KR101872670B1 - 조명 장치 - Google Patents
조명 장치 Download PDFInfo
- Publication number
- KR101872670B1 KR101872670B1 KR1020110106958A KR20110106958A KR101872670B1 KR 101872670 B1 KR101872670 B1 KR 101872670B1 KR 1020110106958 A KR1020110106958 A KR 1020110106958A KR 20110106958 A KR20110106958 A KR 20110106958A KR 101872670 B1 KR101872670 B1 KR 101872670B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- terminal electrode
- light emitting
- layer
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010235089 | 2010-10-20 | ||
| JPJP-P-2010-235089 | 2010-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120041138A KR20120041138A (ko) | 2012-04-30 |
| KR101872670B1 true KR101872670B1 (ko) | 2018-07-02 |
Family
ID=45972225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110106958A Expired - Fee Related KR101872670B1 (ko) | 2010-10-20 | 2011-10-19 | 조명 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9269921B2 (enExample) |
| JP (1) | JP5795935B2 (enExample) |
| KR (1) | KR101872670B1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5795935B2 (ja) * | 2010-10-20 | 2015-10-14 | 株式会社半導体エネルギー研究所 | 照明装置 |
| JP5841406B2 (ja) | 2010-11-05 | 2016-01-13 | 株式会社半導体エネルギー研究所 | 照明装置 |
| JP5827104B2 (ja) | 2010-11-19 | 2015-12-02 | 株式会社半導体エネルギー研究所 | 照明装置 |
| CN105247699B (zh) | 2013-05-21 | 2017-12-08 | Lg化学株式会社 | 包封薄膜和使用该包封薄膜包封有机电子装置的方法 |
| JP2017157269A (ja) * | 2014-07-18 | 2017-09-07 | パナソニックIpマネジメント株式会社 | 光デバイス |
| DE102015112681B4 (de) * | 2015-08-03 | 2025-08-28 | Pictiva Displays International Limited | Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements |
| CN109196679B (zh) * | 2015-12-01 | 2021-06-08 | 株式会社半导体能源研究所 | 发光元件、发光装置、电子设备及照明装置 |
| CN107180852B (zh) * | 2017-05-18 | 2019-11-15 | 上海天马有机发光显示技术有限公司 | 一种触控显示面板及显示装置 |
| CN113646905A (zh) | 2019-04-18 | 2021-11-12 | 株式会社半导体能源研究所 | 固态继电器以及半导体装置 |
| US11588137B2 (en) | 2019-06-05 | 2023-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Functional panel, display device, input/output device, and data processing device |
| US11659758B2 (en) | 2019-07-05 | 2023-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Display unit, display module, and electronic device |
| JP7530897B2 (ja) | 2019-07-12 | 2024-08-08 | 株式会社半導体エネルギー研究所 | 機能パネル、表示装置、入出力装置、情報処理装置 |
| US11997766B2 (en) | 2019-10-11 | 2024-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Functional panel, display device, input/output device, and data processing device |
| JP2024064792A (ja) * | 2022-10-28 | 2024-05-14 | キヤノン株式会社 | 発光装置、表示装置、撮像装置および電子装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002175877A (ja) * | 2000-09-27 | 2002-06-21 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、電子機器 |
| JP2003227903A (ja) * | 2002-02-05 | 2003-08-15 | Seiko Epson Corp | マイクロレンズアレイ板及びその製造方法、光学素子板及びその製造方法、電気光学装置、並びに電子機器 |
| JP2007173088A (ja) * | 2005-12-22 | 2007-07-05 | Matsushita Electric Works Ltd | 有機elパネル、およびこれを用いた有機el照明装置 |
| US20080117519A1 (en) * | 2006-11-17 | 2008-05-22 | Eastman Kodak Company | Light emitting device with microlens array |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4216597A (en) * | 1979-04-03 | 1980-08-12 | R. D. Werner Co., Inc. | Picture frame retaining clip |
| JPH06223972A (ja) * | 1993-01-28 | 1994-08-12 | Toshiba Corp | Elパネル構造体 |
| JPH07263142A (ja) | 1994-03-17 | 1995-10-13 | Moriyama Kogyo Kk | エレクトロルミネッセンス素子の入力電圧制御装置 |
| US5703436A (en) * | 1994-12-13 | 1997-12-30 | The Trustees Of Princeton University | Transparent contacts for organic devices |
| US6084299A (en) * | 1995-11-09 | 2000-07-04 | International Business Machines Corporation | Integrated circuit package including a heat sink and an adhesive |
| JPH10172757A (ja) | 1996-12-13 | 1998-06-26 | Idemitsu Kosan Co Ltd | 有機el発光装置 |
| JP2000058255A (ja) * | 1998-08-12 | 2000-02-25 | Tdk Corp | 有機elモジュール |
| US6747638B2 (en) * | 2000-01-31 | 2004-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Adhesion type area sensor and display device having adhesion type area sensor |
| US6605826B2 (en) * | 2000-08-18 | 2003-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and display device |
| JP4647134B2 (ja) * | 2001-05-18 | 2011-03-09 | ローム株式会社 | 有機el表示装置 |
| DE10164063B4 (de) | 2001-12-24 | 2007-12-06 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Verbundscheibe mit einem elektrisch steuerbaren Funktionselement |
| AU2002364992A1 (en) | 2001-12-24 | 2003-07-30 | Saint-Gobain Glass France | Method for making a multilayer element with a transparent surface electrode and an electroluminescent illuminating element |
| US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| US6869329B2 (en) * | 2002-04-24 | 2005-03-22 | Eastman Kodak Company | Encapsulating OLED devices with transparent cover |
| CN1650672A (zh) * | 2002-04-25 | 2005-08-03 | 哈利盛东芝照明株式会社 | 有机电致发光装置 |
| JP4800247B2 (ja) * | 2002-06-17 | 2011-10-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス素子封止用接着剤、有機エレクトロルミネッセンス素子封止用粘着テープ、有機エレクトロルミネッセンス素子封止用両面粘着テープ、有機エレクトロルミネッセンス素子の封止方法、及び、有機エレクトロルミネッセンス素子 |
| JP4027914B2 (ja) | 2004-05-21 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 照明装置及びそれを用いた機器 |
| US7205717B2 (en) * | 2004-06-24 | 2007-04-17 | Eastman Kodak Company | OLED display having thermally conductive material |
| US7205718B2 (en) * | 2004-06-24 | 2007-04-17 | Eastman Kodak Company | OLED display having thermally conductive adhesive |
| KR100637129B1 (ko) * | 2005-08-05 | 2006-10-23 | 삼성에스디아이 주식회사 | 유기 발광 표시 소자 및 그 제조방법 |
| JP5011677B2 (ja) * | 2005-08-12 | 2012-08-29 | ソニー株式会社 | 二次電池 |
| JP4770450B2 (ja) | 2005-12-21 | 2011-09-14 | パナソニック電工株式会社 | 有機el照明装置 |
| WO2008069219A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Antireflective film and display device |
| WO2008069162A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Anti-reflection film and display device |
| WO2008069223A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Anti-reflection film and display device |
| WO2008069221A1 (en) | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Plasma display panel and field emission display |
| JP5153486B2 (ja) * | 2008-07-08 | 2013-02-27 | キヤノン株式会社 | トナー |
| TWI394921B (zh) * | 2008-09-22 | 2013-05-01 | Sinology Entpr Ltd | 具模組化光源之燈箱結構及其模組化光源結構 |
| US8508148B1 (en) * | 2009-02-01 | 2013-08-13 | MagicLux, LLC | System for light and appliance remote control |
| JP5118659B2 (ja) * | 2009-02-24 | 2013-01-16 | パナソニック株式会社 | 発光素子 |
| JP5507101B2 (ja) | 2009-03-17 | 2014-05-28 | パナソニック株式会社 | 有機elモジュールとそれを用いた照明器具 |
| JP5715149B2 (ja) * | 2009-11-27 | 2015-05-07 | コーニンクレッカ フィリップス エヌ ヴェ | エレクトロルミネッセンス装置の強化された対向電極 |
| JP5731830B2 (ja) * | 2010-01-19 | 2015-06-10 | パナソニック株式会社 | 面状発光装置 |
| JP2012084370A (ja) | 2010-10-12 | 2012-04-26 | Seiko Epson Corp | 照明装置 |
| JP5795935B2 (ja) * | 2010-10-20 | 2015-10-14 | 株式会社半導体エネルギー研究所 | 照明装置 |
-
2011
- 2011-10-18 JP JP2011228627A patent/JP5795935B2/ja not_active Expired - Fee Related
- 2011-10-18 US US13/275,522 patent/US9269921B2/en active Active
- 2011-10-19 KR KR1020110106958A patent/KR101872670B1/ko not_active Expired - Fee Related
-
2016
- 2016-02-17 US US15/046,038 patent/US20160163924A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002175877A (ja) * | 2000-09-27 | 2002-06-21 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、電子機器 |
| JP2003227903A (ja) * | 2002-02-05 | 2003-08-15 | Seiko Epson Corp | マイクロレンズアレイ板及びその製造方法、光学素子板及びその製造方法、電気光学装置、並びに電子機器 |
| JP2007173088A (ja) * | 2005-12-22 | 2007-07-05 | Matsushita Electric Works Ltd | 有機elパネル、およびこれを用いた有機el照明装置 |
| US20080117519A1 (en) * | 2006-11-17 | 2008-05-22 | Eastman Kodak Company | Light emitting device with microlens array |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120097982A1 (en) | 2012-04-26 |
| US20160163924A1 (en) | 2016-06-09 |
| KR20120041138A (ko) | 2012-04-30 |
| JP2012109226A (ja) | 2012-06-07 |
| JP5795935B2 (ja) | 2015-10-14 |
| US9269921B2 (en) | 2016-02-23 |
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