KR101888697B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR101888697B1
KR101888697B1 KR1020120058385A KR20120058385A KR101888697B1 KR 101888697 B1 KR101888697 B1 KR 101888697B1 KR 1020120058385 A KR1020120058385 A KR 1020120058385A KR 20120058385 A KR20120058385 A KR 20120058385A KR 101888697 B1 KR101888697 B1 KR 101888697B1
Authority
KR
South Korea
Prior art keywords
resin
resin composition
epoxy resin
mass
modified
Prior art date
Application number
KR1020120058385A
Other languages
English (en)
Korean (ko)
Other versions
KR20120134081A (ko
Inventor
시게오 나카무라
가즈히코 츠루이
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20120134081A publication Critical patent/KR20120134081A/ko
Application granted granted Critical
Publication of KR101888697B1 publication Critical patent/KR101888697B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
KR1020120058385A 2011-05-31 2012-05-31 수지 조성물 KR101888697B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011121519 2011-05-31
JPJP-P-2011-121519 2011-05-31

Publications (2)

Publication Number Publication Date
KR20120134081A KR20120134081A (ko) 2012-12-11
KR101888697B1 true KR101888697B1 (ko) 2018-09-20

Family

ID=47685076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120058385A KR101888697B1 (ko) 2011-05-31 2012-05-31 수지 조성물

Country Status (3)

Country Link
JP (1) JP6069887B2 (ja)
KR (1) KR101888697B1 (ja)
TW (1) TWI609917B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6048193B2 (ja) * 2013-02-13 2016-12-21 味の素株式会社 樹脂組成物
CN105027273B (zh) * 2013-03-07 2019-01-22 住友电木株式会社 粘接膜、叠层体及其固化物、和半导体装置及其制造方法
JP6163803B2 (ja) * 2013-03-14 2017-07-19 味の素株式会社 樹脂組成物
JP6313602B2 (ja) * 2013-03-22 2018-04-18 積水化学工業株式会社 エポキシ樹脂材料及び多層基板
JP6314337B2 (ja) * 2013-03-28 2018-04-25 味の素株式会社 シート材
KR102113738B1 (ko) * 2013-11-29 2020-05-21 엘지디스플레이 주식회사 포토레지스트용 스트리퍼 조성물 및 이를 이용한 표시장치의 제조방법
JP6439960B2 (ja) * 2014-08-07 2018-12-19 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
JP6848187B2 (ja) * 2016-02-25 2021-03-24 住友ベークライト株式会社 半導体装置製造用樹脂シート、半導体装置、半導体装置の製造方法、有機樹脂基板および有機樹脂基板の製造方法
US11930594B2 (en) * 2016-08-15 2024-03-12 Resonac Corporation Adhesive film for multilayer printed-wiring board
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
JP7240085B2 (ja) * 2017-03-31 2023-03-15 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
CN108864653A (zh) * 2017-05-10 2018-11-23 味之素株式会社 树脂组合物
JP2021073328A (ja) * 2020-12-25 2021-05-13 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112972A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001261776A (ja) * 2000-03-24 2001-09-26 Matsushita Electric Works Ltd プリント配線板用絶縁材料
JP2005298781A (ja) * 2004-04-06 2005-10-27 Hitachi Kasei Polymer Co Ltd フレキシブルプリント配線板用接着剤組成物および接着フィルム
JPWO2007061086A1 (ja) * 2005-11-25 2009-05-07 日本ゼオン株式会社 硬化性樹脂組成物およびその利用
TWI466938B (zh) * 2009-04-07 2015-01-01 Threebond Fine Chemical Co Ltd 環氧樹脂組成物
JP5133946B2 (ja) * 2009-06-18 2013-01-30 ヤフー株式会社 情報検索装置及び情報検索方法
JP5698453B2 (ja) * 2009-11-10 2015-04-08 日本化薬株式会社 エポキシ樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008112972A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置

Also Published As

Publication number Publication date
TWI609917B (zh) 2018-01-01
KR20120134081A (ko) 2012-12-11
JP2013010932A (ja) 2013-01-17
TW201311810A (zh) 2013-03-16
JP6069887B2 (ja) 2017-02-01

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