KR101853729B1 - 감방사선성 수지 조성물, 경화막, 경화막의 형성 방법 및, 표시 소자 - Google Patents

감방사선성 수지 조성물, 경화막, 경화막의 형성 방법 및, 표시 소자 Download PDF

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KR101853729B1
KR101853729B1 KR1020110052021A KR20110052021A KR101853729B1 KR 101853729 B1 KR101853729 B1 KR 101853729B1 KR 1020110052021 A KR1020110052021 A KR 1020110052021A KR 20110052021 A KR20110052021 A KR 20110052021A KR 101853729 B1 KR101853729 B1 KR 101853729B1
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South Korea
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group
radiation
film
mass
compound
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KR1020110052021A
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Korean (ko)
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KR20110132984A (ko
Inventor
에이지 요네다
노부히로 니시
세이이치로우 고다마
카츠미 이노마타
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제이에스알 가부시끼가이샤
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Publication of KR20110132984A publication Critical patent/KR20110132984A/ko
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Publication of KR101853729B1 publication Critical patent/KR101853729B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
KR1020110052021A 2010-06-03 2011-05-31 감방사선성 수지 조성물, 경화막, 경화막의 형성 방법 및, 표시 소자 KR101853729B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-127939 2010-06-03
JP2010127939A JP5471851B2 (ja) 2010-06-03 2010-06-03 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、及び表示素子

Publications (2)

Publication Number Publication Date
KR20110132984A KR20110132984A (ko) 2011-12-09
KR101853729B1 true KR101853729B1 (ko) 2018-05-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110052021A KR101853729B1 (ko) 2010-06-03 2011-05-31 감방사선성 수지 조성물, 경화막, 경화막의 형성 방법 및, 표시 소자

Country Status (4)

Country Link
JP (1) JP5471851B2 (zh)
KR (1) KR101853729B1 (zh)
CN (1) CN102269932B (zh)
TW (1) TW201202844A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214033A (en) * 2010-06-17 2012-04-01 Sumitomo Chemical Co Photosensitive resin composition
JP6022847B2 (ja) * 2012-03-28 2016-11-09 東京応化工業株式会社 絶縁膜形成用感光性樹脂組成物、絶縁膜、及び絶縁膜の形成方法
CN103365087B (zh) * 2012-03-28 2019-03-08 东京应化工业株式会社 绝缘膜形成用感光性树脂组合物、绝缘膜、以及绝缘膜的形成方法
JP6350335B2 (ja) * 2014-02-27 2018-07-04 Jsr株式会社 着色組成物、着色硬化膜及び表示素子
JP6327173B2 (ja) * 2014-02-27 2018-05-23 Jsr株式会社 着色組成物、着色硬化膜及び表示素子
TWI731895B (zh) * 2015-12-08 2021-07-01 日商富士軟片股份有限公司 感放射線性樹脂組成物、硬化膜、圖案形成方法、固體攝影元件及影像顯示裝置
JP7560954B2 (ja) * 2020-04-10 2024-10-03 東京応化工業株式会社 感光性組成物、パターン化された硬化膜の製造方法、及びパターン化された硬化膜

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005024659A (ja) * 2003-06-30 2005-01-27 Taiyo Ink Mfg Ltd 硬化性組成物
JP2007023254A (ja) * 2005-06-14 2007-02-01 Fujifilm Corp 硬化促進剤、熱硬化性樹脂組成物、感光性組成物及び感光性フィルム、並びに、永久パターン及びその形成方法
JP2007079114A (ja) * 2005-09-14 2007-03-29 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP2007106886A (ja) * 2005-10-13 2007-04-26 Fujifilm Corp 硬化促進剤、熱硬化性樹脂組成物、感光性組成物及び感光性フィルム、並びに、永久パターン及びその形成方法
JP4895034B2 (ja) * 2006-05-24 2012-03-14 Ｊｓｒ株式会社 感放射線性樹脂組成物、スペーサーおよびその形成方法
KR101398503B1 (ko) * 2006-06-23 2014-05-27 후지필름 가부시키가이샤 화합물, 감광성 조성물, 경화성 조성물, 컬러 필터용 경화성 조성물, 컬러 필터, 및 그 제조 방법
JP4689553B2 (ja) * 2006-08-11 2011-05-25 富士フイルム株式会社 光硬化性着色組成物及びそれを用いたカラーフィルタ
JP4846484B2 (ja) * 2006-08-11 2011-12-28 富士フイルム株式会社 光硬化性着色組成物及びそれを用いたカラーフィルタ
JP5198816B2 (ja) * 2007-08-31 2013-05-15 株式会社日本触媒 側鎖含有重合体の製造方法

Also Published As

Publication number Publication date
CN102269932B (zh) 2015-03-25
KR20110132984A (ko) 2011-12-09
JP2011253110A (ja) 2011-12-15
TW201202844A (en) 2012-01-16
JP5471851B2 (ja) 2014-04-16
CN102269932A (zh) 2011-12-07

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