KR101755577B1 - 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템 - Google Patents

애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템 Download PDF

Info

Publication number
KR101755577B1
KR101755577B1 KR1020137015246A KR20137015246A KR101755577B1 KR 101755577 B1 KR101755577 B1 KR 101755577B1 KR 1020137015246 A KR1020137015246 A KR 1020137015246A KR 20137015246 A KR20137015246 A KR 20137015246A KR 101755577 B1 KR101755577 B1 KR 101755577B1
Authority
KR
South Korea
Prior art keywords
aperture array
array element
aperture
beamlets
apertures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020137015246A
Other languages
English (en)
Korean (ko)
Other versions
KR20130126936A (ko
Inventor
마르코 얀-야코 빌란트
알렉산데르 헨드릭 빈센트 반 벤
헨드릭 얀 데 종
Original Assignee
마퍼 리쏘그라피 아이피 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마퍼 리쏘그라피 아이피 비.브이. filed Critical 마퍼 리쏘그라피 아이피 비.브이.
Publication of KR20130126936A publication Critical patent/KR20130126936A/ko
Application granted granted Critical
Publication of KR101755577B1 publication Critical patent/KR101755577B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/09Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002Cooling arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/043Beam blanking
    • H01J2237/0435Multi-aperture
    • H01J2237/0437Semiconductor substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
KR1020137015246A 2010-11-13 2011-11-14 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템 Active KR101755577B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US41339610P 2010-11-13 2010-11-13
US61/413,396 2010-11-13
US41520010P 2010-11-18 2010-11-18
US61/415,200 2010-11-18
US42171710P 2010-12-10 2010-12-10
US61/421,717 2010-12-10
PCT/EP2011/070030 WO2012065941A1 (en) 2010-11-13 2011-11-14 Charged particle lithography system with aperture array cooling

Publications (2)

Publication Number Publication Date
KR20130126936A KR20130126936A (ko) 2013-11-21
KR101755577B1 true KR101755577B1 (ko) 2017-07-07

Family

ID=45065871

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015246A Active KR101755577B1 (ko) 2010-11-13 2011-11-14 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템

Country Status (6)

Country Link
US (1) US8558196B2 (enExample)
EP (1) EP2638560B1 (enExample)
JP (1) JP6133212B2 (enExample)
KR (1) KR101755577B1 (enExample)
TW (1) TWI562183B (enExample)
WO (1) WO2012065941A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586949B2 (en) * 2010-11-13 2013-11-19 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber
NL2007604C2 (en) * 2011-10-14 2013-05-01 Mapper Lithography Ip Bv Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams.
US10586625B2 (en) 2012-05-14 2020-03-10 Asml Netherlands B.V. Vacuum chamber arrangement for charged particle beam generator
KR101945964B1 (ko) * 2012-05-14 2019-02-11 마퍼 리쏘그라피 아이피 비.브이. 하전 입자 다중-빔렛 리소그래피 시스템 및 냉각 장치 제조 방법
US9724553B2 (en) * 2013-03-15 2017-08-08 Arqex Outdoor Fitness Systems, Llc Resistance band assembly and a method of varying a resistive force applied thereby
CN106415775B (zh) 2014-06-13 2019-06-04 英特尔公司 电子束交错的束孔阵列
US10486232B2 (en) * 2015-04-21 2019-11-26 Varian Semiconductor Equipment Associates, Inc. Semiconductor manufacturing device with embedded fluid conduits
JP2017199610A (ja) * 2016-04-28 2017-11-02 株式会社ニューフレアテクノロジー ステージ機構
US10784071B2 (en) * 2016-08-08 2020-09-22 Asml Netherlands B.V. Electron emitter and method of fabricating same
US10663746B2 (en) * 2016-11-09 2020-05-26 Advanced Semiconductor Engineering, Inc. Collimator, optical device and method of manufacturing the same
KR102596854B1 (ko) * 2017-08-08 2023-11-02 에이에스엠엘 네델란즈 비.브이. 하전 입자 차단 요소, 이러한 요소를 포함하는 노광 장치, 및 이러한 노광 장치를 사용하는 방법
EP3703100A1 (en) * 2019-02-27 2020-09-02 FEI Company Charged particle beam device for inspection of a specimen with a plurality of charged particle beamlets
EP3716313A1 (en) * 2019-03-28 2020-09-30 ASML Netherlands B.V. Aperture array with integrated current measurement
KR20230118106A (ko) 2020-12-14 2023-08-10 에이에스엠엘 네델란즈 비.브이. 하전 입자의 다중 빔을 사용하여 샘플을 프로세싱하는 하전 입자 시스템, 방법
EP4086933A1 (en) 2021-05-03 2022-11-09 ASML Netherlands B.V. Charged particle system, method of processing a sample using a multi-beam of charged particles
JP2024501655A (ja) 2020-12-23 2024-01-15 エーエスエムエル ネザーランズ ビー.ブイ. 電子レンズ
EP4020517A1 (en) 2020-12-23 2022-06-29 ASML Netherlands B.V. Electron-optical device
US11615939B2 (en) * 2021-03-24 2023-03-28 Kla Corporation Shaped aperture set for multi-beam array configurations
JPWO2024180616A1 (enExample) * 2023-02-27 2024-09-06

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203776A (ja) * 2000-12-28 2002-07-19 Advantest Corp 電子ビーム露光装置及び電子ビーム成形部材
JP2006140267A (ja) 2004-11-11 2006-06-01 Hitachi High-Technologies Corp 荷電粒子線露光装置
WO2009127658A1 (en) * 2008-04-15 2009-10-22 Mapper Lithography Ip B.V. Projection lens arrangement
WO2010109647A1 (ja) * 2009-03-27 2010-09-30 株式会社アドバンテスト マルチコラム電子線描画用マスク保持装置及びマルチコラム電子線描画装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11224846A (ja) * 1998-02-04 1999-08-17 Nikon Corp レチクル照明光学系
JPH11354063A (ja) * 1998-06-05 1999-12-24 Nikon Corp 電子線転写装置
JP2000030647A (ja) * 1998-07-10 2000-01-28 Advantest Corp 荷電粒子ビーム露光装置
GB2351567A (en) * 1999-04-19 2001-01-03 Ims Ionen Mikrofab Syst Transmission mask and mask-exposure arrangement for projection lithography
JP2001237161A (ja) * 2000-02-23 2001-08-31 Nikon Corp 荷電粒子線光学系及び電子光学系
JP4156809B2 (ja) * 2001-01-31 2008-09-24 株式会社アドバンテスト 電子ビーム露光装置及び電子レンズ
KR101060557B1 (ko) 2002-10-25 2011-08-31 마퍼 리쏘그라피 아이피 비.브이. 리소그라피 시스템
KR101077098B1 (ko) 2002-10-30 2011-10-26 마퍼 리쏘그라피 아이피 비.브이. 전자 빔 노출 시스템
KR101068607B1 (ko) 2003-03-10 2011-09-30 마퍼 리쏘그라피 아이피 비.브이. 복수 개의 빔렛 발생 장치
JP4949843B2 (ja) 2003-05-28 2012-06-13 マッパー・リソグラフィー・アイピー・ビー.ブイ. 荷電粒子ビームレット露光システム
GB2412232A (en) * 2004-03-15 2005-09-21 Ims Nanofabrication Gmbh Particle-optical projection system
JP4652829B2 (ja) * 2005-01-26 2011-03-16 キヤノン株式会社 電子線露光装置およびデバイス製造方法
DE602005012945D1 (de) * 2005-07-20 2009-04-09 Zeiss Carl Sms Gmbh Teilchenstrahlbelichtungssystem und Vorrichtung zur Strahlbeeinflussung
WO2007112465A1 (en) * 2006-04-03 2007-10-11 Ims Nanofabrication Ag Particle-beam exposure apparatus with overall-modulation of a patterned beam
SG153748A1 (en) * 2007-12-17 2009-07-29 Asml Holding Nv Lithographic method and apparatus
WO2012062854A1 (en) * 2010-11-13 2012-05-18 Mapper Lithography Ip B.V. Lithography system and method of refracting
WO2012062934A1 (en) * 2010-11-13 2012-05-18 Mapper Lithography Ip B.V. Charged particle beam modulator
US8586949B2 (en) * 2010-11-13 2013-11-19 Mapper Lithography Ip B.V. Charged particle lithography system with intermediate chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203776A (ja) * 2000-12-28 2002-07-19 Advantest Corp 電子ビーム露光装置及び電子ビーム成形部材
JP2006140267A (ja) 2004-11-11 2006-06-01 Hitachi High-Technologies Corp 荷電粒子線露光装置
WO2009127658A1 (en) * 2008-04-15 2009-10-22 Mapper Lithography Ip B.V. Projection lens arrangement
WO2010109647A1 (ja) * 2009-03-27 2010-09-30 株式会社アドバンテスト マルチコラム電子線描画用マスク保持装置及びマルチコラム電子線描画装置

Also Published As

Publication number Publication date
US8558196B2 (en) 2013-10-15
JP2013544030A (ja) 2013-12-09
KR20130126936A (ko) 2013-11-21
WO2012065941A1 (en) 2012-05-24
TWI562183B (en) 2016-12-11
JP6133212B2 (ja) 2017-05-24
TW201236045A (en) 2012-09-01
EP2638560A1 (en) 2013-09-18
US20120292524A1 (en) 2012-11-22
EP2638560B1 (en) 2017-02-22

Similar Documents

Publication Publication Date Title
KR101755577B1 (ko) 애퍼처 어레이 냉각장치를 갖춘 하전 입자 리소그래피 시스템
US8841636B2 (en) Modulation device and charged particle multi-beamlet lithography system using the same
JP5384759B2 (ja) 小ビームブランカ構成体
EP2633545B1 (en) Modulation device and charged particle multi-beamlet lithography system using the same
JP6049627B2 (ja) 中間チャンバを備えた荷電粒子リソグラフィシステム
US8890094B2 (en) Projection lens arrangement
JP5973061B2 (ja) 荷電粒子マルチ小ビームリソグラフィシステム及び冷却装置製造方法
CN102017053A (zh) 投影透镜装置
TW201007371A (en) Imaging system
US8368030B2 (en) Charged particle beam exposure system and beam manipulating arrangement

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20130613

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
A302 Request for accelerated examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20161114

Comment text: Request for Examination of Application

PA0302 Request for accelerated examination

Patent event date: 20161114

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170209

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20170426

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20170703

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20170704

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20210622

Start annual number: 5

End annual number: 5