KR101763974B1 - Ｌｅｄ 용 방열 기판 - Google Patents
Ｌｅｄ 용 방열 기판 Download PDFInfo
- Publication number
- KR101763974B1 KR101763974B1 KR1020127029108A KR20127029108A KR101763974B1 KR 101763974 B1 KR101763974 B1 KR 101763974B1 KR 1020127029108 A KR1020127029108 A KR 1020127029108A KR 20127029108 A KR20127029108 A KR 20127029108A KR 101763974 B1 KR101763974 B1 KR 101763974B1
- Authority
- KR
- South Korea
- Prior art keywords
- foil
- polyimide
- polyimide film
- aluminum
- heat
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 229920001721 polyimide Polymers 0.000 claims abstract description 303
- 239000011888 foil Substances 0.000 claims abstract description 215
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000011889 copper foil Substances 0.000 claims abstract description 72
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 61
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 42
- 239000004642 Polyimide Substances 0.000 claims description 147
- 238000004519 manufacturing process Methods 0.000 claims description 21
- 238000007906 compression Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 109
- 229910052751 metal Inorganic materials 0.000 description 52
- 239000002184 metal Substances 0.000 description 52
- 230000005855 radiation Effects 0.000 description 50
- 239000000243 solution Substances 0.000 description 50
- 229920005575 poly(amic acid) Polymers 0.000 description 35
- 239000010408 film Substances 0.000 description 34
- 238000010438 heat treatment Methods 0.000 description 34
- 238000000034 method Methods 0.000 description 21
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 16
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 15
- 238000001816 cooling Methods 0.000 description 15
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 14
- 150000004985 diamines Chemical class 0.000 description 14
- 239000006087 Silane Coupling Agent Substances 0.000 description 13
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 11
- 230000009477 glass transition Effects 0.000 description 11
- 239000007788 liquid Substances 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000010409 thin film Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- -1 acryl Chemical group 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000002243 precursor Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 229910018134 Al-Mg Inorganic materials 0.000 description 5
- 229910018467 Al—Mg Inorganic materials 0.000 description 5
- 238000007743 anodising Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000005187 foaming Methods 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920001646 UPILEX Polymers 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 2
- WOYZXEVUWXQVNV-UHFFFAOYSA-N 4-phenoxyaniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1 WOYZXEVUWXQVNV-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical group C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- KFSRINVVFGTVOA-UHFFFAOYSA-N 3-[butoxy(dimethoxy)silyl]propan-1-amine Chemical compound CCCCO[Si](OC)(OC)CCCN KFSRINVVFGTVOA-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- LYKJEJVAXSGWAJ-UHFFFAOYSA-N compactone Natural products CC1(C)CCCC2(C)C1CC(=O)C3(O)CC(C)(CCC23)C=C LYKJEJVAXSGWAJ-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PPTYNCJKYCGKEA-UHFFFAOYSA-N dimethoxy-phenyl-prop-2-enoxysilane Chemical compound C=CCO[Si](OC)(OC)C1=CC=CC=C1 PPTYNCJKYCGKEA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910000498 pewter Inorganic materials 0.000 description 1
- 239000010957 pewter Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010092685 | 2010-04-13 | ||
| JPJP-P-2010-092685 | 2010-04-13 | ||
| PCT/JP2011/058649 WO2011129232A1 (ja) | 2010-04-13 | 2011-04-05 | Ｌｅｄ用放熱基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130086936A KR20130086936A (ko) | 2013-08-05 |
| KR101763974B1 true KR101763974B1 (ko) | 2017-08-01 |
Family
ID=44798609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127029108A KR101763974B1 (ko) | 2010-04-13 | 2011-04-05 | Ｌｅｄ 용 방열 기판 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130199771A1 (zh) |
| JP (1) | JP5920213B2 (zh) |
| KR (1) | KR101763974B1 (zh) |
| CN (1) | CN102939671A (zh) |
| TW (1) | TWI591865B (zh) |
| WO (1) | WO2011129232A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014141340A1 (ja) * | 2013-03-11 | 2014-09-18 | パナソニック株式会社 | 照明装置及び表示装置 |
| US9381717B2 (en) * | 2014-01-22 | 2016-07-05 | Asia Vital Components Co., Ltd | Manufacturing method of heat dissipation structure applied to mobile device |
| CN104393162A (zh) * | 2014-11-05 | 2015-03-04 | 共青城超群科技股份有限公司 | 一种铜柱型基板封装的led |
| EP3276655A1 (en) * | 2016-07-26 | 2018-01-31 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Method and system for bonding a chip to a substrate |
| CN113507780A (zh) * | 2021-07-08 | 2021-10-15 | 江西柔顺科技有限公司 | 一种散热线路板及其制备方法 |
| CN116406090B (zh) * | 2023-05-15 | 2024-02-02 | 台山市科伟电子科技有限公司 | 一种铝基覆铜铝箔板的生产工艺 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005175150A (ja) * | 2003-12-10 | 2005-06-30 | Ube Ind Ltd | 両面回路基板及びその製造方法 |
| JP2008293692A (ja) * | 2007-05-22 | 2008-12-04 | Du Pont Toray Co Ltd | Ｌｅｄ照明装置及び該装置を用いた車両用灯具 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4413049A (en) * | 1980-06-30 | 1983-11-01 | Dennison Manufacturing Company | Anodized electrostatic imaging surface |
| US4985509A (en) * | 1985-04-18 | 1991-01-15 | Hitachi, Ltd. | Heat curable resin composition |
| JP2542806B2 (ja) * | 1985-05-08 | 1996-10-09 | 三洋電機株式会社 | 半導体装置 |
| JPS6433947A (en) * | 1987-07-29 | 1989-02-03 | Hitachi Chemical Co Ltd | Wiring board for mounting semiconductor element |
| JPH02207587A (ja) * | 1989-02-06 | 1990-08-17 | Nitto Denko Corp | 回路基板 |
| JPH0897526A (ja) * | 1993-01-27 | 1996-04-12 | Furukawa Electric Co Ltd:The | 金属ベースプリント配線基板 |
| US6175084B1 (en) * | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
| US5889639A (en) * | 1997-02-07 | 1999-03-30 | Imation Corp. | Plain carbon steel shutter for removable data storage cartridges |
| JP4457542B2 (ja) * | 2001-06-22 | 2010-04-28 | 宇部興産株式会社 | 熱圧着性を有する多層ポリイミドフィルム、熱対策銅張り板 |
| JP2003301048A (ja) * | 2002-04-10 | 2003-10-21 | Polymatech Co Ltd | 熱伝導性成形体 |
| US20040184272A1 (en) * | 2003-03-20 | 2004-09-23 | Wright Steven A. | Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same |
| CN1960870A (zh) * | 2004-05-31 | 2007-05-09 | 株式会社钟化 | 聚酰亚胺层合体及其制造方法 |
| US7303315B2 (en) * | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
| US20060127686A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device |
| KR100965441B1 (ko) * | 2005-04-04 | 2010-06-24 | 우베 고산 가부시키가이샤 | 구리박 적층 기판 |
| JP4912624B2 (ja) * | 2005-06-14 | 2012-04-11 | 株式会社フジクラ | 発光素子実装用基板の製造方法及び発光素子モジュールの製造方法 |
| JP2007012288A (ja) * | 2005-06-28 | 2007-01-18 | Toshiba Lighting & Technology Corp | 照明装置及び照明器具 |
| DE102006000476A1 (de) * | 2005-09-22 | 2007-05-24 | Lexedis Lighting Gesmbh | Lichtemissionsvorrichtung |
| US20080213605A1 (en) * | 2006-12-07 | 2008-09-04 | Briney Gary C | Multi-functional circuitry substrates and compositions and methods relating thereto |
| JP5181618B2 (ja) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | 金属箔積層ポリイミド樹脂基板 |
| EP2227926A1 (en) * | 2007-12-04 | 2010-09-15 | E. I. du Pont de Nemours and Company | Bendable circuit structure for led mounting and interconnection |
| JP2009172996A (ja) * | 2007-12-26 | 2009-08-06 | Shin Etsu Chem Co Ltd | フレキシブル銅張積層板及びその製造方法 |
| JP5233298B2 (ja) * | 2008-02-01 | 2013-07-10 | 宇部興産株式会社 | ポリイミドフィルムおよびポリイミドフィルムの製造方法 |
| JP2009266461A (ja) * | 2008-04-23 | 2009-11-12 | Rohm Co Ltd | 発光ダイオード照明装置 |
| JP2010021400A (ja) * | 2008-07-11 | 2010-01-28 | Mitsui Mining & Smelting Co Ltd | 放熱特性に優れたプリント配線基板 |
-
2011
- 2011-04-05 US US13/640,556 patent/US20130199771A1/en not_active Abandoned
- 2011-04-05 WO PCT/JP2011/058649 patent/WO2011129232A1/ja active Application Filing
- 2011-04-05 JP JP2012510626A patent/JP5920213B2/ja active Active
- 2011-04-05 KR KR1020127029108A patent/KR101763974B1/ko active IP Right Grant
- 2011-04-05 CN CN2011800268541A patent/CN102939671A/zh active Pending
- 2011-04-11 TW TW100112468A patent/TWI591865B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005175150A (ja) * | 2003-12-10 | 2005-06-30 | Ube Ind Ltd | 両面回路基板及びその製造方法 |
| JP2008293692A (ja) * | 2007-05-22 | 2008-12-04 | Du Pont Toray Co Ltd | Ｌｅｄ照明装置及び該装置を用いた車両用灯具 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI591865B (zh) | 2017-07-11 |
| US20130199771A1 (en) | 2013-08-08 |
| CN102939671A (zh) | 2013-02-20 |
| JPWO2011129232A1 (ja) | 2013-07-18 |
| WO2011129232A1 (ja) | 2011-10-20 |
| KR20130086936A (ko) | 2013-08-05 |
| JP5920213B2 (ja) | 2016-05-18 |
| TW201205906A (en) | 2012-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5035220B2 (ja) | 銅張積層板及びその製造方法 | |
| JP4147639B2 (ja) | フレキシブル金属箔積層体 | |
| JP4625458B2 (ja) | 接着フィルムおよびその利用 | |
| KR101763974B1 (ko) | Ｌｅｄ 용 방열 기판 | |
| US20090211786A1 (en) | Process for producing polyimide film with copper wiring | |
| JP2004098659A (ja) | 銅張積層板及びその製造方法 | |
| JP4457542B2 (ja) | 熱圧着性を有する多層ポリイミドフィルム、熱対策銅張り板 | |
| JP4692139B2 (ja) | 片面或いは両面金属箔積層ポリイミドフィルム及びこれらの製造方法 | |
| US20090266589A1 (en) | Process for producing metal wiring board | |
| JP5480490B2 (ja) | 接着フィルムならびにフレキシブル金属張積層板 | |
| JP4356184B2 (ja) | フレキシブル金属箔積層体 | |
| JP6412012B2 (ja) | 多層フレキシブル金属張積層体及びその製造方法 | |
| JP2004230670A (ja) | 熱融着性を有するポリイミドフィルム、それを用いた積層板およびそれらの製造法 | |
| WO2013157565A1 (ja) | 熱融着性ポリイミドフィルム、熱融着性ポリイミドフィルムの製造方法及び熱融着性ポリイミドフィルムを用いたポリイミド金属積層体 | |
| JP2007216688A (ja) | 銅張積層板及びその製造方法 | |
| JP4389337B2 (ja) | フレキシブル金属箔積層体及びその製造法 | |
| JP4894866B2 (ja) | 多層ポリイミドフィルムおよび積層体 | |
| JP4345187B2 (ja) | フレキシブル金属箔積層体の製造方法 | |
| JP4360025B2 (ja) | 補強材を有するポリイミド片面積層体およびその製造法 | |
| JP2004006735A (ja) | 半導体パッケ−ジ内部絶縁用ポリイミドフィルムおよび積層基板 | |
| JP4501851B2 (ja) | ポリイミド付き低粗度金属箔および金属箔表面の処理方法 | |
| JP2013176931A (ja) | 片面金属張積層板およびその製造方法 | |
| JP2007320083A (ja) | 銅張積層板 | |
| JP2007313854A (ja) | 銅張積層板 | |
| JP2006328407A (ja) | ポリイミドフィルムおよびそれを用いた電気・電子機器用基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |