobutyl group; An alkoxy group having 1 to 10 carbon atoms such as a methoxy group, an ethoxy group, a propoxy group and a butoxy group is preferable, and a hydrogen atom or a methyl group is more preferable. n is preferably an integer of 0 to 3.

Among the novolak type epoxy resins represented by the above formula (IV), orthocresol novolak type epoxy resins are preferable. As such epoxy resin, N500P-1, a product of Dainippon Ink and Chemicals, Inc., is available as a commercial product.

When a novolak type epoxy resin is used, the content thereof is preferably 20% by mass or more, more preferably 30% by mass or more, in the total amount of the epoxy resin in order to exhibit its performance.

Examples of the naphthalene type epoxy resin include an epoxy resin represented by the following formula (V). Examples of the triphenylmethane type epoxy resin include an epoxy resin represented by the following formula (VI).

(V)

In the formula (V), each of R ¹ to R ³ independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. R ¹ to R ³ may be all the same or different. p is 1 or 0, m and n are each independently an integer of 0 to 11, and m, n and m are integers from 1 to 11 and (m + p) n is selected. i represents an integer of 0 to 3, j represents an integer of 0 to 2, and k represents an integer of 0 to 4.

R ¹ to R ³ in the formula (V) are each independently an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a tert-butyl group; An alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group and a butenyl group. Among them, a methyl group is more preferable.

≪ Formula (VI)

In the general formula (VI), each R independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms. n represents an integer of 1 to 10;

Each R in the formula (VI) independently represents a hydrogen atom; An alkyl group having 1 to 10 carbon atoms such as methyl group, ethyl group, propyl group, butyl group, isopropyl group, isobutyl group and tert-butyl group; An alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group and a butenyl group. Among them, a hydrogen atom or a methyl group is more preferable. n is preferably an integer of 0 to 3.

As the naphthalene type epoxy resin represented by the above-mentioned general formula (V), a random copolymer randomly including m constituent units and n constituent units, an alternating copolymer alternately containing, a regularly contained copolymer, a block Copolymers. Any one of them may be used alone, or two or more of them may be used in combination.

The triphenylmethane type epoxy resin represented by the above formula (VI) is not particularly limited, but a salicylaldehyde type epoxy resin is preferable.

Any of these naphthalene type epoxy resins and triphenylmethane type epoxy resins may be used singly or in combination. When at least one of a naphthalene type epoxy resin and a triphenylmethane type epoxy resin is used, the content thereof is preferably 20 mass% or more, more preferably 30 mass% or more, in the total amount of the epoxy resin in order to exhibit its performance By mass, and more preferably 50% by mass or more.

Examples of the epoxide of the phenol-aralkyl resin include an epoxy resin represented by the following formula (VII) and an epoxy resin represented by the following formula (VIII).

(VII)

In formula (VII), R ¹ to R ⁴ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. R ¹ to R ⁴ may be all the same or different. And each R ⁵ independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. When a plurality of R < ⁵ > exist, all may be the same or different. i represents an integer of 0 to 3, and n represents an integer of 0 to 10.

≪ Formula (VIII)

In formula (VIII), each of R ¹ to R ⁸ independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. R ¹ to R ⁸ may be all the same or different. And each R ⁹ independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. When a plurality of R < ⁹ > exist, they may all be the same or different. i represents an integer of 0 to 3, and n represents an integer of 0 to 10.

The epoxide of the phenol / aralkyl resin represented by the formula (VII) can be produced by reacting epichlorohydrin with a phenol / aralkyl resin synthesized from an alkyl-substituted, aromatic-ring-substituted or unsubstituted phenol and dimethoxyparaxylene by a known method . ≪ / RTI > The epoxide of the phenol-aralkyl resin having a biphenylene skeleton represented by the above-mentioned formula (VIII) is preferably a phenol-aralkyl (meth) acrylate synthesized from an alkyl-substituted, aromatic-ring-substituted or unsubstituted phenol and bis And then reacting the resin with epichlorohydrin by a known method.

Examples of the substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms represented by R ¹ to R ⁵ and R ¹ to R ⁹ in the formula (VIII) include methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, pentyl, hexyl, octyl, decyl or dodecyl; A cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, and a cyclohexenyl group; An aryl group-substituted alkyl group such as a benzyl group or a phenethyl group; An alkoxy-substituted alkyl group such as a methoxy group-substituted alkyl group, an ethoxy group-substituted alkyl group or a butoxy-group-substituted alkyl group; Amino-substituted alkyl groups such as aminoalkyl groups, dimethylaminoalkyl groups and diethylaminoalkyl groups; A hydroxyl-substituted alkyl group; An unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; An alkyl group-substituted aryl group such as a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a tert-butylphenyl group and a dimethylnaphthyl group; An alkoxy group-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, or a methoxynaphthyl group; Amino group-substituted aryl groups such as dimethylamino group and diethylamino group; A hydroxyl-substituted aryl group, and the like.

Among them, R ¹ to R ⁴ in the formula (VII) and R ¹ to R ⁸ in the formula (VIII) are each independently preferably a hydrogen atom or a methyl group. As R ⁵ in the formula (VII) and R ⁹ in the formula (VIII), a methyl group is preferable.

In the formulas (VII) and (VIII), i independently represents an integer of 0 to 3, preferably 0 or 1.

Each of n in the formulas (VII) and (VIII) independently represents an integer of 0 to 10, more preferably 6 or less on average. As such an epoxy resin, the formula VII is a commercial product, NC-2000L, manufactured by Nippon Kayaku Co., Ltd., and VIII, a commercially available product, NC-3000S, manufactured by Nippon Kayaku Co., Ltd. is available.

When a phenol-aralkyl resin is used, the content thereof is preferably 20% by mass or more, more preferably 30% by mass or more, in the total amount of the epoxy resin in order to exhibit its performance.

In addition, from the viewpoints of both flame retardancy, flowability and fluidity, it is preferable to contain the epoxy resin represented by the above formula (I), and among these, R ¹ to R ^{8 in} the formula (VIII) ¹ to R &^lt; ⁸ > are hydrogen atoms and n = 0. In addition, particularly, the content ratio by mass thereof is preferably in the range of 50/50 to 5/95, more preferably 40/60 to 10/90, and most preferably 30/70 to 15/85 . As a compound satisfying such a content ratio by mass, CER-3000L (trade name, manufactured by Nippon Kayaku Co., Ltd.) is available as a commercial product.

Examples of the epoxy compound of the naphthol-aralkyl resin include an epoxy resin represented by the following formula (IX).

<Formula IX>

In the formula (IX), each R independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. The plural Rs may be all the same or different. i represents an integer of 0 to 3; X each independently represent a divalent organic group having an aromatic ring; and n represents an integer of 0 to 10.

The epoxide of the naphthol-aralkyl resin represented by the above general formula (IX) can be obtained by reacting a naphthol-aralkyl resin synthesized from an alkyl-substituted, aromatic ring-substituted or unsubstituted naphthol and dimethoxyparaxylene or bis (methoxymethyl) Is obtained by reacting epichlorohydrin with a known method.

X is, for example, independently an arylene group such as a phenylene group, a biphenylene group or a naphthylene group; Alkyl-substituted arylene groups such as tolylene group; An alkoxy group-substituted arylene group; An aralkyl group-substituted arylene group; A bivalent group derived from an aralkyl group such as a benzyl group or a phenethyl group; And a bivalent group containing an arylene group such as a xylylene group. Among them, a phenylene group or a biphenylene group is preferably independently selected from the viewpoint of compatibility between flame retardancy and storage stability.

Examples of R in formula (IX) include, but are not limited to, methyl, ethyl, propyl, isopropyl, n-butyl, sec- A straight chain alkyl group such as a dodecyl group; A cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, and a cyclohexenyl group; An aryl group-substituted alkyl group such as a benzyl group or a phenethyl group; An alkoxy-substituted alkyl group such as a methoxy group-substituted alkyl group, an ethoxy group-substituted alkyl group or a butoxy-group-substituted alkyl group; Amino-substituted alkyl groups such as aminoalkyl groups, dimethylaminoalkyl groups and diethylaminoalkyl groups; A hydroxyl-substituted alkyl group; An unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; An alkyl group-substituted aryl group such as a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a tert-butylphenyl group and a dimethylnaphthyl group; An alkoxy group-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, or a methoxynaphthyl group; Amino group-substituted aryl groups such as dimethylamino group and diethylamino group; A hydroxyl-substituted aryl group, and the like. Among them, R in formula (IX) is preferably independently a methyl group, and i is preferably 1 or 2. Examples of the compound represented by the formula (IX) include an epoxy compound of a naphthol-alkyl resin represented by the following formula (X) or (XI).

n represents an integer of 0 to 10, more preferably 6 or less on average. As an epoxy resin represented by the following formula (X), a commercial product ESN-375 (trade name) manufactured by Shin-Nittsu Chemical Co., Ltd. may be mentioned. As the epoxy resin represented by the following formula (XI), a commercial product ESN-175 (trade name, manufactured by Shin-Nittsu Chemical Co., Ltd.) may be mentioned.

When the epoxide of the naphthol-aralkyl resin is used, the content thereof is preferably 20% by mass or more, more preferably 30% by mass or more, more preferably 50% by mass or more of the total amount of the epoxy resin Is more preferable.

(X)

In the formula (X), each X independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

(XI)

In the formula (XI), each X independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

Epoxy resins such as biphenyl type epoxy resin, thiodiphenol type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, naphthalene type epoxy resin, triphenylmethane type epoxy resin, epoxidized phenol / aralkyl resin and naphthol The epoxide of the aralkyl resin may be used singly or in combination of two or more kinds. When two or more of them are used in combination, the content is preferably 50 mass% or more, more preferably 60 mass% or more, and even more preferably 80 mass% or more, in the total amount of the epoxy resin. Among them, biphenyl type epoxy resin is preferably used in an amount of 50 mass% or more, more preferably 60 mass% or more, and further preferably 80 mass% or more in the entire epoxy resin. Further, it is preferable to use the above epoxy resin other than the biphenyl type epoxy resin in combination.

[(B) Curing agent]

The (B) curing agent used in the present invention is not particularly limited as long as it is generally used in the epoxy resin composition for sealing. Examples thereof include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, thiodiphenol, aminophenol,? -Naphthol,? -Naphthol and dihydroxynaphthalene, A novolak type phenol resin obtained by condensing or co-condensing a compound having an aldehyde group such as benzaldehyde and salicylaldehyde in the presence of an acidic catalyst; Aralkyl-type phenol resins such as phenol-aralkyl resins and naphthol-aralkyl resins synthesized from phenols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl; A copolymerized phenol-aralkyl resin in which a phenol novolac structure and a phenol-aralkyl structure are randomly, repeatedly or alternatively repeated; Para-xylylene and / or meta-xylylene-modified phenolic resins; Melamine modified phenolic resins; Terpene-modified phenolic resins; Dicyclopentadiene modified phenolic resins; Cyclopentadiene modified phenolic resins; Polycyclic aromatic ring-modified phenol resins, and the like. These may be used singly or in combination of two or more.

Among them, phenol-aralkyl resins, copolymerized phenol-aralkyl resins and naphthol-aralkyl resins are preferable from the viewpoints of fluidity, flame retardance and flow resistance. From the viewpoint of heat resistance, low expansion ratio and low bending property, triphenylmethane type phenol resins And novolac-type phenol resin is preferable from the viewpoint of curability. And at least one of these phenolic resins is preferably contained.

As the phenol-aralkyl resin, for example, a resin represented by the following formula (XII) may be mentioned.

(XII)

In the formula (XII), each R independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. The plural Rs may be all the same or different. each independently represents an integer of 0 to 3; X is independently a divalent organic group having an aromatic ring; and n represents an integer of 0 to 10.

Examples of R in the above-mentioned formula (XII) include, independently of each other, a methyl group, an ethyl group, a propyl group, an isopropyl group, an n- butyl group, a sec-butyl group, , A straight chain alkyl group such as a dodecyl group; A cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, and a cyclohexenyl group; An aryl group-substituted alkyl group such as a benzyl group or a phenethyl group; An alkoxy-substituted alkyl group such as a methoxy group-substituted alkyl group, an ethoxy group-substituted alkyl group or a butoxy-group-substituted alkyl group; Amino-substituted alkyl groups such as aminoalkyl groups, dimethylaminoalkyl groups and diethylaminoalkyl groups; A hydroxyl-substituted alkyl group; An unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; An alkyl group-substituted aryl group such as a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a tert-butylphenyl group and a dimethylnaphthyl group; An alkoxy group-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, or a methoxynaphthyl group; Amino group-substituted aryl groups such as dimethylamino group and diethylamino group; A hydroxyl-substituted aryl group, and the like.

Among them, methyl group is preferable as R in formula (XII). In the formula (XII), i independently represents an integer of 0 to 3, preferably 1 or 2.

X in the formula (XII) independently represents a group having an aromatic ring. For example, an arylene group such as a phenylene group, a biphenylene group, or a naphthylene group; Alkyl-substituted arylene groups such as tolylene group; An alkoxy group-substituted arylene group; A bivalent group derived from an aralkyl group such as a benzyl group or a phenethyl group; An aralkyl group-substituted arylene group; And a bivalent group containing an arylene group such as a xylylene group.

Among them, from the viewpoints of flame retardancy, fluidity and curability, X is preferably a substituted or unsubstituted phenylene group, and for example, the phenol aralkyl resin represented by the following formula (XIII) may be mentioned . In addition, from the viewpoint of compatibility between flame retardancy and bottom flowability, X is preferably independently a substituted or unsubstituted biphenylene group. For example, the above-mentioned formula (XII) includes phenol aralkyl resins represented by the following formula .

n represents an integer of 0 to 10, more preferably 6 or less on average.

&Lt; Formula (XIII)

In the formula (XIII), n represents an integer of 0 to 10.

<Formula XIV>

In the formula (XIV), n represents an integer of 0 to 10.

As the phenol / aralkyl resin represented by the above formula (XIII), a commercial product, XLC, manufactured by Mitsui Chemicals, Inc., may be mentioned. As the biphenylene skeleton-containing phenol-aralkyl resin represented by the formula (XIV), a commercial product, MEH-7851 manufactured by Meiwa Kasei Kabushiki Kaisha may be mentioned.

When the phenol-aralkyl resin is used, the content of the phenol-aralkyl resin is preferably 20% by mass or more, more preferably 30% by mass or more, and most preferably 50% by mass or more in the total amount of the curing agent .

Examples of the naphthol-aralkyl resin include a resin represented by the following formula (XV).

(XV)

In the formula (XV), each R independently represents a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms. The plural Rs may be all the same or different. each independently represents an integer of 0 to 3; X is independently a divalent organic group having an aromatic ring; and n represents an integer of 0 to 10.

Examples of R in the above general formula (XV) include, independently of each other, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, pentyl group, hexyl group, , A straight chain alkyl group such as a dodecyl group; A cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, and a cyclohexenyl group; An aryl group-substituted alkyl group such as a benzyl group or a phenethyl group; An alkoxy-substituted alkyl group such as a methoxy group-substituted alkyl group, an ethoxy group-substituted alkyl group or a butoxy-group-substituted alkyl group; Amino-substituted alkyl groups such as aminoalkyl groups, dimethylaminoalkyl groups and diethylaminoalkyl groups; A hydroxyl-substituted alkyl group; An unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; An alkyl group-substituted aryl group such as a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a tert-butylphenyl group and a dimethylnaphthyl group; An alkoxy group-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, or a methoxynaphthyl group; Amino group-substituted aryl groups such as dimethylamino group and diethylamino group; A hydroxyl-substituted aryl group, and the like.

Among them, methyl group is preferable as R in the formula (XV). In the formula (XV), i independently represents an integer of 0 to 3, preferably 1 or 2.

X in the above formula (XV) independently represents a divalent organic group having an aromatic ring. For example, an arylene group such as a phenylene group, a biphenylene group, or a naphthylene group; Alkyl-substituted arylene groups such as tolylene group; An alkoxy group-substituted arylene group; An aralkyl group-substituted arylene group; A bivalent group derived from an aralkyl group such as a benzyl group or a phenethyl group; And a bivalent group containing an arylene group such as a xylylene group. Among them, from the viewpoints of storage stability and flame retardancy, X is preferably independently a substituted or unsubstituted phenylene group or a biphenylene group, more preferably a phenylene group, and for example, in the above formula (XV) And naphthol-aralkyl resins.

n represents an integer of 0 to 10, more preferably 6 or less on average.

<Formula XVI>

In the formula (XVI), n represents an integer of 0 to 10.

(XVII)

In the formula (XVII), n represents an integer of 0 to 10.

As the naphthol-aralkyl resin represented by the above formula (XVI), SN-475, a product of Shin-Nittsu Chemical Co., Ltd., is commercially available. As the naphthol-aralkyl resin represented by the above formula (XVII), a commercial product, SN-170, manufactured by Shin-Nittsu Chemical Co., Ltd. may be mentioned.

When the naphthol-aralkyl resin is used, the content of the naphthol-aralkyl resin is preferably 20% by mass or more, more preferably 30% by mass or more, and still more preferably 50% by mass or more in the total amount of the curing agent .

The phenol-aralkyl resin represented by the general formula (XII) and the naphthol-aralkyl resin represented by the general formula (XV) are preferably premixed with acenaphthylene in part or all in terms of flame retardancy. Acenaphthylene can be obtained by dehydrogenating acenaphthene, but commercially available products can also be used. It is also possible to use a polymer of acenaphthylene or a polymer of acenaphthylene and other aromatic olefins instead of acenaphthylene.

A method for obtaining a polymer of acenaphthylene or a polymer of acenaphthylene and other aromatic olefins includes radical polymerization, cationic polymerization, and anionic polymerization. In the polymerization, a conventionally known catalyst may be used, but it may be carried out by heating only without using a catalyst. In this case, the polymerization temperature is preferably 80 to 160 ° C, and more preferably 90 to 150 ° C. The obtained polymer of acenaphthylene or the polymer of acenaphthylene and other aromatic olefin preferably has a softening point of 60 to 150 캜, more preferably 70 to 130 캜. When the temperature is higher than 60 ° C, permeation during molding tends to be suppressed and moldability tends to be excellent. When the temperature is lower than 150 ° C, compatibility with the resin tends to be improved.

Examples of other aromatic olefins copolymerized with acenaphthylene include styrene,? -Methylstyrene, indene, benzothiophene, benzofuran, vinylnaphthalene, vinylbiphenyl, and alkyl substituents thereof. In addition to the above-mentioned aromatic olefins, aliphatic olefins may be used in combination within the range that does not interfere with the effect of the present invention. Examples of the aliphatic olefins include (meth) acrylic acid and esters thereof, maleic anhydride, itaconic anhydride, fumaric acid and esters thereof. The amount of these aliphatic olefins to be used is preferably 20% by mass or less, more preferably 9% by mass or less, in the total amount of the polymerized monomers.

As a method of preliminarily mixing acenaphthylene with a part or all of the curing agent, there may be mentioned a method of finely pulverizing the curing agent and acenaphthylene, mixing them in a solid state with a mixer or the like, a method of uniformly dissolving them in a solvent dissolving both components A method of removing the solvent, a method of melt-mixing the curing agent and / or acenaphthylene at a temperature equal to or higher than the softening point of the acenaphthylene, and the like. Of these methods, a melt mixing method is preferable in which a uniform mixture is obtained and the incorporation of impurities is small. The premix (acenaphthylene-modified curing agent) is prepared by the above method.

The temperature condition at the time of melt mixing is not limited as long as it is the temperature above the softening point of the hardener and / or acenaphthylene. Specifically, 100 占 폚 to 250 占 폚 is preferable, and 120 占 폚 to 200 占 폚 is more preferable. The mixing time is not limited as long as the mixture is homogeneously mixed, but is preferably 1 to 20 hours, more preferably 2 to 15 hours. When the curing agent and acenaphthylene are premixed, the acenaphthylene may react with the polymerization or curing agent during the mixing.

Examples of the triphenylmethane type phenol resin include a phenol resin represented by the following formula (XVIII).

&Lt; Formula XVIII &

In the formula (XVIII), each R independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, and n represents an integer of 0 to 10.

Examples of R in the formula (XVIII) include, for example, independently a hydrogen atom; Alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group and a tert-butyl group; Alkenyl groups such as a vinyl group, an allyl group and a butenyl group; A halogenated alkyl group; An amino group-substituted alkyl group; Mercapto group-substituted alkyl groups and the like. Among them, R is preferably independently an alkyl group such as a methyl group or an ethyl group, or a hydrogen atom, more preferably a methyl group or a hydrogen atom.

When a triphenylmethane type phenolic resin is used, the content of the triphenylmethane type phenol resin is preferably 30% by mass or more, more preferably 50% by mass or more, in the total amount of the curing agent in order to exert its performance.

Examples of the novolak type phenol resin include novolak type phenol resins such as phenol resins represented by the following formula (XIX), cresol novolak resins, and the like. Among them, a novolak type phenolic resin represented by the following formula (XIX) is preferable.

(XIX)

In the formula (XIX), each R independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, and n represents an integer of 0 to 10.

Examples of R in the above formula (XIX) include, for example, independently a hydrogen atom; Alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group and a tert-butyl group; Alkenyl groups such as a vinyl group, an allyl group and a butenyl group; A halogenated alkyl group; An amino group-substituted alkyl group; Mercapto group-substituted alkyl groups and the like. Among them, R is preferably independently an alkyl group such as a methyl group or an ethyl group, or a hydrogen atom, and more preferably a hydrogen atom.

n represents an integer of 0 to 10, and an average value of 0 to 8 is preferable.

As the novolak type phenolic resin represented by the above formula (XIX), a commercial product, H-100, manufactured by Meiwa Kasei Kabushiki Kaisha, may be mentioned.

When a novolak-type phenol resin is used, the content thereof is preferably 30% by mass or more, more preferably 50% by mass or more, of the total amount of the curing agent to exhibit its performance.

As the copolymerized phenol-aralkyl resin, for example, a phenol resin represented by the following formula (XX) can be mentioned.

&Lt; Formula (XX)

In the formula (XX), each R independently represents a hydrogen atom, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms, or a hydroxyl group. The plural Rs may be all the same or different. Each X represents a divalent group independently having an aromatic ring. n and m each independently represent an integer of 0 to 10;

Examples of R in Formula XX include, for example, independently a hydrogen atom; Chain alkyl groups such as methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, pentyl group, hexyl group, octyl group, decyl group and dodecyl group; A cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group, and a cyclohexenyl group; An aryl group-substituted alkyl group such as a benzyl group or a phenethyl group; An alkoxy-substituted alkyl group such as a methoxy group-substituted alkyl group, an ethoxy group-substituted alkyl group or a butoxy-group-substituted alkyl group; Amino-substituted alkyl groups such as aminoalkyl groups, dimethylaminoalkyl groups and diethylaminoalkyl groups; A hydroxyl-substituted alkyl group; An unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; An alkyl group-substituted aryl group such as a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a tert-butylphenyl group and a dimethylnaphthyl group; An alkoxy group-substituted aryl group such as a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, or a methoxynaphthyl group; Amino group-substituted aryl groups such as dimethylamino group and diethylamino group; A hydroxyl-substituted aryl group, and the like. Among them, R is preferably independently a hydrogen atom or a methyl group.

N and m each independently represent an integer of 0 to 10, more preferably 6 or less on average.

Examples of X in the above formula (XX) include an arylene group such as a phenylene group, a biphenylene group and a naphthylene group; Alkyl-substituted arylene groups such as tolylene group; An alkoxy group-substituted arylene group; An aralkyl group-substituted arylene group; A bivalent group derived from an aralkyl group such as a benzyl group or a phenethyl group; And a bivalent group containing an arylene group such as a xylylene group. Of these, a substituted or unsubstituted phenylene group or biphenylene group is preferable from the viewpoints of storage stability and flame retardancy. As the compound represented by the formula (XX), HE-510 (trade name, manufactured by Air-Water Co., Ltd.) and the like are available as a commercial product.

The copolymerized phenol-aralkyl resin represented by the general formula (XX) includes random copolymers randomly containing m constituent units and n constituent units, alternating copolymers alternately comprising, regularly contained copolymers, As a block copolymer. Any one of them may be used alone, or two or more of them may be used in combination.

In the case of using a copolymerized phenol-aralkyl resin, the content thereof is preferably 30% by mass or more, more preferably 50% by mass or more, in the total amount of the curing agent in order to exhibit its performance.

The phenol-aralkyl resin, the naphthol-aralkyl resin, the triphenylmethane-type phenol resin, the novolak-type phenol resin and the copolymerized phenol-aralkyl resin may be used singly or in combination of two or more . When two or more kinds are used in combination, the content is preferably 50 mass% or more, more preferably 60 mass% or more, and even more preferably 80 mass% or more, in the total amount of the phenol resin.

[(C) Benzophenone derivative]

The epoxy resin composition for sealing according to the present invention contains (C) a benzophenone derivative having at least one phenolic hydroxyl group in one molecule. Thereby, a sealing epoxy resin composition having high adhesiveness to a metal at a high temperature and excellent flow resistance can be obtained.

The benzophenone derivative (C) having at least one phenolic hydroxyl group in one molecule used in the present invention is preferably a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule in the direction of substituted or unsubstituted benzophenone, naphthylphenyl ketone, dinaphthyl ketone, xanthone, Provided that at least one hydroxyl group is directly bonded to the ring. The benzophenone derivative (C) having at least one phenolic hydroxyl group in one molecule may be used singly or in combination of two or more.

Specific examples thereof include o-hydroxybenzophenone, m-hydroxybenzophenone, p-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy- 2-hydroxy-4-allyloxybenzophenone, 2,4-dihydroxybenzophenone, 4,4'-dihydroxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2 , 2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 4,4'-tetrahydroxybenzophenone, 2,3,3 ', 4,4', 5-hexahydroxybenzophenone, positional isomers and substituents thereof, and the like. Hydroxybenzophenone, p-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxybenzophenone, 2-hydroxybenzophenone, 2-hydroxybenzophenone, -Hydroxy-4-octyloxybenzophenone are preferable, and from the viewpoint of further improving the adhesiveness, 2,4-dihydroxybenzophenone, 4,4'-dihydroxybenzophenone, 2,2'-dihydro Hydroxy-4-methoxybenzophenone, and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone are preferable.

The total content of the benzophenone derivative having at least one phenolic hydroxyl group in one molecule (C) used in the present invention is preferably 0.1% by mass or more and 1.0% by mass or less in the epoxy resin composition for sealing. When the content is 0.1% by mass or more, the effect of the invention tends to be sufficiently exhibited. When the content is 1.0% by mass or less, the hardness of the epoxy resin composition for sealing tends to be sufficiently maintained.

In the present invention, the equivalent ratio of the epoxy resin (A), the curing agent (B) and the benzophenone derivative (C) having one or more phenolic hydroxyl groups in one molecule, that is, the ratio of the number of epoxy groups in the epoxy resin (B) a curing agent and (C) a ratio of a total number of hydroxyl groups in a benzophenone derivative having at least one phenolic hydroxyl group in one molecule ((B) a curing agent and (C) a benzophenone having at least one phenolic hydroxyl group in one molecule The total number of hydroxyl groups in the derivative / (A) the number of epoxy groups in the epoxy resin) is not particularly limited. In order to suppress each unreacted component to a small extent, the above-mentioned equivalent ratio is preferably set in a range of 0.5 or more and 2.0 or less, more preferably 0.6 or more and 1.3 or less. In order to obtain an epoxy resin composition for sealing which is excellent in moldability, it is more preferable to set it in the range of 0.8 or more and 1.2 or less.

[(D) Silane compound]

The molding material of the present invention may contain (D) a silane compound. (D) The silane compound is various silane compounds such as epoxy silane, mercaptosilane, amino silane, alkyl silane, ureido silane and vinyl silane. Examples of these include vinyl trichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (? -Methoxyethoxy) silane,? -Methacryloxypropyltrimethoxysilane,? -Methacryloxypropyl Methacryloxypropylmethyldimethoxysilane,? -Methacryloxypropylmethyldiethoxysilane,? -Methacryloxypropyldimethylmethoxysilane,? -Methacryloxypropyldimethylethoxysilane,? -Methacryloxypropyldimethylethoxysilane,? -Acryloxypropyltrimethoxysilane,? -Acryloxypropyltriethoxysilane,? - (3,4-epoxycyclohexyl) ethyltrimethoxysilane,? -Glycidoxypropyltrimethoxysilane,? -Glycidoxypropyltrimethoxysilane, Glycidoxypropylmethyldimethoxysilane, gamma -glycidoxypropylmethyldiethoxysilane, gamma -glycidoxypropyldimethylmethoxysilane, gamma -glycidoxypropyldimethylethoxy &lt; RTI ID = 0.0 &gt; Silane, vinyltriacetoxysilane, gamma- Aminopropyltrimethoxysilane, gamma -mercaptopropyltriethoxysilane, bis (triethoxysilylpropyl) tetrasulfide, gamma -aminopropyltrimethoxysilane, gamma -aminopropyltriethoxysilane, gamma- [ Bis (? - hydroxyethyl)] aminopropyltriethoxysilane, N -? - (aminoethyl) -? - aminopropyltriethoxysilane, N- (trimethoxysilylpropyl) ethylenediamine, isocyanato Methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane, Diphenyldimethoxysilane, diphenyldiethoxysilane, diphenylsilanediol, triphenylmethoxysilane, triphenylethoxysilane, triphenylsilanol, N -? - (N-vinylbenzylaminoethyl) -? - amino Propyl trimethoxysilane,? -Chloropropyl trimethoxysilane, hexa Anilinopropyltrimethoxysilane, 2-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, 3-tri 3- (3- (triethoxysilyl) propylamino) -N, N-diisopropylethylamine, N, Silane such as N-dimethylpropionamide, N-triethoxysilylpropyl-? - alanine methyl ester, 3- (triethoxysilylpropyl) dihydro-3,5-furandione and bis (trimethoxysilyl) An imidazole compound such as an imidazole compound, a 1H-imidazole compound, a 2-alkyl imidazole compound, a 2,4-dialkyl imidazole compound or a 4-vinyl imidazole compound, And imidazole-based silane compounds which are reactants of? -Glycidoxypropylalkoxysilane such as glycidoxypropyltriethoxysilane. These one species may be used singly or two or more species may be used in combination.

(D) a silane compound, the total content of the silane compound (D) is preferably not less than 0.06% by mass and not more than 2% by mass, more preferably not less than 0.1% by mass and not more than 0.75% by mass in the epoxy resin composition for sealing Or less, more preferably 0.2 mass% or more and 0.7 mass% or less. When it is 0.06 mass% or more, the decrease of fluidity tends to be suppressed, and when it is 2 mass% or less, the occurrence of molding defects such as voids tends to be suppressed.

To the epoxy resin composition for encapsulation of the present invention, conventionally known coupling agents other than the silane compound (D) may be blended. Examples thereof include isopropyltriisostearoyltitanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N-aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecylphosphite ) Dioctyl pyrophosphate), tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, bis (dioctyl pyrophosphate) Isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, isopropyl tributyl titanate, Titanate coupling agents such as phenyl titanate and tetraisopropyl bis (dioctylphosphite) titanate, aluminum chelates, aluminum / zirconium-based coupling agents And the like. These one species may be used singly or two or more species may be used in combination.

The total content of the coupling agent other than the silane compound (D) is preferably 0.06 mass% or more and 2 mass% or less, more preferably 0.1 mass% or more and 0.75 mass% or less in the epoxy resin composition for sealing in view of moldability and adhesiveness And more preferably 0.2 mass% or more and 0.7 mass% or less. When it is 0.06 mass% or more, the decrease of fluidity tends to be suppressed, and when it is 2 mass% or less, the occurrence of molding defects such as voids tends to be suppressed.

[(E) Curing Accelerator]

The epoxy resin composition for encapsulation of the present invention may contain a curing accelerator (E). As the curing accelerator (E) used in the present invention, those generally used in the epoxy resin composition for sealing can be used without particular limitation.

For example, 1,8-diazabicyclo [5.4.0] undecene-7,1,5-diazabicyclo [4.3.0] nonene-5,5,6-dibutylamino- Cyclobutane compounds such as benzoic acid, 1,4-benzoquinone, 2,5-toluoquinone, 1,4-naphthoquinone, 2,3 -Dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, A quinone compound such as benzoquinone, a compound having intramolecular polarization obtained by adding a compound having a? Bond such as diazophenylmethane, phenol resin or the like; Tertiary amines such as benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol and derivatives thereof, 2-methylimidazole, 2-phenylimidazole, 2- Imidazoles such as imidazole, imidazole, and 2-heptadecylimidazole, and derivatives thereof; Tertiary phosphines such as triphenylphosphine, tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, diphenylphosphine and phenylphosphine, and tertiary phosphines such as maleic anhydride, A phosphorus compound having an intramolecular polarization formed by adding a compound having a? Bond such as the quinone compound, diazophenylmethane, or phenol resin; Tetra-substituted phosphonium tetra-substituted borates such as tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate and tetrabutylphosphonium tetrabutylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, And tetraphenylboron salts such as N-methylmorpholine and tetraphenylborate, and derivatives thereof. These one species may be used singly or two or more species may be used in combination.

The third phosphine used in the adduct of the third phosphine and the quinone compound is not particularly limited. For example, dibutylphenylphosphine, butyldiphenylphosphine, ethyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, tris (4-ethylphenyl) Tris (tert-butylphenyl) phosphine, tris (2,4-dimethylphenyl) phosphine, tris (2-phenylphenyl) phosphine, tris (2,6-dimethyl-4-ethoxyphenyl) phosphine, tris (4-methoxyphenyl) phosphine, tris , Tris (4-ethoxyphenyl) phosphine, and other tertiary phosphines having an aryl group. From the standpoint of moldability, triphenylphosphine is preferable.

The quinone compound used in the adduct of the third phosphine and the quinone compound is not particularly limited. Examples thereof include o-benzoquinone, p-benzoquinone, diphenoquinone, 1,4-naphthoquinone, and anthraquinone. From the viewpoints of moisture resistance or storage stability, p-benzoquinone is preferred.

The content of the (E) curing accelerator is not particularly limited as long as the effect of accelerating the curing is attained. Specifically, the amount is preferably 0.1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the total amount of the epoxy resin (A), the curing agent (B), and the benzophenone derivative having at least one phenolic hydroxyl group in one molecule (C) More preferably 0.3 parts by mass or more and 5 parts by mass or less. When the amount is less than 10 parts by mass, the curing rate is appropriately suppressed and a good molded article tends to be obtained.

[(F) Inorganic filler]

The epoxy resin composition for sealing according to the present invention may contain (F) an inorganic filler. The inorganic filler (F) used in the present invention is added to the epoxy resin composition for sealing in order to improve the hygroscopicity, the coefficient of linear expansion, the thermal conductivity, and the strength, and is particularly limited as long as it is generally used in the epoxy resin composition for sealing no. For example, there may be mentioned fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllium, zirconia, zircon, , Mullite, titania and the like, or beads obtained by spheroidizing them, glass fibers and the like. These may be used singly or in combination of two or more.

Of these, fused silica is preferable from the viewpoint of reduction of linear expansion coefficient, alumina is preferable from the viewpoint of high thermal conductivity, and the filler shape is spherical in view of fluidity at the time of molding and mold wear resistance. Spherical fused silica is particularly preferable from the viewpoint of balance between cost and performance.

The average particle diameter (D50) of the inorganic filler is preferably 0.1 占 퐉 to 50 占 퐉, and more preferably 10 占 퐉 to 30 占 퐉. When the average particle diameter is 0.1 mu m or more, the increase in viscosity of the epoxy resin composition for sealing is suppressed, and when it is 50 mu m or less, the separation of the resin component and the inorganic filler can be reduced. Therefore, by keeping the average particle diameter within the above-mentioned range, it is possible to prevent the cured product from becoming uneven, the cured product properties varying, or the filling property to a narrow gap being lowered.

The volume average particle diameter (D50) is the particle diameter at which the volume cumulative distribution curve is 50 vol% when the volume cumulative distribution curve is drawn from the small diameter side in the particle diameter distribution. The measurement can be performed by a laser diffraction particle size distribution analyzer (for example, SALD-3000J manufactured by Shimadzu Corporation) by dispersing a sample in purified water containing a surfactant.

From the viewpoint of fluidity, the particle shape of the inorganic filler is preferably spherical rather than angular. In addition, the specific surface area of the inorganic filler is preferably from 0.1m ² / g to 10m ² / g preferred in view of flowability, more preferably 0.5m ² / g to 6.0m ² / g.

The content of the inorganic filler in the sealing epoxy resin composition is preferably 70% by mass or more and 95% by mass or less from the viewpoints of flame retardancy, moldability, hygroscopicity, reduction of linear expansion coefficient and improvement of strength. When it is 70 mass% or more, flame retardancy tends to be excellent, and when it is 95 mass% or less, fluidity tends to be excellent.

[Other additives]

The epoxy resin composition for encapsulation according to the present invention may further contain, in addition to the epoxy resin (A), the curing agent, the benzophenone derivative (D), the silane compound, the curing accelerator (E) , Various additives such as an anion exchanger, a release agent, a flame retardant, a colorant, a stress relieving agent and the like exemplified below may be contained as needed. However, the epoxy resin composition for encapsulation of the present invention is not limited to the following additives, and various additives known in the art may be added as needed.

(Anion exchanger)

In the epoxy resin composition for encapsulation of the present invention, an anion exchanger may be optionally incorporated for the purpose of improving moisture resistance and high temperature storage characteristics of IC. The anion exchanger is not particularly limited, and conventionally known ones can be used. For example, hydrotalcite and hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, and bismuth can be given. These one species may be used singly or two or more species may be used in combination. Among them, hydrotalcite represented by the following composition formula XXI is preferable.

<Composition formula XXI>

In the composition formula XXI, 0 < X &amp;le; 0.5, m represents a positive number.

The content of the anion exchanger is not particularly limited as long as it is sufficient to capture anions such as halogen ions. Specifically, the amount is preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 5 parts by mass or less based on 100 parts by mass of the epoxy resin (A).

(Releasing agent)

The epoxy resin composition for sealing of the present invention may contain a release agent as required. As the release agent, it is preferable to use an oxidized or non-oxidized polyolefin in an amount of 0.01 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A), more preferably 0.1 part by mass or more and 5 parts by mass or less. When the amount is 0.01 part by mass or more, the releasability tends to become sufficient, and when it is 10 parts by mass or less, the adhesiveness tends to be excellent.

Examples of the oxidized or non-oxidized polyolefin include low molecular weight polyethylene having a number average molecular weight of about 500 to 10,000 such as H4, PE, and PED series, available from Struktur Kabushiki Kaisha. Examples of the other release agent include carnauba wax, montanic acid ester, montanic acid, stearic acid and the like. These one species may be used singly or two or more species may be used in combination.

When these other release agents are used in combination with the oxidized or non-oxidized polyolefin, the content thereof is preferably from 0.1 part by mass to 10 parts by mass, more preferably from 0.5 part by mass to 3 parts by mass, relative to 100 parts by mass of the epoxy resin (A) Or less is more preferable.

(Flame retardant)

Conventionally known flame retardants may be incorporated in the epoxy resin composition for sealing according to the present invention as required. Phosphorus compounds such as phosphoric acid esters coated with inorganic substances such as brominated epoxy resin, antimony trioxide, aluminum hydroxide, magnesium hydroxide and zinc oxide and / or thermosetting resins such as phenol resin, melamine, melamine derivatives , A nitrogen-containing compound such as a melamine-modified phenol resin, a compound having a triazine ring, a cyanuric acid derivative, or an isocyanuric acid derivative; phosphorus and nitrogen-containing compounds such as cyclophosphane; aluminum hydroxide; magnesium hydroxide; , And the like.

<Composition formula XXII>

A, b, c, d, e, f, p, q and m are positive numbers, r is 0 or a positive number, and M ¹ , M ² and M ³ in the composition formula XXII represent different metal elements. .

M ¹ , M ² and M ³ in the composition formula XXII are not particularly limited as long as they are different metal elements. In addition, the classification of the metal element is a long period type periodic table in which a typical element is A group and a transition element is B group (refer to &quot; Chemical Dictionary 4 &quot; issued Feb. 15, 1987 by Kyoritsu Tsushin Kagaku Kaisha, .

In the flame retardancy viewpoint M ¹ is selected from the metal elements belonging to the alkaline earth metal elements, IVB group, IIB group, VIII group, IB group, IIIA group and IVA group of the metal elements, IIA group of the third cycle, M ² is M ¹ is selected from magnesium, calcium, aluminum, tin, titanium, iron, cobalt, nickel, copper and zinc, and M ² is selected from the group consisting of iron, cobalt, nickel, More preferably selected from copper and zinc. From the viewpoint of fluidity, it is preferable that M ¹ is magnesium, M ² is zinc or nickel, and r = 0.

The molar ratio of p, q and r is not particularly limited, and it is preferable that r = 0 and p / q is 1/99 to 1/1.

Also included are compounds containing metal elements such as zinc oxide, zinc stannate, zinc borate, iron oxide, molybdenum oxide, zinc molybdate, and dicyclopentadienyl iron. These one species may be used singly or two or more species may be used in combination.

The content of the flame retardant is not particularly limited, but is preferably 1 part by mass or more and 30 parts by mass or less, more preferably 2 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the epoxy resin (A).

(Colorant, stress relieving agent)

The epoxy resin composition for encapsulation of the present invention may contain a coloring agent such as carbon black, organic dye, organic pigment, titanium oxide, pendant, and red iron oxide. As other additives, a stress relaxation agent such as a silicone oil or a silicone rubber powder can be added as needed.

&Lt; Preparation of epoxy resin composition for sealing >

The epoxy resin composition for sealing according to the present invention may be produced by any method so far as it can uniformly disperse and mix various components. As a general method, there may be mentioned a method in which a prescribed amount of components are sufficiently mixed by a mixer or the like and then melt-kneaded by a mixing roll or an extruder, followed by cooling and pulverization. For example, a predetermined amount of the above-mentioned components is uniformly stirred and mixed, and the mixture is kneaded, cooled and pulverized by a kneader, roll, extruder or the like which has been heated to 70 to 140 ° C in advance have. It is easy to use if it is made into tablet with dimensions and mass suitable for molding conditions.

<Electronic parts device>

As the electronic component device having the element sealed by the epoxy resin composition for sealing obtained in the present invention, a semiconductor chip, a transistor, a diode, a thyristor or the like is mounted on a supporting member such as a lead frame, a tape carrier, a wiring board, An electronic component device in which an element such as a passive element such as an active element, a capacitor, a resistor, and a coil is mounted, and a necessary portion is sealed with the epoxy resin composition for sealing according to the present invention.

As such an electronic component device, for example, a semiconductor element is fixed on a lead frame, and a terminal portion and a lead portion of a device such as a bonding pad are connected by wire bonding or bump, and then, using the epoxy resin composition for sealing of the present invention, A dual inline package (DIP), a plastic leaded chip carrier (PLCC), a quad flat package (QFP), a small outline package (SOP) Line package), Small Outline J-lead package (Small Outline J-Red package), TSOP (Thin Small Outline Package) and TQFP (Thin Quad Flat Package) Typical resin-sealed ICs; A TCP (Tape Carrier Package) in which a semiconductor chip connected to a tape carrier by bumps is sealed with the epoxy resin composition for sealing of the present invention; A passive element such as a semiconductor chip, a transistor, a diode, a thyristor or the like and / or a passive element such as a capacitor, a resistor or a coil connected to a wiring formed on a wiring board or glass by wire bonding, flip chip bonding or soldering, A COB (Chip On Board) module, a hybrid IC or a multi-chip module, which is sealed with an epoxy resin composition for use in a semiconductor device; An element is mounted on the surface of an organic substrate on which a terminal for connecting a wiring board is formed on the back surface and the element and the wiring formed on the organic substrate are connected by bump or wire bonding. Then, the element is sealed with the epoxy resin composition for sealing of the present invention A ball grid array (BGA), a chip size package (CSP), and the like. The epoxy resin composition for sealing according to the present invention can also be effectively used for a printed circuit board.

A low-pressure transfer molding method is most commonly used as a method of sealing an element using the epoxy resin composition for sealing of the present invention, but an injection molding method, a compression molding method, or the like can also be used.

<Examples>

EXAMPLES The present invention will be described with reference to the following examples, but the scope of the present invention is not limited to these examples. In addition, &quot;% &quot; means &quot; mass% &quot;

&Lt; Preparation of epoxy resin composition for sealing >

The following components were compounded in the mass parts shown in Tables 1 to 6 respectively and kneaded in a roll kneading machine at a kneading temperature of 80 캜 and a kneading time of 10 minutes to obtain an epoxy resin for sealing of Examples 1 to 24 and Comparative Examples 1 to 24 Thereby preparing a resin composition. Blank in the table indicates no blending.

As the epoxy resin (A)

Epoxy resin 1: biphenyl type epoxy resin (trade name: YX-4000, manufactured by Japan Epoxy Resin Co., Ltd.) having an epoxy equivalent of 196 g / eq and a melting point of 106 캜,

Epoxy resin 2: phenol-aralkyl type epoxy resin having an epoxy equivalent of 240 g / eq and a biphenylene skeleton having a softening point of 96 캜 (trade name: CER-3000L, manufactured by Nippon Kayaku Kabushiki Kaisha)

Epoxy resin 3: phenol-aralkyl type epoxy resin having an epoxy equivalent of 238 g / eq and a softening point of 55 占 폚 (NC-2000L, manufactured by Nippon Kayaku Co., Ltd.)

Epoxy resin 4: Orthocresol novolak type epoxy resin (N500P-1, manufactured by Dainippon Ink and Chemicals, Inc.) having an epoxy equivalent of 200 g / eq and a softening point of 60 캜 was used.

As the curing agent (B)

Curing agent 1: phenol / aralkyl resin having a hydroxyl equivalent of 175 g / eq and a softening point of 70 캜 (MEH-7800, manufactured by Meiwa Kasei Kabushiki Kaisha)

Curing agent 2: phenol novolak resin (trade name: H-100, manufactured by Meiwa Kasei Kabushiki Kaisha) having a hydroxyl group equivalent of 106 g / eq and a softening point of 83 ° C was used.

(C) a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule (hereinafter referred to as a hydroxybenzophenone compound)

Hydroxybenzophenone Compound 1: p-hydroxybenzophenone,

Hydroxybenzophenone Compound 2: o-hydroxybenzophenone,

Hydroxybenzophenone Compound 3: 2-hydroxy-4-methoxybenzophenone,

Hydroxybenzophenone Compound 4: 2,4-Dihydroxybenzophenone,

Hydroxybenzophenone Compound 5: 4,4'-dihydroxybenzophenone was used.

As a material used in place of hydroxybenzophenone in the comparative example,

Phenol Compound 1: phenol,

Phenol compound 2: p-cresol,

Phenol Compound 3: catechol,

Phenol Compound 4: Resorcinol,

Phenol compound 5: hydroquinone,

Benzophenone Compound 1: Benzophenone,

Benzophenone Compound 2: p-Methoxybenzophenone was used.

As the silane compound (D)

Silane compound 1:? -Glycidoxypropyltrimethoxysilane,

As the (E) curing accelerator,

Curing accelerator 1: Betaine adduct of triphenylphosphine and p-benzoquinone,

As the inorganic filler (F)

Inorganic filler 1: spherical fused silica having an average particle diameter of 17.5 탆 and a specific surface area of 3.8 m ² / g was used. As other additive components, montanic acid ester and carbon black were used.

<Evaluation>

The epoxy resin compositions for sealing in Examples and Comparative Examples were evaluated by the following various properties tests (1) to (7). The evaluation results are summarized in Tables 7 to 12 below. Molding of the epoxy resin composition for sealing was performed under the conditions of a mold temperature of 180 deg. C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds by a transfer molding machine unless otherwise specified. Post-curing was performed at 180 占 폚 for 5 hours.

(1) Spiral flow

The molding epoxy molding material was molded under the above conditions using a mold for spiral flow measurement according to EMMI-1-66, and the flow distance (cm) was determined.

(2) Open hardness

The epoxy resin composition for sealing was molded into an original plate having a diameter of 50 mm and a thickness of 3 mm under the above conditions and immediately after molding, the resultant was measured using a Shore D type hardness meter (HD-1120 (Type D) manufactured by Ueshima Seisakusho Co., Ltd.) .

(3) Hardness at the time of moisture absorption

The epoxy resin composition for sealing was allowed to stand for 72 hours at 25 DEG C and 50% RH before molding, and immediately after molding, the epoxy resin composition for HD-1120 (manufactured by Ueshima Seisakusho Co., Ltd. Type D)).

(4) Absorption rate

(Mass%) = {(the mass of the disk after being left - the mass of the disk after being left), and the volume of the disk after being left for 168 hours under the conditions of 85 DEG C and 60% Mass of the original plate) / mass of the original plate before leaving} × 100.

(5) Bending modulus at 260 占 폚 (high-temperature bending test)

A three-point bending test according to JIS-K-6911 was conducted using a bending tester (Tensilon manufactured by A & D Co., Ltd.) and the bending elastic modulus (E) was obtained from the following equation while being maintained at 260 캜 in a thermostatic chamber. The measurement was carried out at a head speed of 1.5 mm / min using a test piece molded from epoxy resin composition for sealing at 10 mm, 70 mm, and 3 mm under the above conditions.

(6) Measurement of adhesion force with metal at 260 캜 (measurement of shear strength)

The epoxy resin composition for sealing was molded into a copper plate or a copper-plated copper plate under the above conditions to a size of 4 mm in diameter on the bottom surface, 3 mm in diameter on the upper surface, and 4 mm in height, ), The shear adhesive strength was measured at a shear rate of 50 占 퐉 / s while maintaining the temperature of the various copper plates at 260 占 폚.

(7) Lower flow property

An 80-pin flat package (lead frame material: copper alloy, upper surface of the die pad part and plated surface of the lead part) having an external dimension of 20 mm x 14 mm x 2 mm with a silicon chip of 8 mm x 10 mm x 0.4 mm was placed in an epoxy resin composition for sealing Were molded under the above conditions and then cured. Examples 1 to 16 and Comparative Examples 1 to 16 were set to 240 占 폚, Examples 17 to 20 and Comparative Examples 17 to 20 were set to 230 占 폚 at a temperature of 85 占 폚 and 60% RH for one week, 21 to 24 and Comparative Examples 21 to 24 were subjected to reflow treatment at 220 占 폚. The presence / absence of peeling of the resin / frame interface in the sealing package after the reflow treatment was observed with an ultrasonic flaw detector (HYE-FOCUS manufactured by Hitachi Chemical Co., Ltd.) and evaluated by the number of peeling occurrence packages with respect to the number of test packages (5 pieces) .

The properties of the above (1) to (7) were compared with the examples and the comparative examples in the combination of the same epoxy resin and the curing agent. For example, Examples 1 to 16 and Comparative Examples 1 to 16, which are combinations of epoxy resin 1 and 2 / curing agent 1, Examples 17 to 20, which are combinations of epoxy resin 1 and 3 / curing agent 1, and Comparative Examples 17 to 20, Examples 21 to 24, which are combinations of epoxy resin 1 and 4 / curing agent 2, and Comparative Examples 21 to 24 were compared.

The results are shown in Tables 7 to 12. The results are shown in Tables 7 to 12. In the Tables 7 to 12, the example in which the hydroxybenzophenone compound was added had a higher shear adhesive force (silver and copper) at 260 캜 than the comparative example, The resin / frame interface was not peeled off, and the flow resistance was excellent.

Example 5, in which the ratio of the hydroxybenzophenone compound was 0.1 mass% or less, was lower than that of Examples 1 to 4 and 6 to 16, which are combinations of the same epoxy resin / curing agent, and the effect of the invention was small. In Example 23 in which the proportion of the phenone compound was 1.0% by mass or more, the hardness was lower than that of Examples 21, 22, and 24, which are combinations of the same epoxy resin / curing agent. However, no peeling of the resin / frame interface occurred in any of the embodiments.

On the other hand, the comparative examples of compositions different from those of the present invention did not satisfy the object of the present invention. Peeling of the resin / frame interface occurred in most of the packages in the reflow treatment after leaving for one week under the conditions of 85 ° C and 60% RH, with a shear adhesive force (silver and copper) And the flowability dropped.

Claims (6)

(A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) a benzophenone derivative having at least one phenolic hydroxyl group in one molecule, wherein the curing agent (B) Based on the total weight of the epoxy resin composition. The epoxy resin composition for sealing according to claim 1, wherein the (C) content of the benzophenone derivative having at least one phenolic hydroxyl group in one molecule is 0.1% by mass or more and 1.0% by mass or less. The sealing epoxy resin composition according to claim 1, further comprising (D) a silane compound. The sealing epoxy resin composition according to claim 1, further comprising (E) a curing accelerator. The sealing epoxy resin composition according to claim 1, further comprising (F) an inorganic filler. An electronic component device comprising an element sealed by the epoxy resin composition for sealing according to any one of claims 1 to 5.