CN102017053A - 投影透镜装置 - Google Patents
投影透镜装置 Download PDFInfo
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- CN102017053A CN102017053A CN2009801148732A CN200980114873A CN102017053A CN 102017053 A CN102017053 A CN 102017053A CN 2009801148732 A CN2009801148732 A CN 2009801148732A CN 200980114873 A CN200980114873 A CN 200980114873A CN 102017053 A CN102017053 A CN 102017053A
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- 239000002245 particle Substances 0.000 claims abstract description 19
- 238000010894 electron beam technology Methods 0.000 claims description 17
- 230000003068 static effect Effects 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 238000013461 design Methods 0.000 description 15
- 230000004075 alteration Effects 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 12
- 238000001393 microlithography Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 6
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- 239000004065 semiconductor Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
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- ZGHDMISTQPRNRG-UHFFFAOYSA-N dimolybdenum Chemical compound [Mo]#[Mo] ZGHDMISTQPRNRG-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/10—Lenses
- H01J37/12—Lenses electrostatic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3007—Electron or ion-optical systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/12—Lenses electrostatic
- H01J2237/1205—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/10—Lenses
- H01J2237/12—Lenses electrostatic
- H01J2237/121—Lenses electrostatic characterised by shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/151—Electrostatic means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3159408P | 2008-02-26 | 2008-02-26 | |
US61/031,594 | 2008-02-26 | ||
PCT/EP2009/052264 WO2009106560A1 (en) | 2008-02-26 | 2009-02-26 | Projection lens arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102017053A true CN102017053A (zh) | 2011-04-13 |
CN102017053B CN102017053B (zh) | 2014-04-02 |
Family
ID=40599969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980114873.2A Active CN102017053B (zh) | 2008-02-26 | 2009-02-26 | 投影透镜装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8089056B2 (zh) |
EP (1) | EP2260499B1 (zh) |
JP (1) | JP5619629B2 (zh) |
KR (1) | KR101570974B1 (zh) |
CN (1) | CN102017053B (zh) |
TW (1) | TWI377593B (zh) |
WO (1) | WO2009106560A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103257528A (zh) * | 2012-02-16 | 2013-08-21 | 纽富来科技股份有限公司 | 电子束描绘装置及电子束描绘方法 |
CN103597572A (zh) * | 2011-04-28 | 2014-02-19 | 迈普尔平版印刷Ip有限公司 | 用于处理靶片表面的带电粒子系统 |
Families Citing this family (39)
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JP5801289B2 (ja) | 2009-05-20 | 2015-10-28 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | リソグラフシステムのためのパターンデータ変換 |
JP2012527766A (ja) | 2009-05-20 | 2012-11-08 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | デュアルパス走査 |
JP2013505575A (ja) * | 2009-09-18 | 2013-02-14 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | マルチプルビームを備えた荷電粒子光学システム |
WO2012041464A1 (en) * | 2010-09-28 | 2012-04-05 | Applied Materials Israel Ltd. | Particle-optical systems and arrangements and particle-optical components for such systems and arrangements |
US9305747B2 (en) | 2010-11-13 | 2016-04-05 | Mapper Lithography Ip B.V. | Data path for lithography apparatus |
US8884255B2 (en) | 2010-11-13 | 2014-11-11 | Mapper Lithography Ip B.V. | Data path for lithography apparatus |
WO2012062854A1 (en) * | 2010-11-13 | 2012-05-18 | Mapper Lithography Ip B.V. | Lithography system and method of refracting |
JP5669636B2 (ja) * | 2011-03-15 | 2015-02-12 | キヤノン株式会社 | 荷電粒子線レンズおよびそれを用いた露光装置 |
RU2573398C2 (ru) | 2011-04-22 | 2016-01-20 | МЭППЕР ЛИТОГРАФИ АйПи Б.В. | Сетевая архитектура и протокол для кластера литографических машин |
NL2007604C2 (en) * | 2011-10-14 | 2013-05-01 | Mapper Lithography Ip Bv | Charged particle system comprising a manipulator device for manipulation of one or more charged particle beams. |
TWI486723B (zh) | 2011-04-28 | 2015-06-01 | Mapper Lithography Ip Bv | 在微影系統中處理基板的方法 |
JP2012237855A (ja) * | 2011-05-11 | 2012-12-06 | Sony Corp | レンズモジュール、撮像装置、電子機器、およびレンズモジュールの駆動方法 |
NL2006868C2 (en) | 2011-05-30 | 2012-12-03 | Mapper Lithography Ip Bv | Charged particle multi-beamlet apparatus. |
JP5859778B2 (ja) | 2011-09-01 | 2016-02-16 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
WO2013045643A2 (en) | 2011-09-28 | 2013-04-04 | Mapper Lithography Ip B.V. | Plasma generator |
US9117625B2 (en) * | 2011-09-30 | 2015-08-25 | Kyocera Corporation | Electrostatic lens and charged particle beam apparatus using the same |
US9665014B2 (en) * | 2012-03-08 | 2017-05-30 | Mapper Lithography Ip B.V. | Charged particle lithography system with alignment sensor and beam measurement sensor |
US9123507B2 (en) * | 2012-03-20 | 2015-09-01 | Mapper Lithography Ip B.V. | Arrangement and method for transporting radicals |
US11348756B2 (en) | 2012-05-14 | 2022-05-31 | Asml Netherlands B.V. | Aberration correction in charged particle system |
US10586625B2 (en) | 2012-05-14 | 2020-03-10 | Asml Netherlands B.V. | Vacuum chamber arrangement for charged particle beam generator |
CN104428866A (zh) | 2012-05-14 | 2015-03-18 | 迈普尔平版印刷Ip有限公司 | 带电粒子光刻系统和射束产生器 |
NL2010759C2 (en) | 2012-05-14 | 2015-08-25 | Mapper Lithography Ip Bv | Modulation device and power supply arrangement. |
KR101417603B1 (ko) * | 2013-02-28 | 2014-07-09 | 선문대학교 산학협력단 | 더블 어라인너를 구비한 초소형 컬럼 |
WO2015024956A1 (en) | 2013-08-23 | 2015-02-26 | Mapper Lithography Ip B.V. | Drying device for use in a lithography system |
JP6318157B2 (ja) * | 2013-08-30 | 2018-04-25 | 株式会社日立製作所 | 荷電粒子線レンズモジュール及びそれを備えた荷電粒子線装置 |
KR20230056063A (ko) | 2013-11-14 | 2023-04-26 | 에이에스엠엘 네델란즈 비.브이. | 멀티-전극 전자 광학 |
TW201532132A (zh) | 2014-01-22 | 2015-08-16 | Mapper Lithography Ip Bv | 於帶電粒子射束處理期間針對半導體基板的電荷調整 |
JP6653125B2 (ja) * | 2014-05-23 | 2020-02-26 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
KR20170084240A (ko) | 2014-11-14 | 2017-07-19 | 마퍼 리쏘그라피 아이피 비.브이. | 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법 |
US9484188B2 (en) | 2015-03-11 | 2016-11-01 | Mapper Lithography Ip B.V. | Individual beam pattern placement verification in multiple beam lithography |
US10096450B2 (en) | 2015-12-28 | 2018-10-09 | Mapper Lithography Ip B.V. | Control system and method for lithography apparatus |
US9981293B2 (en) | 2016-04-21 | 2018-05-29 | Mapper Lithography Ip B.V. | Method and system for the removal and/or avoidance of contamination in charged particle beam systems |
NL2022156B1 (en) | 2018-12-10 | 2020-07-02 | Asml Netherlands Bv | Plasma source control circuit |
JP7431349B2 (ja) | 2020-06-10 | 2024-02-14 | エーエスエムエル ネザーランズ ビー.ブイ. | 荷電粒子装置用の交換可能モジュール |
EP3937205A1 (en) * | 2020-07-06 | 2022-01-12 | ASML Netherlands B.V. | Charged-particle multi-beam column, charged-particle multi-beam column array, inspection method |
EP4199027A1 (en) * | 2021-12-17 | 2023-06-21 | ASML Netherlands B.V. | Charged-particle apparatus, multi-device apparatus, method of using charged-particle apparatus and control method |
EP4202969A1 (en) * | 2021-12-23 | 2023-06-28 | ASML Netherlands B.V. | Electron-optical device with compensation for variations in a property of sub-beams |
WO2023117277A1 (en) * | 2021-12-23 | 2023-06-29 | Asml Netherlands B.V. | Electron-optical device, method of compensating for variations in a property of sub-beams |
US20240304415A1 (en) * | 2023-03-08 | 2024-09-12 | Ims Nanofabrication Gmbh | Method for Determining Focal Properties in a Target Beam Field of a Multi-Beam Charged-Particle Processing Apparatus |
Citations (5)
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US4419182A (en) * | 1981-02-27 | 1983-12-06 | Veeco Instruments Inc. | Method of fabricating screen lens array plates |
US4465934A (en) * | 1981-01-23 | 1984-08-14 | Veeco Instruments Inc. | Parallel charged particle beam exposure system |
US20050253093A1 (en) * | 2004-05-12 | 2005-11-17 | Gorski Richard M | Parallel multi-electron beam lithography for IC fabrication with precise X-Y translation |
CN1708826A (zh) * | 2002-10-30 | 2005-12-14 | 迈普尔平版印刷Ip有限公司 | 电子束曝光系统 |
CN101084567A (zh) * | 2004-11-17 | 2007-12-05 | Nfab有限公司 | 聚焦掩模 |
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-
2009
- 2009-02-26 WO PCT/EP2009/052264 patent/WO2009106560A1/en active Application Filing
- 2009-02-26 TW TW98106092A patent/TWI377593B/zh active
- 2009-02-26 CN CN200980114873.2A patent/CN102017053B/zh active Active
- 2009-02-26 US US12/393,049 patent/US8089056B2/en active Active
- 2009-02-26 KR KR1020107021468A patent/KR101570974B1/ko active IP Right Grant
- 2009-02-26 EP EP09715482.7A patent/EP2260499B1/en active Active
- 2009-02-26 JP JP2010548104A patent/JP5619629B2/ja active Active
-
2011
- 2011-11-25 US US13/304,427 patent/US9105439B2/en active Active
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US4419182A (en) * | 1981-02-27 | 1983-12-06 | Veeco Instruments Inc. | Method of fabricating screen lens array plates |
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Title |
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NOBUO SHIMAZU,ETAL: "An Approach to a High-Throughput E-Beam Writer with a Single-Gun Multiple-Path System", 《JPN J. APPL. PHYS. 》 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103597572A (zh) * | 2011-04-28 | 2014-02-19 | 迈普尔平版印刷Ip有限公司 | 用于处理靶片表面的带电粒子系统 |
CN103597572B (zh) * | 2011-04-28 | 2018-03-27 | 迈普尔平版印刷Ip有限公司 | 用于处理靶片表面的带电粒子系统 |
CN103257528A (zh) * | 2012-02-16 | 2013-08-21 | 纽富来科技股份有限公司 | 电子束描绘装置及电子束描绘方法 |
US9373424B2 (en) | 2012-02-16 | 2016-06-21 | Nuflare Technology, Inc. | Electron beam writing apparatus and electron beam writing method |
Also Published As
Publication number | Publication date |
---|---|
TWI377593B (en) | 2012-11-21 |
US8089056B2 (en) | 2012-01-03 |
JP2011513905A (ja) | 2011-04-28 |
US9105439B2 (en) | 2015-08-11 |
WO2009106560A1 (en) | 2009-09-03 |
TW200952022A (en) | 2009-12-16 |
KR101570974B1 (ko) | 2015-11-23 |
US20090212229A1 (en) | 2009-08-27 |
JP5619629B2 (ja) | 2014-11-05 |
US20120061583A1 (en) | 2012-03-15 |
KR20100132509A (ko) | 2010-12-17 |
CN102017053B (zh) | 2014-04-02 |
EP2260499A1 (en) | 2010-12-15 |
EP2260499B1 (en) | 2016-11-30 |
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