KR101878897B1 - High efficiency far infrared ray and anion radiator and producing method thereof - Google Patents

Abstract

The present invention relates to a high efficiency far-infrared rays and anion radiator and a method for manufacturing the same. More particularly, the present invention relates to a high efficiency far-infrared anion radiator and a method for manufacturing the same which effectively provide heat and far-infrared rays to users due to excellent far-infrared radiation quantity and thermal conductivity by manufacturing a far-infrared radiator by mixing expanded graphite having excellent thermal conductivity and a volcanic mineral having excellent far-infrared radiation quantity. The method comprises the step of: manufacturing a first mixture; manufacturing a second mixture; agitating the mixture; forming the mixture into a product; sintering and cooling the product; and polishing the product surface.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-efficiency far-infrared ray and an anion radiator,

More particularly, the present invention relates to a far-infrared ray radiator and a method of manufacturing the same, and more particularly, to a far-infrared ray radiator having excellent thermal conductivity and excellent thermal conductivity by manufacturing a far-infrared ray radiator by mixing expansive graphite having excellent thermal conductivity and a volcanic rock having excellent far- Far infrared ray and an anion radiator and a method of manufacturing the same.

As is well known, generally far-infrared rays are collectively referred to as wavelengths ranging from 3 to 1000 탆, and have wavelengths longer than visible rays, shorter wavelengths than microwaves, and have resonance absorption, radiation, and calendar properties.

Resonance absorbing action refers to an action in which a molecule absorbs far-infrared radiation energy so that the vibration becomes more vigorous when the radiant energy frequency and the molecular frequency of the molecule coincide with each other when the far-infrared ray is irradiated to the material. A part of the energy is converted into an activation energy and the molecular motion is activated. In addition, the term "radiation" refers to the transmission of far-infrared rays emitted from an object to heat, and the "deep-sea calendar" means that the penetration power is determined in proportion to the square root of the wavelength of the radiant energy to be irradiated. Penetration is reduced.

Due to the characteristics of far-infrared rays as described above, far-infrared rays penetrate deep into the body to activate molecules or atoms in the body, thereby discharging various wastes in the body and promoting metabolism, thereby regenerating body health such as cell regeneration and fatigue recovery .

On the other hand, the anion emission material is a crystal having electric polarization, in which the center of the positive charge and the center of the negative charge of the unit lattice of the crystal are slightly shifted from the original position so that a positive electrode and a negative electrode are formed at both ends of the crystal, Electrons are generated.

The electrons generated from the negative electrode are combined with other atoms to form anions. The anions protrude along the electric force lines of the positive electrodes and become a permanent electric current. This current is a minute current of about 0.06 mA, It is the most suitable current.

When the above-mentioned anion generating material hits moisture, it is instantaneously discharged to electrolyze water molecules (H 2 O) into hydrogen ions (H +) and hydroxide ions (OH -). The water is reduced to hydrogen gas (H2) and evaporated, so that the water is alkaline ionized. In addition, the hydroxide ion (OH-) acts to reduce the acidified human body, and weak alkalization of water enhances the immune function (sterilization ability, antibacterial ability), purifies the blood, stimulates the autonomic nerve, .

Recently, due to the efficacy of the above-mentioned far-infrared radiation material and anion emission material, various studies have been made to utilize the characteristics of the far-infrared radiation material as a health product of everyday life. However, in the case of the existing far-infrared ray emitter, Therefore, there is a disadvantage that not only the far infrared ray emissivity is low but also the amount of anion emission is small.

However, it is inevitable to develop materials having properties that can be used as industrial materials while maintaining a high far infrared ray emissivity.

Such a far-infrared ray radiator and its manufacturing method are disclosed in Korean Patent Registration No. 10-0344944 and Patent Publication No. 10-2014-0110380.

Korean Patent Registration No. 10-0344944 discloses that 50 to 55 parts by weight of silicon oxide, 2 to 4 parts by weight of potassium oxide, 3 to 7 parts by weight of alumina, 15 to 25 parts by weight of borax, 10 to 20 parts by weight of sodium oxide, 3 to 7 parts by weight of calcium are put into a vessel and mixed for 30 to 60 minutes. Then, the mixture is charged into a melting furnace at 1200 to 1400 DEG C for 1 to 3 hours and then quenched and pulverized. Then, By weight of the above-mentioned pulverized product.

In addition, in Patent Document 10-2014-0110380, 100 parts by weight of silicon oxide and 4 to 9 parts by weight of potassium oxide, 7 to 15 parts by weight of alumina, 40 to 60 parts by weight of borax, 20 to 30 parts by weight of sodium oxide, 8 to 15 parts by weight of calcium oxide, 30 to 35 parts by weight of pegmatite and 20 to 40 parts by weight of silane are mixed in a vessel for 30 to 60 minutes, And then charged into a melting furnace and fired for 1 to 3 hours, followed by quenching and pulverization.

However, such a far-infrared ray radiator can radiate a high-radiation far-infrared ray and anion, and can maintain the physical properties required by the industry, so that it can be used as a variety of materials in contact with the human body and a high thermal conductivity is required.

(Prior art 1) Korean Patent Registration No. 10-0344944 (Prior Art 2) Korean Patent Laid-Open Publication No. 10-2014-0110380

The present invention relates to a method of manufacturing a far infrared ray radiator by mixing expansive graphite excellent in thermal conductivity and a volcanic rock having excellent far infrared ray radiation amount to produce a far infrared ray radiation amount and excellent thermal conductivity, And an object of the present invention is to provide a highly efficient far-infrared ray and anion radiator and a method of manufacturing the same.

According to an aspect of the present invention,

100 parts by weight of silicon oxide and 4 to 9 parts by weight of potassium oxide, 7 to 15 parts by weight of alumina, 40 to 60 parts by weight of borax, 20 to 30 parts by weight of sodium oxide, 15 to 30 parts by weight for 30 to 60 minutes, adding the mixture to a melting furnace at 1300 to 1500 DEG C for 1 to 3 hours, quenching and pulverizing the mixture at a predetermined particle size; 10 to 20 parts by weight of expanded graphite powder having a predetermined particle size and 10 to 20 parts by weight of a volcanic clay powder having a predetermined particle size are mixed with 100 parts by weight of the quenched primary mixture; A stirring step of stirring the mixture consisting of 80 to 90% by weight of the secondary mixture and 10 to 20% by weight of the binder for 2 to 4 hours; Injecting the secondary mixture, which has been stirred, into a mold and applying the mixture at a pressure of 10 to 50 kg / cm < 2 > for 5 to 10 seconds to mold the product; A sintering step of putting the formed product into a sintering furnace to remove the binder and strengthening the sintered body, sintering the sintered body at 1500 to 1700 ° C for 12 to 24 hours, and then cooling the sintered body; A surface grinding step of grinding the surface of the molded article after sintering and cooling and removing foreign matter; And a coating process for coating the surface of the molded product after surface polishing with a finishing material.

Here, the binder includes at least one selected from the group consisting of polyethylene, polypropylene, ethylene vinyl acetate, polystyrene, polyacetal, and polymethyl methacrylate.

Here, in the primary mixture manufacturing process, the predetermined particle size is pulverized to a particle size of 150 to 250 mesh.

Here, the particle size of the secondary mixture is 150 ~ 250 mesh.

Here again, the finish is Teflon.

According to another aspect of the present invention,

And is a far-infrared ray radiator manufactured by the above-described high-efficiency far-infrared ray and an anion radiator manufacturing method.

According to the high-efficiency far-infrared ray and anion radiator of the present invention having the above-described structure and the method of manufacturing the same, the far-infrared ray radiator can be manufactured by mixing the expanded graphite excellent in thermal conductivity and the volcanic rock having excellent far- It is possible to effectively provide the user with heat and far-infrared rays.

In addition, the present invention can reduce the manufacturing cost by simplifying the manufacturing process by mixing the binder into the mixture and pressurizing it in a mold to produce a molded product.

FIG. 1 is a process diagram for explaining a method of manufacturing a high-efficiency far-infrared ray and an anion radiator according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a high-efficiency far infrared ray and an anion emitter manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and these may be changed according to the intention of the user, the operator, or the like. Therefore, the definition should be based on the contents throughout this specification.

FIG. 1 is a process diagram for explaining a method of manufacturing a high-efficiency far-infrared ray and an anion radiator according to the present invention.

Referring to FIG. 1, a high-efficiency far infrared ray and an anion radiator according to the present invention includes a first mixture manufacturing step (S10), a second mixture manufacturing step (S20), a stirring step (S30) , A sintering step (S50), a surface polishing step (S60), and a coating step (S70).

&Quot; Primary Mixture Manufacturing Process-S10 "

First, 100 parts by weight of silicon oxide and 4 to 9 parts by weight of potassium oxide, 7 to 15 parts by weight of alumina, 40 to 60 parts by weight of borax, 20 to 30 parts by weight of sodium oxide, and calcium oxide And 8 to 15 parts by weight of the mixture are mixed in a stirrer for 30 to 60 minutes and then the mixture is charged into a melting furnace at 1300 to 1500 DEG C for 1 to 3 hours and then quenched and ground to a predetermined particle size to prepare a first mixture. At this time, the silicon oxide, potassium oxide, alumina, borax, sodium oxide, and calcium oxide are added without being pulverized separately.

Silicon oxide has excellent far-infrared radiation efficiency and is generally used in manufacturing far-infrared ray radiators.

In order to manufacture a far-infrared ray radiator having a high far-infrared ray emissivity, it is necessary to burn the silicon oxide at a high temperature. However, if it is baked at an excessively high temperature, it may cause equipment damage and impurities to be introduced due to corrosion of the melter, .

In order to solve this problem, it is necessary to lower the melting temperature of silicon oxide. In the present invention, a part of the silicon oxide content is replaced with borax and alumina in order to lower the melting temperature.

In the present invention, 7-15 parts by weight of alumina and 40-60 parts by weight of borax are used relative to 100 parts by weight of silicon oxide in the present invention.

At this time, the alumina loosens the structure of silicon oxide through the substitution process with silicon oxide at a high temperature to lower the melting temperature of silicon oxide. When added at less than 7 parts by weight, alumina does not exhibit sufficient effect of lowering the melting temperature, If the addition amount exceeds 7 parts by weight, there is a problem that the substitution limit of alumina to silicon oxide is exceeded and the melting temperature is rather increased. Therefore, 7 to 15 parts by weight of alumina is preferably added.

Borax lowers the melting temperature of silicon oxide by loosening the structure of silicon oxide through the substitution process with silicon oxide at a high temperature. When the addition amount is less than 40 parts by weight, borax lowers the melting temperature sufficiently If the amount is more than 60 parts by weight, the structure of the silicon oxide becomes too loose and the produced emitter becomes weak. Therefore, the borax is preferably added in an amount of 40 to 60 parts by weight.

When the addition amount of sodium oxide is less than 20 parts by weight, the effect of lowering the firing temperature can not be sufficiently obtained. When the addition amount exceeds 30 parts by weight, there arises a problem that sodium oxide is eluted at a later time. Is preferably added in an amount of 20 to 30 parts by weight.

When potassium oxide and sodium oxide are added, they are contacted with water and a small amount thereof is eluted into an ionic state to cause whitening. In the present invention, 8-15 parts by weight of calcium oxide is added in order to prevent this.

When calcium oxide is added, calcium ions are mixed with alkali ions such as potassium and sodium, thereby preventing the elution of potassium and sodium ions and increasing the toughness of the material.

On the other hand, the particle size of silicon oxide, potassium oxide, alumina, borax, sodium oxide and calcium oxide has a particle size of 150 to 250 mesh. When the particle size is less than 150 mesh, the surface of the product is rough. And the manufacturing cost is increased.

Further, when the firing temperature is less than 1300 ° C, the additive materials are not sufficiently melted and mixed so that the uniform characteristics of the manufactured far-infrared ray radiator are not exhibited. When the firing temperature exceeds 1500 ° C, impurities are mixed due to corrosion of the melting furnace And a problem of lowering the far-infrared ray emissivity occurs. Therefore, it is preferable to perform the calcination at a temperature within the above range.

In addition, when the melt after the firing is slowly cooled, the far infrared ray emission efficiency is reduced due to the crystallization of the melt. To prevent this, the melt is quenched in the present invention, and quenching is performed using water at room temperature.

&Quot; Secondary Mixture Manufacturing Process-S20 &

10 to 20 parts by weight of expanded graphite powder and 10 to 20 parts by weight of a volcanic clay powder are mixed with 100 parts by weight of the quenched primary mixture.

If the amount of the expanded graphite powder is less than 10 parts by weight, the effect is insignificant. If the amount of the expanded graphite powder is more than 20 parts by weight, the production cost is increased and the strength is lowered. The effect is insignificant. When the amount of the additive is more than 20 parts by weight, the production cost is increased and the strength is lowered.

In this case, the expanded graphite powder and the volcanic silicate powder have a particle size of 150 to 250 mesh. When the particle size is less than 150 mesh, the surface of the product is rough. When the particle size exceeds 250 mesh, it is difficult to handle.

The reason why the expanded graphite powder and the volcanic silicate powder are injected afterwards is that they do not melt like the first mixture and maintain the original properties so as to increase the far infrared radiation dose and improve the thermal conductivity.

On the other hand, expanded graphite is produced by mining graphite from natural minerals and then crushing and watering the graphite. The graphite is washed with strong acid, sintered in high temperature and alkali state, The graphite is intercalated between the layers of the graphite, and then subjected to a neutralization process, followed by washing and drying to produce expanded graphite.

In the expanded graphite produced in this manner, expansion occurs as gas is generated in the chemical contained in the interlayer by heat. The expansion starting temperature of the expanded graphite is determined according to the chemical used.

Expanded graphite has no toxicity, is lightweight, does not contain a halogen component, is insoluble in water, does not generate toxic gas, and has excellent thermal conductivity.

Scoria is also called a volcanic rock. The volcanic rocks are alkaline (pH 7.4) volcanic eruptions naturally fired at 1600 ℃ by volcanic activity, and are colored reddish brown, yellowish brown, black and dark gray.

These volcanic clusters have been used as thermal insulation, insulation, soundproofing and moisture proofing materials, and have been used as a radiation prevention and filtration agent in yards or small roads. The volcanic pine mushroom has excellent far-infrared radiation dose, is effective for absorbing, deodorizing, storing heat, inhibiting fungus and mite propagation, and has recently become a well-being product. Especially, formaldehyde (VOC), volatile organic compound It has been reported that it can prevent various dermatitis and atopy by improving indoor air quality.

&Quot; Stirring process-S30 "

When the mixing of the secondary mixture is completed, the mixture consisting of 80 to 90% by weight of the secondary mixture and 10 to 20% by weight of the binder is put into a stirrer and stirred for 2 to 4 hours.

In this case, the binder preferably includes at least one selected from the group consisting of polyethylene, polypropylene, ethylene vinyl acetate, polystyrene, polyacetal, and polymethyl methacrylate.

In addition, when the binder is added in an amount of less than 10% by weight, the binding force is relatively weak. When the binder is added in an amount exceeding 20% by weight, the product shape may be deformed during molding.

&Quot; Forming process-S40 "

After the stirring, the secondary mixture is poured into a mold, and the product is molded using a press at a pressure of 10 to 50 kg / cm < 2 > for 5 to 10 seconds.

&Quot; Sintering Process-S50 "

When the molding is completed, the binder is removed and the molded product is put into a sintering furnace so as to strengthen the strength, sintered at 1500 to 1700 ° C for 12 to 24 hours, and then cooled at room temperature.

"Surface Polishing Process-S60"

The surface of the molded article after sintering and cooling is polished, and foreign matters are removed.

&Quot; Coating process-S70 "

The finished surface of the surface-polished product is coated with a finish and dried to complete the product. At this time, the finishing material is Teflon.

The high-efficiency far-infrared ray and anion emitter according to the present invention thus manufactured exhibits a maximum wavelength at a wavelength range of 5 to 20 탆, and the far-infrared emissivity is as high as 0.97, thereby maximizing the efficacy by far-infrared radiation and having an extremely high anion emission. Which can be useful for the promotion of health.

Particularly, the high-efficiency far-infrared rays and anion radiators manufactured according to the present invention have high thermal conductivity and can increase the effect of thermal therapy when applied to a product such as a heating product or a personal thermotherapy device.

&Quot; Experimental Example &

Hereinafter, the present invention will be described in more detail with reference to the following experimental examples. However, the present invention is not limited thereto.

<Examples>

1000 g of silicon oxide, 60 g of potassium oxide, 100 g of alumina, 500 g of borax, 250 g of sodium oxide and 100 g of calcium oxide were put into a stirrer and mixed for 30 minutes. Then, the primary mixture was put into a melting furnace at 1400 캜 and calcined for 2 hours, Then, it was pulverized to 200 mesh.

Then, 1000 g of the first mixture, 200 g of expanded graphite powder of 200 mesh, and 200 g of 200 g of the crushed volcanic ash powder were put in a stirrer and mixed for 60 minutes. Then, 900 g of the second mixture and 100 g of the binder were mixed, Followed by stirring for 3 hours.

In this state, the secondary mixture was poured into a mold and molded at a pressure of 30 kg / cm 2 for 10 seconds to form a product. The product was then sintered in a sintering furnace at 1600 ° C. for 16 hours and then cooled to complete the product.

The prepared far-infrared ray radiator was heated to 50 DEG C, and far-infrared ray emissivity and radiant energy of 5 to 20 mu m were measured using FT-IR (MIDAC Corp., M 2400-C, USA) The anion concentration was measured using a highly sensitive and weak current measuring device (Signal Electronics Co., Ltd. (Japan), product name: KST900), and the far infrared ray emissivity, radiant energy and anion concentration measurement results are shown in Table 1 below.

<Comparative Example>

1000 g of silicon oxide, 50 g of potassium oxide, 80 g of alumina, 400 g of borax, 200 g of sodium oxide and 90 g of calcium oxide, 300 g of pegmatite and 200 g of silane (MTMS) were placed in a vessel as disclosed in the conventional patent publication 10-2014-0110380 And the mixture was calcined for 2 hours, followed by quenching and pulverization to 200 mesh. Then, 900 g of the mixture and 100 g of the binder were mixed and stirred, and the mixture was poured into a mold, followed by stirring at 30 kg / cm 2 For 10 seconds to produce a far-infrared ray radiator.

The far-infrared ray emissivity, radiant energy and anion concentration of the prepared far-infrared ray radiator were measured in the same manner as in the above examples, and the results are shown in Table 1 below.

division Far-infrared emissivity Radiant energy (W / m &lt; 2 &gt; Anion concentration (parts / ml) Example 0.98 5.4 x 10 ² 2100 Comparative Example 0.95 4.6 × 10 ² 1600

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It is to be understood, however, that the invention is not to be limited to the specific forms thereof, which are to be considered as being limited to the specific embodiments, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims. .

Claims (6)

100 parts by weight of silicon oxide and 4 to 9 parts by weight of potassium oxide, 7 to 15 parts by weight of alumina, 40 to 60 parts by weight of borax, 20 to 30 parts by weight of sodium oxide, 15 parts by weight of the mixture is mixed for 30 to 60 minutes and then the mixture is charged into a melting furnace at 1300 to 1500 DEG C for 1 to 3 hours followed by quenching and pulverization at a particle size of 150 to 250 mesh;
10 to 20 parts by weight of expanded graphite powder having a particle size of 150 to 250 mesh with 100 parts by weight of a quenched primary mixture and 10 to 20 parts by weight of a volcanic clay powder having a particle size of 150 to 250 mesh are mixed, and;
A mixture comprising 80 to 90% by weight of a secondary mixture and 10 to 20% by weight of a binder containing at least one selected from the group consisting of polyethylene, polypropylene, ethylene vinyl acetate, polystyrene, polyacetal, and polymethyl methacrylate, Stirring for 4 hours;
Injecting the secondary mixture, which has been stirred, into a mold and applying the mixture at a pressure of 10 to 50 kg / cm &lt; 2 &gt; for 5 to 10 seconds to mold the product;
A sintering step of putting the formed product into a sintering furnace to remove the binder and strengthening the sintered body, sintering the sintered body at 1500 to 1700 ° C for 12 to 24 hours, and then cooling the sintered body;
A surface grinding step of grinding the surface of the molded article after sintering and cooling and removing foreign matter; And
And a coating step of coating the surface of the molded article with the surface polished with Teflon as a finishing material. delete delete delete delete A high efficiency far infrared ray and anion radiator manufactured by the manufacturing method of high efficiency far infrared ray and anion radiator of claim 1.

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