KR101882120B1 - 집적 회로 패키지의 정렬 고정구 - Google Patents

집적 회로 패키지의 정렬 고정구 Download PDF

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Publication number
KR101882120B1
KR101882120B1 KR1020167025829A KR20167025829A KR101882120B1 KR 101882120 B1 KR101882120 B1 KR 101882120B1 KR 1020167025829 A KR1020167025829 A KR 1020167025829A KR 20167025829 A KR20167025829 A KR 20167025829A KR 101882120 B1 KR101882120 B1 KR 101882120B1
Authority
KR
South Korea
Prior art keywords
integrated circuit
circuit packages
alignment fixtures
fixtures
alignment
Prior art date
Application number
KR1020167025829A
Other languages
English (en)
Other versions
KR20160124199A (ko
Inventor
스루티 치걸라팔리
르네 제이 산체즈
네이더 엔 아바자니아
토드 알 쿤스
투안 훙 고
Original Assignee
인텔 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인텔 코포레이션 filed Critical 인텔 코포레이션
Publication of KR20160124199A publication Critical patent/KR20160124199A/ko
Application granted granted Critical
Publication of KR101882120B1 publication Critical patent/KR101882120B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Wire Bonding (AREA)
  • Connecting Device With Holders (AREA)
KR1020167025829A 2014-04-21 2014-04-21 집적 회로 패키지의 정렬 고정구 KR101882120B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/034827 WO2015163845A1 (en) 2014-04-21 2014-04-21 Alignment fixtures for integrated circuit packages

Publications (2)

Publication Number Publication Date
KR20160124199A KR20160124199A (ko) 2016-10-26
KR101882120B1 true KR101882120B1 (ko) 2018-07-25

Family

ID=54332878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167025829A KR101882120B1 (ko) 2014-04-21 2014-04-21 집적 회로 패키지의 정렬 고정구

Country Status (8)

Country Link
US (1) US10228418B2 (ko)
JP (1) JP6382343B2 (ko)
KR (1) KR101882120B1 (ko)
CN (1) CN106461702B (ko)
DE (1) DE112014006609T5 (ko)
MY (1) MY192643A (ko)
SG (1) SG11201608514UA (ko)
WO (1) WO2015163845A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
EP3135142B1 (en) * 2015-08-31 2019-06-05 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Magnetic closure element and closure device
US10714988B2 (en) * 2017-08-24 2020-07-14 Uchicago Argonne, Llc Permanent magnet design to enable higher magnetic flux density
US10388579B2 (en) * 2017-09-21 2019-08-20 Texas Instruments Incorporated Multi-plate semiconductor wafer testing systems
CN108000389B (zh) * 2017-11-28 2019-09-24 中国电子科技集团公司第五十八研究所 集成电路恒定加速度试验夹具
KR102200527B1 (ko) * 2019-04-19 2021-01-11 주식회사 아이에스시 소켓 보드 조립체
KR102192764B1 (ko) * 2019-11-19 2020-12-18 (주)티에스이 테스트 소켓 장치
KR20220037124A (ko) * 2020-09-17 2022-03-24 주식회사 엘지에너지솔루션 완충 패드 평가용 지그 및 이를 사용한 완충 패드 평가 방법
KR20220061545A (ko) * 2020-11-06 2022-05-13 삼성전자주식회사 반도체 장치의 테스트 설비
TWI750984B (zh) * 2020-12-30 2021-12-21 致茂電子股份有限公司 架橋連接式的自動化測試系統

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4661886A (en) * 1985-10-03 1987-04-28 Burroughs Corporation Magnetically sealed multichip integrated circuit package
US5204616A (en) 1990-04-26 1993-04-20 The United States Of America As Represented By The Secretary Of The Air Force In-circuit test fixture for leaded packages
US5986459A (en) * 1994-03-18 1999-11-16 Fujitsu Limited Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier
JP4162058B2 (ja) * 1996-06-21 2008-10-08 富士通株式会社 半導体装置の支持装置、半導体装置の固定方法及び半導体装置の支持装置からの離脱方法
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
JP2983163B2 (ja) * 1995-12-27 1999-11-29 株式会社しなのエレクトロニクス Ｉｃハンドラ
JP3932000B2 (ja) 1997-05-29 2007-06-20 株式会社いうら ストレッチャーにおける昇降駆動機構
JP3516860B2 (ja) 1998-03-18 2004-04-05 株式会社アスペクト 形状設計支援装置及び造形方法
US7355427B2 (en) 2005-08-18 2008-04-08 Research In Motion Limited Clamping top plate using magnetic force
CN1978352B (zh) 2005-12-02 2012-01-25 鸿富锦精密工业（深圳）有限公司 浮动式精密对位模具
US20080164267A1 (en) * 2007-01-09 2008-07-10 Alissa Huber Apparatuses, systems and methods for holding portable devices or instruments
EP2317330B1 (en) * 2009-09-11 2013-12-11 Giga-Byte Technology Co., Ltd. Pin connector and chip test fixture having the same
JP5342526B2 (ja) * 2010-09-03 2013-11-13 三菱電機株式会社 Ｔｄｒ式検査装置
JP2013164304A (ja) * 2012-02-09 2013-08-22 Nidec-Read Corp 基板検査用治具
CN103587007A (zh) 2013-10-15 2014-02-19 苏州益群模具有限公司 导位辅助器
KR101357020B1 (ko) * 2013-11-27 2014-02-05 주식회사 티씨에스 전자부품 테스트용 소켓

Also Published As

Publication number Publication date
MY192643A (en) 2022-08-29
DE112014006609T5 (de) 2017-01-26
US10228418B2 (en) 2019-03-12
JP6382343B2 (ja) 2018-08-29
SG11201608514UA (en) 2016-11-29
US20170123001A1 (en) 2017-05-04
JP2017514134A (ja) 2017-06-01
WO2015163845A1 (en) 2015-10-29
CN106461702B (zh) 2019-08-27
CN106461702A (zh) 2017-02-22
KR20160124199A (ko) 2016-10-26

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