JPS6433947A - Wiring board for mounting semiconductor element - Google Patents

Wiring board for mounting semiconductor element

Info

Publication number
JPS6433947A
JPS6433947A JP62189137A JP18913787A JPS6433947A JP S6433947 A JPS6433947 A JP S6433947A JP 62189137 A JP62189137 A JP 62189137A JP 18913787 A JP18913787 A JP 18913787A JP S6433947 A JPS6433947 A JP S6433947A
Authority
JP
Japan
Prior art keywords
thickness
body layer
wiring board
metal plate
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62189137A
Other languages
Japanese (ja)
Inventor
Koichi Tsuyama
Masashi Isono
Toshiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP62189137A priority Critical patent/JPS6433947A/en
Publication of JPS6433947A publication Critical patent/JPS6433947A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To obtain a wiring board characterized by excellent heat radiation and high connection reliability, by providing a constitution, which comprises a metal plate, an insulating layer including a metal body layer and a conductor circuit, and in which the heat conductivity of the metal plate and the thermal expansion coefficient of the metal body layer are within specified ranges, respectively. CONSTITUTION:A wiring board comprises a metal plate 4, an insulating layer 2 including a metal body layer 1 and a conductor circuit 3. The heat conductivity of the metal plate 4 is 150X10<-3>cal/cmsec deg.C or more. The thermal expansion coefficient of the metal body layer 1 is (1-6)X10<-6>/ deg.C. It is desirable that the thickness of the metal plate 4 is 0.4-2mm and the thickness of the metal body layer 1 is 16-600mum. For example, epoxy-regin-impregnated glass cloth having a thickness of 50mum, 42 alloy having a thickness of 50mum and an area of 5cm square, epoxy-resin-impregnated glass cloth having a thickness of 50mum and a copper foil having a thickness of 35mum are sequentially overlapped on an aluminum plate having a thickness of 1mm and an area size of 15cm square. The layers are compressed, heated and laminated. Resist is formed on the board obtained in this way. The conductor circuit 3 is formed by an etching method. Thus the semiconductor-element mounting wiring board as shown in the Figure is obtained.
JP62189137A 1987-07-29 1987-07-29 Wiring board for mounting semiconductor element Pending JPS6433947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189137A JPS6433947A (en) 1987-07-29 1987-07-29 Wiring board for mounting semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189137A JPS6433947A (en) 1987-07-29 1987-07-29 Wiring board for mounting semiconductor element

Publications (1)

Publication Number Publication Date
JPS6433947A true JPS6433947A (en) 1989-02-03

Family

ID=16236028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189137A Pending JPS6433947A (en) 1987-07-29 1987-07-29 Wiring board for mounting semiconductor element

Country Status (1)

Country Link
JP (1) JPS6433947A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102939671A (en) * 2010-04-13 2013-02-20 宇部兴产株式会社 Heat dissipation substrate for led

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102939671A (en) * 2010-04-13 2013-02-20 宇部兴产株式会社 Heat dissipation substrate for led

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