TWI589617B - Epoxy resin composition for sealing and electronic component device - Google Patents

Description

Sealing epoxy resin composition and electronic component device

The present invention relates to an epoxy resin composition for sealing and an electronic component device including an element sealed with the epoxy resin composition for sealing.

Since the past, the epoxy resin composition for sealing has been widely used in the field of sealing electronic components such as transistors and ICs (integrated circuits). The reason for this is that the epoxy resin can be balanced in electrical properties, moisture resistance, heat resistance, mechanical properties, adhesion to inserts, and the like. In particular, the combination of an o-cresol novolac type epoxy resin and a novolac type phenol hardener has an excellent balance of the above characteristics, and thus is a mainstream of a base resin for a sealing composition.

In recent years, the miniaturization, weight reduction, and high performance of electronic devices have increased, and the density of mounting has also increased. The electronic component devices have gradually changed from being packaged in a pin insertion type to surface mounting. Mount type). When mounting a semiconductor device to a circuit board, in the conventional pin insertion type package, since the pin is inserted into the circuit board, it is soldered from the back side of the circuit board. Therefore, the package is not directly exposed to high temperatures. However, in the surface mount package, since the entire semiconductor device is processed by a solder bath or a reflow device, the package is exposed to the soldering temperature. As a result, when the package absorbs moisture, moisture absorption during the soldering will rapidly expand, causing peeling of the adhesive interface or cracking of the package, and there is a problem that the package reliability at the time of mounting is lowered.

In order to reduce the moisture absorption in the semiconductor device, a method of preventing the wet moisture in the semiconductor device from being used for moisture-proof packaging or sufficiently drying the IC before mounting on the circuit board may be used. However, these methods are complicated and costly.

As another measure, a method of increasing the content of the filler in the epoxy resin composition for sealing can be mentioned. However, in this method, although the moisture absorption moisture of the sealed portion in the semiconductor device can be reduced, there is a problem that the fluidity of the epoxy resin composition for sealing is largely lowered. When the fluidity of the epoxy resin composition for sealing is lowered, problems such as gold wire flow, voids, and pin holes occur during molding.

In the Japanese Patent Publication No. 06-224328, the resin composition for semiconductor encapsulation in which the particle size distribution of the filler added to the epoxy resin is within a specific range has been disclosed. According to the resin composition for semiconductor encapsulation, the content of the filler is increased without losing fluidity, and the thermal expansion property, heat conduction property, moisture absorption resistance, and bending strength are improved.

Further, in Japanese Laid-Open Patent Publication No. H09-165433, a method for producing an epoxy resin is disclosed in which a polyhydric phenol and an epoxy are used. In the method in which a halogenated propane is reacted to produce an epoxy resin, a mixture of dihydroxybenzophenone and other polyhydric phenols is used as the polyhydric phenol. In the invention, in the synthesis stage of the epoxy resin, the epoxy resin obtained by mixing the epoxy resin obtained with the phenol novolak resin or the ceria powder is prepared by using dihydroxybenzophenone. The epoxy resin composition is excellent in curability and fluidity, and has no crystallinity.

In the invention of the above-mentioned Japanese Patent Publication No. Hei 09-165433, although the curability and fluidity are improved, the adhesion to metal at a high temperature may be lowered. From the viewpoint of improvement in reflow resistance, it is expected to improve adhesion to metals at high temperatures.

In view of the above-mentioned circumstances, the present invention provides an epoxy resin composition for sealing which is excellent in adhesion to metals at high temperatures and excellent in reflow resistance, and an electronic component device including the element to be sealed thereby. .

The present invention relates to the following.

(1) An epoxy resin composition for sealing comprising (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) having one in one molecule The above benzophenone derivative of a phenolic hydroxyl group.

(2) The epoxy resin composition for sealing according to the above (1), wherein the (C) has one or more phenolic hydroxyl groups in one molecule. The content of the benzophenone derivative is 0.1% by mass or more and 1.0% by mass or less.

(3) The epoxy resin composition for sealing according to (1) or (2) above which further contains (D) a decane compound.

(4) The epoxy resin composition for sealing according to any one of (1) to (3) further comprising (E) a curing accelerator.

(5) The epoxy resin composition for sealing according to any one of (1) to (4) further comprising (F) an inorganic filler.

(6) An electronic component device comprising an element sealed by the sealing epoxy resin composition according to any one of the above items (1) to (5).

According to the present invention, it is possible to provide an epoxy resin composition for sealing which is excellent in adhesion to metal at a high temperature and excellent in reflow resistance, and an electronic component device including the element to be sealed thereby.

[Formation of the Invention]

The invention will be described in detail below.

Further, "~" in the present specification means a range including the numerical values described before and after the minimum value and the maximum value. Again, this description The amount of each component in the composition in the book, when there are a plurality of substances corresponding to the respective components in the composition, unless otherwise specified, indicates the total amount of the plural substances present in the composition.

<Epoxy resin composition for sealing>

The epoxy resin composition for sealing of the present invention contains (A) an epoxy resin containing two or more epoxy groups in one molecule, (B) a curing agent, and (C) one or more in one molecule. A benzophenone derivative of a phenolic hydroxyl group. The epoxy resin composition for sealing of the present invention is a solid at room temperature (25 ° C).

Hereinafter, each component constituting the epoxy resin composition for sealing of the present invention will be described.

[(A) Epoxy Resin]

The epoxy resin (A) which contains two or more epoxy groups in one molecule used in the present invention is not particularly limited as long as it is generally used for a sealing epoxy resin composition. For example, a phenol novolak type epoxy resin, an o-cresol novolac type epoxy resin, an epoxy resin having a triphenylmethane skeleton, and phenol, cresol, xylenol, and isophthalene are mentioned. Phenols, catechol, bisphenol A, bisphenol F, α -naphthol, β -naphthol, dihydroxynaphthalene and other phenols with formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, etc. The phenolic varnish resin obtained by condensation or co-condensation of the compound under an acidic catalyst is subjected to epoxidation; bisphenol A substituted by an alkyl group, substituted or unsubstituted by an aromatic ring, bisphenol F, bisphenol S, biphenol, a diglycidyl ether such as thiodiphenol; a stilbene type epoxy resin; a hydroquinone type epoxy resin; a reaction of a polybasic acid such as phthalic acid or a dimer acid with epichlorohydrin a glycidyl ester type epoxy resin; a glycidylamine type epoxy resin obtained by reacting a polyamine such as diaminodiphenylmethane or isomeric cyanuric acid with epichlorohydrin; dicyclopentadiene and Epoxides of co-condensation resins of phenols; epoxy resins having naphthalene rings; by phenols and dimethoxy groups Phenol aralkyl resin synthesized from p-xylene or bis(methoxymethyl)biphenyl; epoxide of aralkyl type phenol resin such as naphthol ‧ aralkyl resin; trimethylolpropane ring Oxygen resin; terpene-modified epoxy resin; linear aliphatic epoxy resin obtained by oxidizing an olefin with a peracid such as peracetic acid; an alicyclic epoxy resin or the like. These may be used alone or in combination of two or more.

Among them, from the viewpoint of achieving both fluidity and hardenability, a biphenyl type epoxy resin is preferably contained, and it is a diglycidyl ether of an alkyl group-substituted, aromatic ring-substituted or unsubstituted biphenol. From the viewpoint of curability, it is preferable to contain a novolac type epoxy resin, and it is preferable to contain a naphthalene type epoxy resin and/or a triphenylmethane type epoxy resin from the viewpoint of heat resistance and low anti-warpage property. The resin preferably has a bisphenol F type epoxy resin and is a diglycidyl group which is substituted by an alkyl group, substituted by an aromatic ring or unsubstituted bisphenol F, from the viewpoint of achieving both fluidity and flame retardancy. The ether is preferably a thiodiphenol type epoxy resin which is a thiodiphenol type epoxy resin which is an alkyl substituted, an aromatic ring substituted or unsubstituted thiodiphenol condensed water, from the viewpoint of balance between fluidity and reflowability. The glyceryl ether is preferably an epoxide containing a phenol ‧ aralkyl resin from the viewpoint of achieving both hardenability and flame retardancy, and is a phenol substituted by an alkyl group, substituted by an aromatic ring or unsubstituted Synthesized with bis(methoxymethyl)biphenyl From the viewpoint of properties and flame retardancy, an epoxide containing a naphthol ‧ aralkyl resin is preferred, and it is an alkyl substituted, aromatic ring substituted or unsubstituted naphthol and dimethoxy group. Synthesized by p-xylene.

The biphenyl type epoxy resin may, for example, be an epoxy resin represented by the following general formula (I).

In the general formula (I), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. R ¹ ~ R ⁸ may all be the same or different. n represents an integer from 0 to 3.

The biphenyl type epoxy resin represented by the above general formula (I) can be obtained by reacting epichlorohydrin with a biphenol compound in a known manner.

As R ¹ to R ⁸ in the general formula (I), for example, a hydrogen atom may be independently mentioned; a carbon such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a tributyl group; An alkyl group having 1 to 10 carbon atoms; an alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group, and a butenyl group. Each of them is preferably a hydrogen atom or a methyl group.

As such an epoxy resin, for example, 4,4'-bis(2,3-epoxypropoxy)biphenyl or 4,4'-bis(2,3-epoxypropoxy group) can be mentioned. )-3,3',5,5'-tetramethylbiphenyl as the main component of epoxy resin, making epichlorohydrin and 4,4'-biphenol or 4,4'- An epoxy resin obtained by reacting (3,3',5,5'-tetramethyl)biphenol.

Among them, an epoxy resin containing 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl as a main component is preferred. As such a commercially available product, a trade name YX-4000 manufactured by Mitsubishi Chemical Corporation (formerly Japan Epoxy Resin Co., Ltd.) can be obtained.

When the biphenyl type epoxy resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the epoxy resin, more preferably 30% by mass or more, and still more preferably 50% by mass or more.

The thiodiphenol type epoxy resin may, for example, be an epoxy resin represented by the following general formula (II).

In the general formula (II), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. R ¹ ~ R ⁸ may all be the same or different. n represents an integer from 0 to 3.

The thiodiphenol type epoxy resin represented by the above general formula (II) can be obtained by reacting epichlorohydrin with a thiodiphenol compound by a known method.

As R ¹ to R ⁸ in the general formula (II), for example, a hydrogen atom may be independently mentioned; a carbon such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a t-butyl group; An alkyl group having 1 to 10 carbon atoms; an alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group, and a butenyl group. Each of them is preferably a hydrogen atom, a methyl group or a tert-butyl group.

Examples of such an epoxy resin include an epoxy resin containing diglycidyl ether of 4,4′-dihydroxydiphenyl sulfide as a main component, and 2,2′,5,5′-four. Epoxy resin as a main component of diglycidyl ether of methyl-4,4'-dihydroxydiphenyl sulfide, 2,2'-dimethyl-4,4'-dihydroxy-5,5 An epoxy resin or the like having a diglycidyl ether of '-di-t-butyldiphenyl sulfide as a main component.

The epoxy resin containing diglycidyl ether of 2,2'-dimethyl-4,4'-dihydroxy-5,5'-di-t-butyldiphenyl sulfide as a main component is good. As such a commercially available product, a trade name of YSLV-120TE manufactured by Nippon Steel Chemical Co., Ltd. can be obtained.

When the thiodiphenol type epoxy resin is used, the content is preferably 20% by mass or more based on the total amount of the epoxy resin, preferably 30% by mass or more, and more preferably 50% by mass or more. .

Examples of the bisphenol F-type epoxy resin include an epoxy resin represented by the following general formula (III).

In the general formula (III), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. R ¹ ~ R ⁸ may all be the same or different. n represents an integer from 0 to 3.

The bisphenol F type epoxy resin represented by the above formula (III) can be obtained by reacting epichlorohydrin with a bisphenol F compound by a known method.

As R ¹ to R ⁸ in the general formula (III), for example, a hydrogen atom may be independently mentioned; a carbon such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a third butyl group; An alkyl group having 1 to 10 carbon atoms; an alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group, and a butenyl group. Each of them is preferably a hydrogen atom or a methyl group.

Examples of such an epoxy resin include an epoxy resin containing 4,4′-methylenebis(2,6-dimethylphenol) diglycidyl ether as a main component, and 4, 4'. - an epoxy resin containing methylene bis(2,3,6-trimethylphenol) diglycidyl ether as a main component, and diglycidyl ether of 4,4'-methylene bisphenol as a main component Ingredients such as epoxy resin. Among them, an epoxy resin containing a diglycidyl ether of 4,4'-methylenebis(2,6-dimethylphenol) as a main component is preferred. As such a commercially available product, a trade name of YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd. can be obtained.

When the bisphenol F-type epoxy resin is used, the content is preferably 20% by mass or more based on the total amount of the epoxy resin, preferably 30% by mass or more, and more preferably 50% by mass or more. .

Examples of the novolak-type epoxy resin include an epoxy resin represented by the following general formula (IV).

In the general formula (IV), R each independently represents a substituted or unsubstituted one valent group having a hydrogen atom or an element selected from a carbon atom, a hydrogen atom and an oxygen atom, and n represents 0 to 10. The integer.

The novolac type epoxy resin represented by the above general formula (IV) is obtained by reacting epichlorohydrin with a novolac type phenol resin.

As the R in the above general formula (IV), each independently has a hydrogen atom; a methyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group or an isobutyl group; An alkoxy group having 1 to 10 carbon atoms such as an ethoxy group, a propoxy group or a butoxy group is preferred, and a hydrogen atom or a methyl group is preferred. n is preferably an integer from 0 to 3.

Among the novolac type epoxy resins represented by the above general formula (IV), an o-cresol novolac type epoxy resin is preferred. As such a commercially available product, the product name N500P-1 manufactured by Dainippon Ink Chemical Industry Co., Ltd. can be obtained.

When the novolac type epoxy resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the epoxy resin, and more preferably 30% by mass or more.

Examples of the naphthalene type epoxy resin include an epoxy resin represented by the following general formula (V). Examples of the triphenylmethane-type epoxy resin include an epoxy resin represented by the following general formula (VI).

In the general formula (V), R ¹ to R ³ each independently represent a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. R ¹ to R ³ may all be the same or different. p is 1 or 0, m and n are each an integer of 0 to 11, and (m+n) is an integer of 1 to 11, and p and m are selected such that (m+p) becomes an integer of 1 to 12. And n. i represents an integer from 0 to 3, j represents an integer from 0 to 2, and k represents an integer from 0 to 4.

R ¹ to R ³ in the above general formula (V) may each independently represent a carbon number of a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a third butyl group. An alkyl group of 10; an alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group or a butenyl group; and the like. Among them, a methyl group is preferred.

In the general formula (VI), R each independently represents a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. n represents an integer from 1 to 10.

As R in the above general formula (VI), a hydrogen atom may be independently mentioned; a carbon number of 1 to 10 such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group or a third butyl group; An alkyl group; an alkenyl group having 1 to 10 carbon atoms such as a vinyl group, an allyl group or a butenyl group; and the like. Among them, a hydrogen atom or a methyl group is preferred. n is preferably an integer from 0 to 3.

The naphthalene type epoxy resin represented by the above general formula (V) includes a random copolymer which is randomly contained in m constituent units and n constituent units, and an interactive copolymer which is alternately contained and which is regularly contained. a copolymer, a block copolymer containing the block. These may be used alone or in combination of two or more.

Further, the triphenylmethane type epoxy resin represented by the above general formula (VI) is not particularly limited, but a salicylaldehyde type epoxy resin is preferred.

These naphthalene type epoxy resins and triphenylmethane type epoxy resins may be used singly or in combination of two or more. Using naphthalene type epoxy resin and When at least one of the triphenylmethane type epoxy resins is used, the content thereof is preferably 20% by mass or more based on the total amount of the epoxy resin, and preferably 30% by mass or more, and 50% or more. More than % by mass is more preferable.

Examples of the epoxide of the phenol ‧ aralkyl resin include an epoxy resin represented by the following general formula (VII) or an epoxy resin represented by the following general formula (VIII).

In the general formula (VII), R ¹ to R ⁴ each independently represent a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. R ¹ to R ⁴ may all be the same or different. R ⁵ each independently represents a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. When there are a plurality of R ⁵ , they may all be the same or different. i represents an integer from 0 to 3, and n represents an integer from 0 to 10.

In the general formula (VIII), R ¹ to R ⁸ each independently represent a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. R ¹ to R ⁸ may all be the same or different. R ⁹ each independently represents a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. When there are a plurality of R ⁹ , they may all be the same or different. i represents an integer from 0 to 3, and n represents an integer from 0 to 10.

The epoxide of the phenol ‧ aralkyl resin represented by the above general formula (VII) is a phenol synthesized by an alkyl group-substituted, aromatic-substituted or unsubstituted phenol and dimethoxy-p-xylene The aralkyl resin is obtained by reacting epichlorohydrin in a known manner. Further, the epoxide of the phenol ‧ aralkyl resin containing a biphenyl skeleton represented by the above general formula (VIII) is phenol and bis(methoxy) which may be substituted by an alkyl group, an aromatic ring or an unsubstituted group The phenol ‧ aralkyl resin synthesized from the methyl group) biphenyl is obtained by reacting epichlorohydrin in a known manner.

The substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms represented by R ¹ to R ⁵ in the general formula (VII) and R ¹ to R ⁹ in the general formula (VIII) may, for example, be a methyl group. Ethyl, propyl, isopropyl, n-butyl, t-butyl, tert-butyl, pentyl, hexyl, octyl, decyl, dodecyl and the like chain alkyl; cyclopentyl, cyclohexyl a cyclic alkyl group such as a cycloheptyl group, a cyclopentenyl group or a cyclohexenyl group; an alkyl group substituted with an aryl group such as a benzyl group or a phenethyl group; an alkyl group substituted by a methoxy group, substituted with an ethoxy group; An alkyl group substituted with an alkoxy group such as an alkyl group substituted with a butoxy group; an alkyl group substituted with an amine group such as an aminoalkyl group, a dimethylaminoalkyl group or a diethylaminoalkyl group; An alkyl group substituted by a hydroxyl group; an unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butylphenyl group, a t-butylphenyl group, and a second group; An aryl group substituted with an alkyl group such as a methylnaphthyl group; a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, a methoxynaphthyl group or the like substituted by an alkoxy group An aryl group; a dimethylamino group, a diethylamino group or the like substituted by an amine group An aryl group; an aryl group substituted by a hydroxyl group or the like.

Wherein in the formula (VII) as a general formula of R ¹ ~ R ⁴ and the general formula ^{(VIII) R 1 ~ R 8} , are each independently a hydrogen atom or a methyl group is preferred. R ⁵ in the general formula (VII) and R ⁹ in the general formula (VIII) are preferably a methyl group.

Each of i in the general formula (VII) and the general formula (VIII) independently represents an integer of 0 to 3, preferably 0 or 1.

Further, in the general formula (VII) and the general formula (VIII), n each independently represents an integer of 0 to 10, and an average of 6 or less is preferable. As a commercially available product, the general formula (VII) can be obtained from the product name NC-2000L manufactured by Nippon Kayaku Co., Ltd., and the general formula (VIII) can be obtained from the product name of Nippon Kayaku Co., Ltd. NC-3000S.

When the phenol aralkyl resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the epoxy resin, and more preferably 30% by mass or more.

Moreover, it is preferable to contain the epoxy resin represented by the above general formula (I) from the viewpoint of achieving both flame retardancy, reflow resistance, and fluidity, and R ¹ to R ^{8 of the} above general formula (VIII). It is a hydrogen atom and R ¹ to R ⁸ of the above general formula (I) are a hydrogen atom and n = 0 is preferred. Further, in particular, the mass ratio thereof is generally (I) / general formula (VIII) = 50/50 to 5/95, preferably 40/60 to 10/90, and 30/70 to 15/. 85 is better. As a commercially available product, CER-3000L (trade name manufactured by Nippon Kayaku Co., Ltd.) or the like can be obtained as a commercially available product.

Examples of the epoxide of the naphthol aralkyl resin include an epoxy resin represented by the following general formula (IX).

In the general formula (IX), R each independently represents a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. A plurality of Rs may all be the same or different. i represents an integer of 0 to 3, X each independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

The epoxide of the naphthol ‧ aralkyl resin represented by the above general formula (IX) can be obtained by using an alkyl substituted, an aromatic ring substituted or unsubstituted naphthol and dimethoxy p-xylene or bis (A) Oxymethyl)biphenyl The naphthol ‧ aralkyl resin synthesized is obtained by reacting epichlorohydrin in a known manner.

X, for example, each independently exhibits an extended aryl group such as a phenyl group, a phenylene group or a naphthyl group; an aryl group substituted with an alkyl group such as a methylphenyl group; and an aryl group substituted with an alkoxy group; An aralkyl group-substituted aryl group; a divalent group derived from an aralkyl group such as a benzyl group or a phenethyl group; a divalent group having an extended aryl group such as benzenedimethyl group; and the like. Among them, from the viewpoint of achieving both flame retardancy and storage stability, each of them is preferably a phenylene group or a phenylene group.

As R in the general formula (IX), for example, methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, t-butyl, pentyl, hexyl, octyl may be independently mentioned. a chain alkyl group such as a fluorenyl group, a fluorenyl group, a tetradecyl group or the like; a cyclic alkyl group such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group or a cyclohexenyl group; a benzyl group, a phenethyl group, etc. Alkyl-substituted alkyl group; alkyl group substituted by methoxy group, alkyl group substituted by ethoxy group, alkyl group substituted by butoxy group, alkyl group substituted by alkoxy group; aminoalkyl group, dimethyl group An alkyl group substituted with an amine group such as an aminoalkyl group or a diethylaminoalkyl group; an alkyl group substituted by a hydroxyl group; an unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; a tolyl group and a dimethylbenzene group; An aryl group substituted with an alkyl group such as ethyl, ethylphenyl, butylphenyl, tert-butylphenyl or dimethylnaphthyl; methoxyphenyl, ethoxyphenyl, butoxyphenyl An aryl group substituted with an alkoxy group such as a tert-butoxyphenyl group or a methoxynaphthyl group; an aryl group substituted with an amine group such as a dimethylamino group or a diethylamino group; and an aryl group substituted by a hydroxyl group; Wait. Among them, as R in the general formula (IX), each is preferably a methyl group, and i is preferably 1 or 2. Make As such a general formula (IX), for example, an epoxide of a naphthol ‧ alkyl resin represented by the following general formula (X) or (XI) can be given.

n represents an integer of 0 to 10, and an average of 6 or less is preferable. The epoxy resin shown by the following general formula (X) is a commercial item, and the brand name ESN-375 by Nippon Steel Chemical Co., Ltd. is mentioned. The epoxy resin shown by the following general formula (XI) is a commercial item, and the brand name ESN-175 by Nippon Steel Chemical Co., Ltd. is mentioned.

When the epoxide of the naphthol ‧ aralkyl resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the epoxy resin, more preferably 30% by mass or more, and 50% by mass. The above is better.

In the general formula (X), X each independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

In the general formula (XI), X each independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

The above biphenyl type epoxy resin, thiodiphenol type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, naphthalene type epoxy resin, triphenylmethane type epoxy resin, phenol ‧ aralkyl The epoxide of the base resin and the epoxide of the naphthol ‧ aralkyl resin may be used alone or in combination of two or more. When these two or more types are used in combination, the content ratio is preferably 50% by mass or more based on the total amount of the epoxy resin, more preferably 60% by mass or more, and still more preferably 80% by mass or more. In particular, the biphenyl type epoxy resin is preferably 50% by mass or more based on the total amount of the epoxy resin, more preferably 60% by mass or more, and still more preferably 80% by mass or more. Further, it is preferred to use the above epoxy resin other than the biphenyl type epoxy resin.

[(B) hardener]

The (B) curing agent used in the present invention is not particularly limited as long as it is generally used for a sealing epoxy resin composition. Examples thereof include phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, thiodiphenol, aminophenol, α -naphthol, β -naphthol, and dihydroxy group. a novolac type phenol resin obtained by condensing or co-condensing a phenol having a aldehyde group such as naphthalene with formaldehyde, benzaldehyde or salicylaldehyde under an acidic catalyst; and a phenol or dimethoxy-p-xylene or a double Aromatic phenolic resin such as phenol ‧ aralkyl resin synthesized by (methoxymethyl) biphenyl, naphthol ‧ aralkyl resin; phenol novolac structure and phenol ‧ aralkyl structure in random, embedded a copolymerized phenol aralkyl resin which is repeated in stages or alternately; a p-xylylene and/or m-xylylene modified phenol resin; a melamine-modified phenol resin; a terpene-modified phenol resin; Diene modified phenol resin; cyclopentadiene modified phenol resin; polycyclic aromatic ring modified phenol resin. These may be used alone or in combination of two or more.

Among them, from the viewpoints of fluidity, flame retardancy and reflow resistance, phenol ‧ aralkyl resin, copolymerized phenol ‧ aralkyl resin and naphthol ‧ aralkyl resin are preferred, and heat resistance, From the viewpoint of low expansion ratio and low anti-warpage property, a triphenylmethane type phenol resin is preferred, and a novolak type phenol resin is preferred from the viewpoint of hardenability. It is preferred to contain at least one of these phenol resins.

The phenol aralkyl resin may, for example, be a resin represented by the following general formula (XII).

In the general formula (XII), R each independently represents a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. A plurality of Rs may all be the same or different. i each independently represents an integer of 0 to 3, X each independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

As R in the above general formula (XII), for example, methyl, ethyl, propyl, isopropyl, n-butyl, t-butyl, t-butyl, pentyl, hexyl, etc. may be independently mentioned. Xinji, Yanji, Twelve, etc. a chain alkyl group; a cyclic alkyl group such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group or a cyclohexenyl group; an alkyl group substituted with an aryl group such as a benzyl group or a phenethyl group; Alkyl-substituted alkyl group, alkyl group substituted by ethoxy group, alkyl group substituted by butoxy group, etc.; alkyl group substituted by alkoxy group; aminoalkyl group, dimethylaminoalkyl group, diethylamine An alkyl group substituted with an amine group; an alkyl group substituted by a hydroxyl group; an unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; a tolyl group, a dimethylphenyl group, an ethylphenyl group, a butyl group An aryl group substituted with an alkyl group such as a phenyl group, a t-butylphenyl group or a dimethylnaphthyl group; a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a third butoxyphenyl group, An aryl group substituted with an alkoxy group such as a methoxynaphthyl group; an aryl group substituted with an amine group such as a dimethylamino group or a diethylamino group; an aryl group substituted with a hydroxyl group; and the like.

Among them, as R in the general formula (XII), each is preferably a methyl group. Further, i in the general formula (XII) independently represents an integer of 0 to 3, preferably 1 or 2.

X in the above general formula (XII) each independently represents a group having an aromatic ring. For example, an aryl group such as a stretching phenyl group, a stretching phenyl group or a stretching naphthyl group; an exoaryl group substituted by an alkyl group such as a phenyl group; an exoaryl group substituted by an alkoxy group; a divalent group obtained by an aralkyl group such as a methyl group or a phenethyl group; an extended aryl group substituted by an aralkyl group; a divalent group having an extended aryl group such as benzodimethyl group; and the like.

In view of the viewpoints of compatibility with flame retardancy, fluidity, and hardenability, each of X is preferably a substituted or unsubstituted phenyl group. For example, the above general formula (XII) includes the following general formula ( Phenol aralkyl resin shown in XIII). From the point of view of both flame retardancy and reflow resistance It is preferable that each of X is a substituted or unsubstituted biphenyl group. For example, the above formula (XII) includes a phenol ‧ aralkyl resin represented by the following general formula (XIV).

n represents an integer of 0 to 10, and an average of 6 or less is preferable.

In the general formula (XIII), n represents an integer of 0 to 10.

In the general formula (XIV), n represents an integer of 0 to 10.

The phenol aralkyl resin represented by the above general formula (XIII) is commercially available from Mitsui Chemicals Co., Ltd. under the trade name XLC. The phenol aralkyl resin containing a bisphenylene skeleton represented by the general formula (XIV) is commercially available, and the product name MEH-7851 manufactured by Mingwa Chemical Co., Ltd. is mentioned.

When the phenol aralkyl resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the curing agent, more preferably 30% by mass or more, and still more preferably 50% by mass or more.

The naphthol ‧ aralkyl resin may, for example, be a resin represented by the following general formula (XV).

In the general formula (XV), R each independently represents a substituted or unsubstituted one-valent hydrocarbon group having 1 to 12 carbon atoms. A plurality of Rs may all be the same or different. i each independently represents an integer of 0 to 3, X each independently represents a divalent organic group having an aromatic ring, and n represents an integer of 0 to 10.

As R in the above general formula (XV), for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, a second butyl group, a third butyl group, a pentyl group, a hexyl group, or the like may be independently mentioned. a chain alkyl group such as an octyl group, a decyl group or a dodecyl group; a cyclic alkyl group such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group or a cyclohexenyl group; a benzyl group, a phenethyl group or the like An aryl-substituted alkyl group; an alkyl group substituted by a methoxy group; an alkyl group substituted by an ethoxy group; an alkyl group substituted by a butoxy group; An alkyl group substituted with an amine group such as an aminoalkyl group or a diethylaminoalkyl group; an alkyl group substituted by a hydroxyl group; an unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; a tolyl group or a dimethyl group; An aryl group substituted with an alkyl group such as phenyl, ethylphenyl, butylphenyl, tert-butylphenyl or dimethylnaphthyl; methoxyphenyl, ethoxyphenyl, butoxybenzene Base, tert-butoxyphenyl, methoxynaphthyl An aryl group substituted with an alkoxy group; an aryl group substituted with an amine group such as a dimethylamino group or a diethylamino group; an aryl group substituted with a hydroxyl group; and the like.

Among them, as R in the general formula (XV), a methyl group is preferred. Further, i in the general formula (XV) independently represents an integer of 0 to 3, preferably 1 or 2.

X in the above general formula (XV) each independently represents a divalent organic group having an aromatic ring. For example, an aryl group such as a stretching phenyl group, a stretching phenyl group or a stretching naphthyl group; an exoaryl group substituted by an alkyl group such as a phenyl group; an exoaryl group substituted by an alkoxy group; An alkyl-substituted aryl group; a divalent group obtained from an aralkyl group such as a benzyl group or a phenethyl group; a divalent group having an extended aryl group such as benzodimethyl group; and the like. From the viewpoints of preservation stability and flame retardancy, X is preferably each independently substituted or unsubstituted phenyl and phenyl, and phenyl is preferred, for example, as the above general formula (XV). The naphthol ‧ aralkyl resin represented by the following general formulas (XVI) and (XVII) can be mentioned.

n represents an integer of 0 to 10, and an average of 6 or less is preferable.

In the general formula (XVI), n represents an integer of 0-10.

In the general formula (XVII), n represents an integer of 0 to 10.

As a commercially available product, a naphthol ‧ aralkyl resin represented by the above general formula (XVI) is SN-475 manufactured by Nippon Steel Chemical Co., Ltd. As a commercially available product, a naphthol ‧ aralkyl resin represented by the above general formula (XVII) is SN-170, manufactured by Nippon Steel Chemical Co., Ltd.

When the naphthol ‧ aralkyl resin is used, the content thereof is preferably 20% by mass or more based on the total amount of the curing agent, preferably 30% by mass or more, and more preferably 50% by mass or more. .

The phenol aralkyl resin represented by the above general formula (XII) and the naphthol ‧ aralkyl resin represented by the general formula (XV) are one or all of them and acenaphthylene from the viewpoint of flame retardancy. It is better to mix in advance. The terpene can be obtained by dehydrogenating acenaphthene, and a commercially available product can also be used. Further, a terpene polymer or a polymer of a terpene and another aromatic olefin may be used instead of the terpene.

Examples of the method for obtaining a polymer of a terpene or a polymer of a terpene and another aromatic olefin include radical polymerization, cationic polymerization, anionic polymerization, and the like. Further, a conventionally known catalyst may be used for the polymerization, but it may be heated only without using a catalyst. In this case, the polymerization temperature is preferably from 80 ° C to 160 ° C, and more preferably from 90 ° C to 150 ° C. The softening point of the obtained terpene polymer or the polymer of the terpene and other aromatic olefins 60 ° C ~ 150 ° C is preferred, 70 ° C ~ 130 ° C is preferred. When it is 60 ° C or more, the bleeding during molding is suppressed and the formability is excellent, 150. When it is below °C, the compatibility with the resin tends to increase.

Examples of the other aromatic olefin copolymerized with terpene include styrene, α -methylstyrene, anthracene, benzothiophene, benzofuran, vinylnaphthalene, ethylenebiphenyl or alkyl substituents thereof. . Further, in addition to the above aromatic olefin, an aliphatic olefin may be used in combination within a range not inhibiting the effects of the present invention. Examples of the aliphatic olefin include (meth)acrylic acid and esters thereof, maleic anhydride, itaconic anhydride, fumaric acid, and the like. The amount of use of these aliphatic olefins is preferably 20% by mass or less based on the total amount of the polymerizable monomers, and preferably 9% by mass or less.

As a method of pre-mixing one or all of the curing agent with the terpene, the curing agent and the terpene may be separately pulverized into a fine form, and then directly mixed in a solid state by a mixer or the like, and the two components may be uniformly dissolved. A method in which a solvent of both components is dissolved, a solvent is removed, and a method of melt-mixing the two at a temperature equal to or higher than a softening point of the curing agent and/or terpene. Among these methods, a melt mixing method in which a homogeneous mixture is obtained and less impurities are mixed is preferred. A preliminary mixture (terpene-modified hardener) can be produced by the aforementioned method.

The temperature conditions at the time of melt mixing are not limited as long as it is a temperature higher than the softening point of the curing agent and/or terpene. Specifically, it is preferably 100 ° C to 250 ° C, and more preferably 120 ° C to 200 ° C. Further, the melt mixing may be carried out by mixing the two to be uniform, and the mixing time is not limited, but it is preferably from 1 hour to 20 hours, and from 2 hours to 15 hours. good. When the hardener and the terpene are mixed in advance, it is also possible to polymerize or react with the hardener in the mixing.

Examples of the triphenylmethane type phenol resin include a phenol resin represented by the following general formula (XVIII).

In the general formula (XVIII), R each independently represents a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.

As R in the above general formula (XVIII), for example, a hydrogen atom may be independently mentioned; an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group or a tributyl group; a vinyl group; An alkenyl group such as a butyl group; a halogenated alkyl group; an alkyl group substituted by an amine group; an alkyl group substituted by a thiol group; Among them, R is preferably an alkyl group such as a methyl group or an ethyl group or a hydrogen atom, and a methyl group or a hydrogen atom is preferred.

When the triphenylmethane type phenol resin is used, the content thereof is preferably 30% by mass or more based on the total amount of the curing agent, and preferably 50% by mass or more.

Examples of the novolak-type phenol resin include a novolac type phenol resin such as a phenol resin represented by the following general formula (XIX), and a cresol novolak resin. Among them, a novolac type phenol resin represented by the following general formula (XIX) is preferred.

In the general formula (XIX), R each independently represents a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.

As R in the above general formula (XIX), for example, a hydrogen atom may be independently mentioned; an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group or a tributyl group; a vinyl group; An alkenyl group such as a butyl group; a halogenated alkyl group; an alkyl group substituted by an amine group; an alkyl group substituted by a thiol group; Among them, R is preferably an alkyl group such as a methyl group or an ethyl group or a hydrogen atom, and a hydrogen atom is preferred.

n represents an integer from 0 to 10, and an average value of 0 to 8 is preferred.

The novolac type phenol resin represented by the above-mentioned general formula (XIX) is a commercial product, and the product name H-100 by the company of Minghe Chemical Co., Ltd. is mentioned.

When a novolac type phenol resin is used, the content thereof is preferably 30% by mass or more, and preferably 50% by mass or more, in order to exhibit the performance.

The phenol resin represented by the following general formula (XX) is exemplified as the copolymerized phenol aralkyl resin.

In the general formula (XX), R each independently represents a hydrogen atom, a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms or a hydroxyl group. A plurality of Rs may all be the same or different. Further, X each independently represents a divalent group having an aromatic ring. n and m each independently represent an integer of 0 to 10.

As R in the above general formula (XX), for example, a hydrogen atom may be independently mentioned; methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, second butyl group, tert-butyl group, and pentyl group. a chain alkyl group such as a hexyl group, an octyl group, a decyl group or a dodecyl group; a cyclic alkyl group such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclopentenyl group or a cyclohexenyl group; a benzyl group or a phenyl group; An alkyl group substituted with an aryl group; an alkyl group substituted by a methoxy group, an alkyl group substituted by an ethoxy group, an alkyl group substituted by a butoxy group, or the like, an alkyl group substituted by an alkoxy group; an aminoalkyl group; An alkyl group substituted with an amine group such as a dimethylaminoalkyl group or a diethylaminoalkyl group; an alkyl group substituted by a hydroxyl group; an unsubstituted aryl group such as a phenyl group, a naphthyl group or a biphenyl group; a tolyl group; Dimethylphenyl, ethylphenyl, butylphenyl, An aryl group substituted with an alkyl group such as a butyl phenyl group or a dimethyl naphthyl group; a methoxyphenyl group, an ethoxyphenyl group, a butoxyphenyl group, a tert-butoxyphenyl group, a methoxy group An aryl group substituted with an alkoxy group such as a naphthyl group; an aryl group substituted with an amine group such as a dimethylamino group or a diethylamino group; an aryl group substituted with a hydroxyl group; and the like. Among them, as R, each independently has a hydrogen atom or a methyl group.

Further, n and m each independently represent an integer of 0 to 10, and an average of 6 or less is preferable.

Examples of X in the above general formula (XX) include an extended aryl group such as a stretched phenyl group, a stretched biphenyl group, or an extended naphthyl group; an alkyl group substituted with an alkyl group; and an alkoxy group; a substituted aryl group; an extended aryl group substituted by an aralkyl group; a divalent group obtained from an aralkyl group such as a benzyl group or a phenethyl group; a divalent group having an extended aryl group such as benzodimethyl group; and the like. Among them, a substituted or unsubstituted phenyl group or a biphenyl group is preferred from the viewpoints of preservation stability and flame retardancy. As a compound represented by the general formula (XX), as a commercial product, HE-510 (trade name, manufactured by Air Water Co., Ltd.) or the like can be obtained.

The copolymerized phenol aralkyl resin represented by the above general formula (XX) includes a random copolymer containing m constituent units and n constituent units in a random manner, and interactively copolymerized. The copolymer, the copolymer contained in a regular manner, and the block copolymer contained in a block form. These may be used alone or in combination of two or more.

In the case of using a copolymerized phenol aralkyl resin, the content is preferably 30% by mass or more based on the total amount of the curing agent, and preferably 50% by mass or more.

The phenol aralkyl resin, the naphthol aralkyl resin, the triphenylmethane phenol resin, the novolak phenol resin, and the copolymerized phenol aralkyl resin may be used alone or in combination of two or more. use. When the content of the phenol resin is 50% by mass or more in total, the content is preferably 60% by mass or more, and more preferably 80% by mass or more.

[(C) benzophenone derivative]

The epoxy resin composition for sealing of the present invention contains (C) a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule. Thereby, a sealing epoxy resin composition having high adhesion to a metal at a high temperature and excellent reflow resistance is obtained.

(C) a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule used in the present invention as long as it is a substituted or unsubstituted benzophenone, naphthyl phenyl ketone or dinaphthone It is not particularly limited as long as one or more hydroxyl groups are directly bonded to an aromatic ring such as xanthone or fluorenone. (C) The benzophenone derivative which has one or more phenolic hydroxyl groups in one molecule may be used alone or in combination of two or more.

Specific examples thereof include o-hydroxybenzophenone, m-hydroxybenzophenone, p-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, and 2-hydroxy-4-n-octyl group. Oxybenzophenone, 2-hydroxy-4-allyloxybenzophenone, 2,4-dihydroxybenzophenone, 4,4'-dihydroxybenzophenone, 2,2'- Dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,3,3',4,4',5-hexahydroxydi Benzophenone and its positional isomers or substituents. From the viewpoint of reduced thermal stress (decreased elastic modulus at reflow temperature), o-hydroxybenzophenone, m-hydroxybenzophenone, p-hydroxybenzophenone, 2-hydroxy-4-methoxy Benzophenone, 2-hydroxy-4-octyloxybenzophenone is preferred, and further, from the viewpoint of improved adhesion, 2,4-dihydroxybenzophenone, 4,4'-dihydroxyl Benzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone are preferred.

The total content of the (B) benzophenone derivative having one or more phenolic hydroxyl groups in one molecule used in the present invention is 0.1% by mass or more and 1.0% by mass in the epoxy resin composition for sealing. The following is better. When it is 0.1% by mass or more, the effect of the invention is sufficiently exhibited, and when it is 1.0% by mass or less, the hardness of the epoxy resin composition for sealing tends to be sufficiently maintained.

In the present invention, (A) an epoxy resin and (B) a curing agent and (C) an equivalent ratio of a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule, that is, (B) a curing agent and (C) ratio of the total number of hydroxyl groups in the benzophenone derivative having one or more phenolic hydroxyl groups in one molecule to the number of epoxy groups in the epoxy resin (A) (B) hardener and C) The total number of hydroxyl groups in the benzophenone derivative having one or more phenolic hydroxyl groups in one molecule / (A) The number of epoxy groups in the epoxy resin) is not particularly limited. In order to minimize each unreacted portion, it is preferable to set the above-described equivalent ratio to be 0.5 or more and 2.0 or less, and to be 0.6 or more. 1.3 is preferred below. In order to obtain a sealing epoxy resin composition excellent in moldability, a range of 0.8 or more and 1.2 or less is more preferable.

[(D) decane compound]

The molding material of the present invention may contain (D) a decane compound. The (D) decane compound is various decane-based compounds such as epoxy decane, hydrothiodecane, amino decane, alkyl decane, urea decane, and vinyl decane. To exemplify these, examples include ethylene trichlorodecane, ethylene trimethoxy decane, ethylene triethoxy decane, ethylene ginseng ( β -methoxyethoxy) decane, and γ -methyl propylene methoxy propyl group. Trimethoxydecane, γ -methacryloxypropyltriethoxydecane, γ -methacryloxypropylmethyldimethoxydecane, γ -methacryloxypropylpropyl Diethoxy decane, γ -methyl propylene methoxypropyl dimethyl methoxy decane, γ -methyl propylene methoxy propyl dimethyl ethoxy decane, γ - propylene methoxy propylene Trimethoxy decane, γ -propylene methoxypropyl triethoxy decane, β- (3,4-epoxycyclohexyl)ethyltrimethoxydecane, γ -glycidoxypropyltrimethyl Oxydecane, γ -glycidoxypropyltriethoxydecane, γ -glycidoxypropylmethyldimethoxydecane, γ -glycidoxypropylmethyldiethoxylate Base decane, γ -glycidoxypropyl dimethyl methoxy decane, γ -glycidoxypropyl dimethyl ethoxy decane, ethylene triethoxy decane, γ -hydrogenthio Propyl three Silane group, γ - mercapto propyltriethoxysilane Silane, bis (triethoxysilylpropyl silicon alkyl) tetrasulfide, γ - aminopropyl trimethoxy Silane, γ - aminopropyl three Silane ethoxy, γ - [bis (β - hydroxyethyl) amino] propyltriethoxysilane Silane, N- β - (aminoethyl) - γ - aminopropyl triethoxysilane Silane, N-(trimethoxydecylpropyl) ethylene ethylamine, isocyanate propyl trimethoxy decane, isocyanate propyl triethoxy decane, methyl trimethoxy decane, methyl triethoxy decane, two Methyl dimethoxy decane, dimethyl diethoxy decane, phenyl trimethoxy decane, phenyl triethoxy decane, diphenyl dimethoxy decane, diphenyl diethoxy decane, Diphenyldecanediol, triphenylmethoxydecane, triphenylethoxydecane, triphenylstanol, N- β- (N-vinylbenzylaminoethyl) -γ -amine Propyltrimethoxydecane, γ -chloropropyltrimethoxydecane, hexamethyldioxane, γ -anilinopropyltrimethoxydecane, γ -anilinopropyltriethoxydecane, 2-triethyl Oxyalkylene-N-( 1,3-Dimethyl-butylene)propylamine, 3-triethoxydecyl-N-(1,3-dimethyl-butylene)propylamine, N-(3-triethoxy) Base propyl propyl) phenylimine, 3-(3-(triethoxydecyl)propylamino)-N,N-dimethylpropanamide, N-triethoxydecyl propyl a decane compound such as methyl-β-alanine methyl ester, 3-(triethoxydecylpropyl)dihydro-3,5-furandione or bis(trimethoxydecyl)benzene; 1H-imidazole, Imidazole compound such as 2-alkylimidazole, 2,4-dialkylimidazole or 4-vinylimidazole with γ -glycidoxypropyltrimethoxydecane, γ -glycidoxypropyltriethoxy An imidazole-based decane compound of a reaction product of γ -glycidoxypropyl alkoxy decane such as decane. These may be used alone or in combination of two or more.

When the (D) decane compound is contained, the total content of the (D) decane compound is preferably 0.06 mass% or more and 2 mass% or less in terms of moldability and fluidity. It is preferably 0.1% by mass or more and 0.75% by mass or less, more preferably 0.2% by mass or more and 0.7% by mass or less. When it is 0.06 mass% or more, the fluidity tends to be lowered, and when it is 2 mass% or less, molding defects such as voids tend to be suppressed.

In the epoxy resin composition for sealing of the present invention, a conventionally known coupling agent other than the (D) decane compound may be added. For example, isopropyl triisostearate titanate, isopropyl ginate (dioctylpyrophosphate) titanate, isopropyl tris(N-aminoethyl-aminoethyl) Titanate, tetraoctylbis(di(tridecyl)phosphite) titanate, tetrakis(2,2-diallyloxymethyl-1-butyl)bis(di(tridecane) Base)) phosphite titanate, bis(dioctylpyrophosphate)oxyacetate titanate, bis(dioctylpyrophosphate)extended ethyl titanate, isopropyltrioctylidene titanium Acid ester, isopropyl dimethyl propylene decyl isostearyl decyl titanate, isopropyl isostearyl decyl bis propylene decyl titanate, isopropyl tris(dioctyl phosphate) titanic acid Titrate coupling agent such as ester, isopropyl tricumyl phenyl titanate or tetraisopropyl bis(dioctylphosphite) titanate, aluminum chelate compound, aluminum/zirconium compound Wait. These may be used alone or in combination of two or more.

(D) The total content of the coupling agent other than the decane compound is preferably 0.06 mass% or more and 2 mass% or less, and more preferably 0.1 mass% or more, from the viewpoint of moldability and adhesiveness. Further, it is preferably 0.75 mass% or less, more preferably 0.2 mass% or more and 0.7 mass% or less. When it is 0.06 mass% or more, it can suppress flow When the amount is less than 2% by mass, the molding failure such as voids tends to be suppressed.

[(E) hardening accelerator]

The epoxy resin composition for sealing of the present invention may contain (E) a curing accelerator. The (E) hardening accelerator to be used in the present invention is not particularly limited as long as it is generally used for the epoxy resin composition for sealing.

For example, 1,8-diazabicyclo[5.4.0]undecene-7, 1,5-diazabicyclo[4.3.0]nonene-5,5,6-dibutylamine can be mentioned. a cyclic oxime compound such as keto-1,8-diazabicyclo[5.4.0]undecene-7 and addition of maleic anhydride, 1,4-benzoquinone, 2,5-toluene, 1 to these compounds , 4-naphthoquinone, 2,3-dimethylphenylhydrazine, 2,6-dimethylphenylhydrazine, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3 a compound having a molecular weight of ytterbium compound such as dimethoxy-1,4-benzoquinone or phenyl-1,4-benzoquinone, a compound having a π bond such as diazophenylmethane or a phenol resin a tertiary amine such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, ginseng (dimethylaminomethyl)phenol, and derivatives thereof; 2-methylimidazole, 2- Imidazoles such as phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole, and derivatives thereof; tributylphosphine, methyldiphenylphosphine, triphenylphosphine, and ginseng a third phosphine such as (4-methylphenyl)phosphine, diphenylphosphine or phenylphosphine, or a maleic anhydride, a hydrazine compound, a diazophenylmethane or a phenol resin added to the third phosphine π bond a phosphorus compound having an intramolecular polarization formed by a compound; a tetrasubstituted anthracene tetrasubstituted boronic acid such as tetraphenylphosphonium tetraphenylboronic acid, tetraphenylphosphonium ethyltriphenylboronic acid or tetrabutylphosphonium tetrabutylborate; Tetraphenylboronic acid such as 2-ethyl-4-methylimidazole‧tetraphenylboronic acid, N-methylmorpholine or tetraphenylboronic acid, and derivatives thereof. These may be used alone or in combination of two or more.

The third phosphine used as an adduct of the third phosphine and the hydrazine compound is not particularly limited. For example, dibutylphenylphosphine, butyl diphenylphosphine, ethyl diphenylphosphine, triphenylphosphine, ginseng (4-methylphenyl) phosphine, and ginseng (4-ethylphenyl) are mentioned. Phosphine, ginseng (4-propylphenyl)phosphine, ginseng (4-butylphenyl)phosphine, cis (isopropylphenyl)phosphine, ginseng (t-butylphenyl)phosphine, ginseng (2,4 -Dimethylphenyl)phosphine, ginseng (2,6-dimethylphenyl)phosphine, ginseng (2,4,6-trimethylphenyl)phosphine, ginseng (2,6-dimethyl-4) a third phosphine having an aryl group such as -ethoxyphenyl)phosphine, stilbene (4-methoxyphenyl)phosphine, ginseng (4-ethoxyphenyl)phosphine or the like. From the viewpoint of formability, triphenylphosphine is preferred.

Further, the ruthenium compound used as an adduct of the third phosphine and the ruthenium compound is not particularly limited. For example, o-benzoquinone, p-benzoquinone, biphenyl fluorene, 1,4-naphthoquinone, anthracene, etc. are mentioned. Phenylhydrazine is preferred from the viewpoint of moisture resistance or preservation stability.

(E) The content of the hardening accelerator is not particularly limited as long as it is an amount capable of achieving a hardening promoting effect. Specifically, it is 0.1 part by mass based on 100 parts by mass of (A) epoxy resin, (B) hardener, and (C) benzophenone derivative having one or more phenolic hydroxyl groups in one molecule. It is preferably 10 parts by mass or more and more preferably 0.3 parts by mass or more and 5 parts by mass or less. When it is 0.1 parts by mass or more, It can be hardened in a short time, and when it is 10 mass parts or less, the hardening speed can be suitably suppressed and the favorable molded product tends to be acquired.

[(F) Inorganic Filler]

The epoxy resin composition for sealing of the present invention may contain (F) an inorganic filler. The inorganic filler (F) used in the present invention is added to the epoxy resin composition for sealing in order to reduce hygroscopicity, linear expansion coefficient, thermal conductivity, and strength, as long as it is generally used for sealing epoxy. The resin composition is not particularly limited. For example, molten cerium oxide, crystalline cerium oxide, aluminum oxide, zircon (zirconium silicate), calcium silicate, calcium carbonate, potassium titanate, tantalum carbide, tantalum nitride, aluminum nitride, boron nitride Powders such as cerium oxide, zirconium oxide, zircon (zirconium silicate), forsterite, talc, spinel, mullite, titanium dioxide, or the like, or spheroidized beads, glass fibers, and the like. These may be used alone or in combination of two or more.

Among them, molten cerium oxide is preferred from the viewpoint of a reduction in linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity, and from the viewpoint of fluidity at the time of molding and mold wearability, a filler The shape is preferably spherical. In particular, from the viewpoint of the balance between cost and performance, it is preferred to melt the cerium oxide in a spherical shape.

The average particle diameter (D50) of the inorganic filler is preferably from 0.1 μm to 50 μm , more preferably from 10 μm to 30 μm . When the average particle diameter is set to 0.1 μm or more, the viscosity of the epoxy resin composition for sealing can be suppressed from increasing, and when it is 50 μm or less, the separation between the resin component and the inorganic filling agent can be reduced. Therefore, when it is in the range of the above average particle diameter, it is possible to prevent the cured product from being uneven, the deterioration of the properties of the cured product, and the decrease in the filling property between the narrow gaps.

Further, the volume average particle diameter (D50) is a particle size distribution, and when the volume cumulative distribution curve is drawn from the small particle diameter side, the particle diameter is 50% by volume. The measurement can be carried out by dispersing the sample in the purified water containing the surfactant and using a laser diffraction type particle size distribution measuring apparatus (for example, SALD-3000J manufactured by Shimadzu Corporation).

From the viewpoint of fluidity, the particle shape of the inorganic filler is preferably spherical in shape from the angle. Further, the ratio of the surface area of the inorganic filler viewpoint of fluidity to ^{0.1m 2 / g ~ 10m 2 /} g is preferable, and 0.5m ² /g~6.0m ² / g is preferred.

The content of the inorganic filler is preferably 70% by mass or more and 95% by mass or less based on the epoxy resin composition for sealing, from the viewpoints of reduction in flame retardancy, moldability, hygroscopicity, coefficient of linear expansion, and strength. . When it is 70% by mass or more, the flame retardancy tends to be excellent, and when it is 95% by mass or less, the fluidity tends to be excellent.

[Other additives]

The epoxy resin composition for sealing of the present invention comprises (A) an epoxy resin, (B) a hardener, (C) a benzophenone derivative, (D) a decane compound, (E) a hardening accelerator, and (F). In addition to the inorganic filler, various additives such as an anion exchanger, a mold release agent, a flame retardant, a colorant, and a stress relaxation agent exemplified below may be contained as necessary. However, the epoxy resin composition for sealing of the present invention is not limited to the following additives, and various additives known in the art may be added as necessary.

(anion exchanger)

In the epoxy resin composition for sealing of the present invention, an anion exchanger may be added as needed for the purpose of improving the moisture resistance and high-temperature placement characteristics of the IC. The anion exchanger is not particularly limited, and those known in the art can be used. For example, hydrotalcites and hydrous oxides selected from elements of magnesium, aluminum, titanium, zirconium, and hafnium may be mentioned. One type of these may be used alone or two or more types may be used in combination. Among them, hydrotalcite represented by the following composition formula (XXI) is preferred.

[Chem. 21] Mg _1-x Al _x (OH) ₂ (CO ₃ ) _x/2 . mH ₂ O....(XXI)

In the composition formula (XXI), 0 < X ≦ 0.5, and m represents a positive number.

The content of the anion exchanger is not particularly limited as long as it can capture an anion such as a halide ion. Specifically, it is preferably 0.1 parts by mass or more and 30 parts by mass or less, and more preferably 1 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the (A) epoxy resin.

(release agent)

In the epoxy resin composition for sealing of the present invention, a release agent may be contained as necessary. The amount of the oxidized or non-oxidized polyolefin is preferably 0.01 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the (A) epoxy resin, and 0.1 parts by mass or more and 5 parts by mass are used. The following are preferred. When the amount is 0.01 parts by mass or more, the mold release property tends to be sufficient, and when it is 10 parts by mass or less, the adhesiveness tends to be excellent.

Examples of the oxidized or non-oxidized polyolefin include a low molecular weight polyethylene having a number average molecular weight of about 500 to 10,000, such as H4, PE, and PED series, manufactured by Hoechst Co., Ltd. Further, examples of the release agent other than these include palm wax, montanic acid ester, montanic acid, and stearic acid. These may be used alone or in combination of two or more.

In addition to the oxidized or non-oxidized polyolefin, when the other release agent is used in combination, the total content thereof is preferably 0.1 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the (A) epoxy resin. It is preferably 0.5 parts by mass or more and 3 parts by mass or less.

(flammable agent)

In the epoxy resin composition for sealing of the present invention, a conventionally known flame retardant may be added as necessary. For example, an inorganic substance such as a brominated epoxy resin, antimony trioxide, red phosphorus, aluminum hydroxide, magnesium hydroxide or zinc oxide, and/or a red phosphorus or a phosphate ester coated with a thermosetting resin such as a phenol resin may be used. Phosphorus compound; nitrogen-containing compound such as melamine, melamine derivative, melamine-modified phenol resin, compound having a triazine ring, cyanuric acid derivative, or isocyanuric acid derivative; A compound of phosphorus and nitrogen; aluminum hydroxide, magnesium hydroxide, and a composite metal hydroxide represented by the following composition formula (XXII).

[Chem. 22] p (M ¹ _a O _b ). q(M ² _c O _d ). r(M ³ _e O _f ). mH ₂ O....(XXII)

In the composition formula (XXII), M ¹ , M ² and M ³ represent metal elements different from each other, and a, b, c, d, e, f, p, q and m are positive numbers, and r is 0 or a positive number.

M ¹ , M ² and M ³ in the above composition formula (XXII) are not particularly limited as long as they are metal elements different from each other. In addition, the classification of metal elements is a long-period periodic table in which a typical element is a sub-group and a transition element is a sub-group B. (Source: Kyoritsu Publishing Co., Ltd. issued "Chemical Dictionary 4" February 1987 The 15th brushed version of the 30th brush) is subject to approval.

From the viewpoint of flame retardancy, M ¹ is a metal element selected from the third cycle, an alkaline earth metal element of Group IIA, a metal element belonging to Group IVB, Group IIB, Group VIII, Group IB, Group IIIA, and Group IVA. , M ² is preferably a transition metal element selected from the group consisting of IIIB to IIB, M ¹ is selected from the group consisting of magnesium, calcium, aluminum, tin, titanium, iron, cobalt, nickel, copper and zinc, and M ² is selected from iron, Cobalt, nickel, copper and zinc are preferred. From the viewpoint of fluidity, M ¹ is magnesium, M ² is zinc or nickel, and r = 0 is preferred.

The molar ratio of p, q and r is not particularly limited, and is preferably r=0 and p/q is 1/99 to 1/1.

Further, examples thereof include compounds containing a metal element such as zinc oxide, zinc stannate, zinc borate, iron oxide, molybdenum oxide, zinc molybdate, and dicyclopentadienyl iron. These may be used alone or in combination of two or more.

The content of the flame retardant is not particularly limited, and is preferably 1 part by mass or more and 30 parts by mass or less, and preferably 2 parts by mass or more and 15 parts by mass or less with respect to 100 parts by mass of the (A) epoxy resin.

(colorant, stress relieving agent)

Further, the epoxy resin composition for sealing of the present invention may contain a coloring agent such as carbon black, an organic dye, an organic pigment, titanium oxide, lead dan or red iron oxide. Further, as other additives, a stress relieving agent such as eucalyptus oil or a silicone rubber powder may be added as necessary.

<Preparation of epoxy resin composition for sealing>

The epoxy resin composition for sealing of the present invention can be prepared by any method as long as it can uniformly disperse and mix various components. As a general method, a method in which a predetermined amount of a component is sufficiently mixed by a mixer or the like, and then melt-kneaded by a roll mixer or an extruder, and then cooled and pulverized is mentioned. For example, the above components may be uniformly stirred and mixed in a predetermined amount, and heated in advance at 70 to 140 ° C, kneaded by a kneading machine, a roll, an extruder, or the like, cooled, and then pulverized. It is easier to use if it is ingots in accordance with the size and quality of the forming conditions.

<Electronic parts device>

As an electronic component device including a component sealed by the epoxy resin composition for sealing obtained by the present invention, a semiconductor device can be mounted on a support member such as a lead frame or a tape carrier, a circuit board, a glass, or a germanium wafer. An active component such as a wafer, a transistor, a diode, or a thyristor, a passive component such as a capacitor, a resistor, or a coil, and the like, and an electronic component device in which a sealing epoxy resin composition of the present invention is required to be sealed.

As such an electronic component device, for example, a semiconductor element can be fixed on a lead frame, and a component such as a bond pad can be used. After the terminal portion and the lead portion are connected by wire bonding or bumping, the sealing epoxy resin composition of the present invention is sealed by transfer molding or the like: DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead package) A general resin-sealed IC such as a TSOP (Thin Small Outline Package) or a TQFP (Thin Quad Flat Package); a semiconductor wafer to be bonded to a carrier with a bump to seal the present invention TCP (Tape Carrier Package) sealed with an epoxy resin composition; connected to a circuit formed on a circuit board or glass by wire bonding, Flip Chip Bonding, soldering, etc. Active components such as semiconductor wafers, transistors, diodes, thyristors, and/or passive components such as capacitors, resistors, coils, etc., with the epoxy resin group for sealing of the present invention a COB (Chip On Board) module, a hybrid IC or a multi-chip module sealed by a substance; a component mounted on a surface of an organic substrate on which a terminal for circuit board connection is formed on the back surface, by bumps or wires After bonding the connecting member and the circuit formed on the organic substrate, the BGA (Ball Grid Array) and the CSP (Chip Size Package) are sealed by the sealing epoxy resin composition of the present invention. Package) and so on. Further, the epoxy resin composition for sealing of the present invention can be effectively used in a printed circuit board.

As a method of sealing a member using the epoxy resin composition for sealing of the present invention, a low pressure transfer molding method is most common, but a spray molding method, a compression molding method, or the like may be used.

[Examples]

The invention is illustrated by the following examples, but the scope of the invention is not limited by the examples. Further, "%" means "% by mass" unless otherwise specified.

<Preparation of epoxy resin composition for sealing>

The following components were each added in the mass parts shown in the following Tables 1 to 6, and kneaded at a kneading temperature of 80 ° C and a kneading time of 10 minutes to prepare Examples 1 to 24 and Comparative Examples 1 to 24; The seal is made of an epoxy resin composition. And the empty column in the table indicates no addition.

Used as (A) epoxy resin: Epoxy resin 1: biphenyl type epoxy resin having a melting point equivalent of 196 g/eq and a melting point of 106 ° C (trade name YX-4000, manufactured by Nippon Epoxy Resin Co., Ltd.), Epoxy resin 2: an epoxy group having an epoxy group equivalent of 240 g/eq and a phenolic aralkyl type epoxy resin having a diphenyl structure at a softening point of 96 ° C (trade name CER-3000L, manufactured by Nippon Kayaku Co., Ltd.), Epoxy resin 3: phenol ‧ aralkyl type epoxy resin having an epoxy equivalent of 238 g/eq and a softening point of 55 ° C (trade name NC-2000L, manufactured by Nippon Kayaku Co., Ltd.), Epoxy resin 4: an o-cresol novolac type epoxy resin (trade name: N500P-1, manufactured by Dainippon Ink and Chemicals, Inc.) having an epoxy group equivalent of 200 g/eq and a softening point of 60 °C.

As the (B) curing agent: curing agent 1: phenol ‧ aralkyl resin having a hydroxyl group equivalent of 175 g/eq, a softening point of 70 ° C (trade name: MEH-7800, manufactured by Megumi Kasei Co., Ltd.), and hardener 2: hydroxyl equivalent 106 g/eq, phenol novolac resin (trade name: H-100, manufactured by Mingwa Kasei Co., Ltd.) having a softening point of 83 °C.

(C) a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule (hereinafter referred to as a hydroxybenzophenone compound): hydroxybenzophenone compound 1: p-hydroxybenzophenone Hydroxybenzophenone compound 2: o-hydroxybenzophenone, hydroxybenzophenone compound 3: 2-hydroxy-4-methoxybenzophenone, hydroxybenzophenone compound 4: 2,4- Dihydroxybenzophenone, hydroxybenzophenone compound 5: 4,4'-dihydroxybenzophenone.

Further, as a material used for substituting the hydroxybenzophenone in the comparative example, phenol compound 1: phenol, phenol compound 2: p-cresol, phenol compound 3: catechol, Phenol compound 4: resorcinol, phenol compound 5: hydroquinone, benzophenone compound 1: benzophenone, benzophenone compound 2: p-methoxybenzophenone.

As the (D) decane compound: decane compound 1: γ -glycidoxypropyltrimethoxydecane.

As the (E) hardening accelerator: a hardening accelerator 1: a betaine-type adduct of triphenylphosphine and p-benzoquinone.

As the inorganic filler (F): inorganic filler 1: spherical molten cerium oxide having an average particle diameter of 17.5 μm and a specific surface area of 3.8 m ² /g.

As other added components, montanic acid ester and carbon black are used.

<evaluation>

The epoxy resin compositions for sealing of the examples and the comparative examples were evaluated by various characteristic tests of the following (1) to (7). The results of the evaluation are summarized in Tables 7 to 12 below. Further, the molding of the epoxy resin composition for sealing was carried out by a transfer molding machine under the conditions of a mold temperature of 180 ° C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Further, post-hardening was carried out at 180 ° C for 5 hours.

(1) Spiral flow (spiral-flow)

Using a mold for spiral-flow measurement based on EMMI-1-66, the epoxy resin molding material for sealing was molded under the above conditions to obtain a flow distance (cm).

(2) high temperature hardness

The epoxy resin composition for sealing was molded on a circular plate having a diameter of 50 mm and a thickness of 3 mm under the above-described conditions, and immediately after molding, a Shore D-type hardness tester (HD-1120 (Model D) manufactured by Ushimashima Co., Ltd.) was used. Determination.

(3) High temperature hardness when moisture absorption

(2) Before the molding, the epoxy resin composition for sealing was allowed to stand at 25 ° C, 50% RH for 72 hours, and immediately after molding, a Shore D type hardness tester (HD-made by Ushimashima Co., Ltd.) was used. 1120 (Model D)) was measured.

(4) Water absorption rate

After the (2) formed circular plate was post-hardened under the above conditions, it was allowed to stand at 85 ° C, 60% RH for 168 hours, and the mass change before and after the standing was measured to evaluate the water absorption rate (% by mass) = {(placement) The quality of the rear disc - the quality of the front disc placed) / the mass of the front disc placed} × 100.

(5) Flexural modulus at 260 ° C (high temperature bending test)

A three-point bending test based on JIS-K-6911 was carried out using a bending tester (tensilon manufactured by A & D Co., Ltd.), and the bending elastic modulus was obtained by the following formula while maintaining the temperature at 260 ° C. E). In the measurement, the epoxy resin composition for sealing was subjected to the test piece formed into 10 mm, 70 mm, and 3 mm under the above conditions, and the test was carried out under the conditions of a head speed of 1.5 mm/min.

(6) Determination of adhesion to metal at 260 ° C (measurement of shear strength)

The sealing epoxy resin composition was formed into a copper plate or a silver plated copper plate under the above conditions to have a diameter of 4 mm on the bottom surface, a diameter of 3 mm on the top surface, and a height of 4 mm, and then post-hardened by a bond strength test. The machine (4000 series manufactured by Dage Japan Co., Ltd.) measured the shear adhesion at a shear rate of 50 μm /s while maintaining the temperature of various copper sheets at 260 °C.

(7) Reflow resistance

An 80-pin flat package with an outer dimension of 20mm × 14mm × 2mm with a 8mm × 10mm × 0.4mm xenon wafer (lead frame material: copper alloy, top surface of the die pad and silver plated part at the tip end of the wire) The epoxy resin composition for sealing was molded under the above conditions and post-hardened. After leaving this at 85 ° C and 60% RH for one week, Examples 1 to 16 and Comparative Examples 1 to 16 were reflowed at 240 ° C, and Examples 17 to 20 and Comparative Examples 17 to 20 were at 230 ° C. The reflow process was carried out, and Examples 21 to 24 and Comparative Examples 21 to 24 were subjected to reflow treatment at 220 °C. Ultrasonic inspection device (ultrasonic test) for the peeling of the resin/frame interface in the sealed package after reflow processing Equipment, HYE-FOCUS, manufactured by Hitachi Construction Machinery Co., Ltd., was observed and evaluated by the number of packages which were peeled off relative to the number of test packages (5).

The characteristics of the above (1) to (7) were compared between the same epoxy resin and a curing agent, and the examples and comparative examples were compared. Examples 17 to 20 of the combination of Examples 1 to 16 and Comparative Examples 1 to 16 and Epoxy Resin 1 and 3/hardener 1 in which epoxy resin 1 and 2/hardener 1 are combined, for example. Examples 21 to 24 in combination with Comparative Examples 17 to 20, Epoxy Resin 1 and 4/hardener 2 were compared with Comparative Examples 21 to 24.

Referring to Tables 7 to 12, the examples in which the hydroxybenzophenone compound was added were compared with the comparative examples, and the shear adhesion at 260 ° C (silver and copper) was higher, and placed at 85 ° C and 60% RH. In the reflow treatment after the week, peeling of the resin/frame interface is not caused, and the reflow resistance is excellent.

Example 5 in which the ratio of the hydroxybenzophenone compound was 0.1% by mass or less, and the adhesion of Examples 1 to 4 and 6 to 16 in combination with the same epoxy resin/hardener was lower, and only a small effect was exhibited. The hardness of Examples 21, 22, and 24 in which the ratio of the hydroxybenzophenone compound was 1.0% by mass or more was lower than that of the combination of the same epoxy resin/hardener. However, none of the examples produced peeling of the resin/frame interface.

On the other hand, a comparative example of a composition different from the present invention does not satisfy the object of the present invention. Compared with the examples, in the comparative example, the shear adhesion at 260 ° C (silver and copper) was equal to or less, and in the reflow treatment after being placed at 85 ° C and 60% RH for 1 week, most of the package produced resin. The peeling of the frame interface is poor and the reflow resistance is poor.

Claims (5)

An electronic component device including an element sealed by the following epoxy resin composition for sealing, wherein the epoxy resin composition for sealing contains (A) an epoxy resin containing two or more epoxy groups in one molecule. (B) a curing agent, (C) a benzophenone derivative having one or more phenolic hydroxyl groups in one molecule, and (F) an inorganic filler, wherein the (B) curing agent is a phenol resin, and the above (C) The content of the benzophenone derivative having one or more phenolic hydroxyl groups in one molecule is 0.1% by mass or more and 1.0% by mass or less, and the (B) curing agent and the above (C) have one molecule. The ratio of the total number of hydroxyl groups in the benzophenone derivative of one or more phenolic hydroxyl groups to the number of epoxy groups in the epoxy resin (A) is 0.5 or more and 2.0 or less, and the above (F) inorganic filler The content ratio is 70% by mass or more and 95% by mass or less. The electronic component device of claim 1, wherein the epoxy resin composition for sealing further contains (D) a decane compound. An electronic component device according to claim 1 or 2, wherein the epoxy resin composition for sealing further contains (E) Hardening accelerator. The electronic component device of claim 1, wherein the component is mounted on a support member. The electronic component device of claim 1, wherein the aforementioned component is an active component or a passive component.