KR101749874B1 - 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제 - Google Patents

감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제 Download PDF

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KR101749874B1
KR101749874B1 KR1020167003048A KR20167003048A KR101749874B1 KR 101749874 B1 KR101749874 B1 KR 101749874B1 KR 1020167003048 A KR1020167003048 A KR 1020167003048A KR 20167003048 A KR20167003048 A KR 20167003048A KR 101749874 B1 KR101749874 B1 KR 101749874B1
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South Korea
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photosensitive resin
resin composition
alkyl
substituted
relief pattern
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KR1020167003048A
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Korean (ko)
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KR20160027189A (ko
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다즈히 양
다카오 미와
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다이요 홀딩스 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020167003048A 2013-08-09 2014-07-15 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제 KR101749874B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013166706 2013-08-09
JPJP-P-2013-166706 2013-08-09
PCT/JP2014/068760 WO2015019802A1 (ja) 2013-08-09 2014-07-15 感光性樹脂組成物、そのレリーフパターン膜、レリーフパターン膜の製造方法、レリーフパターン膜を含む電子部品又は光学製品、及び感光性樹脂組成物を含む接着剤

Related Child Applications (1)

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KR1020167036578A Division KR20170001752A (ko) 2013-08-09 2014-07-15 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제

Publications (2)

Publication Number Publication Date
KR20160027189A KR20160027189A (ko) 2016-03-09
KR101749874B1 true KR101749874B1 (ko) 2017-06-21

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KR1020167003048A KR101749874B1 (ko) 2013-08-09 2014-07-15 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제
KR1020167036578A KR20170001752A (ko) 2013-08-09 2014-07-15 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제

Family Applications After (1)

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KR1020167036578A KR20170001752A (ko) 2013-08-09 2014-07-15 감광성 수지 조성물, 그의 릴리프 패턴막, 릴리프 패턴막의 제조 방법, 릴리프 패턴막을 포함하는 전자 부품 또는 광학 제품, 및 감광성 수지 조성물을 포함하는 접착제

Country Status (5)

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JP (1) JP6138943B2 (zh)
KR (2) KR101749874B1 (zh)
CN (1) CN105452383B (zh)
TW (1) TWI629311B (zh)
WO (1) WO2015019802A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102674122B1 (ko) * 2016-01-13 2024-06-12 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
US11086220B2 (en) * 2017-10-31 2021-08-10 Rohm And Haas Electronic Materials Korea Ltd. Underlayer coating compositions for use with photoresists

Citations (4)

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JP2003140352A (ja) 2001-11-05 2003-05-14 Toshiba Corp 反射防止膜、これを用いたレジストパターン形成方法および半導体装置の製造方法
JP2006045423A (ja) 2004-08-06 2006-02-16 Asahi Kasei Corp ポリイミド前駆体樹脂組成物
WO2009028208A1 (ja) 2007-08-30 2009-03-05 Mitsui Chemicals, Inc. ネガ型感光性材料、および回路基板
CN101900940A (zh) * 2009-05-27 2010-12-01 日东电工株式会社 负型感光性材料、感光性基材及负型图案形成方法

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ES2181162T3 (es) * 1997-01-22 2003-02-16 Ciba Sc Holding Ag Bases fotoactivables que contienen nitrogeno, basadas en alfa-amino-cetonas.
CN1245665C (zh) * 2001-09-26 2006-03-15 日产化学工业株式会社 正感光性聚酰亚胺树脂组合物
JP2006189591A (ja) 2005-01-05 2006-07-20 Tokyo Institute Of Technology 感光性樹脂組成物、レリーフパターンの製造方法及び半導体装置
JP4830435B2 (ja) 2005-09-30 2011-12-07 大日本印刷株式会社 感光性樹脂組成物及び物品
JP4756350B2 (ja) 2006-03-17 2011-08-24 大日本印刷株式会社 感光性樹脂組成物、物品、及びネガ型パターン形成方法
JP5120029B2 (ja) * 2008-03-31 2013-01-16 大日本印刷株式会社 感光性樹脂組成物、およびこれを用いた物品、及びネガ型パターン形成方法
CN101981154B (zh) * 2008-03-31 2014-03-19 大日本印刷株式会社 碱产生剂、感光性树脂组合物、包含该感光性树脂组合物的图案形成用材料、使用了该感光性树脂组合物的图案形成方法以及物品
JP2009265294A (ja) * 2008-04-24 2009-11-12 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP5379507B2 (ja) * 2009-02-12 2013-12-25 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた回路基板
KR102161427B1 (ko) * 2012-12-28 2020-10-05 도오꾜오까고오교 가부시끼가이샤 감에너지성 수지 조성물

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003140352A (ja) 2001-11-05 2003-05-14 Toshiba Corp 反射防止膜、これを用いたレジストパターン形成方法および半導体装置の製造方法
JP2006045423A (ja) 2004-08-06 2006-02-16 Asahi Kasei Corp ポリイミド前駆体樹脂組成物
WO2009028208A1 (ja) 2007-08-30 2009-03-05 Mitsui Chemicals, Inc. ネガ型感光性材料、および回路基板
CN101900940A (zh) * 2009-05-27 2010-12-01 日东电工株式会社 负型感光性材料、感光性基材及负型图案形成方法

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WO2015019802A1 (ja) 2015-02-12
JP6138943B2 (ja) 2017-05-31
CN105452383A (zh) 2016-03-30
KR20170001752A (ko) 2017-01-04
CN105452383B (zh) 2018-09-11
TW201510083A (zh) 2015-03-16
TWI629311B (zh) 2018-07-11
KR20160027189A (ko) 2016-03-09
JPWO2015019802A1 (ja) 2017-03-02

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