KR101821187B1 - 통합된 세정기 및 건조기 - Google Patents

통합된 세정기 및 건조기 Download PDF

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Publication number
KR101821187B1
KR101821187B1 KR1020127001370A KR20127001370A KR101821187B1 KR 101821187 B1 KR101821187 B1 KR 101821187B1 KR 1020127001370 A KR1020127001370 A KR 1020127001370A KR 20127001370 A KR20127001370 A KR 20127001370A KR 101821187 B1 KR101821187 B1 KR 101821187B1
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South Korea
Prior art keywords
cleaning
container
semiconductor article
chamber
article
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Korean (ko)
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KR20120036981A (ko
Inventor
루츠 레브슈톡
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다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/0821—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices
    • B08B9/0826—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices the containers being brought to the cleaning device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
KR1020127001370A 2009-06-17 2010-06-17 통합된 세정기 및 건조기 Active KR101821187B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21806709P 2009-06-17 2009-06-17
US61/218,067 2009-06-17
PCT/IB2010/052745 WO2010146561A1 (en) 2009-06-17 2010-06-17 Integrated cleaner and dryer

Publications (2)

Publication Number Publication Date
KR20120036981A KR20120036981A (ko) 2012-04-18
KR101821187B1 true KR101821187B1 (ko) 2018-01-23

Family

ID=42663664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127001370A Active KR101821187B1 (ko) 2009-06-17 2010-06-17 통합된 세정기 및 건조기

Country Status (5)

Country Link
US (4) US8591664B2 (https=)
JP (2) JP5730297B2 (https=)
KR (1) KR101821187B1 (https=)
CN (1) CN102804332B (https=)
WO (1) WO2010146561A1 (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101821187B1 (ko) 2009-06-17 2018-01-23 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 통합된 세정기 및 건조기
JP5654807B2 (ja) * 2010-09-07 2015-01-14 東京エレクトロン株式会社 基板搬送方法及び記憶媒体
US9646858B2 (en) 2011-06-23 2017-05-09 Brooks Automation, Inc. Semiconductor cleaner systems and methods
JP5978728B2 (ja) * 2012-04-12 2016-08-24 東京エレクトロン株式会社 基板受け渡し装置、基板受け渡し方法及び記憶媒体
JP5959381B2 (ja) * 2012-09-20 2016-08-02 ヒューグルエレクトロニクス株式会社 基板ケース洗浄装置
US9579697B2 (en) * 2012-12-06 2017-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. System and method of cleaning FOUP
US9558927B2 (en) * 2013-03-14 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Wet cleaning method for cleaning small pitch features
US20160303622A1 (en) 2013-10-23 2016-10-20 Brooks Ccs Gmbh Cleaning Systems and Methods for Semiconductor Substrate Storage Articles
KR101915233B1 (ko) * 2016-11-02 2018-11-05 주식회사 아이에스티이 세정이 완료된 캐리어의 실시간 검사를 위한 출력 포트 및 그에 의한 검사방법
US20180169720A1 (en) * 2016-12-16 2018-06-21 Tec-Sem Ag Substrate compartment cleaning
KR102067752B1 (ko) * 2018-02-09 2020-01-17 (주)에스티아이 풉 세정 장치 및 풉 세정 방법
US11488848B2 (en) 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
JP7241568B2 (ja) * 2019-03-04 2023-03-17 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
WO2021207311A1 (en) * 2020-04-08 2021-10-14 Pintek Solutions Corporation Sample carrier cleaner
US11813649B2 (en) 2020-05-29 2023-11-14 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement and method for making
DE102020129470B4 (de) * 2020-11-09 2025-01-30 Gsec German Semiconductor Equipment Company Gmbh Vorrichtung und Verfahren zum Behandeln von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für EUV-Lithografie-Masken
KR102596033B1 (ko) 2020-11-16 2023-11-01 (주)에스티아이 포드 세정공정
KR102593653B1 (ko) * 2020-11-16 2023-10-26 (주)에스티아이 포드 세정장치
US20230182181A1 (en) * 2021-03-11 2023-06-15 Pintek Solutions Corporation System and Method for Cleaning Carrier
TWI762273B (zh) 2021-04-16 2022-04-21 科嶠工業股份有限公司 物料傳送盒的清潔方法及其設備
CN115213184B (zh) * 2021-04-16 2024-11-05 科峤工业股份有限公司 物料传送盒的清洁方法及其设备
CN115343414B (zh) * 2021-05-13 2024-12-20 科峤工业股份有限公司 物料传送盒的清洁成果检测方法及其装置
CN113289995B (zh) * 2021-05-14 2022-04-22 无锡亚电智能装备有限公司 晶圆容纳盒清洗设备及晶圆容纳盒清洗方法
KR20250028255A (ko) * 2022-05-06 2025-02-28 지에스이씨 저먼 세미컨덕터 이큅먼트 컴퍼니 게엠베하 냄비 모양의 중공체, 특히 반도체 웨이퍼용 또는 euv 리소그래피 마스크용 이송 컨테이너를 건조 및/또는 세척하기 위한 장치 및 방법
DE102022116177A1 (de) 2022-06-29 2024-01-04 Gsec German Semiconductor Equipment Company Gmbh Vorrichtung zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken
KR102610364B1 (ko) * 2022-08-01 2023-12-06 주식회사 아이에스티이 캐리어 세정장치
DE102023100730B4 (de) * 2023-01-13 2024-09-19 Gsec German Semiconductor Equipment Company Gmbh Verfahren zum Reinigen von topfförmigen Hohlkörpern, insbesondere von Transportbehältern für Halbleiterwafer oder für Lithografie-Masken mit einer entsprechenden Vorrichtung
JP7716438B2 (ja) * 2023-03-06 2025-07-31 芝浦メカトロニクス株式会社 ウェーハ収納容器乾燥装置及び洗浄システム
JP2024131696A (ja) * 2023-03-16 2024-09-30 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置
EP4609425A1 (de) * 2023-10-17 2025-09-03 Gsec German Semiconductor Equipment Company Gmbh Vorrichtung und verfahren zum trocknen und/oder reinigen von topfförmigen hohlkörpern, insbesondere von transportbehältern für halbleiterwafer oder für euv-lithografie-masken
WO2025224509A1 (en) * 2024-04-23 2025-10-30 Brooks Automation (Germany) Gmbh Improved carrier degassing
WO2025229526A1 (en) * 2024-04-30 2025-11-06 Brooks Automation (Germany) Gmbh Method and system for cleaning containers configured and adapted to store wafers or reticles

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267123B1 (en) 1998-03-23 2001-07-31 Kabushiki Kaisha Toshiba Pod and method of cleaning it
JP2003124176A (ja) 2001-10-11 2003-04-25 Nse Tekku Kk ウエハキャリア自動洗浄設備
WO2004093147A2 (en) 2003-04-10 2004-10-28 Entegris, Inc. Wafer carrier cleaning system
JP2005109523A (ja) 2004-12-27 2005-04-21 Takeshiba Electric Co Ltd 半導体ウエハ等のポッド洗浄乾燥装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745574Y2 (ja) 1989-02-13 1995-10-18 株式会社豊田自動織機製作所 リングを有する紡機
JPH04354128A (ja) 1991-05-31 1992-12-08 Maatec:Kk 基板の薬液処理方法及びその装置並びに基板の薬液処理、洗浄及び乾燥方法及びその装置
JPH0745574A (ja) * 1993-07-27 1995-02-14 Sankyo Eng Kk ワークの洗浄及び乾燥方法とその装置
TW501196B (en) * 1999-08-05 2002-09-01 Tokyo Electron Ltd Cleaning device, cleaning system, treating device and cleaning method
JP4608748B2 (ja) * 1999-08-05 2011-01-12 東京エレクトロン株式会社 洗浄装置、洗浄システム及び洗浄方法
JP2001110733A (ja) 1999-10-07 2001-04-20 Sharp Corp シリコン結晶シートの製造装置及び製造方法
JP2003266252A (ja) 2002-03-19 2003-09-24 Ricoh Co Ltd 自動組立分解装置
US6830057B2 (en) 2002-11-01 2004-12-14 Semitool, Inc. Wafer container cleaning system
CN1802222A (zh) 2003-04-10 2006-07-12 安堤格里斯公司 晶片承载器清洗系统
JP2004335838A (ja) 2003-05-09 2004-11-25 Shin Etsu Handotai Co Ltd 洗浄装置、洗浄システム及び洗浄方法
US20050224103A1 (en) * 2003-10-10 2005-10-13 Dolechek Kert L Centrifugal container cleaning system
FR2920046A1 (fr) * 2007-08-13 2009-02-20 Alcatel Lucent Sas Procede de post-traitement d'un support de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs, et station de post-traitement pour la mise en oeuvre d'un tel procede
US7976263B2 (en) * 2007-09-22 2011-07-12 David Barker Integrated wafer transfer mechanism
FR2929046B1 (fr) 2008-03-19 2014-04-25 Connecteurs Electr Deutsch "dispositif de fixation pour connecteur"
KR101821187B1 (ko) 2009-06-17 2018-01-23 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 통합된 세정기 및 건조기

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267123B1 (en) 1998-03-23 2001-07-31 Kabushiki Kaisha Toshiba Pod and method of cleaning it
JP2003124176A (ja) 2001-10-11 2003-04-25 Nse Tekku Kk ウエハキャリア自動洗浄設備
WO2004093147A2 (en) 2003-04-10 2004-10-28 Entegris, Inc. Wafer carrier cleaning system
JP2005109523A (ja) 2004-12-27 2005-04-21 Takeshiba Electric Co Ltd 半導体ウエハ等のポッド洗浄乾燥装置

Also Published As

Publication number Publication date
US11443962B2 (en) 2022-09-13
JP2014003338A (ja) 2014-01-09
US20230085278A1 (en) 2023-03-16
JP5606607B2 (ja) 2014-10-15
JP2012531035A (ja) 2012-12-06
US8858723B2 (en) 2014-10-14
CN102804332A (zh) 2012-11-28
US20140069467A1 (en) 2014-03-13
JP5730297B2 (ja) 2015-06-10
KR20120036981A (ko) 2012-04-18
WO2010146561A1 (en) 2010-12-23
US20100319733A1 (en) 2010-12-23
CN102804332B (zh) 2017-06-09
US8591664B2 (en) 2013-11-26
US20100319730A1 (en) 2010-12-23

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